Grinding wheel and grinding and polishing equipment

Abstract

The utility model provides a grinding wheel and grinding and polishing equipment, and the grinding wheel comprises a shell, an outer polishing wheel assembly and an inner grinding wheel assembly which are coaxially arranged, the shell is provided with a connecting part used for being connected with the linear driving device. The outer polishing wheel assembly comprises a joint sleeve and an annular outer polishing wheel; the inner grinding wheel assembly comprises a main shaft and an inner grinding wheel which are connected, one end of the main shaft penetrates out of the shell and is used for being connected with a rotary driving device, the inner grinding wheel is arranged in an annular shape of the outer polishing wheel, and the outer polishing wheel is connected with the inner grinding wheel through a key. When the grinding wheel is in the first working state, the inner grinding wheel protrudes out of the outer polishing wheel, and the inner grinding wheel assembly is driven by the rotary driving device to rotate, so that the inner grinding wheel grinds a wafer; and in the second working state, the linear driving device drives the outer polishing wheel assembly to move downwards, so that the outer polishing wheel protrudes out of the inner grinding wheel, the inner grinding wheel assembly is driven to rotate through the rotary driving device, the outer polishing wheel assembly is driven to rotate through key connection, and the wafer is ground through the outer polishing wheel.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding and polishing equipment, in particular to a grinding wheel and a grinding and polishing equipment. Background Art

[0002] Wafers are the basic raw materials for manufacturing semiconductor devices. Before integrated circuit packaging, the wafer substrate needs to be thinned. The wafer thinning process includes grinding and polishing. Currently, grinding and polishing generally involves rapid thinning through rough grinding, followed by fine grinding and polishing with polishing liquid cleaning. The grinding and polishing processes are performed separately. For example, the semiconductor wafer thinning and polishing machine disclosed in patent CN117047636A has a rough grinding mechanism and a fine grinding mechanism respectively. The wafer is first sent to the rough grinding mechanism for rough grinding, and then transferred to the fine grinding mechanism for fine grinding and polishing. The operation is relatively cumbersome, and the wafer is easily damaged during the transfer process, resulting in surface scratches and edge bumps. In addition, the separate rough grinding mechanism and fine grinding mechanism make the grinding and polishing equipment structure cumbersome and the equipment cost high.

[0003] In view of this, the applicant filed this application after studying the existing technology. Utility Model Content

[0004] The utility model provides a grinding wheel and a grinding and polishing device, aiming to improve at least one of the above technical problems.

[0005] In order to solve the above technical problems, the utility model provides a grinding wheel, comprising a coaxially arranged outer shell, an outer throwing wheel assembly and an inner grinding wheel assembly;

[0006] The housing is provided with a connecting portion for connecting to the linear drive device;

[0007] The outer throwing wheel assembly includes a sleeve and an annular outer throwing wheel, one end of the sleeve is rotatably connected to the housing, and the other end is connected to the outer throwing wheel, and the inner side wall of the outer throwing wheel is provided with a plurality of connecting grooves;

[0008] The inner grinding wheel assembly includes a main shaft and an inner grinding wheel. The main shaft passes through the sleeve and the outer shell, one end of which is used to connect to the rotation drive device, and the other end is connected to the inner grinding wheel. The inner grinding wheel is placed in the ring of the outer polishing wheel, and its outer side wall is provided with a connecting key adapted to the connecting groove;

[0009] The grinding wheel is constructed as follows: the outer shell can drive the outer throwing wheel assembly to reciprocate along the axial direction of the main shaft under the drive of the linear drive device. In the first working state, the inner grinding wheel protrudes from the outer throwing wheel, and the inner grinding wheel assembly is driven to rotate by the rotary drive device, so that the inner grinding wheel grinds the wafer; in the second working state, the outer throwing wheel assembly is driven downward, so that the outer throwing wheel protrudes from the inner grinding wheel, and the inner grinding wheel assembly is driven to rotate by the rotary drive device, and the outer throwing wheel assembly is driven to rotate by the cooperation of the connecting key and the connecting groove, so that the outer throwing wheel grinds the wafer.

[0010] As a further optimization, the outer throwing wheel assembly also includes a first bearing, and the sleeve is rotatably connected to the outer shell through the first bearing.

[0011] As a further optimization, the inner grinding wheel assembly further includes a second bearing, which is placed between the sleeve and the main shaft. The second bearing has a clearance fit with the sleeve and an interference fit with the main shaft.

[0012] As a further optimization, an annular sealing cover is provided at the bottom of the shell.

[0013] As a further optimization, the inner grinding wheel and the main shaft, and the outer grinding wheel and the sleeve are all connected by bolts and nuts.

[0014] As a further optimization, a first abrasive placement groove is provided on the inner grinding wheel.

[0015] As a further optimization, a second abrasive placement groove is provided on the outer polishing wheel.

[0016] As a further optimization, the connecting portion is arranged on the outer side wall of the shell.

[0017] The present application further provides a grinding and polishing device, comprising any one of the grinding wheels described above.

[0018] By adopting the above technical solution, the utility model can achieve the following technical effects:

[0019] The outer grinding wheel assembly is connected to the outer grinding wheel assembly through the outer gear and the outer gear is connected to the outer gear by the outer gear. The grinding wheel of the present application can realize integrated grinding and polishing. After the wafer is roughly ground and thinned, the outer polishing wheel only needs to be driven downward by the linear drive device to continue fine grinding and polishing the wafer without transferring the wafer. At the same time, it can simplify the structure of the grinding and polishing equipment and save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a cross-sectional view of a grinding wheel of the present utility model;

[0022] Figure 2 This is an exploded view of a grinding wheel of the present utility model;

[0023] Figure 3 This is a structural diagram of a grinding wheel of the utility model;

[0024] Figure 4 This is a connection diagram of a grinding wheel of the utility model;

[0025] Markings in the figure: 1-housing; 11-connecting part; 12-cover; 2-sleeve; 21-first bearing; 3-outer throwing wheel; 31-connecting groove; 32-second abrasive placement groove; 33-abrasive; 4-spindle; 41-second bearing; 5-inner grinding wheel; 52-first abrasive placement groove; 51-connecting key; 6-bolt; 7-nut; 8-linear push electric cylinder; 9-rotating motor. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] Example 1

[0028] Reference Figures 1 to 3 As shown, an embodiment of the present invention provides a grinding wheel, including an outer shell 1, an outer throwing wheel assembly and an inner grinding wheel assembly, which are coaxially arranged and arranged radially from outside to inside; the outer shell 1 is provided with a connecting portion 11 on the outer wall for connecting to a linear drive device; the outer throwing wheel assembly includes a sleeve 2 and an annular outer throwing wheel 3, one end of the sleeve 2 is rotatably connected to the outer shell 1, and the other end is fixedly connected to the outer throwing wheel 3, and the inner side wall of the outer throwing wheel 3 is provided with a plurality of connecting grooves 31; the inner grinding wheel assembly includes a main shaft 4 and an inner grinding wheel 5, the main shaft 4 passes through the sleeve 2 and the outer shell 1, one end of the main shaft 4 is used to connect to the rotation drive device, and the other end is connected to the inner grinding wheel 5, and the inner grinding wheel 5 is placed in the annular area of ​​the outer throwing wheel 3, and a connecting key 51 is provided on its outer wall that is compatible with the connecting groove 31, so that the outer throwing wheel 3 and the inner grinding wheel 5 can transmit rotational motion through the key connection, and there is no vertical mechanical position restriction between the connecting groove 31 and the connecting key 51, so that the connecting key 51 can slide up and down in the connecting groove 31.

[0029] The grinding wheel is constructed as follows: the outer shell 1 can drive the outer throwing wheel assembly to reciprocate along the axial direction of the main shaft 4 under the drive of the linear drive device. In the first working state, the position of the inner grinding wheel 5 protrudes from the outer throwing wheel 3, and the inner grinding wheel assembly is driven to rotate by the rotary drive device, so that the inner grinding wheel 5 grinds the wafer; in the second working state, the outer shell 1 is driven downward by the linear drive device, and drives the outer throwing wheel assembly downward, so that the outer throwing wheel 3 protrudes from the inner grinding wheel 5, and the inner grinding wheel assembly is driven to rotate by the rotary drive device, and the outer throwing wheel assembly is driven to rotate by the cooperation of the connecting key 51 and the connecting groove 31, so that the outer throwing wheel 3 grinds the wafer.

[0030] In this embodiment, preferably, the inner grinding wheel 5 is a coarse grinding wheel for rough grinding and rapid thinning of the wafer, and the outer throwing wheel 3 is a fine grinding wheel for fine grinding and polishing the wafer. During rough grinding, the inner grinding wheel 5 protrudes from the outer throwing wheel 3, so the outer throwing wheel 5 does not contact the wafer, and only the inner grinding wheel 5 performs rough grinding and thinning on the wafer; after thinning is completed, the linear drive device drives the outer shell to drive the outer throwing wheel assembly to move downward, so that the outer throwing wheel 3 protrudes from the inner grinding wheel 5. At this time, the inner grinding wheel 5 does not contact the wafer, and only the outer throwing wheel 3 performs fine grinding and polishing on the wafer. The present application drives the outer throwing wheel assembly to slide up and down along the main shaft 4 through the linear drive device, so that the grinding wheel can switch between two working states, thereby realizing integrated grinding and polishing. The two processes of rough grinding and fine grinding can be completed at the same workstation, without the need to transfer the wafer, simplifying the processing process, and reducing the damage to the wafer during the transfer process. At the same time, it can simplify the equipment structure and save equipment costs.

[0031] Furthermore, the outer throwing wheel assembly also includes a first bearing 21, and the sleeve 2 and the housing 1 are rotatably connected through the first bearing 21.

[0032] Furthermore, the inner grinding wheel assembly also includes a second bearing 41, which is placed between the sleeve 2 and the main shaft 4. The second bearing 41 has a clearance fit with the sleeve 3 and an interference fit with the main shaft 4. The provision of the second bearing 41 reduces friction between the main shaft 4 and the sleeve 2.

[0033] Furthermore, an annular cover 12 is provided at the bottom of the housing 1. By providing the cover 12, it is possible to prevent debris or polishing fluid from splashing into the grinding wheel during the grinding process.

[0034] Furthermore, the inner grinding wheel 5 and the main shaft 4, as well as the outer grinding wheel 3 and the sleeve 2 are connected by bolts 6 and nuts 7.

[0035] Reference Figure 3 As shown, the inner grinding wheel 5 is provided with a first abrasive placement groove 52; the outer polishing wheel 3 is provided with a second abrasive placement groove 32, and the abrasive 33 is placed in the abrasive placement groove. By setting the abrasive placement groove, different types of abrasives can be easily replaced to meet the grinding requirements of different material products, making the grinding wheel more applicable.

[0036] Example 2

[0037] The present application further provides a grinding device, comprising any one of the grinding wheels described above, with reference to Figure 4As shown, the linear drive device of the grinding equipment can use a linear electric cylinder 8, and the rotary drive device can use a rotary motor 9. The linear electric cylinder 8 and the rotary motor 9 are fixedly connected to the grinding equipment, the main shaft 4 of the grinding wheel is connected to the drive part of the rotary motor 9, and the connecting part 1 of the housing 1 is connected to the drive part of the linear electric cylinder 8. The outer grinding wheel assembly is driven up and down along the main shaft 4 by the linear electric cylinder, and the inner grinding wheel assembly is driven to rotate by the rotary motor 9.

[0038] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A grinding wheel, characterized in that: It includes a coaxially arranged housing, an outer throwing wheel assembly and an inner grinding wheel assembly; The housing is provided with a connecting portion for connecting to the linear drive device; The outer throwing wheel assembly includes a sleeve and an annular outer throwing wheel, one end of the sleeve is rotatably connected to the housing, and the other end is connected to the outer throwing wheel, and the inner side wall of the outer throwing wheel is provided with a plurality of connecting grooves; The inner grinding wheel assembly includes a main shaft and an inner grinding wheel. The main shaft passes through the sleeve and the outer shell, one end of which is used to connect to the rotation drive device, and the other end is connected to the inner grinding wheel. The inner grinding wheel is placed in the ring of the outer polishing wheel, and its outer side wall is provided with a connecting key adapted to the connecting groove; The grinding wheel is constructed as follows: the outer shell can drive the outer throwing wheel assembly to reciprocate along the axial direction of the main shaft under the drive of the linear drive device. In the first working state, the inner grinding wheel protrudes from the outer throwing wheel, and the inner grinding wheel assembly is driven to rotate by the rotary drive device, so that the inner grinding wheel grinds the wafer; in the second working state, the outer throwing wheel assembly is driven downward, so that the outer throwing wheel protrudes from the inner grinding wheel, and the inner grinding wheel assembly is driven to rotate by the rotary drive device, and the outer throwing wheel assembly is driven to rotate by the cooperation of the connecting key and the connecting groove, so that the outer throwing wheel grinds the wafer.

2. A grinding wheel according to claim 1, characterized in that The outer throwing wheel assembly also includes a first bearing, and the sleeve is rotatably connected to the outer shell through the first bearing.

3. A grinding wheel according to claim 1, characterized in that The inner grinding wheel assembly also includes a second bearing, which is placed between the sleeve and the main shaft. The second bearing has a clearance fit with the sleeve and an interference fit with the main shaft.

4. A grinding wheel according to claim 1, characterized in that , an annular sealing cover is provided at the bottom of the shell.

5. A grinding wheel according to claim 1, characterized in that The inner grinding wheel and the main shaft, the outer grinding wheel and the sleeve are all connected by bolts and nuts.

6. A grinding wheel according to claim 1, characterized in that , a first abrasive placement groove is provided on the inner grinding wheel.

7. A grinding wheel according to claim 1, characterized in that , a second abrasive placement groove is provided on the outer polishing wheel.

8. A grinding wheel according to claim 1, characterized in that , the connecting portion is arranged on the outer side wall of the shell.

9. A grinding and polishing equipment, characterized in that , including the grinding wheel described in any one of claims 1-8.

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