Electrolytic capacitor circuit board and converter

Abstract

The utility model discloses an electrolytic capacitor circuit board and a converter. The electrolytic capacitor circuit board comprises a circuit substrate, a plurality of electrolytic capacitors, a plurality of wiring terminals and a plurality of patch devices. The electrolytic capacitor and the wiring terminal are electrically connected with the circuit substrate through wave soldering; the patch devices are electrically connected with the circuit substrate through reflow soldering; a first area and a second area are sequentially arranged on the front face of the circuit substrate in the first direction. All the electrolytic capacitors are distributed in the first area; all the patch devices and at least part of the wiring terminals are distributed in the second area, and in the first direction, at least part of the patch devices are separated from the first area through the wiring terminals located in the second area. The electrolytic capacitor circuit board can improve the paint spraying effect of a patch device.

Description

Technical Field

[0001] The utility model relates to the technical field of converters, in particular to an electrolytic capacitor circuit board and a converter. Background Art

[0002] Inverters can be used in uninterruptible power supplies, or UPS devices, to perform bidirectional conversion between DC and AC. In converters, electrolytic capacitor circuit boards are key components, performing multiple functions, such as smoothing output voltage, providing instantaneous current, and reducing electromagnetic interference. Electrolytic capacitor circuit boards primarily include substrates, electrolytic capacitors, related SMD components, and wiring terminals. These electrolytic capacitors are all soldered and fixed to the substrate using wave soldering, while SMD components are generally soldered and fixed to the substrate using reflow soldering. After soldering, SMD components also need to be sprayed with paint using a nozzle to improve their protective performance. However, due to the large size of electrolytic capacitors, the nozzles will interfere with the electrolytic capacitors, resulting in poor painting results for the SMD components. Utility Model Content

[0003] The purpose of the present invention is to overcome the above-mentioned defects or problems existing in the background technology and to provide an electrolytic capacitor circuit board and a converter. The electrolytic capacitor circuit board can improve the painting effect of the chip device.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] Technical Solution 1: An electrolytic capacitor circuit board, comprising a circuit substrate, multiple electrolytic capacitors, multiple wiring terminals and multiple surface mount devices; the electrolytic capacitors and wiring terminals are electrically connected to the circuit substrate through wave soldering, and the surface mount devices are electrically connected to the circuit substrate through reflow soldering; the front of the circuit substrate is provided with a first area and a second area in sequence along a first direction; all the electrolytic capacitors are arranged in the first area; all the surface mount devices and at least part of the wiring terminals are arranged in the second area, and in the first direction, at least part of the surface mount devices are separated from the first area by the wiring terminals located in the second area.

[0006] Technical solution 2 based on technical solution 1: In the second area, the patch device is arranged close to the edge of the circuit substrate in the first direction, and the connection terminal is close to the patch device to reduce the distance from the edge of the circuit substrate in the first direction.

[0007] Technical solution three based on technical solution two: in the second area, multiple connection terminals are arranged at intervals along a direction at a preset angle to the first direction to separate the electrolytic capacitors and surface mount devices located on both sides thereof in the first direction.

[0008] Technical solution 4 based on technical solution 3: Some of the patch components are arranged between two adjacent wiring terminals arranged at intervals in a preset direction.

[0009] Technical solution five based on technical solution four: the first area faces the edge of the second area, and the second area faces the edge of the first area, and the shapes of the two match each other.

[0010] Technical solution six based on technical solution five: In the second area, the connection terminals are arranged close to the second area toward the edge of the first area, and are arranged at intervals along the shape of the edge.

[0011] Technical solution seven based on technical solution six: the remaining connection terminals are located in the first area and arranged close to the edge of the circuit substrate.

[0012] Technical solution eight based on technical solution seven: the circuit substrate is rectangular, and the first direction is the length direction of the circuit substrate.

[0013] Technical solution nine based on technical solution eight: the heights of the electrolytic capacitors, terminal blocks, and chip devices relative to the front of the circuit substrate decrease in sequence; the chip devices include resistors, capacitors, and / or inductors.

[0014] In addition, the present invention also provides technical solution ten: a converter, characterized in that it includes the electrolytic capacitor circuit board as described in any one of technical solutions one to nine.

[0015] From the above description of the present invention, it can be seen that compared with the prior art, the present invention has the following beneficial effects:

[0016] Technical solution 1 provides an electrolytic capacitor circuit board, which includes a circuit substrate, multiple electrolytic capacitors, multiple wiring terminals and multiple surface mount devices, wherein the electrolytic capacitors and the wiring terminals need to be connected to the circuit substrate through wave soldering, and the surface mount devices need to be connected to the circuit substrate through reflow soldering; in the electrolytic capacitor circuit board, a first area and a second area are set on the front of the circuit substrate, and the electrolytic capacitors are concentratedly arranged in the first area, and all the surface mount devices and part of the wiring terminals are concentratedly arranged in the second area; since the electrolytic capacitors, wiring terminals and surface mount devices are only arranged on one side of the circuit substrate, the surface mount devices will no longer be arranged on the back of the circuit substrate, and when the electrolytic capacitors and wiring terminals are wave soldered, there is no need to place them on the circuit substrate. A shielding tool is set on the chip components on the back to reduce production costs. Moreover, since the chip components are no longer arranged on the back of the circuit substrate, the electrolytic capacitors that originally needed to give way can be arranged more closely, thereby increasing the current carrying capacity of the circuit substrate and improving work efficiency. At the same time, through centralized layout, the areas where the electrolytic capacitors and chip components are arranged are separated. The chip components will no longer be interspersed between the electrolytic capacitors, making it more convenient to spray paint the chip components, and the paint nozzle will not interfere with the electrolytic capacitors. In addition, the chip components and electrolytic capacitors are separated by wiring terminals. Most of the chip components will have a farther distance from the electrolytic capacitors, and the wiring terminals fill this distance, so that the space utilization rate of the circuit substrate remains at a high level.

[0017] In the second technical solution, the SMD devices in the second area are arranged close to the edge of the circuit substrate, and the connection terminals are placed close to the SMD devices, thereby reducing the distance between the connection terminals and the edge of the circuit substrate and facilitating external connection of the connection terminals.

[0018] In technical solution three, the multiple terminal blocks in the second area are arranged to be spaced apart along a preset direction, which can form a dividing line between the electrolytic capacitor and the surface mount device, thereby reducing the impact of the electrolytic capacitor on the painting process of the surface mount device.

[0019] In technical solution four, some surface mount devices are arranged between adjacent wiring terminals. Since sufficient safety distance needs to be left between the wiring terminals, this space can be used for the arrangement of surface mount devices to improve the utilization rate of the front side of the circuit substrate.

[0020] In technical solution five, the shapes of the adjacent edges of the first region and the second region match each other to maximize the use of the space of the circuit substrate and make the devices on the circuit substrate more densely distributed.

[0021] In Technical Solution 6, the connection terminals in the second area are arranged at intervals along the shape of the edge where the second area is adjacent to the first area, thereby forming a dividing line that separates the chip devices and the electrolytic capacitors. While improving the utilization rate of the front side of the circuit substrate, it effectively separates the layout areas of the chip devices and the electrolytic capacitors, reducing the impact of the electrolytic capacitors on the chip devices.

[0022] In technical solution seven, the remaining connection terminals are located in the first area and close to the edge of the circuit substrate, which is convenient for forming an electrical connection with the electrolytic capacitor and facilitating external wiring.

[0023] Technical solution ten provides a converter, which includes the above-mentioned electrolytic capacitor circuit board, which can reduce production costs and facilitate the painting operation of the surface mount devices on the electrolytic capacitor circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a schematic diagram of the front structure of the electrolytic capacitor circuit board provided by the utility model;

[0026] Figure 2 for Figure 1 Enlarged schematic diagram of part A.

[0027] Description of main reference numerals:

[0028] Circuit substrate 1; electrolytic capacitor 2; terminal 3; surface mount device 4; first area 5; second area 6. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are preferred embodiments of the present invention and should not be regarded as excluding other embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0030] In the claims, description and the above-mentioned drawings of the present utility model, unless otherwise clearly defined, the use of terms such as "first", "second" or "third" is to distinguish different objects rather than to describe a specific order.

[0031] In the claims, specification and the above-mentioned drawings of the present utility model, unless otherwise expressly defined, directional words, such as the terms "center", "transverse", "longitudinal", "horizontal", "vertical", "top", "bottom", "inside", "outside", "up", "down", "front", "back", "left", "right", "clockwise", "counterclockwise" and the like, indicating directions or positional relationships are based on the directions and positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the specific protection scope of the present utility model.

[0032] In the claims, specification and the above drawings of the present utility model, unless otherwise clearly defined, if the terms "fixed connection" or "fixed connection" are used, they should be understood in a broad sense, that is, any connection method without any displacement relationship and relative rotation relationship between the two parties, that is to say, including non-detachable fixed connection, detachable fixed connection, integral connection and fixed connection through other devices or elements.

[0033] In the claims, description and drawings of the present utility model, if the terms "include", "have" and their variations are used, they are intended to mean "including but not limited to".

[0034] Example 1

[0035] The utility model embodiment 1 provides an electrolytic capacitor circuit board, referring to Figure 1 The electrolytic capacitor circuit board includes a circuit substrate 1, multiple electrolytic capacitors 2, multiple wiring terminals 3, and multiple surface mount devices 4. The electrolytic capacitors 2 and wiring terminals 3 are electrically connected to the circuit substrate 1 through wave soldering, and the surface mount devices 4 are electrically connected to the circuit substrate 1 through reflow soldering.

[0036] As those skilled in the art are familiar with, wave soldering is a process in which molten solder is pumped to an outlet, forming a stable wave. A printed circuit board (PCB) containing electronic components passes through this wave, achieving soldering. Wave soldering is typically used for soldering plug-in components. The pins of the plug-in components extend from one side of the PCB to the other. As the PCB passes through the wave, the solder coats the pins of the plug-in component and the pads on the PCB, forming solder joints. After cooling, the plug-in component is soldered and secured to the PCB.

[0037] The surface mount components 4 are generally fixed by soldering using reflow soldering, which is a process of melting the solder paste pre-distributed on the PCB pads by heating to achieve mechanical and electrical connections between the surface mount components and the PCB pads.

[0038] On a conventional electrolytic capacitor circuit board, the electrolytic capacitor 2 is generally installed on the front of the circuit substrate 1, while the surface mount components 4 may be partially installed on the back of the circuit substrate 1. This results in the electrolytic capacitor 2 being affected by the surface mount components 4 on the back during the wave soldering process. To solve this problem, it is necessary to install a shielding tool on the surface mount components 4 on the back. However, this operation not only increases production costs, but also requires the electrolytic capacitor 2 on the front to be separated from the surface mount components 4 on the back, resulting in a reduction in the current carrying capacity of the circuit substrate 1.

[0039] However, if the patch device 4 is simply moved from the back side of the circuit substrate 1 to the front side, new problems may arise. Specifically, on the electrolytic capacitor circuit board, the heights of the electrolytic capacitor 2, the terminal block 3, and the patch device 4 relative to the front side of the circuit substrate 1 decrease in sequence. At the same time, after the patch device 4 is fixed to the circuit substrate 1 by reflow soldering, the surface of the patch device 4 also needs to be sprayed with paint for protection. Spray painting is generally performed using a nozzle, but the height of the electrolytic capacitor 2 is relatively high. When the patch device 4 is relatively close to the electrolytic capacitor 2, the electrolytic capacitor 2 will interfere with the nozzle, resulting in imperfect spray paint protection for some of the patch devices 4.

[0040] For this purpose, refer to Figure 1 In this embodiment, a first area 5 and a second area 6 are sequentially provided on the front side of the circuit substrate 1 along the first direction, and all of the electrolytic capacitors 2 are arranged in the first area 5; all of the surface mount devices 4 and at least part of the wiring terminals 3 are arranged in the second area 6, and in the first direction, at least part of the surface mount devices 4 are separated from the first area 5 by the wiring terminals 3 located in the second area 6.

[0041] Specifically, the circuit substrate 1 in this embodiment is a rectangle, and the length direction of the rectangle is defined as the first direction mentioned above. Figure 1In the circuit, the left side in the first direction mostly forms the above-mentioned first area 5, and a plurality of electrolytic capacitors 2 are arranged in the first area 5; the right side in the first direction forms the above-mentioned second area 6, and all the SMD components 4 and part of the wiring terminals 3 are arranged in the second area 6. With such an arrangement, since the electrolytic capacitors 2, wiring terminals 3 and SMD components 4 are only arranged on one side of the circuit substrate 1, the SMD components 4 will no longer be arranged on the back of the circuit substrate 1. When the electrolytic capacitors 2 and wiring terminals 3 are wave soldered, it is no longer necessary to set shielding tooling on the SMD components 4 on the back of the circuit substrate 1, thereby reducing production costs. Moreover, since the SMD components 4 are no longer arranged on the back of the circuit substrate 1, the electrolytic capacitors 2 that originally needed to give way can be arranged more closely, thereby increasing the current carrying capacity of the circuit substrate 1 and improving work efficiency. At the same time, through centralized layout, the areas where the electrolytic capacitors 2 and the chip devices 4 are laid out are separated, and the chip devices 4 will no longer be interspersed between the electrolytic capacitors 2, making it more convenient to spray paint on the chip devices 4, and the paint nozzle will not interfere with the electrolytic capacitors 2; in addition, the chip devices 4 and the electrolytic capacitors 2 are separated by the wiring terminals 3, and most of the chip devices 4 will have a farther distance from the electrolytic capacitors 2, and the wiring terminals 3 fill this part of the distance, so that the space utilization rate of the circuit substrate 1 remains at a high level.

[0042] Among them, reference Figure 2 The edge of the first region 5 facing the second region 6 and the edge of the second region 6 facing the first region 5 match each other in shape.

[0043] Specifically, the scope of the first area 5 and the second area 6 can be matched and designed according to the number and size of the electrolytic capacitors 2, as well as the number and size of the patch devices 4 and the terminal blocks 3. For example, in this embodiment, the row of electrolytic capacitors 2 on the far right is arranged to be slightly tilted from top to bottom and from right to left. At this time, the right side edge of the first area 5, that is, the edge facing the second area 6, will also form an inclined shape as the electrolytic capacitors 2 are arranged. In order to further improve the space utilization of the circuit substrate 1, the left side edge of the second area 6, that is, the edge facing the first area 5, is also designed to match the right side edge of the first area 5. At this time, the second area 6 as a whole presents a trapezoidal shape with a narrower width at the top and a larger width at the bottom. With this arrangement, the surface space of the circuit substrate 1 can be maximized, making the device distribution on the circuit substrate 1 more compact.

[0044] At the same time, refer to Figure 2In the second region 6, the SMD components 4 are arranged close to the edge of the circuit substrate 1 in the first direction, and the connection terminals 3 are closely adjacent to the SMD components 4 to reduce the distance from the edge of the circuit substrate 1 in the first direction. Furthermore, the plurality of connection terminals 3 are arranged at intervals along a direction at a predetermined angle to the first direction to separate the electrolytic capacitors 2 and SMD components 4 located on either side thereof in the first direction.

[0045] like Figure 2 As shown, the second area 6 is set on the right side of the circuit substrate 1, and in order to ensure sufficient distance between the surface mount device 4 and the electrolytic capacitor 2, part of the surface mount device 4 is set near the right edge of the circuit substrate 1, and the terminal block 3 is set between most of the surface mount device 4 and the first area 5. However, the terminal block 3 needs to be connected to an external device. If the terminal block 3 is too close to the inside of the circuit substrate 1, it will affect the connection of the terminal block 3. Therefore, the surface mount device 4 is set near the edge, and the terminal block 3 is set close to the surface mount device 4. This arrangement can reduce the distance between the terminal block 3 and the edge of the circuit substrate 1, facilitating the external connection of the terminal block 3.

[0046] In addition, a plurality of wiring terminals 3 are provided in the second area 6. In order to meet the direct safety requirements of the wiring terminals 3, these wiring terminals 3 need to be arranged at a distance apart. Therefore, the wiring terminals 3 in the second area 6 are designed to be arranged at intervals along a direction that is a preset angle to the first direction. The direction that is a preset angle to the first direction here can be a vertical direction, or a slightly different direction as shown in this embodiment, thereby forming a dividing line that separates the electrolytic capacitor 2 and the patch device 4, reducing the impact of the electrolytic capacitor 2 on the painting process of the patch device 4. In this embodiment, the wiring terminals 3 are arranged close to the edge of the second area 6 toward the first area 5, and are arranged at intervals along the shape of the edge. While improving the utilization rate of the front side of the circuit substrate 1, the layout area of ​​the patch device 4 and the electrolytic capacitor 2 is effectively separated, reducing the impact of the electrolytic capacitor 2 on the patch device 4.

[0047] Continue to refer to Figure 2 , some of the SMD components 4 are arranged between two adjacent terminals 3 arranged at intervals in a preset direction. Since the terminals 3 are spaced a certain distance apart, some of the SMD components 4 can be arranged between adjacent terminals 3 to effectively utilize the space on the circuit substrate 1.

[0048] In addition to the aforementioned connection terminals 3 located in the second area 6 , the electrolytic capacitor circuit board may also be configured with other connection terminals 3 . These remaining connection terminals 3 may be arranged in the first area 5 and close to the edge of the circuit substrate 1 to facilitate external connection of the circuit board.

[0049] In this embodiment, the chip components 4 include chip resistors, chip capacitors and / or chip inductors. These chip components 4 are relatively small and can be conveniently fixed on the circuit substrate 1 by reflow soldering.

[0050] Example 2

[0051] Embodiment 2 of the present invention provides a converter comprising a cabinet and electronic components located within the cabinet, such as a rectifier and inverter device, a transformer, a reactor, and a filter. Furthermore, the converter comprises the electrolytic capacitor circuit board provided in Embodiment 1 above, which is electrically connected to certain electronic components within the cabinet to implement their corresponding functions.

[0052] The converter provided in this embodiment uses the electrolytic capacitor circuit board provided in Example 1, thereby reducing production costs and facilitating the painting operation of the chip components 4 on the electrolytic capacitor circuit board.

[0053] The above description and embodiments are used to explain the scope of protection of the utility model, but do not constitute a limitation on the scope of protection of the utility model. Based on the enlightenment of the utility model or the above embodiments, modifications, equivalent replacements, or other improvements to the embodiments of the utility model or part of the technical features thereof that can be obtained by ordinary technicians in this field through logical analysis, reasoning, or limited experiments in combination with common knowledge, ordinary technical knowledge in this field and / or existing technology should be included in the scope of protection of the utility model.

Claims

1. An electrolytic capacitor circuit board, characterized in that: The invention comprises a circuit substrate (1), a plurality of electrolytic capacitors (2), a plurality of connection terminals (3) and a plurality of surface mount devices (4); the electrolytic capacitors (2) and the connection terminals (3) are electrically connected to the circuit substrate (1) through wave soldering, and the surface mount devices (4) are electrically connected to the circuit substrate (1) through reflow soldering; The front surface of the circuit substrate (1) is provided with a first area (5) and a second area (6) in sequence along a first direction; all the electrolytic capacitors (2) are arranged in the first area (5); all the surface mount devices (4) and at least part of the connection terminals (3) are arranged in the second area (6), and in the first direction, at least part of the surface mount devices (4) and the first area (5) are separated by the connection terminals (3) located in the second area (6).

2. The electrolytic capacitor circuit board according to claim 1, wherein: In the second area (6), the patch device (4) is arranged close to the edge of the circuit substrate (1) in the first direction, and the connection terminal (3) is close to the patch device (4) to reduce the distance from the edge of the circuit substrate (1) in the first direction.

3. The electrolytic capacitor circuit board according to claim 2, wherein: In the second area (6), a plurality of connection terminals (3) are arranged at intervals along a direction at a preset angle to the first direction to separate the electrolytic capacitors (2) and the surface mount devices (4) located on both sides thereof in the first direction.

4. The electrolytic capacitor circuit board according to claim 3, wherein: Some of the patch devices (4) are arranged between two adjacent connection terminals (3) arranged at intervals in a preset direction.

5. The electrolytic capacitor circuit board according to claim 4, wherein: The edge of the first region (5) facing the second region (6) and the edge of the second region (6) facing the first region (5) match each other in shape.

6. The electrolytic capacitor circuit board according to claim 5, wherein: In the second area (6), the connection terminals (3) are arranged close to the edge of the second area (6) toward the first area (5), and are arranged at intervals along the shape of the edge.

7. An electrolytic capacitor circuit board as claimed in claim 6, characterized in that the rest Some of the connection terminals (3) are located in the first area (5) and are arranged close to the edge of the circuit substrate (1).

8. The electrolytic capacitor circuit board according to claim 7, wherein: The circuit substrate (1) is rectangular, and the first direction is the length direction of the circuit substrate (1).

9. The electrolytic capacitor circuit board according to any one of claims 1 to 8, wherein: The heights of the electrolytic capacitor (2), the connection terminal (3), and the patch device (4) relative to the front surface of the circuit substrate (1) decrease in sequence; the patch device (4) includes a resistor, a capacitor, and / or an inductor.

10. A converter, characterized in that: Comprising the electrolytic capacitor circuit board according to any one of claims 1 to 9.

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