Low-cost LED support

Abstract

The utility model discloses a low-cost LED support which comprises a plurality of pins, a cup body is arranged on one side of the pins in an injection molding mode, and a silver coating is arranged on the face, close to the cup body, of each pin. The surface, close to the cup body, of the pin is provided with the silver coating, so that the conductivity and corrosion resistance of the pin can be enhanced, and the conductivity of the LED chip and an external power supply is further improved; the other surface of each pin is provided with a tin coating, so that the weldability between the pins and an external panel or an external circuit board can be improved, and the corrosion resistance of the pins is improved; compared with the traditional method of plating the silver layers on both sides of the substrate, plating the silver layer on the contact area of the pin and the LED chip and plating the tin layer on the other side of the pin, the use volume of the silver is reduced, and the cost is further reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED brackets, in particular to a low-cost LED bracket. Background Art

[0002] An LED bracket is a structural component used to support and connect light-emitting diodes. It's typically made of conductive metal, offering excellent electrical conductivity and mechanical strength. Its primary function is to secure the LED chip. It typically includes two or more pins that provide electrical connection and aid in heat dissipation. To improve the pins' conductivity, they're often plated with silver.

[0003] For example, the “LED bracket with silver-plated double-sided substrate” disclosed in the patent document “CN203434198U” has the technical solution of “including a substrate with silver plating on both the front and back sides, and the substrate is made of translucent aluminum nitride ceramic material.”

[0004] In this patent, the conductivity and corrosion resistance of the pins are improved by silver plating on both sides of the substrate of the bracket. Since silver plating is required on both sides of the pins, the cost of the LED bracket is greatly increased. Utility Model Content

[0005] The purpose of the present invention is to provide a low-cost LED bracket to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A low-cost LED bracket comprises a plurality of pins. A cup body is injection-molded on one side of the plurality of pins. A silver-plated layer is provided on one side of the pins close to the cup body; and a tin-plated layer is provided on the other side of the pins.

[0008] According to a further technical solution, a region where several of the pins are close to each other forms a functional region, and the silver-plated layer is located at a position in the functional region corresponding to the window of the cup body.

[0009] According to a further technical solution, a positioning groove is provided at one end of the cup body.

[0010] According to a further technical solution, one side of the tinned layer of the pin contacts the circuit board.

[0011] According to a further technical solution, the pin is provided with a positioning protrusion.

[0012] According to a further technical solution, curved grooves are provided on the left and right sides of the pin.

[0013] According to a further technical solution, several of the pins are exposed from the bottom surface of the cup body and are flush with it.

[0014] The beneficial effects of the present invention are as follows: by providing a silver-plated layer on one side of the pin close to the cup body, the conductivity and corrosion resistance of the pin can be enhanced, thereby improving the conductivity between the LED chip and the external power supply; the other side of the pin is provided with a tin-plated layer, which can improve the solderability between the pin and the external panel or external circuit board, and improve the corrosion resistance of the pin; compared with the traditional method of coating silver layers on both sides of the substrate, the silver layer is coated on the area of ​​the pin that contacts the LED chip, and the tin layer is coated on the other side of the pin, which reduces the volume of silver used, thereby reducing costs.

[0015] Other features and advantages of the present invention will be described in detail in the subsequent detailed description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 : Schematic diagram of the LED bracket substrate under the prior art of the utility model.

[0017] Figure 2 : A schematic diagram of the top structure of the present invention.

[0018] Figure 3 : A schematic diagram of the structure of the utility model when viewed from above.

[0019] Figure 4 : A three-dimensional structural diagram of the present invention.

[0020] Figure 5 : A front perspective view of the present invention.

[0021] Reference numerals: 1, substrate; 2, silver layer 1; 3, silver layer 2; 4, pin; 5, cup body; 6, silver plating layer; 7, tin plating layer; 8, positioning groove; 9, positioning protrusion DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0023] Reference Figure 1 The traditional LED bracket adopts the method of silver plating on both sides of the substrate 1, that is, a silver layer 2 is plated on one side of the substrate 1, and a silver layer 3 is plated on the other side of the substrate 1. Although the conductivity and corrosion resistance of the pin 4 are improved, the volume of silver used is also increased, thereby increasing the manufacturing cost of the LED bracket.

[0024] Example 1:

[0025] Reference Figure 2The utility model provides a low-cost LED bracket, including several pins 4. In this embodiment, the area where the several pins 4 are close to each other forms a functional area. A cup body 5 is injection-molded on the pin 4 corresponding to the functional area, and a silver-plated layer 6 is provided at the position of the window of the cup body 5 corresponding to the functional area; a tin-plated layer 7 is provided on the other side of the pin 4, and the thickness of the tin-plated layer 7 is not limited in this embodiment. One side of the tin-plated layer 7 of the pin 4 is in contact with the circuit board; the use of an LED bracket with a silver-plated layer 6 at the position of the window of the cup body 5 corresponding to the functional area and a tin-plated layer 7 on the other side of the pin 4 can improve the conductivity and corrosion resistance of the pin 4 while reducing costs.

[0026] In this example, a positioning groove 8 is provided at one end of the outer wall of the cup body 5. In actual application, the positioning groove 8 is provided to facilitate operators to identify the negative pole of the lamp bead during the processes of crystal bonding, wire welding, spectrometry, taping, and patching, thereby preventing mistakes.

[0027] In this embodiment, positioning protrusions 9 are provided on several pins 4. In actual applications, when operators use multiple LED brackets in combination, they usually choose to place multiple LED brackets on a board rack that supports the LED brackets. The board rack is provided with a snap-in groove for snapping with the positioning protrusions 9, which can make it easier to mount the LED brackets on the board rack.

[0028] In this embodiment, the pins 4 are arranged horizontally, and some pins 4 are exposed on the bottom surface of the cup body 5 and are flush with the cup body 5, so that the exposed part of the pins 4, that is, the part of the tin-plated layer 7, can directly contact the circuit board, and then conduct current to the LED chip. That is, the pins 4 adopt a "flat foot" design. The flat foot design can effectively reduce the overall volume of the bracket, which is conducive to the lightweight and thinning of the LED bracket or other products using the LED bracket. The flat foot design makes the packaging bracket smoother after being attached to the board, and can quickly transfer the heat generated by the LED chip.

[0029] In this embodiment, curved grooves are provided on the left and right sides of the pins 4, so that when the cup body 5 is injection-molded, the spacing bands between the pins 4 are injection-molded with curved protrusions, which are engaged with the curved grooves, further enhancing the stability between the pins 4 and the injection-molded cup body 5.

[0030] Example 2:

[0031] Most of the structures of this embodiment are the same as those of embodiment 1;

[0032] The structural difference from Example 1 is:

[0033] In this embodiment, the pin 4 is bent upward to wrap around the cup body 5, and the side surface of the pin 4 is flush with the top plate of the cup body 5, so that it wraps around the cup body 5 of the LED. The bent pin 4 can be more easily fixed on the cup body 5 of the LED, ensuring good mechanical stability. During the assembly process, this design can simplify the welding steps and improve production efficiency. The design of bending upward to wrap around the cup body 5 provides additional mechanical support to prevent the LED from being displaced or vibrated during use, and can provide a more reliable electrical connection between the pin 4 and the external circuit, reduce the risk of poor contact, and ensure that the LED chip can work stably in various environments.

[0034] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0035] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A low-cost LED bracket, comprising a plurality of pins (4), characterized in that: A cup body (5) is injection-molded on one side of the pin (4); a silver-plated layer (6) is provided on one side of the pin (4) close to the cup body (5); and a tin-plated layer (7) is provided on the other side of the pin (4).

2. A low-cost LED bracket according to claim 1, characterized in that: The area where the plurality of pins (4) are close to each other forms a functional area, and the silver-plated layer (6) is located at a position in the functional area corresponding to the window of the cup body (5).

3. A low-cost LED bracket according to claim 1, characterized in that: A positioning groove (8) is provided at one end of the cup body (5).

4. A low-cost LED bracket according to claim 1, characterized in that: One side of the tinned layer (7) of the pin (4) contacts the circuit board.

5. The low-cost LED bracket according to claim 1, characterized in that: The pin (4) is provided with a positioning protrusion (9).

6. The low-cost LED bracket according to claim 1, characterized in that: Curved grooves are provided on the left and right sides of the pin (4).

7. The low-cost LED bracket according to claim 1, characterized in that: Several of the pins (4) are exposed from the bottom surface of the cup body (5) and are flush with it.

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