Carrying platform and silicon wafer processing equipment

Abstract

The utility model provides a carrying table and silicon wafer processing equipment, the carrying table is used for carrying a silicon wafer, and the carrying table comprises a fixing part, a bearing part and an adjusting part. The bearing part is located above the fixing part, the bearing part is provided with a bearing surface, the bearing surface is used for bearing a silicon wafer, the bearing part is provided with an adjusting hole, and the adjusting hole penetrates through the bearing surface. The bottom end of the adjusting piece is rotatably connected to the fixing piece, and the top end of the adjusting piece is arranged in the adjusting hole and located below the bearing face. The adjusting part extends into the adjusting hole from the upper portion of the bearing face, and when the adjusting part is rotated, the bearing part can be driven to move in the axial direction of the adjusting part relative to the fixing part. When the adjusting piece is rotated, a tool can stretch into the adjusting hole from the upper portion of the bearing face to rotate the adjusting piece, operation under the bearing piece is avoided, and operation is more convenient. Besides, the adjusting part is located below the bearing surface, so that the adjusting part does not interfere with the silicon wafer on the bearing surface, the integrity of the bearing surface and the effective bearing area are guaranteed, and the size of the carrying platform is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell silicon wafer manufacturing, and specifically to a carrier and silicon wafer processing equipment. Background Art

[0002] Currently, when manufacturing solar cell silicon wafers, the silicon wafers need to be placed on a carrier, and the carrier needs to be adjusted to a level position to ensure that the silicon wafers are level in order to meet the requirements of the manufacturing process.

[0003] In the current related technologies, the structure used for leveling the platform is usually placed under the platform. When adjusting, operations need to be performed under the platform, which makes the operation process inconvenient and leads to low adjustment efficiency and accuracy. Utility Model Content

[0004] In view of this, it is necessary to provide a carrier and silicon wafer processing equipment that can improve adjustment efficiency and accuracy.

[0005] In one embodiment of the present application, a carrier is provided for carrying a silicon wafer. The carrier includes a fixing member, a carrying member, and an adjusting member. The carrying member is located above the fixing member, and the carrying member has a carrying surface for carrying the silicon wafer. The carrying member is provided with an adjusting hole, and the adjusting hole passes through the carrying surface. The bottom end of the adjusting member is rotatably connected to the fixing member, and the top end of the adjusting member is disposed in the adjusting hole and is located below the carrying surface. When the adjusting member extends into the adjusting hole from above the carrying surface and rotates, the carrying member can be driven to shift axially relative to the fixing member along the adjusting member.

[0006] In the aforementioned carrier, when operating the adjustment member, a tool can be inserted into the adjustment hole from above the carrier surface to rotate the adjustment member. This allows operation to be performed from above the carrier, eliminating the need for operation from below, making operation more convenient and improving adjustment efficiency and precision. Furthermore, since the adjustment member is located below the carrier surface, it does not interfere with the silicon wafer on the carrier surface, thereby maintaining the integrity of the carrier surface and its effective loading area, thereby reducing the size and footprint of the carrier.

[0007] In some embodiments, the fixing member forms an accommodating space, the adjusting member is partially disposed in the accommodating space, the fixing member has a supporting surface in the accommodating space, the adjusting member has an arc surface, the supporting surface is in point contact with the arc surface, and the distance between the arc surface and the supporting surface gradually increases from the contact point between the arc surface and the supporting surface toward the edge of the arc surface.

[0008] In some embodiments, the fixing member includes a base, an upper mounting member and a lower mounting member, the lower mounting member is arranged on the base, the upper mounting member is detachably connected to the lower mounting member, the lower mounting member is provided with a groove, and the upper mounting member is provided with a through hole, the through hole is connected to the groove and forms an accommodating space suitable for the adjusting member, so that the top end of the adjusting member passes through the through hole and extends into the adjusting hole.

[0009] In some embodiments, the base is provided with a receiving groove, the lower mounting member is provided in the receiving groove, and the upper mounting member is at least partially located in the receiving groove.

[0010] In some embodiments, the outer wall of the adjusting member protrudes radially to form a limiting ring, and the limiting ring is snapped into the fixing member, so that the adjusting member is restricted axially relative to the fixing member.

[0011] In some embodiments, the top of the adjusting member is threadedly connected to the wall of the adjusting hole; or; the adjusting member is provided with a protrusion, and the supporting member is provided with at least two grooves, at least two grooves are distributed along a ring, and the opening depths of the grooves increase or decrease sequentially; in the process of rotating the adjusting member, the protrusion can be rotated in or out of the groove.

[0012] In some embodiments, the adjustment hole includes an upper hole section and a lower hole section that are connected to each other, and the adjustment member includes a guide portion and a connecting portion, the guide portion is inserted into the lower hole section, and there is a first distance between the top surface of the guide portion and the top wall of the lower hole section; the connecting portion is inserted into the upper hole section, and there is a second distance between the top surface of the connecting portion and the opening of the upper hole section, and the first distance is less than or equal to the second distance.

[0013] In some embodiments, a socket is formed inwardly on the top surface of the adjusting member. The socket is configured to accommodate a tool for driving the adjusting member to rotate. The tool is detachably connected to the socket.

[0014] In some embodiments, the supporting surface is rectangular, and four adjustment holes are distributed at the four corners of the supporting surface. The supporting member is connected to an adjustment member at each adjustment hole.

[0015] In one embodiment of the present application, a silicon wafer processing device is also provided. The silicon wafer processing device includes a processing mechanism and a carrier in any of the above embodiments. After the carrying surface is adjusted to a horizontal level by an adjusting member, the processing mechanism processes the silicon wafer carried by the carrying surface.

[0016] In the aforementioned silicon wafer processing equipment, when operating the adjustment member, a tool can be inserted into the adjustment hole from above the support surface to rotate the adjustment member. This allows operation to be performed from above the support surface, avoiding operation from below the support surface, making operation more convenient and improving adjustment efficiency and precision. Furthermore, because the adjustment member is located below the support surface, it does not interfere with the silicon wafer on the support surface, thereby ensuring the integrity of the support surface and the effective support area, thereby reducing the size and space occupied by the support stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is an exploded view of the carrier in one embodiment of the present application.

[0018] Figure 2 for Figure 1Cross-sectional view of the mid-stage.

[0019] Figure 3 for Figure 1 Enlarged view of point III in the middle.

[0020] Figure 4 for Figure 2 Enlarged view of IV in the middle.

[0021] Figure 5 for Figure 1 Front view of the middle adjustment part.

[0022] Figure 6 for Figure 4 Cross-sectional view of the fixing parts.

[0023] Figure 7 for Figure 4 Cross-sectional view of the middle carrier.

[0024] Description of main component symbols

[0025] Carrier 100; Tool 200;

[0026] Fixing member 10; accommodating space 11; supporting surface 12; base 13; upper mounting member 14; lower mounting member 15; receiving groove 131; through hole 141; first stop surface 142; first limiting surface 143; groove 151;

[0027] Carrying member 20; carrying surface 21; adjusting hole 22; upper hole section 221; lower hole section 222; second guide surface 2221;

[0028] Adjusting member 30; arc surface 31; second stop surface 32; second limiting surface 33; guide portion 34; first guide surface 341; connecting portion 35; insertion hole 36; limiting ring 30a; main body 30b;

[0029] The first distance is H; the second distance is L. DETAILED DESCRIPTION

[0030] The technical solution of the present application will be described below in conjunction with the drawings in the implementation mode of the present application. Obviously, the described implementation mode is only a part of the implementation mode of the present application, rather than all the implementation modes.

[0031] It should be noted that when a component is referred to as being "provided on," "connected to," or "fixed to" another component, it may be directly on the other component or there may be a central component. The term "horizontal" as used herein refers to a vertical or horizontal state within a certain error range, not vertical or horizontal in an absolute sense. The terms "first," "second," etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance. The term "coincidence" refers to overlap within a certain error range, not overlap in an absolute sense.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Currently, when manufacturing solar cell silicon wafers, the wafers need to be placed on a stage, and the stage needs to be adjusted to ensure the wafer is level to meet the manufacturing process requirements. In current related technologies, the leveling structure of the stage is usually placed below the stage. During adjustment, the adjustment process needs to be performed from below the stage, which makes the operation inconvenient and leads to low adjustment efficiency and accuracy.

[0034] In view of this, it is necessary to provide a carrier and silicon wafer processing equipment that can improve the adjustment efficiency and accuracy. The carrier is used to carry silicon wafers, and the carrier includes a fixing part, a bearing part and an adjusting part. The bearing part is located above the fixing part, and the bearing part has a bearing surface, and the bearing surface is used to carry silicon wafers. The bearing part is provided with an adjustment hole, and the adjustment hole passes through the bearing surface. The bottom end of the adjusting part is rotatably connected to the fixing part, and the top end of the adjusting part is provided in the adjustment hole and is located below the bearing surface. When the adjusting part extends into the adjustment hole from above the bearing surface and rotates, it can drive the bearing part to shift axially relative to the fixing part along the adjusting part.

[0035] In the aforementioned carrier, when operating the adjustment member, a tool can be inserted into the adjustment hole from above the carrier surface to rotate the adjustment member. This allows operation to be performed from above the carrier, eliminating the need for operation from below, making operation more convenient and improving adjustment efficiency and precision. Furthermore, since the adjustment member is located below the carrier surface, it does not interfere with the silicon wafer on the carrier surface, thereby maintaining the integrity of the carrier surface and its effective loading area, thereby reducing the size and footprint of the carrier.

[0036] The following combination Figures 1 to 7 , some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other.

[0037] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a carrier 100, which includes a fixing member 10, a supporting member 20, and an adjusting member 30. The fixing member 10 is fixed in position, and the supporting member 20 is located above the fixing member 10 and is used to support silicon wafers. The fixing member 10 and the supporting member 20 are connected by the adjusting member 30. The adjusting member 30 can adjust the posture of the supporting member 20 relative to the fixing member 10, so that the posture of the silicon wafer carried by the supporting member 20 meets the processing requirements. As an illustrative example, the silicon wafer can be used in a solar panel as a solar cell.

[0038] Among them, the carrier 20 has a carrying surface 21, and the carrier 20 carries the silicon wafer through the carrying surface 21. The carrier 20 is provided with an adjustment hole 22, and the adjustment hole 22 passes through the carrying surface 21. The bottom end of the adjustment member 30 is rotatably connected to the fixed member 10, and the top end of the adjustment member 30 is arranged in the adjustment hole 22 and is located below the carrying surface 21. The adjustment member 30 is inserted into the carrying surface 21 through the adjustment hole 22. After extending into the adjustment hole 22 from the top of the carrying surface 21 and rotating the adjustment member 30, the carrier 20 can be driven to shift axially relative to the fixed member 10 along the adjustment member 30, thereby changing the posture of the carrying surface 21, so that the posture of the silicon wafer carried by the carrying surface 21 meets the processing requirements. As an illustrative example, the adjustment member 30 is connected to the hole wall of the adjustment hole 22 by a thread, so that the adjustment member 30 can drive the carrier 20 to shift after the rotation of the adjustment member 30.

[0039] In the aforementioned carrier 100, when operating the adjustment member 30 to rotate, the tool 200 can be inserted into the adjustment hole 22 from above the support surface 21 to rotate the adjustment member 30, thereby achieving the purpose of operating from above the support member 20, avoiding operating from below the support member 20, making the operation more convenient, and thus improving the adjustment efficiency and accuracy. In addition, because the adjustment member 30 is located below the support surface 21, that is, the adjustment member 30 does not extend out of the adjustment hole 22 nor protrude from the support surface 21, the adjustment member 30 will not interfere with the silicon wafer on the support surface 21, thereby ensuring the integrity of the support surface 21. That is, the entire area of ​​the support surface 21 can be used to support silicon wafers, maximizing the effective support area of ​​the support surface 21, and thus reducing the volume and occupied space of the carrier 100.

[0040] As an illustrative example, during actual use of the carrier 100, the carrying surface 21 needs to be adjusted to a horizontal position using the adjustment member 30 to level the silicon wafer. It is understood that, depending on different processing requirements, the carrier 100 can also be adjusted to an inclined position using the adjustment member 30 to tilt the silicon wafer during use. For example, the tilt angle of the carrying surface 21 relative to the horizontal plane can be 1 degree, 2 degrees, or 5 degrees.

[0041] Combine Figures 3 to 7 As shown, in some embodiments, the fixing member 10 is formed with an accommodating space 11, and the adjusting member 30 is partially disposed within the accommodating space 11. The fixing member 10 has a support surface 12 within the accommodating space 11, and the adjusting member 30 has a curved surface 31. The fixing member 10 supports the adjusting member 30 by supporting the curved surface 31 with the support surface 12. The distance between the curved surface 31 and the supporting surface 12 gradually increases from the contact point between the curved surface 31 and the supporting surface 12 toward the edge of the curved surface 31, so that the contact between the curved surface 31 and the supporting surface 12 is point contact, thereby reducing friction when the adjusting member 30 rotates, thereby facilitating the rotation operation of the adjusting member 30. As an exemplary embodiment, the curved surface 31 is a spherical surface or an ellipsoidal surface.

[0042] In some embodiments, the fixing member 10 includes a base 13, an upper mounting member 14, and a lower mounting member 15. The base 13 is fixed in position, the lower mounting member 15 is disposed on the base 13, and the upper mounting member 14 is detachably connected to the lower mounting member 15. The lower mounting member 15 is provided with a groove 151, the bottom surface of the groove 151 forming the support surface 12. The upper mounting member 14 is provided with a through hole 141, which is connected to the groove 151 and together forms an accommodating space 11 adapted for the adjusting member 30, so that the top end of the adjusting member 30 can pass through the through hole 141 and extend into the adjusting hole 22. The fixing member 10 can accommodate the adjusting member 30 in the accommodating space 11 through the upper mounting member 14 and the lower mounting member 15, so as to facilitate the assembly of the adjusting member 30 with the fixing member 10.

[0043] In some embodiments, the base 13 is provided with a receiving groove 131. The lower mounting member 15 is positioned within the receiving groove 131, and the upper mounting member 14 is at least partially positioned within the receiving groove 131. By accommodating the lower mounting member 15 and a portion of the upper mounting member 14 via the receiving groove 131, the base 13 can reduce the overall thickness of the carrier 100, thereby reducing the volume and space occupied by the carrier 100. Furthermore, the receiving groove 131 can also pre-position the upper and lower mounting members 14, thereby improving assembly accuracy.

[0044] In some embodiments, the outer wall of the adjusting member 30 protrudes radially to form a limiting ring 30 a , and the limiting ring 30 a is snapped into the fixing member 10 , so that the adjusting member 30 is axially restricted relative to the fixing member 10 .

[0045] Optionally, the limiting ring 30a is arranged in the groove 151, and the radial dimension of the through hole 141 is smaller than the radial dimension of the groove 151, so that the top wall of the groove 151 forms a first stop surface 142, and the top surface of the limiting ring 30a forms a second stop surface 32. The first stop surface 142 is used to stop the second stop surface 32, so that the adjusting member 30 is axially restricted relative to the fixing member 10, so that the arc surface 31 can always contact the support surface 12, thereby limiting the up and down movement of the adjusting member 30, reducing the risk of the adjusting member 30 shaking axially or detaching from the accommodating space 11, and improving the position stability of the adjusting member 30, thereby improving the stability of the bearing surface 21.

[0046] Optionally, the upper mounting member 14 forms a first limiting surface 143 on the wall of the through hole 141, and the outer surface of the portion of the adjusting member 30 within the through hole 141 has a second limiting surface 33. The first limiting surface 143 limits the second limiting surface 33 to limit the radial movement of the adjusting member 30 along the through hole 141, avoiding the adjusting member 30 from shaking left and right, thereby ensuring the position stability of the adjusting member 30 and further ensuring the stability of the bearing surface 21.

[0047] Optionally, the adjusting member 30 also includes a main body portion 30b, a limiting ring 30a is formed to protrude radially relative to the outer wall of the main body portion 30b, and is coaxially arranged with the main body portion 30b, the main body portion 30b is at least partially located in the through hole 141, the outer peripheral surface of the main body portion 30b is the second limiting surface 33, the diameter of the main body portion 30b is the same as the diameter of the through hole 141, so that the first limiting surface 143 limits the second limiting surface 33, thereby limiting the radial movement of the adjusting member 30 along the through hole 141. During assembly, after the lower mounting member 15 is installed to the base 13, the limiting ring 30a is placed in the groove 151 of the lower mounting member 15. At the same time, the adjusting member 30 is passed through the through hole 141 of the upper mounting member 14 until the main body 30b is located in the through hole 141. Finally, the upper mounting member 14 and the lower mounting member 15 are installed so that the adjusting member 30 is limited in the accommodating space 11, thereby realizing the assembly of the adjusting member 30 and the fixing member 10.

[0048] In some embodiments, since the adjusting member 30 is connected to the hole wall of the adjusting hole 22 by threads, that is, the adjusting member 30 has external threads and the hole wall of the adjusting hole 22 has internal threads, the adjusting member 30 can achieve stepless adjustment of the supporting member 20 by rotation, thereby improving the adjustment accuracy.

[0049] In some embodiments, the adjustment hole 22 includes an upper hole section 221 and a lower hole section 222 that are connected to each other. The upper hole section 221 and the lower hole section 222 are coaxially arranged. The upper hole section 221 passes through the bearing surface 21 and the lower hole section 222 passes through the bottom surface of the bearing member 20. The adjustment member 30 includes a coaxially arranged guide portion 34 and a connecting portion 35. The guide portion 34 is inserted into the lower hole section 222, and there is a first distance H between the top surface of the guide portion 34 and the top wall of the lower hole section 222; the connecting portion 35 is inserted into the upper hole section 221, and there is a second distance L between the top surface of the connecting portion 35 and the opening formed by the upper hole section 221 passing through the bearing surface 21. The first distance H is less than or equal to the second distance L, so that during the rotation of the adjustment member 30, when the first distance H becomes 0, the second distance L is greater than or equal to 0, so that the adjustment member 30 is always located below the bearing surface 21, reducing the risk of the adjustment member 30 extending out of the bearing surface 21 and interfering with the silicon wafer.

[0050] Further optionally, the diameter of the upper hole section 221 is smaller than the diameter of the lower hole section 222, the diameter of the connecting portion 35 is smaller than the diameter of the guide portion 34, and the connecting portion 35 has an external thread. The connecting portion 35 is connected to the hole wall of the upper hole section 221 via a thread. The outer peripheral surface of the guide portion 34 forms a first guide surface 341, and the hole wall of the lower hole section 222 forms a second guide surface 2221. The diameter of the guide portion 34 is the same as the diameter of the lower hole section 222, so that the second guide surface 2221 can limit the first guide surface 341, so that the axis of the lower hole section 222 coincides with the axis of the guide portion 34, and further the axis of the connecting portion 35 coincides with the axis of the upper hole section 221, so as to ensure that the external thread of the connecting portion 35 is coaxial with the internal thread of the upper hole section 221, avoid thread deviation, and improve adjustment accuracy.

[0051] In some embodiments, the adjusting member 30 is provided with a protrusion (not shown), and the supporting member 20 is provided with two or more grooves (not shown). The two or more grooves are distributed in an annular pattern, and the depth of the grooves increases or decreases sequentially. During the rotation of the adjusting member 30, the protrusion can rotate out of one groove and into another groove, and the top of the protrusion supports the bottom surface of the groove. Because the depth of each groove is different, the protrusion can support the supporting member 20 at different heights when rotating into different grooves, thereby adjusting the supporting member 20. Exemplarily, the depth difference between each two adjacent grooves is 0.1 mm. When the protrusion rotates out of one groove and into an adjacent groove, the supporting member 20 can be raised or lowered by 0.1 mm.

[0052] In some embodiments, the top of the connecting portion 35 is recessed to form a socket 36. Socket 36 is configured to engage a tool 200 for rotating the adjusting member 30. Tool 200 is detachably connected to socket 36. For example, socket 36 is hexagonal, and the tool 200 for rotating the adjusting member 30 is a hexagonal wrench. To rotate the adjusting member 30, the hexagonal wrench is inserted through the adjustment hole 22 into socket 36 to twist the adjusting member 30.

[0053] In some embodiments, the supporting surface 21 is rectangular, with four adjustment holes 22 distributed at the four corners of the supporting surface 21. Correspondingly, the fixing member 10 is provided with four adjustment members 30, and the supporting member 20 is connected to an adjustment member 30 at each adjustment hole 22. The four adjustment members 30 cooperate to adjust the posture of the supporting surface 21. It is understood that in other embodiments, the number of adjustment members 30 may also be other, such as three, with the three adjustment members 30 distributed as the vertices of a triangle. Since three points define a plane, the three adjustment members 30 can also cooperate to adjust the posture of the supporting surface 21.

[0054] Some embodiments of the present application also provide a silicon wafer processing device, comprising a processing mechanism and the carrier 100 of any of the above embodiments. After the carrier surface 21 is adjusted to a horizontal position by the adjustment member 30, the processing mechanism processes the silicon wafer carried by the carrier surface 21. As an exemplary embodiment, the processing mechanism may be a laser cutting device, etc.

[0055] In addition, those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of disclosure of the present application.

Claims

1. A carrier for carrying a silicon wafer, characterized in that: The carrier comprises: fixings; A carrier, the carrier being located above the fixing member, the carrier having a carrying surface for carrying the silicon wafer, the carrier being provided with an adjustment hole, the adjustment hole passing through the carrying surface; and an adjusting member, wherein the bottom end of the adjusting member is rotatably connected to the fixing member, and the top end of the adjusting member is disposed in the adjusting hole and below the bearing surface; When the adjusting member is extended into the adjusting hole from above the bearing surface and the adjusting member is rotated, the bearing member can be driven to shift relative to the fixing member along the axial direction of the adjusting member.

2. The stage according to claim 1, wherein: The fixing member forms an accommodating space, the adjusting member is partially arranged in the accommodating space, the fixing member has a supporting surface in the accommodating space, the adjusting member has an arc surface, the supporting surface is in point contact with the arc surface, and the distance between the arc surface and the supporting surface gradually increases from the contact point between the arc surface and the supporting surface toward the edge of the arc surface.

3. The stage according to claim 1, wherein: The fixing member includes a base, an upper mounting member and a lower mounting member, the lower mounting member is arranged on the base, the upper mounting member is detachably connected to the lower mounting member, the lower mounting member is provided with a groove, and the upper mounting member is provided with a through hole, the through hole is connected to the groove and forms an accommodating space adapted for the adjusting member, so that the top end of the adjusting member passes through the through hole and extends into the adjusting hole.

4. The stage according to claim 3, wherein: The base is provided with a receiving groove, the lower mounting member is arranged in the receiving groove, and the upper mounting member is at least partially located in the receiving groove.

5. The stage according to claim 1, wherein: The outer side wall of the adjusting member protrudes in the radial direction to form a limiting ring, and the limiting ring is clamped in the fixing member, so that the adjusting member is restricted in the axial direction relative to the fixing member.

6. The stage according to claim 1, wherein: The top of the adjusting member is threadedly connected to the wall of the adjusting hole; or The adjusting member is provided with a protrusion, and the supporting member is provided with at least two grooves, at least two of the grooves are distributed along a ring, and the opening depths of the grooves increase or decrease sequentially; during the rotation of the adjusting member, the protrusion can be rotated in or out of the groove.

7. The stage according to claim 1, wherein: The adjustment hole includes an upper hole section and a lower hole section that are connected to each other. The adjustment member includes a guide portion and a connecting portion. The guide portion is inserted into the lower hole section, and a first distance is formed between the top surface of the guide portion and the top wall of the lower hole section. The connecting portion is inserted into the upper hole section, and a second distance is formed between the top surface of the connecting portion and the opening of the upper hole section. The first distance is less than or equal to the second distance.

8. The stage according to claim 1, wherein: The top surface of the adjusting member is concavely formed with a socket, and the socket is configured to accommodate a tool that drives the adjusting member to rotate, and the tool is detachably connected to the socket.

9. The stage according to claim 1, wherein: The bearing surface is rectangular, and four adjusting holes are distributed at four corners of the bearing surface. The bearing member is connected to one adjusting member at each adjusting hole.

10. A silicon wafer processing device, characterized in that: The silicon wafer processing equipment includes a processing mechanism and the carrier according to any one of claims 1 to 9, and after the carrying surface is adjusted to be horizontal by the adjusting member, the processing mechanism processes the silicon wafer carried by the carrying surface.

Images