Semiconductor device capable of adapting to chips of various sizes

Abstract

The utility model discloses semiconductor equipment capable of adapting to chips of various sizes, which comprises a rack, a tin removing mechanism used for tin suction, a moving mechanism, a negative pressure device, a breather pipe, a suction head, a connecting rod and a branch rod, the negative pressure device is arranged at the bottom end of the moving mechanism, and the branch rod is arranged on the rack. The connecting rod is connected with the negative pressure mechanism, one end of each branch rod is connected with the connecting rod, each suction head is connected with one branch rod, one end of the breather pipe is communicated with the negative pressure device, the other end of the breather pipe is communicated with a plurality of branch pipes, and the branch pipes are connected with the connecting rod. The plurality of branch pipes are respectively communicated with the plurality of suction heads, and a gap is formed between every two adjacent suction heads. According to the utility model, a plurality of point positions of the chip are simultaneously subjected to lifting suction force, so that the possibility of deformation of partial positions of the heated chip under the action of self gravity can be reduced, and the yield of the tin-removed chip can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of tin removal, in particular to a semiconductor device that can adapt to chips of various sizes. Background Art

[0002] After the chip on the motherboard is removed, it is necessary to remove the tin spots on the pin side of the removed chip. The specific operation is: first, heat the entire chip to heat the tin spots on the chip to facilitate the removal of the tin spots; after the tin spots on the chip are heated at high temperature, they are removed.

[0003] The applicant believes that since there are a large number of tin spots on a single chip, it is generally chosen to heat the entire chip directly when heating the tin. When the tin is heated to the corresponding melting point, the chip as a whole is under a relatively high temperature condition, and the chip substrate is relatively soft. When the moving device on the detinning machine grabs the chip and moves it, the chip is easily deformed by force; if a negative pressure suction head is used to move the middle part of the chip as in Patent 202310630662.6, the chip is locally subjected to the suction force of negative pressure and is prone to stratification, or the position that is not in contact with the negative pressure suction head is heated and deformed due to its own gravity. Utility Model Content

[0004] The utility model provides a semiconductor device which can adapt to chips of various sizes, can stably lift and move the chips, and can reduce the deformation of the chips caused by the influence of the moving device.

[0005] The present invention provides a semiconductor device that can adapt to chips of various sizes and adopts the following technical solutions:

[0006] A semiconductor device that can adapt to chips of various sizes includes a frame, a moving mechanism and a negative pressure device, wherein the negative pressure device is arranged at the bottom end of the moving mechanism, and is characterized in that it also includes a ventilation pipe, a suction head, a connecting rod and a branch rod, wherein the connecting rod is connected to the negative pressure mechanism, and there are multiple branch rods, one end of the branch rod is connected to the connecting rod, the suction heads are provided in multiple numbers, and each of the multiple suction heads is connected to a branch rod, one end of the ventilation pipe is connected to the negative pressure device, and the other end of the ventilation pipe is connected to multiple branch pipes, and the multiple branch pipes are respectively connected to multiple suction heads, and there is a distance between adjacent suction heads.

[0007] After desoldering is complete, the moving mechanism is activated, causing the multiple suction heads connected to the negative pressure device to move directly above the desoldered chip. The connecting rod is then lowered, allowing the multiple suction heads at the end of the connecting rod to move into contact with the chip, facilitating suction. Spacing between the multiple suction heads allows them to be dispersed across the chip's surface. This ensures the chip is securely attached while simultaneously receiving a pulling force at multiple points on the chip. This helps reduce the possibility of deformation of the chip due to its own weight after heating, thereby improving the yield rate of the chip after desoldering.

[0008] Preferably, the connecting rod is hollow, and serves as a vent pipe connecting the branch pipe and the negative pressure device.

[0009] The hollow connecting rod serves as a ventilation vent, which prevents the external ventilation tube from being deformed or pulled multiple times when the moving mechanism drives the connecting rod to move, resulting in unstable connection of the connection port of the ventilation tube; reduces the complexity of the connecting rod structure caused by setting the ventilation tube inside or outside the connecting rod, which is conducive to simplifying the desoldering machine, using the existing device to achieve multi-functions, improving the utilization rate of the connecting rod, and improving the compactness of the overall device.

[0010] Preferably, the branch rod is partially hollow, the hollow inner cavity of the branch rod replaces the branch tube, and the hollow inner cavity of the branch rod is connected to the hollow inner cavity of the connecting rod; the branch rod is connected to a hose, one end of the hose is connected to the suction head and is connected to the suction head.

[0011] A hollow inner cavity is opened in the branch rod so that the branch rod can replace the branch pipe. At the same time, the branch rod itself is connected to the connecting rod, thereby reducing the connection structure required between the branch pipe and the ventilation pipe, improving the connection stability between the branch pipe and the ventilation pipe, and reducing the occurrence of air leakage.

[0012] Preferably, the branch rod is connected to a connector, which is connected to an end of the hose away from the suction head. The connector and the suction head are both arranged on the corresponding branch rods, and the length direction of the connector is consistent with the length direction of the suction head.

[0013] When connecting the hose, the two ends of the hose are respectively connected to the end of the connector away from the branch rod and the end of the suction head away from the branch rod. Since the length direction of the connector and the suction head are consistent, the directions of the openings at the ends away from the branch rod are consistent, which reduces the degree of distortion of the hose when connecting the two, making the hose less likely to be damaged and the connection more stable.

[0014] Preferably, the plurality of branch rods are evenly distributed along the circumference of the connecting rod, and the suction head can move along the length direction of the branch rods.

[0015] When the volume of the chip changes, the suction head on the movable branch rod is adjusted according to the area of ​​the chip facing the suction head, and the position of the suction head is adjusted so that the suction head adapts to the volume change of the chip, thereby improving the adaptability of the desoldering machine.

[0016] Preferably, the branch rod is provided with a sliding hole along its length direction, and the outer periphery of the suction head is threadedly connected to two nuts, the diameters of the two nuts are larger than the width of the sliding hole, and the two nuts are respectively arranged on both sides of the branch rod.

[0017] Adjust the two nuts on the outer wall of the suction head so that the two nuts move away from each other, thereby releasing the movement restriction of the suction head and allowing the suction head to move along the length direction of the branch rod. Move the suction head to a suitable position, then rotate the nuts so that the two nuts move closer to each other, and then clamp the two nuts on both sides of the branch rod, thereby fixing the suction head and completing the adjustment of the suction head position.

[0018] Preferably, the suction head includes a moving part and an adsorption part, the moving part is slidably connected to the branch rod, the adsorption part is inserted into the bottom end of the moving part, one end of the adsorption part slides in the moving part along the length direction of the suction head, the adsorption part is vertically arranged, and an adjustment groove is provided on the outer periphery of the adsorption part, an elastic part is provided in the adjustment groove, and both ends of the elastic part are respectively tightly fixed to the side of the adjustment groove away from the branch rod and the nut at the bottom of the branch rod.

[0019] When the chip is placed unsteadily or part of the chip has been deformed, resulting in different heights at multiple sites, when the adsorption part is blocked by a higher point, the corresponding elastic part will be compressed to adjust the bottom height of each adsorption part, which is beneficial to reduce the situation where the bottom of each adsorption part collides with the higher point of the chip and causes damage to the adsorption part.

[0020] In summary, the present invention has the following beneficial technical effects:

[0021] When removing tin, multiple suction heads are respectively aimed at multiple points on the chip, and then the negative pressure device is started to generate negative pressure in the negative pressure device. The negative pressure is transmitted to multiple suction heads arranged on the branch rods through multiple branch pipes connected to the negative pressure device, so that the molten tin on multiple points on the chip is sucked up, which is beneficial to improving the speed and efficiency of chip removal, reducing the heating time required for the same point, and helping to save energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a semiconductor device that can adapt to chips of various sizes.

[0023] Figure 2 yes Figure 1 Enlarged schematic diagram of point A in the middle.

[0024] Figure 3 It is a structural diagram used to illustrate the connecting rod and the branch rod.

[0025] Explanation of the accompanying symbols: 1. Suction head; 2. Connecting rod; 3. Branch rod; 4. Connecting head; 5. Sliding hole; 6. Nut; 7. Moving part; 8. Adsorption part; 9. Adjusting groove; 10. Moving mechanism; 11. Frame. DETAILED DESCRIPTION

[0026] The following is combined with Figure 1-3 The utility model is described in further detail.

[0027] An embodiment of the utility model discloses a semiconductor device that can adapt to chips of various sizes.

[0028] Reference Figure 1 as well as Figure 2 A semiconductor device that can adapt to chips of various sizes includes a frame 11, a moving mechanism 10 and a negative pressure device. The negative pressure device is arranged at the bottom end of the moving mechanism 10, and is characterized in that it also includes a ventilation pipe, a suction head 1, a connecting rod 2 and a branch rod 3. The connecting rod 2 is connected to the negative pressure mechanism. There are multiple branch rods 3, one end of the branch rod 3 is connected to the connecting rod 2, and there are multiple suction heads 1. Each of the multiple suction heads 1 is connected to a branch rod 3. One end of the ventilation pipe is connected to the negative pressure device, and the other end of the ventilation pipe is connected to multiple branch pipes. The multiple branch pipes are respectively connected to multiple suction heads 1, and there is a distance between adjacent suction heads 1.

[0029] After desoldering is complete, the moving mechanism 10 is activated, causing the multiple suction heads 1 connected to the negative pressure device to move directly above the desoldered chip. The connecting rod 2 is then lowered, allowing the multiple suction heads 1 at the end of the connecting rod 2 to move into contact with the chip for easier suction. Spacing between the multiple suction heads 1 allows them to be dispersed across the chip's surface, ensuring the chip is securely attached while simultaneously receiving a pulling force at multiple points on the chip. This helps reduce the possibility of deformation of portions of the chip under its own weight after heating, thereby improving the yield rate of the chip after desoldering.

[0030] The suction end of the negative pressure device is communicated with the hollow inner cavity of the connecting rod 2, and the connecting rod 2 and the branch rod 3 are both metal rods.

[0031] The specific structure of the moving mechanism, the tin removal mechanism, the specific structure of the negative pressure device for providing negative pressure, and the structure of the moving mechanism connected to the frame have been described in the same manner in the published patent 202310630662.6, and will not be repeated here.

[0032] Reference Figure 2 as well as Figure 3 In this embodiment, the connecting rod 2 is hollow and serves as a vent pipe connecting the branch pipe and the negative pressure device.

[0033] The hollow connecting rod 2 serves as a ventilation vent, which prevents the external ventilation vent from being deformed or pulled multiple times when the moving mechanism 10 drives the connecting rod 2 to move, resulting in unstable connection of the connection port of the ventilation vent; reduces the complexity of the structure of the connecting rod 2 caused by setting a ventilation vent inside or outside the connecting rod 2, which is conducive to simplifying the desoldering machine, using existing devices to achieve multi-functions, improving the utilization rate of the connecting rod 2, and improving the compactness of the overall device.

[0034] Reference Figure 2 as well as Figure 3 In this embodiment, the branch rod 3 is partially hollow, and the hollow inner cavity of the branch rod 3 replaces the branch pipe, and the hollow inner cavity of the branch rod 3 is connected to the hollow inner cavity of the connecting rod 2; the branch rod 3 is connected to a hose, and one end of the hose is connected to the suction head 1 and is connected to the suction head 1.

[0035] A hollow inner cavity is opened in the branch rod 3 so that the branch rod 3 can replace the branch pipe. At the same time, the branch rod 3 itself is connected to the connecting rod 2, thereby reducing the connection structure required between the branch pipe and the ventilation pipe, improving the connection stability between the branch pipe and the ventilation pipe, and reducing the occurrence of air leakage.

[0036] Reference Figure 2 as well as Figure 3 In this embodiment, the branch rod 3 is connected to a connector 4, which is connected to the end of the hose away from the suction head 1. The connector 4 and the suction head 1 are both arranged on the corresponding branch rod 3, and the length direction of the connector 4 is consistent with the length direction of the suction head 1.

[0037] When connecting the hose, the two ends of the hose are respectively connected to the end of the connector 4 away from the branch rod 3 and the end of the suction head 1 away from the branch rod 3. Since the length direction of the connector 4 and the suction head 1 is consistent, the directions of the openings at the ends away from the branch rod 3 of the two are consistent, so that the degree of distortion of the hose when connecting the two is reduced, making the hose less likely to be damaged and the connection stability higher.

[0038] Reference Figure 2 as well as Figure 3 In this embodiment, the plurality of branch rods 3 are evenly distributed along the circumference of the connecting rod 2 , and the suction head 1 can move along the length direction of the branch rods 3 .

[0039] When the volume of the chip changes, the suction head 1 on the movable branch rod 3 is adjusted according to the area of ​​the chip facing the suction head 1, and the position of the suction head 1 is adjusted so that the suction head 1 adapts to the volume change of the chip, thereby improving the adaptability of the desoldering machine.

[0040] Reference Figure 2 as well as Figure 3In this embodiment, a sliding hole 5 is opened along the length direction of the branch rod 3, and the outer periphery of the suction head 1 is threadedly connected to two nuts 6. The diameters of the two nuts 6 are larger than the width of the sliding hole 5, and the two nuts 6 are respectively arranged on both sides of the branch rod 3.

[0041] Adjust the two nuts 6 on the outer wall of the suction head 1 so that the two nuts 6 move away from each other, thereby releasing the movement restriction of the suction head 1 and allowing the suction head 1 to move along the length direction of the branch rod 3. Move the suction head 1 so that the suction head 1 moves to a suitable position, then rotate the nuts 6 so that the two nuts 6 move closer to each other, and then the two nuts 6 are clamped on both sides of the branch rod 3, thereby fixing the suction head 1 and completing the adjustment of the position of the suction head 1.

[0042] Reference Figure 2 as well as Figure 3 In this embodiment, the suction head 1 includes a moving part 7 and an adsorption part 8. The moving part 7 is slidably connected to the branch rod 3. The adsorption part 8 is inserted into the bottom end of the moving part 7. One end of the adsorption part 8 slides in the moving part 7 along the length direction of the suction head 1. The adsorption part 8 is vertically arranged. An adjustment groove 9 is provided on the outer periphery of the adsorption part 8. An elastic member is provided in the adjustment groove 9. The two ends of the elastic member are respectively tightly fixed to the side of the adjustment groove 9 away from the branch rod 3 and the nut 6 at the bottom of the branch rod 3.

[0043] When the chip is placed unsteadily or part of the chip has been deformed, resulting in different heights at multiple locations, when the adsorption portion 8 is blocked by a higher point, the corresponding elastic part will be compressed to adjust the bottom height of each adsorption portion 8, which is beneficial to reduce the situation where the bottom of each adsorption portion 8 collides with the higher point of the chip and causes damage to the adsorption portion 8.

[0044] The above are all preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor device that can accommodate chips of various sizes, comprising a frame, a tin removal mechanism for absorbing tin, a moving mechanism, and a negative pressure device, wherein the negative pressure device is provided at the bottom end of the moving mechanism, and is characterized in that: The semiconductor equipment that can adapt to chips of various sizes also includes a ventilation pipe, a suction head, a connecting rod and a branch rod. The connecting rod is connected to the negative pressure mechanism. There are multiple branch rods, one end of the branch rod is connected to the connecting rod, and the suction heads are provided in multiples, each of the multiple suction heads is connected to a branch rod. One end of the ventilation pipe is connected to the negative pressure device, and the other end of the ventilation pipe is connected to multiple branch pipes, and the multiple branch pipes are respectively connected to multiple suction heads, and there is a distance between adjacent suction heads.

2. The semiconductor device adaptable to chips of various sizes according to claim 1, characterized in that: The connecting rod is hollow and serves as a vent pipe connecting the branch pipe and the negative pressure device.

3. The semiconductor device adaptable to chips of various sizes according to claim 2, wherein: The branch rod is partially hollow, the hollow inner cavity of the branch rod replaces the branch pipe, and the hollow inner cavity of the branch rod is connected to the hollow inner cavity of the connecting rod; the branch rod is connected to a hose, one end of which is connected to the suction head and is connected to the suction head.

4. The semiconductor device adaptable to chips of various sizes according to claim 3, wherein: The branch rod is connected to a connector, which is connected to an end of the hose away from the suction head. The connector and the suction head are both arranged on the corresponding branch rods, and the length direction of the connector is consistent with the length direction of the suction head.

5. The semiconductor device adaptable to chips of various sizes according to claim 3, wherein: The plurality of branch rods are evenly distributed along the circumference of the connecting rod, and the suction head can move along the length direction of the branch rods.

6. The semiconductor device adaptable to chips of various sizes according to claim 5, characterized in that: The branch rod is provided with a sliding hole along its length direction. The outer periphery of the suction head is threadedly connected to two nuts. The diameters of the two nuts are larger than the width of the sliding hole. The two nuts are respectively arranged on both sides of the branch rod.

7. The semiconductor device adaptable to chips of various sizes according to claim 6, wherein: The suction head includes a moving part and an adsorption part. The moving part is slidably connected to the branch rod. The adsorption part is inserted into the bottom end of the moving part. One end of the adsorption part slides in the moving part along the length direction of the suction head. The adsorption part is vertically arranged. An adjustment groove is provided on the outer periphery of the adsorption part. An elastic member is provided in the adjustment groove. The two ends of the elastic member are respectively tightly fixed to the side of the adjustment groove away from the branch rod and the nut at the bottom of the branch rod.

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