Printing device and silicon wafer printing equipment

Abstract

The utility model discloses a printing device and silicon wafer printing equipment, and belongs to the technical field of silicon wafer printing. According to the technical scheme, the printing device comprises a screen printing plate, an ink jet mechanism and a scraper, and the screen printing plate is provided with a plurality of grooves; the ink jet mechanism is movably arranged above the screen printing plate and is used for spraying printing paste on the screen printing plate; the scraper is movably arranged above the screen printing plate, a groove is formed in the side, facing the screen printing plate, of the scraper to form a protrusion, and the protrusion is matched with a groove of the screen printing plate. The scraper is movably arranged above the screen printing plate, and the side, facing the screen printing plate, of the scraper is slotted to form the protrusion matched with the groove of the screen printing plate, so that the printing time can be shortened, and the silicon wafer printing efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the field of silicon wafer printing technology, and in particular relates to a printing device and silicon wafer printing equipment. Background Art

[0002] During battery production, electrodes are printed on silicon wafers using a screen printing device. Commonly used screen printing devices typically include a scraper assembly and an ink blade assembly. When printing on a silicon wafer, the scraper assembly first presses down to scrape the ink. After scraping, the scraper assembly rises, and the ink blade assembly descends in reverse to return the ink. However, manual wiping of the screen is often required, increasing time and reducing efficiency. The screen also has a short lifespan, impacting both production and efficiency. Furthermore, screen-printed electrodes exhibit poor shape, impacting current collection capabilities, leaving room for improvement. Utility Model Content

[0003] The present application aims to at least solve the technical problem of low silicon wafer printing efficiency in the related art. To this end, the present application proposes a printing device and a silicon wafer printing apparatus that can shorten printing time and improve silicon wafer printing efficiency.

[0004] In a first aspect, the present application provides a printing device, comprising:

[0005] a screen having a plurality of grooves;

[0006] an inkjet mechanism, movably disposed above the screen, for spraying printing paste onto the screen;

[0007] A scraper is movably arranged above the screen, and the scraper is grooved on one side of the screen to form a protrusion, and the protrusion matches the groove of the screen.

[0008] By movably arranging the scraper above the screen, and slotting the scraper toward one side of the screen to form the protrusion matching the groove of the screen, the printing time can be shortened and the silicon wafer printing efficiency can be improved.

[0009] According to one embodiment of the present application, the scraper is configured to move between a first position and a second position, and the inkjet mechanism moves between a third position and a fourth position. When the inkjet mechanism is in the third position and the scraper is in the second position, the protrusion is in contact with the side wall of the groove.

[0010] When the scraper is located at the first position and the inkjet mechanism moves between the third position and the fourth position, the protrusion does not fit the side wall of the groove.

[0011] By precisely controlling the motion path and positional relationship of the scraper and the inkjet mechanism, precise control during the printing process can be achieved.

[0012] According to one embodiment of the present application, the screen is provided with a boss, and the scraper forms a gap with the boss at the second position, and the gap is used to accommodate the printing paste.

[0013] The boss on the screen and the gap formed between the scraper and the boss when the scraper is in the second position can improve the quality and efficiency of printing.

[0014] According to one embodiment of the present application, when the scraper is located at the second position, the distance between the protrusion and the lower surface of the screen is the same as the thickness of the grid line.

[0015] By precisely controlling the distance between the scraper and the lower surface of the screen, the printing paste on the silicon wafer can be evenly distributed, thereby improving the accuracy and consistency of printing.

[0016] According to one embodiment of the present application, a plurality of slurry outlets are provided on a side of the inkjet mechanism facing the screen.

[0017] By using the plurality of slurry outlets simultaneously or sequentially, the inkjet mechanism can significantly improve printing speed and efficiency. In addition, the plurality of slurry outlets can also reduce downtime during the printing process and improve overall production efficiency.

[0018] According to one embodiment of the present application, the slurry outlet is located above the groove, and the slurry outlet corresponds to the groove one-to-one.

[0019] The slurry outlet is located above the groove, and the layout in which each outlet corresponds to one groove is conducive to the smooth discharge and reception of the slurry.

[0020] According to one embodiment of the present application, the cross-sections of the protrusion and the groove are both inverted trapezoidal.

[0021] When the cross-sections of the protrusion and the groove are both inverted trapezoidal, they are usually used to provide a specific assembly relationship to achieve a specific effect.

[0022] According to one embodiment of the present application, the groove extends along the width direction of the screen.

[0023] According to one embodiment of the present application, the length of the groove is smaller than the width of the screen.

[0024] The groove extends along the width direction of the screen, and the length of the groove is smaller than the width of the screen, which can provide a basis for the arrangement of the boss.

[0025] In a second aspect, the present application provides a silicon wafer printing device, comprising:

[0026] The printing device as described in any one of the above is used for printing silicon wafers;

[0027] A drying device for drying printed silicon wafers;

[0028] The silicon wafer transport device is connected between the printing device and the drying device.

[0029] The silicon wafer printing equipment can realize precise printing, drying and transportation operations on the silicon wafer by integrating multiple functional units such as the printing device, the drying device and the silicon wafer transportation device.

[0030] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0032] Figure 1 is a schematic structural diagram of a printing device provided in an embodiment of the present application;

[0033] Figure 2 This is a schematic structural diagram of a scraper for a printing device provided in an embodiment of the present application;

[0034] Figure 3 This is a schematic structural diagram of a screen printing device provided in an embodiment of the present application;

[0035] Figure 4 It is a structural schematic diagram of the inkjet mechanism of the printing device provided in an embodiment of the present application.

[0036] Reference numerals:

[0037] Printing device 10;

[0038] Screen 110, groove 111, boss 112;

[0039] Inkjet mechanism 120, slurry outlet 121, robotic arm 122;

[0040] Scraper 130 , protrusion 131 . DETAILED DESCRIPTION

[0041] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0042] The present application aims to at least solve the technical problem of low silicon wafer printing efficiency in the related art. To this end, the present application proposes a printing device and a silicon wafer printing apparatus that can shorten printing time and improve silicon wafer printing efficiency.

[0043] Reference below Figures 1-4 A printing device 10 according to an embodiment of the present application is described.

[0044] like Figure 1 As shown, the printing device 10 includes: a screen 110, an inkjet mechanism 120, and a scraper 130. The screen 110 is provided with a plurality of grooves 111 for positioning the grid lines during printing. The inkjet mechanism 120 is movably disposed above the screen 110 for spraying printing paste onto the screen 110. The scraper 130 is movably disposed above the screen 110. The scraper 130 is grooved toward one side of the screen 110 to form a protrusion 131, which matches the groove 111 of the screen 110.

[0045] The screen 110 is mainly used for positioning the grid line printing. The multiple grooves 111 on the screen 110 are mainly set according to the grid lines to be printed, and play a role in positioning and guiding so that the printing paste is distributed according to a predetermined pattern or line. At the same time, the material of the screen 110 will also affect the printing effect of the printing paste. The material of the screen 110 can be metal, plastic or fiber, etc.

[0046] Exemplarily, the screen 110 can be a steel plate, which has high hardness and strength, can withstand greater printing pressure and wear, and is not easily deformed. It can maintain stable printing accuracy and pattern clarity, and is not prone to blurring or deformation. It is suitable for high-precision printing occasions.

[0047] The inkjet mechanism 120 is arranged above the screen 110 and moves at a uniform speed along the width direction of the screen 110, spraying the printing paste on the screen 110 while moving. The inkjet mechanism 120 is also equipped with a control system to keep the spraying amount, speed and position of the printing paste stable. In addition, the inkjet mechanism 120 can also have multiple spraying modes to adapt to different printing needs.

[0048] The scraper 130 is also arranged above the screen 110. Unlike the inkjet mechanism 120, the scraper 130 moves along the height direction of the screen 110 and contacts the screen 110 when pressed down. The printing paste sprayed by the inkjet mechanism 120 is printed on the silicon wafer. At the same time, the scraper 130 performs a groove operation toward one side of the screen 110 to form a protrusion 131 that matches the groove 111 of the screen 110. These protrusions 131 can remove excess printing paste when the scraper 130 is pressed down, thereby controlling the thickness of the printed grid lines, which helps to improve the clarity and accuracy of printing.

[0049] During battery production, electrodes need to be printed on silicon wafers using a screen printing device 10. The inventors have discovered that in related art, commonly used screen printing devices 10 typically include a scraper 130 assembly and an ink knife assembly. When printing on a silicon wafer, the scraper 130 assembly first presses down to scrape the ink. After scraping, the scraper 130 assembly rises, and the ink knife assembly descends in reverse to return the ink. However, manual wiping of the screen 110 is often required, increasing time consumption and reducing efficiency. Furthermore, the screen 110 has a short lifespan, impacting both production and efficiency. Furthermore, the electrodes printed on the screen 110 have poor shape, impacting current collection capabilities, leaving room for improvement.

[0050] Based on the above considerations, in order to solve the problem of low silicon wafer printing efficiency, the inventors conducted in-depth research and designed a printing device 10. In the printing device 10 with this structure, the inkjet mechanism 120 can move horizontally above the screen 110, and the scraper 130 only moves up and down above the screen 110. There is no need to manually wipe the screen 110, which shortens the printing time and solves the problem of low silicon wafer printing efficiency.

[0051] According to the printing device 10 provided in an embodiment of the present application, by movably setting the scraper 130 above the screen 110, and slotting the scraper 130 toward one side of the screen 110 to form a protrusion 131 that matches the groove 111 of the screen 110, the printing time can be shortened and the silicon wafer printing efficiency can be improved.

[0052] In some embodiments, as Figure 1 As shown, the scraper 130 is configured to move between a first position and a second position, and the inkjet mechanism 120 moves between a third position and a fourth position.

[0053] At the first position, the scraper 130 hovers above the screen 110. At the second position, the scraper 130 contacts the screen 110, and the protrusion 131 of the scraper 130 extends into the groove 111 of the screen 110 to perform printing operations. At the third position, the inkjet mechanism 120 is located at one edge of the screen 110, and the inkjet mechanism 120 does not interfere with the scraper 130 at any position. At the fourth position, the inkjet mechanism 120 is located at the other edge of the screen 110, and does not interfere with the scraper 130 at any position.

[0054] When the inkjet mechanism 120 is in the third position and the scraper 130 is in the second position, the protrusion 131 of the scraper 130 is in contact with the side wall of the groove 111 of the screen 110, and the printing operation is performed. When the scraper 130 is in the first position and the inkjet mechanism 120 moves between the third position and the fourth position, the protrusion 131 of the scraper 130 is not in contact with the side wall of the groove 111 of the screen 110. At this time, the inkjet mechanism 120 is performing an inkjet operation. These two operations complete the printing of a silicon wafer, and then the above operations are repeated to print the next silicon wafer.

[0055] It is understandable that by precisely controlling the motion path and positional relationship of the scraper 130 and the inkjet mechanism 120 , precise control during the printing process can be achieved.

[0056] In some embodiments, as Figure 1 and Figure 3 As shown, the screen 110 is provided with a boss 112 , and the scraper 130 forms a gap with the boss 112 at the second position, and the gap is used to accommodate printing paste.

[0057] The boss 112 surrounds the screen 110 and has the same shape as the edge of the screen 110. When the scraper 130 moves to the second position, the boss 131 of the scraper 130 contacts the groove 111 of the screen 110, and a gap is formed between the scraper 130 and the boss 112 of the screen 110, which can be used to accommodate the printing paste overflowing from the groove 111 after the boss 131 is pressed down.

[0058] After the printing paste is sprayed onto the screen 110 through the inkjet mechanism 120, it will be distributed on the other parts of the screen 110 except the boss 112. When the scraper 130 moves to the second position and forms a gap with the boss 112, the protrusion 131 of the scraper 130 will squeeze out the excess paste from the groove 111 and push the excess paste into the gap. In this process, the printing paste remaining in the groove 111 will be further sorted and flattened so that the final printed pattern has clear and uniform lines.

[0059] It is understandable that the boss 112 on the screen 110 and the gap formed between the scraper 130 and the boss 112 when in the second position can improve the quality and efficiency of printing.

[0060] In some embodiments, when the scraper 130 is located at the second position, the distance between the protrusion 131 and the lower surface of the screen 110 is the same as the thickness of the grid line.

[0061] When the scraper 130 is in the second position, there is a certain height difference between the protrusion 131 of the scraper 130 and the lower surface of the screen 110, wherein the lower surface of the screen 110 is the surface in contact with the silicon wafer. The protrusion 131 does not abut the silicon wafer, but reserves a certain height so that the remaining printing paste in the groove 111 forms a grid line, and the thickness of the grid line is the same as the distance between the protrusion 131 and the lower surface of the screen 110.

[0062] Grid lines usually refer to lines or borders in a printed pattern. The thickness of the grid lines has an important impact on the quality of printing. By precisely controlling the distance between the scraper 130 and the lower surface of the screen 110, it is possible to ensure that the printing paste has a consistent thickness when forming the grid lines, thereby improving the overall quality of the printed product.

[0063] During the downward pressing of the scraper 130, the printing paste is evenly distributed in the grooves 111 of the screen 110. When the distance between the scraper 130 and the lower surface of the screen 110 is the same as the thickness of the grid line, when the scraper 130 is pressed down, the protrusion 131 will squeeze out the excess printing paste from the grooves 111 and leave a layer of paste with uniform thickness in the grooves 111. This layer of paste will form grid lines with consistent thickness during the subsequent curing or drying process.

[0064] It is understandable that by precisely controlling the distance between the scraper 130 and the lower surface of the screen 110 , the printing paste on the silicon wafer can be evenly distributed, thereby improving the accuracy and consistency of printing.

[0065] In some embodiments, as Figure 4 As shown, a plurality of slurry outlets 121 are provided on the side of the inkjet mechanism 120 facing the screen 110 .

[0066] The inkjet mechanism 120 is equipped with multiple slurry outlets 121 on the side facing the screen 110, which can spray printing slurry to different positions of the screen 110 at the same time or at different times. This design can improve the flexibility and efficiency of printing, allowing the inkjet mechanism 120 to accurately cover the entire screen 110 or a specific printing area.

[0067] At the same time, the presence of multiple slurry outlets 121 enables the inkjet mechanism 120 to more accurately control the slurry spraying amount, speed and direction. Each slurry outlet 121 on the inkjet mechanism 120 can be independently adjusted to adapt to different printing requirements and slurry characteristics. This precise control helps to improve the clarity and accuracy of the printed pattern.

[0068] In addition, a mechanical arm 122 is provided at one end of the inkjet mechanism 120 . The mechanical arm 122 is used to drive the inkjet mechanism 120 so that the inkjet mechanism 120 moves at a uniform speed along the width direction of the screen 110 .

[0069] It is understandable that by using multiple slurry outlets 121 simultaneously or sequentially, the inkjet mechanism 120 can significantly improve printing speed and efficiency. In addition, multiple slurry outlets 121 can also reduce downtime during the printing process and improve overall production efficiency.

[0070] In some embodiments, as Figure 1 and Figure 4 As shown, the slurry outlet 121 is located above the groove 111 , and the slurry outlet 121 corresponds to the groove 111 one by one.

[0071] The slurry outlet 121 refers to one or more openings through which the slurry can be discharged or discharged to a designated location. The slurry outlet 121 is a key component connecting the slurry supply source and the downstream processing equipment. The groove 111 refers to one or more recessed areas that can be used to accommodate the slurry or guide the flow of the slurry.

[0072] The position of the slurry outlet 121 is higher than the groove 111. The slurry can flow from the outlet into the groove 111 under the action of gravity. This layout is conducive to the smooth discharge and reception of the slurry, reducing the blockage or leakage of the slurry during the flow process. In addition, each group of slurry outlets 121 has a corresponding groove 111. This one-to-one correspondence can ensure the accurate discharge and reception of the slurry. Each group of slurry outlets 121 includes multiple slurry outlets 121, and the specific number and distribution depend on the corresponding groove 111.

[0073] It can be understood that the slurry outlets 121 are located above the grooves 111 , and the layout in which each outlet corresponds to one groove 111 facilitates smooth discharge and reception of the slurry.

[0074] In some embodiments, as Figure 1 As shown, the cross sections of the protrusion 131 and the groove 111 are both inverted trapezoidal.

[0075] The upper base of the inverted trapezoid is longer than the lower base. In the protrusion 131 or groove 111 with an inverted trapezoidal cross section, the width gradually decreases from top to bottom. The groove 111 with an inverted trapezoidal cross section is mainly used to meet the printing requirements of the gate line on the silicon wafer. The protrusion 131 with an inverted trapezoidal cross section is used to match the shape of the groove 111 to form a precise assembly relationship. During printing, the protrusion 131 contacts the groove 111, but there is still a certain height difference between the protrusion 131 and the lower surface of the screen 110 to form a gate line of a certain thickness. The cross section of the gate line printed by the protrusion 131 and the groove 111 with an inverted trapezoidal cross section is also an inverted trapezoidal, which can enable the printed electrode to form a good ohmic contact with the silicon wafer, thereby improving the quality of the product.

[0076] It is understandable that when the cross sections of the protrusion 131 and the groove 111 are both inverted trapezoidal, it is usually used to provide a specific assembly relationship, thereby achieving a specific effect.

[0077] In some embodiments, as Figure 3 As shown, the groove 111 extends along the width direction of the screen 110 , and the length of the groove 111 is smaller than the width of the screen 110 .

[0078] In the printing screen 110, the groove 111 can be used to accommodate the printing paste, and the distribution range of the printing paste can be controlled by adjusting its size so that the printing paste is evenly distributed during the printing process. The shape and size of the groove 111 can be adjusted according to the specific application to meet the required functional and performance requirements.

[0079] The groove 111 extends along the width direction of the screen 110, that is, the length direction of the groove 111 is in the same direction as the width direction of the screen 110. When the length of the groove 111 is smaller than the width of the screen 110, the groove 111 does not penetrate the screen 110 along the width direction of the screen 110, so that the boss 112 can be surrounded by the four sides of the screen 110.

[0080] It is understandable that the groove 111 extends along the width direction of the screen 110 , and the length of the groove 111 is smaller than the width of the screen 110 , which can provide a basis for the arrangement of the boss 112 .

[0081] An embodiment of the present application also provides a silicon wafer printing device, including: a printing device 10, a drying device and a silicon wafer transporting device, wherein the printing device 10 is used to print silicon wafers, the drying device is used to dry the printed silicon wafers, and the silicon wafer transporting device is connected between the printing device 10 and the drying device.

[0082] The printing device 10 is the core part of the silicon wafer printing equipment, responsible for accurately printing the required pattern or material onto the silicon wafer. Printing technologies include screen printing, gravure printing and lithography, which are used to transfer ink, photoresist or other functional materials to the surface of the silicon wafer.

[0083] The drying device is located downstream of the printing device 10 and is used to dry or cure the ink, photoresist or other materials printed on the silicon wafer to ensure their stability and adhesion. The drying process usually involves heating or ventilation operations to remove solvents or moisture in the material and promote cross-linking or curing of the material.

[0084] The silicon wafer transport device is responsible for transporting silicon wafers between the printing device 10 and the drying device, and usually involves an automated robotic arm, conveyor belt or other transport mechanism to enable the silicon wafers to be quickly moved from one workstation to another, thereby reducing manual intervention and improving production efficiency.

[0085] During the actual working process, the silicon wafer is placed on the workbench of the printing device 10 and is ready for printing. Then, the required pattern or material is printed onto the silicon wafer through the printing device 10. After printing is completed, the silicon wafer transport device moves the silicon wafer from the printing device 10 to the drying device, and the drying device dries or solidifies the silicon wafer. After drying is completed, the silicon wafer transport device moves the silicon wafer out of the drying device and prepares for subsequent processing or testing.

[0086] It should be noted that the printing device 10 described above is mainly used to print gate lines on silicon wafers, and the main gate lines and fine gate lines can be printed on printing devices 10 at different stations, or on the printing device 10 at the same station. However, when printing on the printing device 10 at the same station, the movement of the inkjet device may interfere with the scraper 130, resulting in an adverse effect on the printing quality and efficiency.

[0087] It is understandable that the silicon wafer printing device can achieve precise printing, drying and transportation operations on silicon wafers by integrating multiple functional units such as the printing device 10, the drying device and the silicon wafer transportation device.

[0088] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0089] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0090] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0091] In the description of this application, “plurality” means two or more.

[0092] In the description of the present application, a first feature being “on” or “under” a second feature may include the first and second features being in direct contact with each other, or the first and second features being in contact with each other not directly but via another feature therebetween.

[0093] In the description of this application, a first feature “on”, “above” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0094] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0095] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A printing device, characterized in that include: a screen having a plurality of grooves; an inkjet mechanism, movably disposed above the screen, for spraying printing paste onto the screen; A scraper is movably arranged above the screen, and the scraper is grooved on one side of the screen to form a protrusion, and the protrusion matches the groove of the screen.

2. The printing device according to claim 1, wherein The scraper is configured to move between a first position and a second position, and the inkjet mechanism moves between a third position and a fourth position, and when the inkjet mechanism is in the third position and the scraper is in the second position, the protrusion is in contact with the side wall of the groove; When the scraper is located at the first position and the inkjet mechanism moves between the third position and the fourth position, the protrusion does not fit the side wall of the groove.

3. The printing device according to claim 2, wherein: The screen is provided with a boss, and the scraper forms a gap with the boss at the second position, and the gap is used to accommodate the printing paste.

4. The printing device according to claim 2, wherein: When the scraper is located at the second position, the distance between the protrusion and the lower surface of the screen is the same as the thickness of the grid line.

5. The printing device according to claim 1, wherein The inkjet mechanism is provided with a plurality of slurry outlets on a side facing the screen.

6. The printing device according to claim 5, characterized in that The slurry outlet is located above the groove, and the slurry outlet corresponds to the groove one by one.

7. The printing device according to claim 1, wherein The cross sections of the protrusion and the groove are both inverted trapezoidal.

8. The printing device according to claim 7, wherein: The grooves extend along the width direction of the screen.

9. The printing device according to claim 8, characterized in that The length of the groove is smaller than the width of the screen.

10. A silicon wafer printing device, characterized in that: include: The printing device according to any one of claims 1 to 9, used for printing silicon wafers; A drying device for drying printed silicon wafers; The silicon wafer transport device is connected between the printing device and the drying device.

Images