Cleaning device and wafer detection system

Abstract

The utility model relates to a cleaning device and a wafer detection system. The cleaning device comprises a mounting plate, a cleaning plate, a connecting plate, a brush part and a horizontal adjusting assembly, and the cleaning plate is borne on the mounting plate; the connecting plate is connected with the peripheral side of the mounting plate; the brush part is borne on the connecting plate; the horizontal adjusting assembly is arranged on the connecting plate and used for adjusting the relative position of the connecting plate and the brush piece. According to the cleaning device, the brush part can be independently and horizontally adjusted.

Description

Technical Field

[0001] The present application relates to the field of wafer inspection technology, and in particular to a cleaning device and a wafer inspection system. Background Art

[0002] During wafer manufacturing, after etching, vapor deposition, and other processes, wafers need to be tested using probes. Over time, the probe tips inevitably adhere to the vapor-deposited metal layer on the wafer, necessitating regular cleaning of the probes.

[0003] Usually, a needle cleaning plate is used to clean the tip of the probe. Cleaning paper is pasted on the plate. When cleaning is needed, the plate mechanism rises, allowing the cleaning paper to contact the probe tip. At this time, the plate can be moved horizontally to complete the probe cleaning. However, the area where the cleaning paper is wiped is immediately ineffective. Therefore, the industry has explored the method of combining brush cleaning with needle cleaning to extend the maintenance cycle and improve production efficiency. However, due to errors in processing, manufacturing and installation, the existing needle cleaning mechanism does not always maintain parallelism between the brush plane and the needle cleaning plate. In addition, the brush plane and the needle cleaning table share a horizontal leveling mechanism, so the brush may not be parallel to the plane where the probe tip is located, resulting in poor cleaning effect of the brush on the probe or damage to the probe. Utility Model Content

[0004] In view of this, the present application provides a cleaning device and a wafer detection system, wherein the cleaning device can individually adjust the level of the brush member.

[0005] The present application provides a cleaning device, which includes: a mounting plate, a cleaning plate, a connecting plate, a brush member and a horizontal adjustment component, wherein the cleaning plate is supported on the mounting plate; the connecting plate is connected to the peripheral side of the mounting plate; the brush member is supported on the connecting plate; the horizontal adjustment component is arranged on the connecting plate for adjusting the relative position of the connecting plate and the brush member.

[0006] Furthermore, the cleaning device also includes a setting member, which is carried by the connecting plate and is used to set the brush member; the connecting plate has a plurality of first through holes, and the plurality of first through holes are circumferentially spaced and extend along a preset direction; the horizontal adjustment assembly includes a plurality of adjusting members, which are movably arranged in the first through holes along the preset direction and abut against the surface of the setting member facing the connecting plate, and the plurality of adjusting members are adjusted along the preset direction to adjust the relative position of the connecting plate and the brush member; wherein, the preset direction is the arrangement direction of the mounting plate and the cleaning plate.

[0007] Furthermore, the connecting plate also has a plurality of second through holes arranged at intervals; the setting member has a plurality of third through holes arranged at intervals, and the plurality of third through holes are arranged one-to-one corresponding to the plurality of second through holes; the horizontal adjustment assembly also includes a plurality of first locking members, each of the first locking members passes through one of the third through holes and one of the second through holes in turn to fix the relative position of the setting member and the connecting plate.

[0008] Furthermore, the plurality of first through holes are symmetrically arranged relative to the center of the setting member, and the plurality of second through holes are symmetrically arranged relative to the center of the setting member.

[0009] Furthermore, the cleaning device also includes a pressure plate and a plurality of second locking members, the pressure plate is arranged on the side of the setting member away from the connecting plate and is arranged around the outer periphery of the brush member, and the second locking members are sequentially passed through the pressure plate and the setting member to fix the relative positions of the brush member and the setting member.

[0010] Furthermore, the connecting plate includes a connected bearing portion and a connecting portion, the bearing portion is used to bear the setting member, the connecting portion is used to connect the mounting plate, and the connecting portion has a fourth through hole; the mounting plate has a locking hole, and the cleaning device also includes a third locking member, and the third locking member is sequentially passed through the fourth through hole and the locking hole.

[0011] Furthermore, the locking hole has a circular outline, and the width of the fourth through hole along the preset direction is greater than the width along the direction perpendicular to the preset direction, so that the relative position of the connecting plate and the mounting plate along the preset direction can be adjusted.

[0012] Furthermore, along the preset direction, the surface of the brush member facing away from the connecting plate protrudes beyond the surface of the cleaning plate facing away from the mounting plate, and the height difference h between the surface of the brush member facing away from the connecting plate and the surface of the cleaning plate facing away from the mounting plate is in the range of: 1mm≤h≤2mm.

[0013] Furthermore, the cleaning device includes a first limit block and a second limit block, the first limit block and the second limit block are spaced apart on the side of the mounting plate facing the cleaning plate, and are respectively arranged on opposite sides of the cleaning plate, the first limit block and the second limit block cooperate to limit the relative position of the cleaning plate and the mounting plate.

[0014] The present application also provides a wafer detection system, which includes: a sample stage, a moving mechanism, a probe and a cleaning device provided in the present application, wherein the sample stage is used to carry the sample to be detected; the moving mechanism is used to carry the sample stage and drive the sample stage to move; the probe is used to detect the sample to be detected; the cleaning device is carried by the moving mechanism and is spaced apart from the sample stage, the mounting plate is connected to the moving mechanism, and the cleaning device is used to clean the probe.

[0015] In the present application, the cleaning device includes a cleaning plate and a brush member, so that when the cleaning device is applied to a wafer detection system, the cleaning plate and the brush member are used together to clean the tip of the probe, which is beneficial to prolonging the service life of the cleaning device. The brush member is carried on the connecting plate and is connected to the mounting plate through the connecting plate. In the cleaning device of the present application, the cleaning device also includes a horizontal adjustment component, which can adjust the relative position of the connecting plate and the brush member, so that when the relative position of the connecting plate and the mounting plate is fixed, the brush member can be horizontally adjusted by the horizontal adjustment component so that the brush member can be parallel to the cleaning plate and parallel to the plane where the tip of the probe is located, thereby ensuring that the brush member can fully contact the probe and has a good cleaning effect on the probe, avoiding damage to the probe during the cleaning process. The cleaning device of the present application is separately provided with a horizontal adjustment component to adjust the brush part horizontally, which is beneficial to improving the installation accuracy of the cleaning device in the wafer detection system, ensuring that the brush part and the cleaning plate are parallel to the plane where the tip of the probe is located, and improving the performance of the cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the implementation. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic structural diagram of a wafer inspection system according to an embodiment of the present application;

[0018] Figure 2 This is a schematic structural diagram of a cleaning device according to an embodiment of the present application;

[0019] Figure 3 This is a schematic diagram of the exploded structure of a cleaning device according to an embodiment of the present application;

[0020] Figure 4 This is a schematic diagram of the exploded structure of a cleaning device according to another embodiment of the present application;

[0021] Figure 5 This is a schematic side view of the cleaning device according to one embodiment of the present application;

[0022] Figure 6 This is a schematic structural diagram of a cleaning device according to another embodiment of the present application;

[0023] Figure 7 This is a schematic side view of the brush member according to one embodiment of the present application;

[0024] Figure 8 A partial structural top view of a brush member according to an embodiment of the present application;

[0025] Figure 9 This is a schematic structural diagram of an adjusting member according to an embodiment of the present application;

[0026] Figure 10 Schematic diagram of the structure of the first locking member according to an embodiment of the present application.

[0027] Description of reference numerals:

[0028] 100-cleaning device, 110-mounting plate, 111-locking hole, 120-cleaning plate, 130-connecting plate, 131-first through hole, 132-second through hole, 133-bearing part, 134-connecting part, 1341-fourth through hole, 140-brush part, 141-body, 1411-brush hole, 142-brush part, 150-horizontal adjustment component, 151-adjusting part, 1511-first head, 1512-second through hole An extension portion, 1513-first groove, 152-first locking member, 1521-second head, 1522-second extension portion, 1523-second groove, 160-setting member, 161-third through hole, 170-pressure plate member, 180-second locking member, 190-third locking member, 210-first limit block, 220-second limit block, 300-wafer detection system, 310-sample stage, 320-moving mechanism, 330-probe. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0030] The terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0031] References herein to "embodiments" or "implementations" mean that a particular feature, structure, or characteristic described in connection with the embodiments or implementations may be included in at least one embodiment of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor do they constitute independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] During wafer manufacturing, after etching, vapor deposition, and other processes, wafers need to be tested using probes. Over time, the probe tips inevitably adhere to the vapor-deposited metal layer on the wafer, necessitating regular cleaning of the probes.

[0033] Usually, a needle cleaning plate is used to clean the tip of the probe. Cleaning paper is pasted on the needle cleaning plate. When cleaning is needed, the needle cleaning plate mechanism rises to make the cleaning paper contact the probe tip. At this time, the needle cleaning plate can be moved horizontally to complete the probe cleaning. However, the area where the cleaning paper is wiped will immediately become ineffective. Therefore, the industry has explored the method of cleaning the needle with a brush to extend the maintenance cycle and improve production efficiency. However, due to errors in processing, manufacturing and installation, the existing needle cleaning mechanism cannot always keep the brush plane and the needle cleaning plate parallel. In addition, the brush plane and the needle cleaning plate share a horizontal leveling mechanism. When the needle cleaning plate is parallel to the plane where the probe tip is located, the brush may not be parallel to the plane where the probe tip is located, resulting in poor cleaning effect of the brush on the probe or damage to the probe.

[0034] See Figure 1The present application also provides a wafer inspection system 300, which includes: a sample stage 310, a moving mechanism 320, a probe 330 and a cleaning device 100 provided in the present application, wherein the sample stage 310 is used to carry the sample to be inspected; the moving mechanism 320 is used to carry the sample stage 310 and drive the sample stage 310 to move; the probe 330 is used to inspect the sample to be inspected; the cleaning device 100 is carried on the moving mechanism 320 and is spaced apart from the sample stage 310, the mounting plate 110 is connected to the moving mechanism 320, and the cleaning device 100 is used to clean the probe 330.

[0035] It can be understood that the moving mechanism 320 can drive the cleaning device 100 and the chuck to move in the height direction and the horizontal direction.

[0036] It can be understood that the mounting plate 110 is connected to the moving mechanism 320, and the moving mechanism 320 can move the cleaning plate 120 through the mounting plate 110, and the connecting plate 130 is connected to the mounting plate 110, then the moving mechanism 320 can also move the brush member 140.

[0037] Optionally, the moving mechanism 320 can horizontally adjust the mounting plate 110 so that the cleaning plate 120 is in a horizontal position and remains horizontal with the plane where the tip of the probe 330 is located.

[0038] In the wafer inspection system 300 provided in this embodiment, the sample stage 310 and the cleaning device 100 are spaced apart from each other by the moving mechanism 320. When the sample stage 310 carries the sample to be inspected, the moving mechanism 320 moves the sample to the bottom of the probe 330, so that the probe 330 contacts the sample and inspects it. After a period of use, the tip of the probe 330 may become contaminated with metal debris. The moving mechanism 320 then moves the cleaning device 100 to the bottom of the probe 330 to clean the tip of the probe 330. Specifically, the moving mechanism 320 can move the cleaning plate 120 to the bottom of the probe 330 so that the tip of the probe 330 contacts the cleaning plate 120, and the probe 330 contacts the cleaning plate 120 to achieve cleaning; the moving mechanism 320 can also move the brush member 140 to the bottom of the probe 330, and the brush member 140 sweeps away the metal debris stuck to the tip of the probe 330 to achieve cleaning of the probe 330. In this embodiment, the cleaning device 100 can independently adjust the horizontal position of the brush member 140, so that when either the brush member 140 or the cleaning plate 120 is used to clean the probe 330, the brush member 140 and the cleaning plate 120 can both remain level with the plane where the tip of the probe 330 is located, thereby ensuring the cleaning effect of the brush member 140 and the cleaning plate 120, and avoiding damage to the probe 330 due to tilting during use. The cleaning device 100 has good performance when applied to the wafer detection system 300.

[0039] Understandably, in Figure 1 The embodiment shows the positional relationship between the probe 330 and the sample stage 310 , the moving mechanism 320 and the cleaning device 100 , omitting the fixing structure of the probe 330 . It should not be understood that the probe 330 is suspended.

[0040] Optionally, the sample to be tested is a wafer, a circuit board, etc.

[0041] It is understood that when the cleaning plate 120 is used to clean the tip of the probe 330, a needle cleaning paper is laid on the cleaning plate 120, and the tip of the probe 330 contacts the needle cleaning paper to clean the probe 330. When the brush member 140 is used to clean the tip of the probe 330, the tip of the probe 330 contacts the brush member 140 or partially extends into the brush member 140, so that the brush member 140 sweeps away metal debris on the tip of the probe 330, thereby cleaning the probe 330.

[0042] See Figure 2 and Figure 3 The present application provides a cleaning device 100, which includes: a mounting plate 110, a cleaning plate 120, a connecting plate 130, a brush member 140 and a horizontal adjustment component 150, wherein the cleaning plate 120 is supported on the mounting plate 110; the connecting plate 130 is connected to the peripheral side of the mounting plate 110; the brush member 140, the brush member 140 is supported on the connecting plate 130; the horizontal adjustment component 150 is arranged on the connecting plate 130, and is used to adjust the relative position of the connecting plate 130 and the brush member 140.

[0043] It can be understood that the horizontal adjustment assembly 150 is used to adjust the relative position of the brush member 140 and the connecting plate 130, and to make the brush member 140 parallel to the cleaning plate 120. In other words, the moving mechanism 320 horizontally adjusts the mounting plate 110 so that the cleaning plate 120 and the plane where the tip of the probe 330 is located are parallel, thereby making the brush member 140, the cleaning plate 120 and the plane where the tip of the probe 330 is located parallel.

[0044] In this embodiment, the cleaning device 100 includes a cleaning plate 120 and a brush member 140, so that when the cleaning device 100 is applied to the wafer detection system 300, the cleaning plate 120 and the brush member 140 are used together to clean the tip of the probe 330, which is beneficial to extending the service life of the cleaning device 100. The brush member 140 is carried on the connecting plate 130 and is connected to the mounting plate 110 through the connecting plate 130. In the cleaning device 100 of this embodiment, the cleaning device 100 also includes a horizontal adjustment component 150. The horizontal adjustment component 150 can adjust the relative position of the connecting plate 130 and the brush member 140, so that when the relative positions of the connecting plate 130 and the mounting plate 110 are fixed, the brush member 140 can be horizontally adjusted by the horizontal adjustment component 150, so that the brush member 140 can be parallel to the cleaning plate 120 and can be parallel to the plane where the tip of the probe 330 is located, thereby ensuring that the brush member 140 can fully contact the probe 330 and have a better cleaning effect on the probe 330, thereby avoiding damage to the probe 330 during the cleaning process. The cleaning device 100 of this embodiment is separately provided with a horizontal adjustment component 150 to perform horizontal adjustment on the brush member 140, which is beneficial to improving the installation accuracy of the cleaning device 100 in the wafer detection system 300, ensuring that the brush member 140 and the cleaning plate 120 are both parallel to the plane where the tip of the probe 330 is located, thereby improving the performance of the cleaning device 100.

[0045] In some embodiments, the cleaning device 100 further includes a setting member 160, the setting member 160 is carried on the connecting plate 130, and the setting member 160 is used to set the brush member 140; the connecting plate 130 has a plurality of first through holes 131, and the plurality of first through holes 131 are arranged at circumferential intervals and are all arranged along a preset direction (such as Figure 3 The horizontal adjustment component 150 includes a plurality of adjustment members 151, which are movably arranged in the first through hole 131 along a preset direction and abut against the surface of the setting member 160 facing the connecting plate 130. The plurality of adjustment members 151 are adjusted along the preset direction to adjust the relative positions of the connecting plate 130 and the brush member 140; wherein the preset direction is the arrangement direction of the mounting plate 110 and the cleaning plate 120.

[0046] It can be understood that the first through hole 131 passes through two surfaces of the connecting plate 130 that are arranged opposite to each other along a preset direction.

[0047] It can be understood that the plurality of first through holes 131 are arranged at intervals in the circumferential direction, and the plurality of first through holes 131 are arranged at intervals in the circumferential direction around the setting member 160 .

[0048] In the terminology of this application, "plurality" means greater than or equal to two, and can be two, three, four, five or six, etc.

[0049] It can be understood that one adjusting member 151 is disposed in one first through hole 131 , different adjusting members 151 are disposed in different first through holes 131 , and the plurality of adjusting members 151 and the plurality of first through holes 131 correspond one to one.

[0050] In this embodiment, the connecting plate 130 has a plurality of first through-holes 131, each of which extends in a predetermined direction. The adjusting member 151 is movable along the predetermined direction through the first through-holes 131 and abuts against the surface of the setting member 160 facing the connecting plate 130. When the setting member 160 tilts, the adjusting member 151 can be moved along the predetermined direction toward the setting member 160 to lift the downwardly tilted portion of the setting member 160 away from the connecting plate 130, thereby placing the setting member 160 in a horizontal position. The brush member 140 of this embodiment is disposed on the setting member 160. When the setting member 160 is horizontally disposed, the brush member 140 is also disposed horizontally. When the cleaning device 100 is applied to the wafer detection system 300, the brush member 140 can be horizontal relative to the cleaning plate 120 and can be parallel to the plane where the tip of the probe 330 is located, thereby ensuring that the brush member 140 can fully contact the probe 330 and have a better cleaning effect on the probe 330, avoiding damage to the probe 330 during the cleaning process.

[0051] Optionally, the adjusting member 151 is a top screw member.

[0052] In some embodiments, the connecting plate 130 also has a plurality of second through holes 132 arranged at intervals; the setting member 160 has a plurality of third through holes 161 arranged at intervals, and the plurality of third through holes 161 are arranged one-to-one corresponding to the plurality of second through holes 132; the horizontal adjustment assembly 150 also includes a plurality of first locking members 152, each of the first locking members 152 passes through one of the third through holes 161 and one of the second through holes 132 in turn to fix the relative positions of the setting member 160 and the connecting plate 130.

[0053] It can be understood that, on the connecting plate 130 , the first through holes 131 and the second through holes 132 are arranged at intervals.

[0054] It can be understood that the second through hole 132 passes through two surfaces of the connecting plate 130 that are arranged opposite to each other along a preset direction.

[0055] It can be understood that the third through hole 161 passes through two surfaces of the setting member 160 that are arranged opposite to each other along a preset direction.

[0056] It can be understood that the multiple third through holes 161 are arranged in a one-to-one correspondence with the multiple second through holes 132, that is, one third through hole 161 corresponds to one second through hole 132, and different third through holes 161 correspond to different second through holes 132.

[0057] In this embodiment, the connecting plate 130 has a plurality of second through holes 132 arranged at intervals, and the setting member 160 has a plurality of third through holes 161 arranged at intervals. When the plurality of adjusting members 151 cooperate to adjust the relative positions of the setting member 160 and the connecting plate 130, the first locking member 152 is sequentially passed through the third through holes 161 and the second through holes 132 to fix the relative positions of the setting member 160 and the connecting plate 130 to prevent the setting member 160 from shifting from a horizontal position to an inclined position during use, thereby ensuring that the brush member 140 can remain parallel to the plane where the tip of the probe 330 is located when cleaning the tip of the probe 330, thereby enabling the cleaning device 100 to have a better cleaning effect.

[0058] Optionally, the first locking member 152 is a screw.

[0059] In some embodiments, the plurality of first through holes 131 are symmetrically arranged relative to the center of the setting member 160 , and the plurality of second through holes 132 are symmetrically arranged relative to the center of the setting member 160 .

[0060] In this embodiment, the plurality of first through-holes 131 are symmetrically arranged relative to the center of the setting member 160. Therefore, when the adjusting member 151 is inserted into the first through-hole 131 and abuts against the surface of the setting member 160 facing the connecting plate 130, the weight of the connecting plate 130 can be relatively evenly distributed among the plurality of adjusting members 151, thereby avoiding stress concentration and facilitating the extension of the service life of the level adjustment assembly 150. Furthermore, when adjusting the relative position of the setting member 160 and the connecting plate 130, the plurality of first through-holes 131 are evenly distributed, facilitating the independent operation of the adjusting members 151 and fine-tuning the local position of the setting member 160. This allows the plurality of adjusting members 151 to finely adjust the relative position of the setting member 160 and the connecting plate 130, thereby improving the accuracy of the level adjustment assembly 150 in adjusting the level of the brush member 140. In addition, the multiple second through holes 132 are symmetrically arranged relative to the center of the setting member 160. When the first locking member 152 is inserted into the second through hole 132, the multiple first locking members 152 are also more evenly dispersed in the circumferential direction of the setting member 160, which is beneficial to improving the stability of the fixing effect on the relative positions of the setting member 160 and the connecting plate 130.

[0061] In some embodiments, the cleaning device 100 also includes a pressure plate member 170 and a plurality of second locking members 180. The pressure plate member 170 is arranged on the side of the setting member 160 away from the connecting plate 130 and is arranged around the outer periphery of the brush member 140. The second locking members 180 are sequentially passed through the pressure plate member 170 and the setting member 160 to fix the relative positions of the brush member 140 and the setting member 160.

[0062] It can be understood that, along the preset direction, the connecting plate 130 , the setting member 160 and the pressing plate member 170 are arranged in sequence.

[0063] In this embodiment, the second locking member 180 is sequentially provided through the pressing plate 170 and the setting member 160 on a side of the pressing plate 170 facing away from the setting member 160, so as to press the brush member 140 onto the setting member 160 and fix the relative positions of the brush member 140 and the setting member 160. When the horizontal adjustment assembly 150 adjusts the relative position of the setting member 160 and the connecting plate 130, the relative positions of the brush member 140 and the connecting plate 130 are adjusted so that the brush member 140 is horizontal relative to the cleaning plate 120 and parallel to the plane where the tip of the probe 330 is located. In addition, the second locking member 180 fixes the relative positions of the brush member 140 and the setting member 160, thereby preventing the brush member 140 from moving when cleaning the probe 330, thereby ensuring the cleaning effect of the brush member 140 on the probe 330 and avoiding damage to the probe 330, thereby improving the performance of the cleaning device 100.

[0064] See Figure 4 In some embodiments, the connecting plate 130 includes a connected bearing portion 133 and a connecting portion 134, the bearing portion 133 is used to bear the setting member 160, and the connecting portion 134 is used to connect the mounting plate 110, and the connecting portion 134 has a fourth through hole 1341; the mounting plate 110 has a locking hole 111, and the cleaning device 100 also includes a third locking member 190, and the third locking member 190 is sequentially passed through the fourth through hole 1341 and the locking hole 111.

[0065] In this embodiment, the connecting plate 130 includes a connected supporting portion 133 and a connecting portion 134. The supporting portion 133 is used to support the setting member 160, and the connecting portion 134 is used to connect to the mounting plate 110, so that the brush member 140 is supported on the mounting plate 110 and moves with the mounting plate 110. The third locking member 190 is sequentially inserted into the fourth through hole 1341 and the locking hole 111 to fix the relative positions of the connecting plate 130 and the mounting plate 110 and connect the connecting plate 130 and the mounting plate 110 into an integrated structure. When the cleaning device 100 is used in a wafer inspection system 300, the moving mechanism 320 can simultaneously drive the connecting plate 130 and the mounting plate 110 to move, eliminating the need to set up two sets of moving mechanisms 320 to move the connecting plate 130 and the mounting plate 110 separately, which is beneficial to improving the performance of the cleaning device 100.

[0066] In some embodiments, the locking hole 111 has a circular outline, and the width of the fourth through hole 1341 along the preset direction is greater than the width in the direction perpendicular to the preset direction, so that the relative position of the connecting plate 130 and the mounting plate 110 along the preset direction can be adjusted.

[0067] In this embodiment, the contour of the locking hole 111 is circular, and the width of the fourth through hole 1341 along the preset direction is greater than the width along the direction perpendicular to the preset direction. Then, when the third locking member 190 is sequentially passed through the fourth through hole 1341 and the locking hole 111, the third locking member 190 can be passed through different positions of the fourth through hole 1341 along the preset direction to change the different positions of the connecting plate 130 and the mounting plate 110 in the preset direction, thereby realizing the adjustment of the relative position of the connecting plate 130 and the mounting plate 110 along the preset direction, that is, realizing the adjustment of the relative position of the brush member 140 and the cleaning plate 120 along the preset direction, thereby improving the assembly flexibility of the connecting plate 130 and the brush member 140 in the cleaning device 100.

[0068] It is understood that in some embodiments, the fourth through hole 1341 has a waist-shaped outline, and the waist-shaped outline extends in a direction parallel to the preset direction. In other embodiments, the fourth through hole 1341 has a rectangular outline.

[0069] See Figure 5In some embodiments, along a preset direction, the surface of the brush member 140 facing away from the connecting plate 130 protrudes beyond the surface of the cleaning plate 120 facing away from the mounting plate 110, and the height difference h between the surface of the brush member 140 facing away from the connecting plate 130 and the surface of the cleaning plate 120 facing away from the mounting plate 110 is in the range of: 1mm≤h≤2mm.

[0070] Specifically, the height difference h between the surface of the brush member 140 away from the connecting plate 130 and the surface of the cleaning plate 120 away from the mounting plate 110 can be, but is not limited to, 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm and 2 mm, etc.

[0071] It can be understood that when the cleaning device 100 is in normal use, the surface of the brush member 140 facing away from the connecting plate 130 is higher than the surface of the cleaning plate 120 facing away from the mounting plate 110 .

[0072] In this embodiment, along a preset direction, the surface of the brush member 140 facing away from the connecting plate 130 protrudes from the surface of the cleaning plate 120 facing away from the mounting plate 110, that is, the surface of the brush member 140 facing away from the connecting plate 130 and the surface of the cleaning plate 120 facing away from the mounting plate 110 are staggered in the preset direction, and the brush member 140 and the cleaning plate 120 do not interfere with each other during use. Specifically, when the cleaning device 100 is applied to the wafer inspection system 300, if the brush member 140 is used to clean the tip of the probe 330, due to the distance between the brush member 140 and the cleaning plate 120 in the preset direction and the horizontal direction, the tip of the probe 330 will not touch the cleaning plate 120; similarly, if the cleaning plate 120 is used to clean the tip of the probe 330, the tip of the probe 330 will not touch the brush member 140. When the height difference h between the surface of the brush member 140 away from the connecting plate 130 and the surface of the cleaning plate 120 away from the mounting plate 110 is in the range of 1mm≤h≤2mm, the height difference between the surface of the brush member 140 away from the connecting plate 130 and the surface of the cleaning plate 120 away from the mounting plate 110 is within a reasonable range, so that during the use of the cleaning device 100, the brush member 140 and the cleaning plate 120 do not interfere with each other, thereby improving the performance of the cleaning device 100.

[0073] See Figure 6In some embodiments, the cleaning device 100 includes a first limit block 210 and a second limit block 220. The first limit block 210 and the second limit block 220 are spaced apart on the side of the mounting plate 110 facing the cleaning plate 120, and are respectively arranged on opposite sides of the cleaning plate 120. The first limit block 210 and the second limit block 220 cooperate to limit the relative position of the cleaning plate 120 and the mounting plate 110.

[0074] It can be understood that the first limiting block 210 and the second limiting block 220 are arranged at opposite corners of the peripheral side of the mounting plate 110 .

[0075] In this embodiment, the first limit block 210 and the second limit block 220 are spaced apart on the side of the mounting plate 110 facing the cleaning plate 120. The first limit block 210 and the second limit block 220 limit the position of the mounting plate 110 from opposite sides of the cleaning plate 120. In other words, the first limit block 210 and the second limit block 220 are arranged on the outer periphery of the cleaning plate 120 and abut against opposite sides of the mounting plate 110, thereby improving the structural stability of the cleaning plate 120 set on the mounting plate 110.

[0076] Optionally, in some embodiments, the cleaning plate 120 is disposed on the mounting plate 110 by negative pressure adsorption; in other embodiments, the cleaning plate 120 is fixed on the mounting plate 110 by a fixing member (not shown).

[0077] See Figure 7 and Figure 8 Optionally, the brush member 140 includes a main body 141 and multiple brush parts 142, the main body 141 has multiple brush holes 1411 arranged in an array, and the radial size of the brush hole 1411 satisfies the range of 0.45mm to 0.55mm; the multiple brush parts 142 are distributed in the multiple brush holes 1411, and one brush hole 1411 is provided with multiple brush parts 142, and the diameter of the brush part 142 satisfies the range of 0.02mm to 0.05mm.

[0078] Optionally, the radial size of the brush hole 1411 may be, but is not limited to, 0.45 mm, 0.46 mm, 0.47 mm, 0.48 mm, 0.49 mm, 0.5 mm, 0.51 mm, 0.52 mm, 0.53 mm, 0.54 mm, and 0.55 mm.

[0079] Optionally, the diameter of the brush portion 142 may be, but is not limited to, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, etc.

[0080] In this embodiment, the radial dimensions of the brush holes 1411 fall within a range of 0.45 mm to 0.55 mm, which facilitates evenly distributing the multiple brush portions 142 within the multiple brush holes 1411. This results in a uniform and dense distribution of the brush portions 142 within the brush holes 1411, while minimizing the difficulty of manufacturing the brush member 140 and ensuring that the brush member 140 effectively cleans the probe 330. Furthermore, the diameter of the brush portion 142 falls within a range of 0.02 mm to 0.05 mm, which facilitates the brush portion 142 maintaining a good cleaning effect on the probe 330 while also providing good structural strength, thereby extending the service life of the brush member 140 and the cleaning device 100.

[0081] See Figure 9 Optionally, the adjusting member 151 includes a first head 1511 and a first extension 1512 connected to each other. The first head 1511 has a first recess 1513 for easy tool clamping. The first extension 1512 can be movably inserted into the first through hole 131. The radial dimensions of the first head 1511 and the first extension 1512 are equal.

[0082] In this embodiment, the radial dimensions of the first head portion 1511 and the first extension portion 1512 are equal, and the first head portion 1511 has a first recessed groove 1513, which facilitates a tool to clamp the first head portion 1511 and insert it into the first through hole 131, so that the adjusting member 151 can be movably inserted into the first through hole 131. The adjusting member 151 can be completely inserted into the first through hole 131 or partially inserted into the first through hole 131.

[0083] See Figure 10 Optionally, the first locking member 152 includes a second head 1521 and a second extension 1522 connected to each other. The second head 1521 has a second recess 1523 for easy tool clamping. The first locking member 152 can be inserted into the third through hole 161 and the second through hole 132. The radial dimension of the second head 1521 is greater than the radial dimension of the second extension 1522.

[0084] In this embodiment, the radial dimension of the second head portion 1521 is greater than the radial dimension of the second extension portion 1522, and the second head portion 1521 has a second recessed groove 1523, which facilitates the use of a tool to grip the second head portion 1521 and insert it into the third through-hole 161 and the second through-hole 132. When the first locking member 152 is inserted into the third through-hole 161 and the second through-hole 132, the second head portion 1521 can abut against the surface of the setting member 160 facing away from the connecting plate 130, preventing the first locking member 152 from fully entering the third through-hole 161 and the second through-hole 132, thereby allowing the first locking member 152 to secure the setting member 160 and the connecting plate 130.

[0085] Optionally, in some embodiments, the tool used to clamp the first head 1511 and the second head 1521 is an Allen wrench.

[0086] Optionally, in a specific embodiment, the specification of the first through hole 131 is metric M4, that is, the width of the first through hole 131 is 4 mm; the specification of the second through hole 132 is metric M3, that is, the width of the second through hole 132 is 3 mm. When the adjusting member 151 is passed through the first through hole 131 and the first locking member 152 is passed through the second through hole 132, the radial dimensions of the first head 1511 and the first extension portion 1512 of the adjusting member 151 are approximately 4 mm, the radial dimension of the second extension portion 1522 of the second locking member 180 is approximately 3 mm, and the radial dimension of the second head 1521 is approximately 4 mm. The radial dimensions of the first head 1511 and the second head 1521 are the same. During the use of the cleaning device 100, when the brush member 140 is horizontally adjusted and the relative position of the brush member 140 and the connecting plate 130 is fixed, it is convenient to use tools of the same size, that is, hexagonal wrenches of the same specification can be used, which is beneficial to improving the performance of the cleaning device 100.

[0087] Mentioning "embodiments" and "implementation methods" in this application means that the specific features, structures or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, unless there is a contradiction between them.

[0088] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the above preferred implementation modes, ordinary technicians in this field should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A cleaning device, characterized in that: The cleaning device comprises: Mounting plate; a cleaning plate, the cleaning plate being carried on the mounting plate; a connecting plate connected to a peripheral side of the mounting plate; a brush member, the brush member being carried by the connecting plate; and A horizontal adjustment component is provided on the connecting plate and is used for adjusting the relative position of the connecting plate and the brush member.

2. The cleaning device according to claim 1, characterized in that The cleaning device also includes a setting member, which is carried by the connecting plate and is used to set the brush member; the connecting plate has a plurality of first through holes, which are circumferentially spaced and extend along a preset direction; the horizontal adjustment assembly includes a plurality of adjusting members, which are movably arranged in the first through holes along a preset direction and abut against the surface of the setting member facing the connecting plate, and the plurality of adjusting members are adjusted along the preset direction to adjust the relative position of the connecting plate and the brush member; wherein the preset direction is the arrangement direction of the mounting plate and the cleaning plate.

3. The cleaning device according to claim 2, characterized in that The connecting plate further comprises a plurality of second through holes arranged at intervals; the setting member comprises a plurality of third through holes arranged at intervals, and the plurality of third through holes are arranged in a one-to-one correspondence with the plurality of second through holes; The horizontal adjustment assembly further includes a plurality of first locking members, each of which passes through one of the third through holes and one of the second through holes in sequence to fix the relative positions of the setting member and the connecting plate.

4. The cleaning device according to claim 3, characterized in that The plurality of first through holes are symmetrically arranged relative to the center of the setting member, and the plurality of second through holes are symmetrically arranged relative to the center of the setting member.

5. The cleaning device according to claim 2, characterized in that The cleaning device also includes a pressure plate and a plurality of second locking members. The pressure plate is arranged on the side of the setting member away from the connecting plate and is arranged around the outer periphery of the brush member. The second locking members are sequentially passed through the pressure plate and the setting member to fix the relative positions of the brush member and the setting member.

6. The cleaning device according to claim 2, characterized in that The connecting plate includes a connected bearing portion and a connecting portion, the bearing portion is used to bear the setting member, the connecting portion is used to connect the mounting plate, and the connecting portion has a fourth through hole; the mounting plate has a locking hole, and the cleaning device also includes a third locking member, and the third locking member is sequentially passed through the fourth through hole and the locking hole.

7. The cleaning device according to claim 6, characterized in that The locking hole has a circular outline, and the width of the fourth through hole along the preset direction is greater than the width along the direction perpendicular to the preset direction, so that the relative position of the connecting plate and the mounting plate along the preset direction can be adjusted.

8. The cleaning device according to claim 6, characterized in that Along the preset direction, the surface of the brush member facing away from the connecting plate protrudes beyond the surface of the cleaning plate facing away from the mounting plate, and the height difference h between the surface of the brush member facing away from the connecting plate and the surface of the cleaning plate facing away from the mounting plate is in the range of: 1mm≤h≤2mm.

9. The cleaning device according to any one of claims 1 to 8, characterized in that The cleaning device includes a first limit block and a second limit block. The first limit block and the second limit block are spaced apart on the side of the mounting plate facing the cleaning plate, and are respectively arranged on opposite sides of the cleaning plate. The first limit block and the second limit block cooperate to limit the relative position of the cleaning plate and the mounting plate.

10. A wafer inspection system, characterized in that: The wafer inspection system includes: A sample stage, used to carry samples to be tested; A moving mechanism, used for carrying the sample stage and driving the sample stage to move; A probe, wherein the probe is used to detect a sample to be detected; and The cleaning device according to any one of claims 1 to 9, wherein the cleaning device is carried by the moving mechanism and is spaced apart from the sample stage, the mounting plate is connected to the moving mechanism, and the cleaning device is used to clean the probe.

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