Temperature compensation device

Abstract

The utility model relates to the technical field of FPGA circuit high and low temperature tests, in particular to a temperature compensation device which comprises a circuit board, a lower fastener is mounted at the bottom of the circuit board, an upper fastener is mounted at the top of the lower fastener, a fastener rear baffle assembly is mounted at the rear end of the upper fastener, and a temperature compensation device is mounted at the rear end of the upper fastener. An L-shaped fixing block and a fixing assembly are installed at the top of the upper fastener, a fastener front baffle assembly is installed at the front end of the fixing assembly, and a fan is installed at the rear end of the inner wall of the upper fastener. According to the improved temperature compensation device, when the temperature compensation device is used, a fastener rear baffle assembly and a fixing baffle are inserted into a U-shaped fixing frame, so that a cavity of the temperature compensation device is a closed space, the temperature rising efficiency of an electric heater on an FPGA circuit in the cavity can be improved, and meanwhile the temperature rising efficiency of the FPGA circuit in the cavity can be improved through a fixing assembly and a fastener front baffle assembly. The fastener front baffle assembly can be quickly disassembled and assembled, and a temperature supplementing device can be conveniently used for high and low temperature tests.

Description

Technical Field

[0001] The utility model relates to the technical field of high and low temperature testing of FPGA circuits, in particular to a temperature compensation device. Background Art

[0002] FPGAs are integrated circuits that can be programmed and configured after fabrication to implement a variety of digital circuit functions. High and low temperature testing of FPGA circuits is crucial because these tests evaluate the performance and reliability of FPGAs under extreme temperature conditions, which is crucial for many critical applications.

[0003] When conducting high and low temperature tests on FPGA circuits, it is necessary to use a temperature compensation device to simulate the relative temperature environment for testing.

[0004] In the process of realizing the present invention, the inventors discovered that the prior art has the following problems: 1. Fans are used in some existing temperature compensation devices. During high-temperature tests, when the temperature compensation device is heated, the outside air circulates with the air in the cavity through the fan gap, affecting the heating efficiency and thus affecting the test efficiency; 2. In order to maintain the temperature in the cavity and the ambient temperature, some existing temperature compensation devices require the removal of the front baffle. When using a fan to achieve air convection, the front baffle is generally installed with screws and devices. The front baffle is not easy to disassemble, which affects the test efficiency. Utility Model Content

[0005] The purpose of the present invention is to provide a temperature compensation device to solve the problem proposed in the above background technology that when a temperature compensation device is used for a high temperature test, the outside air circulates with the air in the cavity through the fan gap, affecting the heating efficiency and the problem that the front baffle is difficult to disassemble. In order to achieve the above purpose, the present invention provides the following technical solutions: a temperature compensation device, comprising a circuit board, a lower fastener is installed at the bottom of the circuit board, an upper fastener is installed at the top of the lower fastener, a fastener rear baffle assembly is installed at the rear end of the upper fastener, an L-shaped fixing block and a fixing assembly are installed at the top of the upper fastener, a fastener front baffle assembly is installed at the front end of the fixing assembly, a fan is installed at the rear end of the inner wall of the upper fastener, and an electric heater is installed at the top of the inner wall of the upper fastener.

[0006] Further preferably, the fastener rear baffle assembly includes a "U"-shaped fixing frame installed on the rear end of the upper fastener, a fixed baffle is slidably installed on the inner wall of the "U"-shaped fixing frame, a "mouth"-shaped rubber sealing ring is installed on the front end of the fixed baffle, and the external dimension structure of the fixed baffle is consistent with the internal dimension structure of the "U"-shaped fixing frame.

[0007] Further preferably, the fixing assembly includes a fixing shell installed on the top of the upper fastener, a slot and a movable groove are opened inside the fixing shell, a slider is slidably installed on the inner wall of the movable groove, a spring is installed on the top of the slider, an insertion rod is installed on the bottom of the slider, and a shift rod is installed on the outer wall of the insertion rod.

[0008] Further preferably, the fastener front baffle assembly includes an insert block plugged into the inner wall of the slot, an "L"-shaped baffle is installed at the front end of the insert block, a "U"-shaped rubber sealing ring is installed at the rear end of the "L"-shaped baffle, and a circular hole with an internal size structure consistent with the external size structure of the insert rod is opened on the top of the insert block.

[0009] Further preferably, the internal dimension structure of the L-shaped fixing block is consistent with the internal dimension structure of the "L"-shaped baffle, and the L-shaped fixing blocks are symmetrically distributed about the vertical center line of the "L"-shaped baffle.

[0010] Further preferably, the bottom of the insertion rod and the top of the insertion block are both provided with inclined surfaces.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] In the present invention, through the fastener rear baffle assembly, when the electric heater is used to heat the FPGA circuit in the cavity of the temperature compensation device, the fixed baffle is inserted into the "U"-shaped fixing frame. The fixed baffle prevents the outside air from passing through the fan gap and circulating with the air in the cavity, so that the cavity of the temperature compensation device is an enclosed space, avoiding the influence of air circulation on the heating of the FPGA circuit in the cavity, and can improve the heating efficiency of the electric heater on the FPGA circuit in the cavity.

[0013] In the present invention, when installing the fastener front baffle assembly through the fixing assembly and the fastener front baffle assembly, the plug block is inserted into the slot, and the plug rod is squeezed upward. The plug rod is inserted into the top circular hole of the plug block under the elastic force of the spring, and the fastener front baffle assembly can be installed. The lever is pulled upward, and the plug rod is pulled out from the top circular hole of the plug block, and the fastener front baffle assembly can be disassembled. When using the temperature supplement device, the fastener front baffle assembly can be quickly disassembled and installed, which is convenient for using the temperature supplement device to perform high and low temperature tests, thereby improving the convenience of using the temperature supplement device and improving the efficiency of high and low temperature tests. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0015] Figure 2 This is a rear view structural diagram of the utility model;

[0016] Figure 3 This is a schematic diagram of the full cross-section structure of the utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the fastener rear baffle assembly of the utility model;

[0018] Figure 5 This is a schematic diagram of the full cross-section structure of the fixing component of the utility model;

[0019] Figure 6 This is a schematic diagram of the structure of the front baffle assembly of the fastener of the present utility model.

[0020] In the figure: 1. Circuit board; 2. Lower fastener; 3. Upper fastener; 4. Fastener rear baffle assembly; 401. "U"-shaped fixing frame; 402. Fixed baffle; 403. "M"-shaped rubber sealing ring; 5. L-shaped fixing block; 6. Fixing assembly; 601. Fixing shell; 602. Slot; 603. Movable slot; 604. Slider; 605. Spring; 606. Insert rod; 607. Push rod; 7. Fastener front baffle assembly; 701. Insert block; 702. "L"-shaped baffle; 703. "U"-shaped rubber sealing ring; 8. Fan; 9. Electric heater. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0022] See also Figures 1 to 6 The utility model provides a technical solution: a temperature compensation device, including a circuit board 1, a lower fastener 2 is installed at the bottom of the circuit board 1, an upper fastener 3 is installed on the top of the lower fastener 2, a fastener rear baffle assembly 4 is installed at the rear end of the upper fastener 3, an L-shaped fixing block 5 and a fixing assembly 6 are installed on the top of the upper fastener 3, a fastener front baffle assembly 7 is installed at the front end of the fixing assembly 6, a fan 8 is installed at the rear end of the inner wall of the upper fastener 3, and an electric heater 9 is installed at the top of the inner wall of the upper fastener 3.

[0023] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown, the rear baffle assembly 4 of the fastener includes a "U"-shaped fixing frame 401 installed on the rear end of the upper fastener 3, and a fixed baffle 402 is slidably installed on the inner wall of the "U"-shaped fixing frame 401, and a "mouth"-shaped rubber sealing ring 403 is installed at the front end of the fixed baffle 402, and the external dimension structure of the fixed baffle 402 is consistent with the internal dimension structure of the "U"-shaped fixing frame 401; the fixed baffle 402 can be stably inserted into the "U"-shaped fixing frame 401. When the electric heater 9 is used to heat the FPGA circuit in the cavity of the temperature compensation device, the fixed baffle 402 can prevent outside air from circulating with the air in the cavity through the gap of the fan 8, thereby improving the heating efficiency of the electric heater 9 on the FPGA circuit in the cavity.

[0024] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 and Figure 5 As shown, the fixing assembly 6 includes a fixing shell 601 installed on the top of the upper fastener 3, and a slot 602 and a movable groove 603 are provided inside the fixing shell 601. A slider 604 is slidably installed on the inner wall of the movable groove 603, a spring 605 is installed on the top of the slider 604, an insertion rod 606 is installed on the bottom of the slider 604, and a lever 607 is installed on the outer wall of the insertion rod 606; the insertion rod 606 is inserted into the top circular hole of the plug block 701 by the elastic force of the spring 605, fixing the fastener front baffle assembly 7, pulling the lever 607 upward, and the insertion rod 606 is pulled out from the top circular hole of the plug block 701, so that the fastener front baffle assembly 7 can be quickly disassembled, which is convenient for the subsequent use of the fan 8 to dissipate heat for the FPGA circuit in a high-temperature environment of the FPGA circuit.

[0025] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 and Figure 6 As shown, the fastener front baffle assembly 7 includes an insert block 701 plugged into the inner wall of the slot 602, an "L"-shaped baffle 702 is installed at the front end of the insert block 701, and a "U"-shaped rubber sealing ring 703 is installed at the rear end of the "L"-shaped baffle 702, and a circular hole with an internal dimension structure consistent with the external dimension structure of the insertion rod 606 is opened on the top of the insert block 701; when the electric heater 9 is used to heat the FPGA circuit in the cavity of the temperature compensation device, the "L"-shaped baffle 702 can prevent the outside air from circulating with the air in the cavity, thereby improving the heating efficiency of the electric heater 9 on the FPGA circuit in the cavity.

[0026] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 and Figure 6As shown, the internal dimension structure of the L-shaped fixing block 5 is consistent with the internal dimension structure of the "L"-shaped baffle 702, and the L-shaped fixing blocks 5 are symmetrically distributed about the vertical center line of the "L"-shaped baffle 702; when the "L"-shaped baffle 702 is inserted into the groove of the L-shaped fixing block 5, the insert block 701 is inserted into the fixing assembly 6, which can improve the stability of the fastener front baffle assembly 7 and the device during installation.

[0027] In this embodiment, Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 and Figure 6 As shown, both the bottom of the insertion rod 606 and the top of the insertion block 701 are provided with inclined surfaces; when the insertion block 701 is inserted into the slot 602, the top inclined surface of the insertion block 701 contacts the bottom inclined surface of the insertion rod 606, which can squeeze the insertion rod 606 upward. When the position of the insertion rod 606 coincides with the position of the circular hole on the insertion block 701, the insertion rod 606 is inserted into the top circular hole of the insertion block 701 under the elastic force of the spring 605, and the fastener front baffle assembly 7 can be quickly installed, thereby improving the convenience of using the device.

[0028] The use method and advantages of this utility model: When the temperature compensation device is used, the working process is as follows:

[0029] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, first use screws to install the lower fastener 2 and the upper fastener 3 with the circuit board 1. The FPGA circuit is located in the cavity of the temperature compensation device. When the FPGA circuit needs to be heated in a low temperature environment, the fixed baffle 402 is inserted into the "U"-shaped fixing frame 401, and the plug 701 of the fastener front baffle assembly 7 is inserted into the slot 602. The insertion rod 606 is squeezed upward by the plug 701, and then the insertion rod 606 is inserted into the top circular hole of the plug 701 under the elastic force of the spring 605. Then, the electric heater 9 is started to heat the FPGA circuit. When in a high temperature environment, in order to make the temperature in the cavity tend to be balanced with the ambient temperature, the fixed baffle 402 is pulled out of the "U"-shaped fixing frame 401, and then the lever 607 is pulled upward to remove the fastener front baffle assembly 7 from the fixing assembly 6. Then, the fan 8 is started. Under the action of the fan 8, air convection is achieved.

[0030] The above shows and describes the basic principles, main features, and advantages of the present invention. Persons skilled in the art should understand that the present invention is not limited to the above-described embodiments. The above-described embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A temperature compensation device, comprising a circuit board (1), characterized in that: A lower fastener (2) is installed at the bottom of the circuit board (1), an upper fastener (3) is installed at the top of the lower fastener (2), a fastener rear baffle assembly (4) is installed at the rear end of the upper fastener (3), an L-shaped fixing block (5) and a fixing assembly (6) are installed at the top of the upper fastener (3), a fastener front baffle assembly (7) is installed at the front end of the fixing assembly (6), a fan (8) is installed at the rear end of the inner wall of the upper fastener (3), and an electric heater (9) is installed at the top of the inner wall of the upper fastener (3).

2. A temperature compensation device according to claim 1, characterized in that: The fastener rear baffle assembly (4) comprises a "U"-shaped fixing frame (401) mounted on the rear end of the upper fastener (3); a fixed baffle (402) is slidably mounted on the inner wall of the "U"-shaped fixing frame (401); a "mouth"-shaped rubber sealing ring (403) is mounted on the front end of the fixed baffle (402); and the external dimension structure of the fixed baffle (402) is consistent with the internal dimension structure of the "U"-shaped fixing frame (401).

3. A temperature compensation device according to claim 1, characterized in that: The fixing assembly (6) comprises a fixing shell (601) mounted on the top of the upper fastener (3); a slot (602) and a movable groove (603) are provided inside the fixing shell (601); a slider (604) is slidably mounted on the inner wall of the movable groove (603); a spring (605) is mounted on the top of the slider (604); an insertion rod (606) is mounted on the bottom of the slider (604); and a shifting rod (607) is mounted on the outer wall of the insertion rod (606).

4. A temperature compensation device according to claim 1, characterized in that: The fastener front baffle assembly (7) comprises an insert block (701) plugged into the inner wall of the slot (602), an L-shaped baffle (702) being installed at the front end of the insert block (701), a U-shaped rubber sealing ring (703) being installed at the rear end of the L-shaped baffle (702), and a circular hole having an internal dimension structure consistent with the external dimension structure of the insert rod (606) being opened at the top of the insert block (701).

5. The temperature compensation device according to claim 1, characterized in that: The internal dimension structure of the L-shaped fixing block (5) is consistent with the internal dimension structure of the "L"-shaped baffle (702), and the L-shaped fixing blocks (5) are symmetrically distributed about the vertical center line of the "L"-shaped baffle (702).

6. A temperature compensation device according to claim 3, characterized in that: The bottom of the insertion rod (606) and the top of the insertion block (701) are both provided with inclined surfaces.

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