Wafer process machine table
By designing circular baking lamps and reflective devices, the problem of uneven heating at the edge of the wafer is solved, more efficient improvement of grain size and reduced electron migration failure efficiency are achieved, and wafer production quality and energy-saving effect are improved.
Patent Information
- Application Number
- CN202422657665.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-10-31
AI Technical Summary
The lack of special wafer edge heating treatment steps and special heating equipment in the existing wafer production process, resulting in uneven heating of wafer edges, which cannot effectively improve grain size, and affects electron migration failure efficiency.
Design a circular baking lamp, including multiple arc-shaped lamp tubes or lighting modules, evenly distributed around the wafer, combined with a lampshade and a reflector, ensure uniform heating of the wafer edges and precise temperature control through the controller and temperature sensor.
It realizes uniform heating of all the wafer edges, improves the grain size improvement effect, reduces electron migration failure efficiency, improves process efficiency and reduces energy waste.
Smart Images
Figure CN223308954U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor processing, and more specifically, to a wafer processing machine. Background Art
[0002] Electron migration (EM) refers to the physical structure of a metal conductor that changes due to the movement of metal atoms caused by collisions between electrons and metal atoms when electrons flow through it under high current density and electric field. In wafers, EM can lead to open / short circuit failures, increased resistance, decreased thermal stability, and performance degradation. One effective way to improve EM failure rates is to improve the grain size at the wafer edge during the physical vapor deposition (PVD) process. This is because improving grain size at the wafer edge can reduce grain boundary migration, improve metal film quality, reduce current density gradients, lower mechanical stress, increase thermal conductivity, and reduce electron scattering. A common method for improving grain size at the wafer edge is to heat the wafer edge. Heating can promote grain growth, reduce lattice defects, improve the material's microstructure, control grain size uniformity, improve heat treatment efficiency, reduce the heat-affected zone, improve wafer edge yield, and improve mechanical properties, effectively reducing the probability of wafer damage due to EM.
[0003] However, existing wafer production processes typically lack dedicated wafer edge heating steps and specialized heating equipment. Although baking lamps may be installed in PVD process chambers, their primary function is to assist with maintenance work, such as evaporating moisture in the chamber through heating. Therefore, the position, shape, and power of these baking lamps do not meet the requirements for wafer edge heating. For example, a common baking lamp in PVD process chambers uses a straight tube design, which is low-cost but makes it difficult to evenly heat the wafer edge and cannot meet the needs of improving grain size. Utility Model Content
[0004] The purpose of the embodiments of the present application is to provide a wafer processing machine that can achieve more uniform and efficient heating, better improve the grain size of the wafer and enhance process efficiency.
[0005] The present application provides a wafer processing machine, comprising a machine body, a carrier platform, and a baking lamp. The machine body comprises a hollow chamber, and a wafer entrance is provided on the surface of the machine body for entering the chamber from the outside. The carrier platform is fixedly disposed within the chamber, and a wafer carrier is provided on top of the carrier platform. The baking lamp is annular and fixedly disposed within the chamber, with the center of the baking lamp coinciding with the center of the carrier plate.
[0006] In an implementable solution, the baking lamp includes a plurality of arc-shaped lamp tubes, and the plurality of arc-shaped lamp tubes are connected end to end to form a complete annular baking lamp.
[0007] In an implementable solution, the baking lamp includes a plurality of lighting modules, and the plurality of lighting modules are evenly distributed along a circular trajectory to form a complete annular baking lamp.
[0008] In one feasible solution, the baking lamps are symmetrically distributed vertically relative to the center of the wafer.
[0009] In one feasible solution, multiple arc-shaped lamp tubes are electrically connected in series.
[0010] In one feasible solution, multiple lighting modules are electrically connected in series.
[0011] In an implementable solution, a lampshade is provided in the chamber, and the lampshade is provided on a side of the baking lamp facing away from the supporting platform.
[0012] In one feasible solution, a reflective device is provided on the inner wall of the chamber, which reflects the light from the baking lamp and focuses the reflected light on the edge of the wafer.
[0013] In an implementable solution, the wafer processing machine further includes a controller disposed outside the machine body, and the controller is connected to the baking lamp signal.
[0014] In an implementable solution, the wafer processing machine further includes a temperature sensor disposed inside the machine body, and the temperature sensor is connected to the controller signal.
[0015] Compared with the prior art, the beneficial effects of this application include at least:
[0016] This application provides a wafer processing machine that helps ensure that the distance between the wafer edge and the light source is consistent throughout operation, thereby achieving more uniform heating. Heat can be more efficiently transferred to the edge of the wafer, helping to improve process efficiency and further improve the wafer's grain size. In addition, because the circular baking lamp provides more concentrated heating, it can reduce energy waste and be more energy-efficient than other baking lamps. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0018] Figure 1 1 is a top view of a wafer processing machine according to an embodiment of the present application;
[0019] Figure 2 A top view of the second wafer processing tool;
[0020] Figure 3 A top view of the third wafer processing tool;
[0021] Figure 4 for Figure 1 Working diagram of the wafer process tool;
[0022] Figure 5 for Figure 4 A partial schematic diagram of the wafer process tool;
[0023] Figure 6 for Figure 2 Schematic diagram of the interior of the wafer processing tool.
[0024] Figure 7 This is a comparison of the grain size effects at the wafer edge before and after optimization;
[0025] Figure 8 This is a comparison chart of the grain size effect at the center of the wafer before and after optimization;
[0026] Figure 9 Schematic diagram of wafer electron migration before and after optimization.
[0027] In the figure: 1. Body; 2. Carrying platform; 3. Baking lamp; 4. Controller; 5. Wafer; 6. Temperature sensor; 101. Chamber; 102. Wafer entrance; 201. Carrying tray; 301. Ring-shaped lamp tube; 302. Arc-shaped lamp tube; 303. Light module; 304. Lampshade. DETAILED DESCRIPTION
[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.
[0030] like Figures 1-4 as well as Figure 6 As shown, the present application provides a wafer processing machine, including a body 1, a carrier 2 and a baking lamp 201. The interior of the body 1 is a hollow chamber 101, and the surface of the body 1 is provided with a wafer entrance 102 for entering the chamber 101 from the outside. The carrier 2 is fixedly arranged in the chamber 101, and a carrier tray 201 for placing wafers is provided on the top of the carrier 2. The baking lamp 3 is in the shape of a ring and is fixedly arranged in the chamber 101, and the center of the baking lamp 3 coincides with the center of the carrier tray 201.
[0031] Specifically, the baking lamp 3 can be one or more of an infrared heating lamp, an LED heating lamp, and a halogen heating lamp, which are not limited here. When in use, the wafer is placed on the carrier plate 201, and then the baking lamp 3 is started and adjusted to the preset power. After the preset time, the baking lamp is turned off to complete the wafer heating process. Compared with baking lamps of other shapes, such as straight tube baking lamps, the annular baking lamp has a geometric shape that matches the wafer, so the distance between the edge of the wafer and the light source is the same, which can achieve more uniform heating, and the heat can be more efficiently transferred to the edge of the wafer, which helps to improve process efficiency. In addition, since the annular baking lamp can provide more concentrated heating, it can reduce energy waste and be more energy-efficient than the straight tube baking lamp.
[0032] In one embodiment, if Figure 1 As shown, the baking lamp 3 can be a complete annular lamp tube 301. Since only one lamp tube needs to be installed and replaced, this design simplifies the assembly and maintenance of the lamp tube.
[0033] In one embodiment, if Figure 2 As shown, the baking lamp 3 may include multiple arc-shaped lamp tubes 302, which are connected end to end to form a complete circular baking lamp 3. Since each arc-shaped lamp tube can be installed and replaced independently, if part of the lamp tube is damaged, only the damaged part needs to be replaced, which helps reduce maintenance costs.
[0034] In one embodiment, if Figure 3 As shown, the baking lamp 3 may include multiple light modules 303, which are evenly distributed along a circular trajectory to form a complete annular baking lamp 3. This modular design is more flexible and helps to adapt to the heating requirements of wafers of different sizes by adjusting the number and position of light modules.
[0035] In one embodiment, the baking lamps 3 are symmetrically distributed up and down relative to the center of the wafer. Figure 5As shown, the baking lamps 3 are vertically symmetrical relative to the BB' direction. The symmetrical distribution of the baking lamps 3 helps ensure that the upper and lower surfaces of the wafer are heated evenly, thereby fully heating the wafer edge and helping to reduce deformation or stress caused by uneven heating of the wafer.
[0036] In one embodiment, when the baking lamp 3 includes multiple arc-shaped lamp tubes 302, each arc-shaped lamp tube 302 can be electrically connected in series. Using a series connection provides multiple advantages, including: first, the current passing through each arc-shaped lamp tube 302 is the same, which helps ensure current consistency between the arc-shaped lamp tubes 302, thereby ensuring that the heating effect of all arc-shaped lamp tubes 302 remains uniform; second, the status of all arc-shaped lamp tubes 302 can be simultaneously controlled by a single switch or controller, which helps to simplify the control process and circuit design; third, if some of the arc-shaped lamp tubes 302 are damaged, the entire circuit will be disconnected, which can serve as a simple fault detection mechanism; fourth, since damage to the arc-shaped lamp tube 302 will cause the entire circuit to be disconnected, the entire heating process will be immediately stopped, and heating can only be resumed after all the arc-shaped lamp tubes 302 are functioning normally. This can effectively prevent uneven heating caused by damage to some of the arc-shaped lamp tubes 302. Similarly, when the baking lamp 3 includes a plurality of light modules 303 , the light modules 303 may be electrically connected in series.
[0037] In one embodiment, if Figure 1-Figure 5 As shown, chamber 101 is equipped with a lampshade 304, located on the side of the baking lamp 3 facing away from the carrier 2. Lampshade 304 reflects the light emitted by the baking lamp 3 and focuses it at the edge of the wafer. When designing the cross-sectional shape of lampshade 304, optical simulation and calculation can be used to optimize the light distribution, ensuring that the light is effectively focused at the edge of the wafer. Lampshade 304 can be made of a highly reflective material, such as aluminum, stainless steel, or other highly reflective metals, to ensure effective reflection and focusing of the light. Alternatively, the side of lampshade 304 closest to the baking lamp 3 can be polished or coated to improve reflection efficiency and reduce light scattering. Because the baking lamp 3 generates high temperatures, lampshade 304 should be made of a heat-resistant material to prevent deformation or damage. The design of lampshade 304 helps provide more sufficient and precise illumination at the wafer edge, improving the efficiency and effectiveness of heating at the wafer edge. This improves overall wafer processing quality, reduces defect rates, and ultimately increases production efficiency and reduces costs.
[0038] In one embodiment, a reflective device may be provided on the inner wall of the chamber 101, which reflects the light from the baking lamp 3 and gathers the reflected light at the edge of the wafer. In actual use, a plurality of reflectors or reflective plates with pre-set angles may be provided on the inner wall of the chamber 101 as reflective devices. In addition, the inner wall of the chamber 101 may also be covered with reflective paint or reflective film, and the specific method is not limited here. When designing the reflective device, optical simulation and calculation can be used to optimize the distribution of light to ensure the uniformity and efficiency of the heating process. Similarly, the reflective device helps to provide more sufficient and accurate lighting for the edge of the wafer, thereby improving production efficiency and reducing costs.
[0039] In one embodiment, if Figure 4 As shown, it also includes a controller 4 arranged outside the body 1, and the controller 4 is connected to the baking lamp 3 by signal. During operation, the wafer is placed on the carrier plate 201 and closed, and then the controller 4 is operated to send a signal to the baking lamp 3, so that the baking lamp 3 runs according to the pre-set power and time (for example, the operating power can be set to 65% and the operating time can be set to 10 minutes). After the preset time, the controller 4 will send a signal to cut off the power supply of the baking lamp 3, thereby completing the wafer edge heating process. Since different operating powers and times can be set, the wafer process machine of the present application can adapt to the heating requirements of wafers of different sizes and types.
[0040] In one embodiment, if Figure 4 As shown, a temperature sensor 6 can also be provided inside the body 1, and the temperature sensor 6 is connected to the controller 4 by signal. Preferably, the temperature sensor 6 can be provided on the side of the carrier plate 201 so as to more accurately measure the temperature near the edge of the wafer. During operation, the temperature sensor 6 detects the temperature in the chamber 101 and transmits the detection result in the form of an electrical signal to the controller 4 in real time, so that the controller 4 can monitor the temperature in the chamber 101 in real time; when the temperature rises or falls abnormally, the controller 4 can send a corresponding adjustment signal to the baking lamp 3, or control the baking lamp 3 to stop working and issue an alarm at the same time, thereby achieving more precise temperature control and ensuring process safety.
[0041] like Figure 7 As shown, after using the wafer processing machine provided by the present application, the grain size at the edge of the wafer can be effectively improved due to the uniform heating effect. Figure 8 As shown in the figure, after heating the wafer using the wafer process tool, the grain size in the center of the wafer has also been optimized to a certain extent. In actual production, the result of the improvement in grain size is that the electron migration failure rate of the wafer has been significantly reduced from 16% to 5%. Figure 9 As shown in the figure, it can be seen that after optimization, the electron migration of the wafer has been significantly improved and the failure rate has been significantly reduced.
[0042] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
Claims
1. A wafer processing machine, characterized in that: include: A body (1) having a hollow chamber (101) inside, and a wafer entrance (102) for entering the chamber (101) from the outside is provided on the surface of the body (1); A carrier platform (2) is fixedly arranged in the chamber (101), and a carrier plate (201) for placing wafers is arranged on the top of the carrier platform (2); The baking lamp (3) is annular and fixedly arranged in the chamber (101), and the center of the baking lamp (3) coincides with the center of the loading plate (201).
2. The wafer processing machine according to claim 1, wherein: The baking lamp (3) comprises a plurality of arc-shaped lamp tubes (302), and the plurality of arc-shaped lamp tubes (302) are connected end to end to form a complete annular baking lamp (3).
3. The wafer processing machine according to claim 1, wherein: The baking lamp (3) comprises a plurality of light modules (303), and the plurality of light modules (303) are evenly distributed along a circular trajectory to form a complete annular baking lamp (3).
4. The wafer processing machine according to claim 1, wherein: The baking lamps (3) are symmetrically distributed up and down relative to the center of the wafer.
5. The wafer processing machine according to claim 2, wherein: The plurality of arc-shaped lamp tubes (302) are electrically connected in series.
6. The wafer processing machine according to claim 3, wherein: The plurality of lighting modules (303) are electrically connected in series.
7. The wafer processing machine according to claim 1, wherein: A lampshade (304) is provided in the chamber (101), and the lampshade (304) is provided on a side of the baking lamp (3) facing away from the supporting platform (2).
8. The wafer processing machine according to claim 1, wherein: A reflective device is provided on the inner wall of the chamber (101), and the reflective device reflects the light of the baking lamp (3) and gathers the reflected light at the edge of the wafer.
9. The wafer processing machine according to claim 1, wherein: It also includes a controller (4) arranged outside the body (1), and the controller (4) is connected to the baking lamp (3) by signal.
10. The wafer processing machine according to claim 9, wherein: It also includes a temperature sensor (6) arranged inside the body (1), and the temperature sensor (6) is connected to the controller (4) via a signal.