Chip packaging module

Abstract

The utility model discloses a chip packaging module which comprises a chip packaging structure, a radiator and a base, the chip packaging structure is located between the radiator and the base, a through hole is formed in one corner of the radiator, and the through hole penetrates through the radiator; a rotatable clamping piece is arranged at the same corner of the base, and the clamping piece has a first rotating state and a second rotating state; when the clamping piece rotates to the first rotating state, the clamping piece can move in the through hole, the radiator can move in the direction away from or close to the base, when the clamping piece rotates to the second rotating state, the clamping piece cannot move in the through hole, and the radiator and the chip packaging structure are clamped between the clamping piece and the base. When the radiator is mounted and dismounted, only the clamping piece needs to be rotated, and no extra tool needs to be used, so that the radiator can be quickly mounted or dismounted.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a chip packaging module. Background Art

[0002] When installing a heat sink above a chip packaging structure, it is necessary to first install a fixing screw at one corner of the heat sink so that one corner of the heat sink is connected to a corner of the base below the chip packaging structure, and then install a fixing screw at the opposite corner of the heat sink so that the opposite corner of the heat sink is connected to the opposite corner of the base below the chip packaging structure. However, because the heat sink is large in size, when installing a fixing screw at one corner of the heat sink, the heat sink may tilt or even shift diagonally, making it impossible to install the fixing screw at the opposite corner of the heat sink. Although the heat sink can be prevented from tilting or shifting diagonally by pre-installing pre-locking screws or tapered columns at the opposite corners of the heat sink, additional tools are required to install and remove the pre-locking screws or tapered columns when installing and removing the heat sink, which is not conducive to the quick installation or removal of the heat sink. Utility Model Content

[0003] The present application discloses a chip packaging module to solve the problem of needing to use additional tools to install and remove pre-locking screws or tapered columns when installing and removing a heat sink.

[0004] In the first aspect, the present application discloses a chip packaging module, comprising a chip packaging structure, a heat sink and a base; the chip packaging structure is located between the heat sink and the base; the heat sink has a through hole at one corner, and the through hole passes through the heat sink; a rotatable clamp is provided at the same corner of the base; the clamp has a first rotation state and a second rotation state; when the clamp is rotated to the first rotation state, the clamp can move in the through hole, and the heat sink can move in a direction away from or close to the base; when the clamp is rotated to the second rotation state, the clamp cannot move in the through hole, and the heat sink and the chip packaging structure are clamped between the clamp and the base.

[0005] In this way, when installing the heat sink, the clamping member can be rotated to the first rotation state first, so that the clamping member can move in the through hole, so that the heat sink moves in the direction close to the base, so that the chip packaging structure is pressed between the heat sink and the base, and then the clamping member can be rotated to the second rotation state, so that the clamping member cannot move in the through hole, so that the heat sink and the chip packaging structure are clamped between the clamping member and the base, so that when installing the fixing screws at the diagonal position of the heat sink, the heat sink can be prevented from tilting diagonally or even shifting. When disassembling the heat sink, the clamping member can be rotated to the first rotation state, so that the clamping member can move in the through hole, so that the heat sink moves in the direction away from the base, so that the heat sink can be separated from the base. Because when installing and disassembling the heat sink, only the clamping member needs to be rotated, and no additional tools are required, it is more conducive to the rapid installation or disassembly of the heat sink.

[0006] In some embodiments of the present application, the clamping member includes a first component and a second component; one end of the first component is connected to the base, and the other end of the first component is connected to the second component; the first component can pass through the through hole; the second component extends in a direction away from the first component; the second component can rotate around the through hole; when the first component passes through the through hole, the second component is at least partially located at the top of the through hole or the top of the radiator; and, when the second component is rotated until it is completely located at the top of the through hole, the clamping member is in a first rotation state; when the second component is rotated until it is partially located at the top of the radiator, the clamping member is in a second rotation state.

[0007] In this way, a simple clamping structure can be used to achieve installation and removal of the heat sink.

[0008] In some embodiments of the present application, the length of the second component is less than the maximum distance between the first component and the side wall of the through hole and greater than the minimum distance between the first component and the side wall of the through hole; when the second component is rotated to a position where its length is less than or equal to the maximum distance between the first component and the side wall of the through hole, the clamping member is in the first rotation state; when the second component is rotated to a position where its length is greater than the minimum distance between the first component and the side wall of the through hole, the clamping member is in the second rotation state.

[0009] In this way, a simple through-hole structure can be used to achieve installation and removal of the heat sink.

[0010] In some embodiments of the present application, the shapes of the first component and the second component include long strips, the shape of the clamping member includes an L shape; and the shape of the through hole includes a long strip.

[0011] In some embodiments of the present application, the length of the second component is greater than the maximum distance between the first component and the side wall of the through hole; one side of the through hole is an opening; when the second component rotates to the opening, the clamping member is in the first rotation state; when the second component rotates to other positions, the clamping member is in the second rotation state.

[0012] In this way, another simple through-hole structure can be used to achieve installation and removal of the heat sink.

[0013] In some embodiments of the present application, the shapes of the first component and the second component include long strips, the shape of the clamping member includes an L shape; and the shape of the through hole includes a U shape.

[0014] In some embodiments of the present application, the first component is fixedly connected to the base, the second component is movably connected to the first component, and the second component can rotate around the first component and the through hole; or, the first component is fixedly connected to the second component, the first component is movably connected to the base, and the first component can drive the second component to rotate around the through hole.

[0015] In some embodiments of the present application, the chip packaging module also includes a printed circuit board; the printed circuit board is located on the side of the base away from the chip packaging structure; the base has a hollow area; the chip packaging structure is electrically connected to the printed circuit board through the hollow area.

[0016] In some embodiments of the present application, the chip packaging module also includes a backplate; the backplate is located on the side of the printed circuit board away from the base; the heat sink is fixedly connected to the base via a first connecting member passing through it; and the base is fixedly connected to the backplate via a second connecting member passing through the printed circuit board.

[0017] In some embodiments of the present application, the chip packaging structure includes an LGA chip packaging structure, the LGA chip packaging structure is electrically connected to a connector, and the connector is electrically connected to the printed circuit board through the hollow area. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0019] Figure 1 The figure is a schematic diagram of the top view of a current chip packaging module.

[0020] Figure 2 for Figure 1 The side view structural diagram of the chip packaging module is shown.

[0021] Figure 3 This is a schematic diagram of the top view of another current chip packaging module.

[0022] Figure 4 for Figure 3 The side view structural diagram of the chip packaging module is shown.

[0023] Figure 5 This is a schematic diagram of the top view of the chip packaging module disclosed in an embodiment of the present application when the heat sink is unlocked.

[0024] Figure 6 for Figure 5 The side view structural diagram of the chip packaging module is shown.

[0025] Figure 7 This is a schematic top view of the structure of a chip packaging module disclosed in an embodiment of the present application in a heat sink pre-locked state.

[0026] Figure 8 for Figure 7 The side view structural diagram of the chip packaging module is shown.

[0027] Figure 9 This is a schematic diagram of the top view of another chip packaging module disclosed in an embodiment of the present application when the heat sink is unlocked.

[0028] Figure 10 This is a schematic top view of the structure of a chip packaging module disclosed in an embodiment of the present application in a heat sink pre-locked state.

[0029] Figure 11 This is a structural schematic diagram of a base disclosed in an embodiment of the present application.

[0030] Figure 12 This is a schematic cross-sectional view of a chip packaging structure disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The following will describe the technical solutions in the embodiments of this application in conjunction with the accompanying drawings. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0032] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the top view of a current chip packaging module. Figure 2 for Figure 1The schematic diagram of the side structure of the chip packaging module shown in the figure includes a chip packaging structure 10, a heat sink 11 mounted above the chip packaging structure 10, fixing screws 12 for fixing at least four corners of the heat sink 11, and a pre-locking screw 13 for pre-locking one corner of the heat sink 11. When installing the heat sink 11, the pre-locking screw 13 is first installed at one corner of the heat sink 11 to pre-lock the corner of the heat sink 11, and then the fixing screw 12 is installed at the opposite corner of the heat sink 11. This can prevent the heat sink 11 from tilting or even shifting diagonally.

[0033] like Figure 3 and Figure 4 As shown, Figure 3 This is a top view of another chip packaging module. Figure 4 for Figure 3 The schematic side view of the chip packaging module shown in the figure includes a chip packaging structure 10, a heat sink 11 mounted above the chip packaging structure 10, fixing screws 12 for fixing at least four corners of the heat sink 11, and an elastic conical column 14 for pre-locking one corner of the heat sink 11. When installing the heat sink 11, the conical column 14 is first extended from a through hole at one corner of the heat sink 11, and then the top of the conical column 14 is opened into an umbrella shape. Because the diameter of the bottom of the umbrella shape is larger than the diameter of the through hole, the conical column 14 is engaged and fixed to the heat sink 11, thereby pre-locking one corner of the heat sink 11. In this way, when the fixing screws 12 are installed at the opposite corner of the heat sink 11, the heat sink 11 will not tilt or even shift diagonally.

[0034] However, when installing and removing the radiator 11, additional tools are required to install and remove the pre-locking screws 13 or the tapered columns 14, which is not conducive to the quick installation or removal of the radiator 11. For example, a screwdriver is required when installing and removing the pre-locking screws 13. However, because the pre-locking screws 13 do not need to fix the radiator 11, the size of the pre-locking screws 13 is generally smaller than the size of the fixing screws 12, resulting in the screwdriver for installing and removing the pre-locking screws 13 being different from the screwdriver for installing and removing the fixing screws 12, and an additional screwdriver is required. Although no tools are required when installing the tapered column 14, when removing the tapered column 14, additional professional tools are required to pinch the top of the tapered column 14 so that the diameter of the umbrella-shaped bottom is smaller than the diameter of the through hole.

[0035] Based on this, the present application discloses a chip packaging module, including a rotatable clamping member, by rotating the clamping member, the heat sink can be pre-locked and unlocked without the need for additional tools, which is conducive to the rapid installation or removal of the heat sink.

[0036] As an optional implementation of the disclosure of this application, the embodiment of this application discloses a chip packaging module, such as Figures 5 to 8 As shown, Figure 5 This is a schematic diagram of a top view of a chip packaging module disclosed in an embodiment of the present application when the heat sink is unlocked. Figure 6 for Figure 5 The side view structural diagram of the chip packaging module shown in FIG. Figure 7 This is a schematic diagram of a top view of a chip packaging module disclosed in an embodiment of the present application in a heat sink pre-locked state. Figure 8 for Figure 7 The chip packaging module shown is a side structural schematic diagram, which includes a chip packaging structure 10, a heat sink 11 and a base 20.

[0037] The chip package structure 10 is located between a heat sink 11 and a base 20. A through hole 110 is defined at one corner of the heat sink 11 and extends through the heat sink 11. A rotatable clamping member 21 is defined at the same corner of the base 20. For example, the clamping member 21 can rotate in the direction indicated by the arc arrow, and has a first rotational state and a second rotational state.

[0038] When the clamping member 21 rotates to the first rotation state, as shown in FIG. Figure 5 and Figure 6 As shown, the clamping member 21 can move in the through hole 110, and the heat sink 11 can move in a direction away from or close to the base 20, and the heat sink 11 is in an unlocked state. When the clamping member 21 rotates to the second rotation state, as shown in FIG. Figure 7 and Figure 8 As shown, the clamping member 21 cannot move in the through hole 110 , the heat sink 11 and the chip packaging structure 10 are clamped between the clamping member 21 and the base 20 , and the heat sink 11 is in a pre-locked state.

[0039] Based on this, when installing the radiator 11, the clamping member 21 can be rotated to the first rotation state first, so that the clamping member 21 can move in the through hole 110, so that the radiator 11 moves toward the direction close to the base 20, so that the chip packaging structure 10 is pressed between the radiator 11 and the base 20, and then the clamping member 21 is rotated to the second rotation state, so that the clamping member 21 cannot move in the through hole 110, so that the radiator 11 and the chip packaging structure 10 are clamped between the clamping member 21 and the base 20, so that when the fixing screws 12 are installed at the diagonal position of the radiator 11, the radiator 11 can be prevented from tilting diagonally or even shifting.

[0040] When removing the heat sink 11, the clamping member 21 can be rotated to the first rotation state, so that the clamping member 21 can move within the through hole 110, so that the heat sink 11 moves away from the base 20, so that the heat sink 11 can be separated from the base 20. Because when installing or removing the heat sink 11, only the clamping member 21 needs to be rotated, and no additional tools are required, it is more convenient to quickly install or remove the heat sink 11.

[0041] In some embodiments of the present application, Figure 8 As shown, the clamping member 21 includes a first component 211 and a second component 212. One end of the first component 211 is connected to the base 20, and the other end of the first component 211 is connected to the second component 212. The first component 211 can pass through the through hole 110. The second component 212 extends away from the first component 211. The second component 211 can rotate around the through hole 110.

[0042] When the first component 211 passes through the through hole 110, the second component 212 is at least partially located on the top of the through hole 110 or the top of the heat sink 11. Figure 6 As shown in FIG, when the second component 211 is rotated to the point where it is completely located at the top of the through hole 110, the clamping member 21 is in the first rotation state. Figure 8 As shown, when the second component 211 rotates to the point where its portion is located at the top of the radiator 11, the clamping member 21 is in the second rotation state. Based on this, a simple clamping member 21 structure can be used to achieve installation and removal of the radiator 11.

[0043] In some embodiments of the present application, the first component 211 is fixedly connected to the base 20, and the second component 212 is movably connected to the first component 211, so that the second component 212 can rotate around the first component 211 and the through hole 100. For example, the second component 212 is threadedly connected to the first component 211 or connected to a rotating shaft so that the second component 212 can rotate around the first component 211.

[0044] Of course, the present application is not limited to this. In other embodiments, the first component 211 may be fixedly connected to the second component 212, and the first component 211 may be movably connected to the base 20, so that the first component 211 can drive the second component 212 to rotate around the through hole 100. For example, the first component 211 and the base 20 may be threadedly connected or connected to a rotating shaft so that the first component 211 can rotate around the base 20.

[0045] In some embodiments of the present application, Figure 5 and Figure 7 As shown, the length L1 of the second component 212 is greater than the maximum distance L2 between the first component 211 and the sidewall of the through hole 100. In addition, one side of the through hole 100 is an opening A. Based on this, a simple through hole 110 structure can be used to achieve installation and removal of the heat sink 11.

[0046] like Figure 5 As shown, when the second component 212 rotates to the opening A, the second component 211 is completely located at the top of the through hole 110, the clamping member 21 can move in the through hole 110, and the radiator 11 can move away from or close to the base 20. The clamping member 21 is in the first rotation state and the radiator 11 is in the unlocked state.

[0047] like Figure 7 As shown, when the second component 212 is rotated to another position, the second component 211 is partially located on the top of the heat sink 11, the clamping member 21 cannot move in the through hole 110, the heat sink 11 and the chip packaging structure 10 are clamped between the second component 212 and the base 20, the clamping member 212 is in the second rotation state, and the heat sink 11 is in the pre-locked state.

[0048] On this basis, in some embodiments of the present application, the shapes of the first component 211 and the second component 212 include long strips, the shape of the clamping member 21 includes L-shape or cross-shape, etc., and the shape of the through hole 100 includes U-shape, square or circle, etc.

[0049] In other embodiments, Figure 9 and Figure 10 As shown, Figure 9 FIG1 is a schematic diagram of a top view of another chip packaging module disclosed in an embodiment of the present application in a heat sink unlocked state. Figure 10 This is a schematic top view of a chip packaging module disclosed in an embodiment of the present application in a heat sink pre-locked state. The length L1 of the second component 212 is less than the maximum distance L2 between the first component 211 and the sidewall of the through-hole 100 and greater than the minimum distance L3 between the first component 211 and the sidewall of the through-hole 100. Based on this, another simple through-hole 110 structure can be used to achieve installation and removal of the heat sink 11.

[0050] When the second component 212 is rotated to a position where its length L1 is less than or equal to the distance between the first component 211 and the side wall of the through hole 100, for example, when the second component 212 is rotated to a position where the distance between the first component 211 and the side wall of the through hole 100 is the maximum distance L2, the second component 211 is entirely located at the top of the through hole 110, the clamping member 21 can move within the through hole 110, and the heat sink 11 can move away from or toward the base 20. The clamping member 21 is in a first rotation state, and the heat sink 11 is in an unlocked state.

[0051] When the second component 212 is rotated to a position where its length L1 is greater than the distance between the first component 211 and the side wall of the through hole 100, for example, when the second component 212 is rotated to a position where the distance between the first component 211 and the side wall of the through hole 100 is the minimum distance L3, the second component 211 is partially located on the top of the heat sink 11, the clamping member 21 cannot move in the through hole 110, the heat sink 11 and the chip packaging structure 10 are clamped between the second component 212 and the base 20, the clamping member 212 is in the second rotation state, and the heat sink 11 is in the pre-locked state.

[0052] On this basis, in some embodiments of the present application, the shapes of the first component 211 and the second component 212 include long strips, the shape of the clamping member 21 includes L-shape or cross-shape, etc., and the shape of the through hole 100 includes long strips or elliptical shapes, etc.

[0053] In some embodiments of the present application, Figure 8 As shown, the chip packaging module further includes a printed circuit board 30, which is located on the side of the base 20 away from the chip packaging structure 10. Figure 11 As shown, Figure 11 This is a schematic diagram of the structure of a base disclosed in an embodiment of the present application. The base 20 has a hollow area B, such as Figure 12 As shown, Figure 12 The cross-sectional view of a chip package structure disclosed in an embodiment of the present application shows that the chip package structure 10 can be electrically connected to the printed circuit board 30 through the hollow area B. The clamping member 21 is provided at a corner of the non-hollow area of ​​the base 20 .

[0054] In some embodiments of the present application, Figure 8 As shown, the chip packaging module further includes a back plate 40, which is located on the side of the printed circuit board 30 away from the base 20. Figure 12 As shown, the heat sink 11 is fixedly connected to the base 20 via a first connector 111 passing through the heat sink 11, and the base 20 is fixedly connected to the back plate 40 via a second connector 112 passing through the printed circuit board 30. The first connector 111 includes a fixing screw 12, and the second connector 112 also includes a fixing screw.

[0055] In some embodiments of the present application, Figure 12 As shown, the chip package structure 10 may be an LGA (Land Grid Array) chip package structure, which is electrically connected to the connector 50. The connector 50 passes through the hollow area of ​​the base 20 and is electrically connected to the printed circuit board 30. Of course, the present application is not limited to this. In other embodiments, the chip package structure 10 may also be a BGA (Ball Grid Array) chip package structure, etc., which will not be repeated here.

[0056] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above embodiments merely represent several implementation methods of this specification. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of this specification, and these modifications and improvements fall within the scope of protection of this specification. Therefore, the scope of protection of the patent in this specification shall be based on the appended claims.

Claims

1. A chip packaging module, characterized in that: Including chip packaging structure, heat sink and base; The chip packaging structure is located between the heat sink and the base; A through hole is provided at one corner of the radiator, and the through hole passes through the radiator; A rotatable clamping member is provided at the same corner of the base; the clamping member has a first rotation state and a second rotation state; When the clamping member rotates to the first rotation state, the clamping member can move in the through hole, and the heat sink can move away from or closer to the base; when the clamping member rotates to the second rotation state, the clamping member cannot move in the through hole, and the heat sink and the chip packaging structure are clamped between the clamping member and the base.

2. The chip packaging module according to claim 1, wherein: The clamping member includes a first component and a second component; One end of the first component is connected to the base, and the other end of the first component is connected to the second component; the first component can pass through the through hole; the second component extends in a direction away from the first component; and the second component can rotate around the through hole; When the first component passes through the through hole, the second component is at least partially located at the top of the through hole or the top of the radiator; and when the second component is rotated until it is entirely located at the top of the through hole, the clamp is in a first rotation state; when the second component is rotated until it is partially located at the top of the radiator, the clamp is in a second rotation state.

3. The chip packaging module according to claim 2, wherein: The length of the second component is smaller than the maximum distance between the first component and the side wall of the through hole and larger than the minimum distance between the first component and the side wall of the through hole; When the second component is rotated to a position where its length is less than or equal to the maximum distance between the first component and the side wall of the through hole, the clamping member is in the first rotation state; when the second component is rotated to a position where its length is greater than the minimum distance between the first component and the side wall of the through hole, the clamping member is in the second rotation state.

4. The chip packaging module according to claim 3, wherein: The shapes of the first component and the second component include an elongated strip, the shape of the clamping member includes an L-shape, and the shape of the through hole includes an elongated strip.

5. The chip packaging module according to claim 2, wherein: The length of the second component is greater than the maximum distance between the first component and the side wall of the through hole; One side of the through hole is an opening; When the second component rotates to the opening, the clamping member is in the first rotation state; when the second component rotates to other positions, the clamping member is in the second rotation state.

6. The chip packaging module according to claim 5, characterized in that: The shapes of the first component and the second component include long strips, the shape of the clamping member includes an L shape, and the shape of the through hole includes a U shape.

7. The chip packaging module according to claim 2, wherein: The first component is fixedly connected to the base, the second component is movably connected to the first component, and the second component can rotate around the first component and the through hole; or The first component is fixedly connected to the second component, and the first component is movably connected to the base. The first component can drive the second component to rotate around the through hole.

8. The chip packaging module according to claim 1, wherein: The chip packaging module further includes a printed circuit board; the printed circuit board is located on a side of the base away from the chip packaging structure; the base has a hollow area; the chip packaging structure is electrically connected to the printed circuit board through the hollow area.

9. The chip packaging module according to claim 8, characterized in that: The chip packaging module further includes a back plate; the back plate is located on a side of the printed circuit board away from the base; The radiator is fixedly connected to the base via a first connecting member passing through the radiator; The base is fixedly connected to the back plate via a second connecting piece that passes through the printed circuit board.

10. The chip packaging module according to claim 8, wherein: The chip packaging structure includes an LGA chip packaging structure, the LGA chip packaging structure is electrically connected to a connector, and the connector is electrically connected to the printed circuit board through the hollow area.

Images