Repeated closing die for circuit board

Abstract

The utility model discloses a circuit board repeated closing die which comprises a lower die base, the upper surface of the lower die base is fixedly connected with a bottom cylinder, the inner bottom wall of the bottom cylinder is fixedly connected with an inner spring, the top end of the inner spring is fixedly connected with a piston block, the upper surface of the piston block is fixedly connected with a piston column, and the piston column is fixedly connected with a piston rod. The top end of the piston column is fixedly connected with an installation table, the top end of the installation table is fixedly connected with an upper die base, the repeated closing die for the circuit board is placed on a press machine, a circuit board is placed on the lower die base, the limiting pin is inserted into a hole in the circuit board, positioning is carried out, the upper die base moves downwards during machining, the upper die base moves downwards, and the upper die base moves downwards. And after machining is completed, the press machine is reset, the inner spring and the outer spring are reset, the upper die base is reset, the machined circuit board and waste are taken out for next machining, and therefore the reset performance of the die can be effectively guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of composite molds, in particular to a reverse composite mold for a circuit board. Background Art

[0002] A compound die is a punching die that can complete multiple processes simultaneously in one stroke of the press. The compound die is a special design that combines another die component with a normal die, so that the two types of dies are combined on the same PCB board at the end of stamping. The reverse compound die is divided into upper and lower die groups.

[0003] After searching, it was found that a reverse composite mold for circuit boards was disclosed in the Chinese Utility Model Patent Publication No. CN209078899U. The reverse composite mold for circuit boards has a good reset effect during the stamping process. After the stamping is completed, the entire mold is flat, which greatly reduces the working hours and improves production efficiency. However, using only the first glue cannot solve the mold reset problem. The first glue will gradually lose its elasticity due to temperature, usage time, etc., and cannot assist in mold reset. Therefore, a mold with an auxiliary mold reset structure is needed. Utility Model Content

[0004] The main purpose of the utility model is to provide a reverse composite mold for a circuit board, which can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A reverse composite mold for a circuit board includes a lower mold base, the upper surface of the lower mold base is fixedly connected to a bottom cylinder, the inner bottom wall of the bottom cylinder is fixedly connected to an inner spring, the top end of the inner spring is fixedly connected to a piston block, the upper surface of the piston block is fixedly connected to a piston column, the top end of the piston column is fixedly connected to a mounting platform, and the top end of the mounting platform is fixedly connected to an upper mold base.

[0007] In order to achieve the effect of limiting the moving position of the piston block, as a reverse composite mold for a circuit board of the utility model, the inner wall of the bottom cylinder is fixedly connected to a limiting ring, and the lower surface of the mounting platform is fixedly connected to an external spring.

[0008] In order to achieve the effect of conveniently limiting the position of the circuit board sheet, as a reverse composite mold for the circuit board of the utility model, the upper surface of the lower mold base is fixedly connected to the inner mold base, and the upper surface of the inner mold base is fixedly connected to the limiting pin.

[0009] In order to achieve the effect of installing the stopper, as a reverse composite mold for a circuit board of the utility model, the front surface of the inner mold base is provided with a mounting groove, and the inner wall of the mounting groove is provided with a stopper.

[0010] In order to achieve the effect of limiting the installation position of the stopper, as a reverse composite mold for a circuit board of the utility model, the inner wall of the installation groove is fixedly connected with a protrusion, and the side surface of the stopper is provided with a groove.

[0011] In order to facilitate the removal of the stopper, as a reverse composite mold for a circuit board of the present invention, a handle groove is opened on the front of the stopper, and an inserting block is fixedly connected to the inner bottom wall of the installation groove.

[0012] In order to achieve the effect of punching in conjunction with the punching column, as a reverse composite mold for a circuit board of the utility model, the inner bottom wall of the inner mold base is fixedly connected with an elastic block, and the upper surface of the elastic block is provided with a bottom hole.

[0013] In order to achieve the effect of connecting the upper mold base and the mounting platform, as a reverse composite mold for a circuit board of the utility model, a fixing hole is opened on the lower surface of the upper mold base, a punching block is fixedly connected to the lower surface of the upper mold base, and a punching column is fixedly connected to the lower surface of the punching block.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The circuit board uses a reverse composite mold. Through the arrangement of the lower mold base, bottom cylinder, inner spring, piston block, piston column, mounting platform, upper mold base, limit collar and outer spring, the mold is placed on the press, the circuit board plate is placed on the lower mold base, and the limit pin is inserted into the hole on the circuit board plate for positioning. During processing, the upper mold base moves downward, so that the piston block under the piston column compresses the inner spring, and the mounting platform compresses the outer spring. After the processing is completed, the press is reset, the inner spring and the outer spring are reset, so that the upper mold base is reset, the processed circuit board and waste are taken out, and preparations are made for the next processing, thereby effectively ensuring the reset performance of the mold.

[0016] 2. The circuit board uses a reverse composite mold. Through the setting of the installation groove, stopper, inserting block, protrusion, groove and handle groove, when taking out the formed circuit board, after the upper mold base is reset, the stopper is removed from the installation groove, so that the front of the circuit board is exposed. Then the circuit board can be directly taken out and the inserting block is installed back into the installation groove; through the setting of the elastic block, bottom hole, punching block and punching column, the hole can be directly processed while processing the appearance of the circuit board, avoiding multiple processing of the circuit board material. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a reverse composite mold for a circuit board according to Example 1 of the utility model;

[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of a reverse composite mold for a circuit board according to Example 1 of the present utility model;

[0019] Figure 3 This is a schematic cross-sectional structure diagram of a reverse composite mold for a circuit board as viewed from the right side of Example 1 of the utility model;

[0020] Figure 4 This is a schematic diagram of the explosion structure of a stopper in a reverse composite mold for a circuit board according to Example 1 of the utility model;

[0021] Figure 5 This is a schematic diagram of the axonometric structure of an upper die seat in a reverse composite die for a circuit board according to Example 1 of the present utility model;

[0022] Figure 6 This is a schematic diagram of the explosion structure of a piston column in a reverse composite mold for a circuit board according to Example 1 of the utility model.

[0023] In the figure: 1. Lower die base; 2. Bottom cylinder; 3. Inner spring; 4. Piston block; 5. Piston column; 6. Mounting platform; 7. Upper die base; 8. Limiting collar; 9. Outer spring; 10. Inner die base; 11. Limiting pin; 12. Mounting groove; 13. Stop block; 14. Insert block; 15. Protrusion; 16. Groove; 17. Handle groove; 18. Elastic block; 19. Bottom hole; 20. Fixing hole; 21. Punching block; 22. Punching column. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example 1

[0026] like Figure 1-6 As shown, a reverse composite mold for a circuit board includes a lower mold base 1, the upper surface of the lower mold base 1 is fixedly connected to a bottom cylinder 2, the inner bottom wall of the bottom cylinder 2 is fixedly connected to an inner spring 3, the top end of the inner spring 3 is fixedly connected to a piston block 4, the upper surface of the piston block 4 is fixedly connected to a piston column 5, the top end of the piston column 5 is fixedly connected to a mounting platform 6, and the top end of the mounting platform 6 is fixedly connected to an upper mold base 7.

[0027] When in use, through the arrangement of the lower die base 1, bottom cylinder 2, inner spring 3, piston block 4, piston column 5, mounting platform 6, upper die base 7, limiting collar 8 and outer spring 9, the bottom end of the bottom cylinder 2 is fixed on the lower die base 1, and the mounting platform 6 at the top end of the piston column 5 in the bottom cylinder 2 is inserted into the fixing hole 20 of the upper die base 7, so that the lower die base 1 and the upper die base 7 are connected, the piston block 4 and the inner bottom wall of the bottom cylinder 2 are connected by the inner spring 3, and the mounting platform 6 and the lower die base 1 are connected by the outer spring 9. When the shape and hole are formed, the mold is placed on the press, the circuit board sheet is placed on the lower mold base 1, and the limit pin 11 is inserted into the hole on the circuit board sheet for positioning. During processing, the upper mold base 7 moves downward, so that the piston column 5 and the lower piston block 4 compress the inner spring 3, and the mounting platform 6 compresses the outer spring 9. After the processing is completed, the press is reset, the inner spring 3 and the outer spring 9 are reset, so that the upper mold base 7 is reset, and the processed circuit board and waste are taken out to prepare for the next processing, thereby effectively ensuring the reset performance of the mold.

[0028] In this embodiment, a limiting collar 8 is fixedly connected to the inner wall of the bottom tube 2 , and an outer spring 9 is fixedly connected to the lower surface of the mounting platform 6 .

[0029] During specific use, the position of the piston block 4 is limited by the setting of the limiting collar 8.

[0030] In this embodiment, the upper surface of the lower mold base 1 is fixedly connected to the inner mold base 10 , and the upper surface of the inner mold base 10 is fixedly connected to the limiting pin 11 .

[0031] During specific use, the position of the circuit board can be conveniently limited by setting the limiting pin 11.

[0032] In this embodiment, a mounting groove 12 is formed on the front surface of the inner mold base 10 , and a stopper 13 is provided on the inner wall of the mounting groove 12 .

[0033] During specific use, the stopper 13 is installed through the setting of the installation groove 12.

[0034] In this embodiment, a protrusion 15 is fixedly connected to the inner wall of the installation groove 12 , and a groove 16 is formed on the side surface of the stopper 13 .

[0035] During specific use, the installation position of the stopper 13 is limited by the arrangement of the protrusion 15 and the groove 16 .

[0036] In this embodiment, a handle groove 17 is formed on the front surface of the stopper 13 , and an inserting block 14 is fixedly connected to the inner bottom wall of the installation groove 12 .

[0037] During specific use, the handle groove 17 is provided to facilitate taking out the stopper 13 .

[0038] In this embodiment, an elastic block 18 is fixedly connected to the inner bottom wall of the inner mold base 10 , and a bottom hole 19 is formed on the upper surface of the elastic block 18 .

[0039] During specific use, the bottom hole 19 is provided in cooperation with the punching column 22 to perform punching.

[0040] In this embodiment, a fixing hole 20 is formed on the lower surface of the upper die base 7 , a punching block 21 is fixedly connected to the lower surface of the upper die base 7 , and a punching column 22 is fixedly connected to the lower surface of the punching block 21 .

[0041] During specific use, the upper die base 7 and the mounting platform 6 are connected through the setting of the fixing hole 20 .

[0042] Working principle: When the mold is processing the shape and holes of the circuit board, the mold is placed on the press, the circuit board plate is placed on the lower die base 1, and the limit pin 11 is inserted into the hole on the circuit board plate for positioning. During processing, the upper die base 7 moves downward, so that the piston column 5 and the lower piston block 4 compress the inner spring 3, and the mounting platform 6 compresses the outer spring 9. After the processing is completed, the press is reset, the inner spring 3 and the outer spring 9 are reset, so that the upper die base 7 is reset, and the processed circuit board and waste are taken out to prepare for the next processing.

[0043] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A reverse composite mold for a circuit board, comprising a lower mold base (1), characterized in that: The upper surface of the lower die base (1) is fixedly connected to a bottom cylinder (2), the inner bottom wall of the bottom cylinder (2) is fixedly connected to an inner spring (3), the top end of the inner spring (3) is fixedly connected to a piston block (4), the upper surface of the piston block (4) is fixedly connected to a piston column (5), the top end of the piston column (5) is fixedly connected to a mounting platform (6), and the top end of the mounting platform (6) is fixedly connected to an upper die base (7).

2. The reverse composite mold for a circuit board according to claim 1, characterized in that: The inner wall of the bottom cylinder (2) is fixedly connected to a limiting collar (8), and the lower surface of the mounting platform (6) is fixedly connected to an outer spring (9).

3. The reverse composite mold for a circuit board according to claim 1, characterized in that: The upper surface of the lower die base (1) is fixedly connected to an inner die base (10), and the upper surface of the inner die base (10) is fixedly connected to a limiting pin (11).

4. The reverse composite mold for a circuit board according to claim 3, characterized in that: A mounting groove (12) is provided on the front surface of the inner mold base (10), and a stopper (13) is provided on the inner wall of the mounting groove (12).

5. The reverse composite mold for a circuit board according to claim 4, characterized in that: A protrusion (15) is fixedly connected to the inner wall of the installation groove (12), and a groove (16) is formed on the side surface of the stopper (13).

6. The reverse composite mold for a circuit board according to claim 4, characterized in that: A handle groove (17) is provided on the front of the stopper (13), and an inserting block (14) is fixedly connected to the inner bottom wall of the installation groove (12).

7. The reverse composite mold for a circuit board according to claim 3, characterized in that: An elastic block (18) is fixedly connected to the inner bottom wall of the inner mold base (10), and a bottom hole (19) is formed on the upper surface of the elastic block (18).

8. The reverse composite mold for a circuit board according to claim 1, characterized in that: A fixing hole (20) is provided on the lower surface of the upper die seat (7), a punching block (21) is fixedly connected to the lower surface of the upper die seat (7), and a punching column (22) is fixedly connected to the lower surface of the punching block (21).

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