Wafer glass cutting device

Abstract

The utility model discloses a wafer glass cutting device, which is characterized in that a rotary workbench is arranged on a linear module and is used for positioning and bearing wafer glass, a tool bit module is arranged on a driving mechanism and is used for cutting the wafer glass, and at least one pair of static elimination mechanisms is symmetrically arranged on two sides of the linear module; the static electricity eliminating mechanism comprises a support, an ion wind bar and a pair of rotating assemblies, mounting plates in the rotating assemblies are arranged on the support, mounting grooves are formed in the ends, away from the support, of the rotating assemblies, rotating columns are arranged on clamping plates and embedded in the mounting grooves, and wrapping plates are arranged on the rotating columns in a sleeving mode and locked on the mounting plates. And the ion wind bar is arranged between the pair of clamping plates. Static electricity generated in the cutting process of wafer glass is eliminated through the ion wind bar so that cutting quality can be guaranteed, the inclination angle of the ion wind bar can be adjusted through the rotating assembly so that the ion wind bar can accurately face the plane where the rotating workbench is located, and static electricity can be efficiently eliminated.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing devices, in particular to a wafer glass cutting device. Background Art

[0002] Micro OLED, also known as silicon-based OLED, is a new display technology that utilizes active-emission OLED devices on single-crystal silicon wafers. Unlike traditional PMOLED and AMOLED display technologies, it utilizes single-crystal silicon as the driver backplane. To create the small silicon wafers suitable for Micro OLED, the wafer glass must be cut to the appropriate specifications.

[0003] In the existing technology, a wafer cutting device can be used to cut the wafer glass to form multiple small silicon wafers. However, since multiple cuts need to be performed within the plane of the wafer glass (such as multiple X-axis cuts and multiple Y-axis cuts within the plane), the cutting actions are more and the cutting time is longer. Therefore, a large amount of static electricity will be generated during the interaction between the cutting head and the wafer glass. If the static electricity cannot be effectively eliminated, a series of problems such as sparks, electric shocks and dust accumulation will occur between the cutting head and the wafer glass, affecting the cutting quality and thus affecting the quality of the silicon wafer. Utility Model Content

[0004] The purpose of the present utility model is to provide a wafer glass cutting device, which eliminates the static electricity generated by the wafer glass during the cutting process through an ion wind rod to ensure the cutting quality. The ion wind rod can adjust its inclination angle through a rotating component so that it can accurately face the plane where the rotating worktable is located, and can efficiently eliminate static electricity.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a wafer glass cutting device, comprising a machine platform, and:

[0006] A rotating workbench is provided on a linear module located on the machine platform. The rotating workbench is provided with a wafer ring for positioning and carrying the wafer glass.

[0007] The cutter head module is arranged on a driving mechanism located on the machine platform, and the driving mechanism drives the cutter head module to cut the wafer glass.

[0008] At least a pair of static elimination mechanisms are symmetrically arranged on both sides of the linear module, the static elimination mechanism includes a bracket, an ion wind rod and a pair of rotating components, the rotating component includes a mounting plate, a rotating column, a card plate and a wrapping plate, the mounting plate is arranged on the bracket, and a mounting groove is formed at the end away from the bracket, the card plate is provided with a rotating column, the rotating column is embedded in the mounting groove, the wrapping plate is sleeved on the rotating column through its limiting groove and locked on the mounting plate, and the ion wind rod is arranged between the pair of card plates.

[0009] As a further optimization, the mounting plate is an L-shaped structure, one end of which is a bent structure, and the mounting groove is formed on the bent structure.

[0010] As a further optimization, a waist-shaped hole is provided on the side of the mounting plate away from the mounting groove. The mounting plate is locked on the bracket by a bolt passing through the waist-shaped hole and extending into the bracket. The distance between a pair of mounting plates can be adjusted through the waist-shaped hole to ensure that the ion wind rod can be stably installed.

[0011] As a further optimization, the bracket includes a vertical frame and a horizontal plate. A pair of the horizontal plates are symmetrically arranged on opposite sides of the vertical frame. The rotating assembly is arranged on the horizontal plates. The height of the ion wind rod can be quickly adjusted by adjusting the height position of the horizontal plates.

[0012] As a further optimization, a slot for positioning the ion wind rod is provided on the card plate, which can ensure the installation stability of the ion wind rod.

[0013] As a further optimization, the static elimination mechanism has two pairs, which can cover a larger range of the area above the rotary table when it moves on the linear module.

[0014] As a further optimization, the driving mechanism includes a horizontal moving module and a vertical moving module. The horizontal moving module is arranged on a gantry located on the machine platform, the vertical moving module is arranged on the horizontal moving module, and the tool head module is arranged on the vertical moving module.

[0015] As a further optimization, the cutter head module includes at least a cutting head.

[0016] As a further optimization, the cutter head module also includes a first camera and a lighting group arranged around the first camera, which can take pictures and detect when cutting the wafer glass. That is, the cutting head must take pictures and align the MARK point before each cutting to ensure the cutting accuracy each time, so as to ensure the cutting quality of the silicon wafer.

[0017] As a further optimization, the wafer glass cutting device also includes a second camera, which is arranged on the gantry to detect the state of the wafer glass after cutting (silicon wafers arranged in a matrix).

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The static electricity generated by the wafer glass during the cutting process is eliminated by the ion wind rod to ensure the cutting quality. The ion wind rod can adjust its tilt angle through the rotating component so that it can be accurately oriented to the plane where the rotating worktable is located. It can efficiently eliminate static electricity and is suitable for cutting wafer glasses of various sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a structural diagram of the utility model.

[0021] Figure 2 This is a structural diagram of the utility model after removing the shell.

[0022] Figure 3 This is a structural diagram of the static elimination mechanism of the utility model.

[0023] Figure 4 This is a structural diagram of the rotating assembly of the present invention.

[0024] Figure 5 This is a structural diagram of the rotating assembly of the present invention from another side perspective.

[0025] Figure 6 This is a structural diagram of the cutter head module of the present invention located on the drive mechanism. DETAILED DESCRIPTION

[0026] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0027] like Figures 1 to 4As shown, a wafer glass cutting device includes a machine table 10, a rotating worktable 32, a cutter head module 40 and an electrostatic elimination mechanism 50. The rotating worktable 32 is arranged on a linear module 31 located on the machine table 10. A wafer ring 100 for positioning and carrying the wafer glass is provided on the rotating worktable 32. The cutter head module 40 is arranged on a driving mechanism 33 located on the machine table 10. The driving mechanism 33 drives the cutter head module 40 to cut the wafer glass. At least one pair of electrostatic elimination mechanisms 50 are symmetrically arranged on both sides of the linear module 31. Preferably, there are two pairs of electrostatic elimination mechanisms 50, which can cover the rotating worktable 32 at The moving position on the linear module 31, the static elimination mechanism 50 includes a bracket 51, an ion wind rod 53 and a pair of rotating components 52, the rotating component 52 includes a mounting plate 521, a card plate 522, a rotating column 523 and a package 524, the mounting plate 521 is arranged on the bracket 51, and a mounting groove 5211 is formed at the end away from the bracket 51, the card plate 522 is provided with a rotating column 523, the rotating column 523 is embedded in the mounting groove 5211, the package plate 524 is sleeved on the rotating column 523 through the limit groove it has, and is locked on the mounting plate 521, and the ion wind rod 53 is arranged between the pair of card plates 522.

[0028] In the present invention, the wafer ring 100 carrying the wafer glass is passed through the feed port 200 on the shell 20 and then positioned and fixed on the rotary worktable 32. The rotary worktable 32 is located on the linear module 31, so that the wafer glass can be driven to translate or rotate, so that it can be cut in two perpendicular directions in the plane in which it is located to form a plurality of small silicon wafers. The cutting action is achieved by driving the cutter head module 40 by the driving mechanism. In the process of the cutter head module 40 cutting the wafer glass, in order to avoid static electricity generated by factors such as frequent and high-speed cutting friction, static electricity elimination mechanisms 50 are set on the opposite sides of the linear module 31 to eliminate static electricity to ensure the quality of cutting. The ion wind rod 53 is set on the bracket 51 through the rotating component 52. The height of the ion wind rod 53 is higher than the plane of the wafer glass on the rotary worktable 32, and the rotating component 52 is adjusted so that the active surface of the ion wind rod 53 faces the rotary worktable 3 2, and the above-mentioned area is covered as much as possible through the cooperation of multiple ion wind rods 53 to eliminate the influence of static electricity during the cutting process; more specifically, the ion wind rod 53 is positioned between a pair of clamping plates 522, and the rotating column 523 on the clamping plate is positioned in the mounting groove 5211 and the limit groove, and is clamped by the mounting plate 521 and the wrapping plate 524 to ensure the stability and accurate orientation of the ion wind rod 53, and the angle of the ion wind rod 53 can be adjusted by adjusting the angle of the rotating column 523 before tightening the wrapping plate 524 and the mounting plate 521. Even in the process of cutting wafer glasses of different sizes, the action angle of the ion wind rod 53 can be adjusted to make it act more accurately on the wafer glass. For example, for larger wafer glass, the ion wind rods 53 on both sides of the linear module 31 can be respectively directed toward the part of the wafer glass close to their respective body sides to cover the entire space where the wafer glass is located as much as possible.

[0029] The present invention eliminates static electricity during the wafer glass cutting process by setting an ion wind rod 53 to ensure the cutting quality. The ion wind rod 53 can adjust its tilt angle through the rotating component 52 so that it can be accurately oriented to the plane where the rotating workbench 32 is located, and is suitable for cutting wafer glasses of various sizes.

[0030] More specifically, the mounting plate 521 is an L-shaped structure, one end of which is bent to form an abutment surface, and a mounting groove 5211 is formed on the abutment surface. The bent structure can form a wider abutment surface, and the mounting groove 5211 is formed on the wider abutment surface to better position, support and wrap the rotating column 523.

[0031] In addition, a waist-shaped hole 5212 is provided on the side of the mounting plate 521 away from the mounting groove 5211. The mounting plate 521 is locked on the bracket 51 by a bolt passing through the waist-shaped hole 5212 and extending into the bracket 51. The setting of the waist-shaped hole 5212 can adjust the distance between a pair of mounting plates 521, which is convenient for fixing the ion wind rod 53 and is suitable for ion wind rods of different lengths.

[0032] The bracket 51 includes a vertical frame 511 and a horizontal plate 512. A pair of horizontal plates 512 are symmetrically arranged on opposite sides of the vertical frame 511. The rotating assembly 52 is arranged on the horizontal plate 512. By adjusting the height position of the pair of horizontal plates 512 on the vertical frame 511, the height position of the ion wind rod 53 can be quickly adjusted.

[0033] like Figure 5 As shown, the card plate 522 is provided with a card slot 5221 for positioning the ion wind rod 53, which can ensure the installation stability of the ion wind rod 53 on the rotating assembly 52 and the installation consistency of the two ends of the ion wind rod 53 on a pair of card plates 522.

[0034] like Figure 6 As shown, the driving mechanism 33 includes a horizontal moving module 331 and a vertical moving module 332. The horizontal moving module 331 is arranged on the gantry located on the machine 10, and the vertical moving module 332 is arranged on the slide 33a on the horizontal moving module 331. The cutting head 41 is arranged on the lifting plate 33b on the vertical moving module 332. The cutting head 41 is driven by the vertical moving module 332 to abut against the wafer glass. After being driven by the horizontal moving module 331, the cutting head 41 is driven to move horizontally to cut the wafer glass. In order to ensure the accuracy of the lifting and lowering of the cutting head and the stability of the translation, the lifting plate 33b is set on the slide 33a through the guide rail 33c.

[0035] In addition, the blade module 40 also includes a first camera 42 and a lighting lamp group arranged around the first camera 42, which can take pictures and detect the state of the wafer glass during cutting; a height sensor 43 can also be set on the lifting plate 33b to ensure that the cutting head 41 can accurately abut against the wafer glass.

[0036] For example Figure 2 As shown, the wafer glass cutting device further includes a second camera 60, which is disposed on the gantry and is used to detect the overall state of the wafer glass after cutting.

[0037] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope defined by the appended claims.

Claims

1. A wafer glass cutting device, comprising a machine platform, characterized in that: Also includes: A rotating workbench is provided on a linear module located on the machine platform. The rotating workbench is provided with a wafer ring for positioning and carrying the wafer glass. The cutter head module is arranged on a driving mechanism located on the machine platform, and the driving mechanism drives the cutter head module to cut the wafer glass. At least a pair of static elimination mechanisms are symmetrically arranged on both sides of the linear module, the static elimination mechanism includes a bracket, an ion wind rod and a pair of rotating components, the rotating component includes a mounting plate, a rotating column, a card plate and a wrapping plate, the mounting plate is arranged on the bracket, and a mounting groove is formed at the end away from the bracket, the card plate is provided with a rotating column, the rotating column is embedded in the mounting groove, the wrapping plate is sleeved on the rotating column through its limiting groove and locked on the mounting plate, and the ion wind rod is arranged between the pair of card plates.

2. The wafer glass cutting device according to claim 1, wherein: The mounting plate is an L-shaped structure, one end of which is a bent structure, and the mounting groove is formed on the bent structure.

3. The wafer glass cutting device according to claim 1 or 2, characterized in that: A waist-shaped hole is provided on one side of the mounting plate away from the mounting groove, and the mounting plate is locked on the bracket by means of a bolt that passes through the waist-shaped hole and extends into the bracket.

4. The wafer glass cutting device according to claim 3, characterized in that: The bracket includes a vertical frame and a horizontal plate. A pair of the horizontal plates are symmetrically arranged on opposite sides of the vertical frame, and the rotating assembly is arranged on the horizontal plates.

5. The wafer glass cutting device according to claim 1, wherein: The card plate is provided with a card slot for positioning the ion wind rod.

6. The wafer glass cutting device according to claim 1, wherein: The static elimination mechanism has two pairs.

7. The wafer glass cutting device according to claim 1, wherein: The driving mechanism includes a horizontal moving module and a vertical moving module. The horizontal moving module is arranged on a gantry located on the machine platform, the vertical moving module is arranged on the horizontal moving module, and the cutter head module is arranged on the vertical moving module.

8. The wafer glass cutting device according to claim 1 or 7, characterized in that: The cutter head module at least includes a cutting cutter head.

9. The wafer glass cutting device according to claim 8, characterized in that: The cutter head module further includes a first camera and a lighting lamp group arranged around the first camera.

10. The wafer glass cutting device according to claim 1, wherein: It also includes a second camera, which is arranged on the gantry to detect the state of the wafer glass after cutting.

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