Degumming machine for monocrystalline silicon wafer

Abstract

The utility model discloses a degumming machine for monocrystalline silicon wafers, which relates to the technical field of silicon wafer degumming and comprises a fixing frame, supporting rods are arranged at two ends of the fixing frame, and silicon wafers are uniformly supported on the supporting rods at two sides; positioning assemblies are arranged on the front side and the rear side of the fixing frame. Two fixing assemblies are arranged on the fixing frame, the two fixing assemblies are distributed in the front-back direction, and the silicon wafer is fixed through one fixing assembly; during cleaning and degumming, the silicon wafers can be fixed through the front fixing assembly and the rear fixing assembly respectively, so that the contact faces of the silicon wafers and the clamping rods can be cleaned, and complete degumming is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer degumming, in particular to a degumming machine for single crystal silicon wafers. Background Art

[0002] Patent No. CN202222340782.6 discloses a degumming machine for single crystal silicon wafers, which uses a pressing block 102 to press and fix the single crystal silicon wafers, solving the problem that most traditional single crystal silicon wafers are placed in a degumming frame for cleaning, which does not have the function of pressing the single crystal silicon wafers, easily causing the single crystal silicon wafers to fall and cause damage to the single crystal silicon wafers. The degumming frame can drive the degumming frame to move back and forth in the cleaning box, solving the problem that most existing single crystal silicon wafers are degummed by static water washing, resulting in poor degumming effect.

[0003] However, the applicant found that the surface part in contact with the silicon wafer and the pressing block 102 could not be effectively cleaned, resulting in incomplete debonding, and the silicon wafer could only be moved forward and backward, and the debonding efficiency was still low. Therefore, we proposed a debonding machine for single crystal silicon wafers. Utility Model Content

[0004] The purpose of the utility model is to provide a debonding machine for single crystal silicon wafers to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a debonding machine for single crystal silicon wafers, comprising a fixing frame, wherein both ends of the fixing frame are provided with support rods, and silicon wafers are evenly supported on the support rods on both sides;

[0006] Positioning components are provided on both the front and rear sides of the fixing frame;

[0007] The fixing frame is provided with two fixing components, which are distributed in the front-to-back direction, and the silicon wafer is fixed by one fixing component;

[0008] An electric telescopic rod is provided on the top of the fixing frame, the electric telescopic rod is connected to a horizontally arranged electric guide rail 1, the electric guide rail 1 is connected to a front-to-back electric guide rail 2, and the electric guide rail 2 is provided on the cleaning box;

[0009] The cleaning box is provided with a controller.

[0010] As a preferred solution of the degumming machine for single crystal silicon wafers described in the utility model, the positioning assembly includes a positioning plate, the positioning plate is evenly provided with slots matching the silicon wafers, the positioning plate is connected to the connecting rod, the connecting rod is connected to the electric push rod, and the electric push rod is arranged on the fixed frame.

[0011] As a preferred solution of a degumming machine for single crystal silicon wafers described in the utility model, the fixing component includes a slide rail arranged on a fixing frame, a motor is arranged at the right end of the slide rail, the output end of the motor is connected to the rotating shaft, threads are evenly arranged on the rotating shaft, and the rotation directions of adjacent threads are opposite, and a clamping rod is screwed on the threads.

[0012] As a preferred solution of the debonding machine for single crystal silicon wafers described in the utility model, the clamping rod is connected to the slide rail in a transverse sliding manner.

[0013] As a preferred solution of the debonding machine for single crystal silicon wafers described in the utility model, the rotating shaft is connected to the slide rail through a bearing.

[0014] As a preferred solution of the debonding machine for single crystal silicon wafers described in the utility model, the silicon wafer is fixed by clamping rods on both sides.

[0015] As a preferred solution of the debonding machine for single crystal silicon wafers described in the utility model, the electric push rod is higher than the silicon wafer.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. When cleaning and degumming, the silicon wafer can be fixed separately by the front and rear fixing components, so that the contact surface between the silicon wafer and the clamping rod can be cleaned to achieve complete degumming;

[0018] 2. The electric telescopic rod enables the silicon wafer to move back and forth vertically, the electric guide rail 1 enables the silicon wafer to move back and forth horizontally, and the electric guide rail 2 enables the silicon wafer to move back and forth, thus enabling the silicon wafer to move in the cleaning water in multiple directions, thereby improving the cleaning efficiency;

[0019] 3. The positioning component facilitates the positioning of the silicon wafer placed on the support rod so that it can be subsequently fixed by one of the fixing components. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of a debonding machine for single crystal silicon wafers according to the present invention;

[0021] Figure 2 This is an enlarged schematic diagram of the partial structure of a debonding machine for single crystal silicon wafers according to the present invention;

[0022] Figure 3 The utility model is a schematic cross-sectional view of the fixing component structure of a debonding machine for single crystal silicon wafers.

[0023] In the figure: 1. Fixed frame; 2. Support rod; 3. Silicon wafer; 4. Electric telescopic rod; 5. Electric guide rail 1; 6. Electric guide rail 2; 7. Cleaning box; 8. Controller; 9. Positioning plate; 10. Connecting rod; 11. Electric push rod; 12. Slide rail; 13. Motor; 14. Rotating shaft; 15. Thread; 16. Clamping rod. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] As mentioned in the background art, the surface of the silicon wafer in contact with the pressing block cannot be effectively cleaned in the prior art, resulting in incomplete debonding. Furthermore, the silicon wafer can only be moved forward and backward, resulting in low debonding efficiency. The present invention provides a debonding machine for single crystal silicon wafers.

[0026] Example 1

[0027] Reference Figures 1 to 3 A debonding machine for single crystal silicon wafers includes a fixing frame 1, support rods 2 are provided at both ends of the fixing frame 1, silicon wafers 3 are evenly supported on the support rods 2 on both sides, and the bottom of the silicon wafer 3 is supported by the support rods 2;

[0028] Positioning components are provided on both the front and rear sides of the fixing frame 1;

[0029] The fixing frame 1 is provided with two fixing components, which are distributed along the front-back direction, and the silicon wafer 3 is fixed by one fixing component;

[0030] An electric telescopic rod 4 is provided on the top of the fixed frame 1. The electric telescopic rod 4 is connected to the horizontal electric guide rail 1 5. The electric guide rail 1 5 is connected to the electric guide rail 2 6 provided in the front-to-back direction. The electric guide rail 2 6 is provided on the cleaning box 7, so that the silicon wafer 3 can be moved vertically, left-right, and front-to-back, thereby improving the degumming efficiency.

[0031] The cleaning box 7 is provided with a controller 8 for controlling the electrical components therein.

[0032] The positioning assembly includes a positioning plate 9, which is evenly provided with slots matching the silicon wafer 3. The positioning plate 9 is connected to a connecting rod 10, which is connected to an electric push rod 11, and the electric push rod 11 is arranged on the fixing frame 1. The silicon wafer 3 is inserted into the slots of the positioning plates 9 on the front and rear sides until the bottom contacts the support rod 2 and stops. All silicon wafers 3 can be positioned, and then the silicon wafer 3 is fixed by the fixing assembly. The connecting rod 10 can be driven to move by the electric push rod 11, so that the positioning plate 9 is separated from the silicon wafer 3, so that the silicon wafer 3 can be completely debonded. The connecting rod 10 is set so that the electric push rod 11 can be set at a high place.

[0033] The fixing assembly includes a slide rail 12 arranged on the fixing frame 1, and a motor 13 is provided at the right end of the slide rail 12. The output end of the motor 13 is connected to the rotating shaft 14. Threads 15 are evenly arranged on the rotating shaft 14, and the rotation directions of adjacent threads 15 are opposite. A clamping rod 16 is screwed on the thread 15. The motor 13 drives the rotating shaft 14 to rotate, so that the thread 15 drives the clamping rod 16 to move.

[0034] The clamping rod 16 is connected to the slide rail 12 in a transverse sliding manner, which can guide the clamping rod 16.

[0035] In order to improve the stability of the rotating shaft 14 , the rotating shaft 14 is connected to the slide rail 12 via a bearing.

[0036] The silicon wafer 3 is fixed by clamping bars 16 on both sides.

[0037] After positioning the silicon wafer 3, the two clamping rods 16 on the rear side can be used to fix the silicon wafer 3, so that the positioning plate 9 can be moved away from the silicon wafer 3. At this time, cleaning and degumming can be carried out. During the degumming process, after the two clamping rods 16 on the front side can be used to fix the silicon wafer 3, the two clamping rods 16 on the rear side can be moved away from the silicon wafer 3, so that the silicon wafer 3 can be fixed respectively by the front and rear clamping rods 16, so that the contact surface between the silicon wafer 3 and the clamping rods 16 can be cleaned to achieve complete degumming.

[0038] Example 2

[0039] Reference Figures 1 to 2 The electric push rod 11 is higher than the silicon wafer 3 so that the electric push rod 11 does not contact the cleaning water when the silicon wafer 3 is cleaned, thereby protecting the electric push rod 11.

[0040] The rest of the structure is the same as that of Example 1.

[0041] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A debonding machine for single crystal silicon wafers, characterized by: include, A fixed frame (1), wherein support rods (2) are provided at both ends of the fixed frame (1), and silicon wafers (3) are evenly supported on the support rods (2) on both sides; Positioning components are provided on both the front and rear sides of the fixing frame (1); The fixing frame (1) is provided with two fixing components, which are distributed in the front-back direction, and the silicon wafer (3) is fixed by one fixing component; An electric telescopic rod (4) is provided on the top of the fixing frame (1), the electric telescopic rod (4) is connected to a horizontally arranged electric guide rail (5), the electric guide rail (5) is connected to a front-back electric guide rail (6), and the electric guide rail (6) is provided on a cleaning box (7); The cleaning box (7) is provided with a controller (8).

2. The debonding machine for single crystal silicon wafers according to claim 1, characterized in that: The positioning assembly includes a positioning plate (9), on which slots matching the silicon wafer (3) are evenly opened, the positioning plate (9) is connected to a connecting rod (10), the connecting rod (10) is connected to an electric push rod (11), and the electric push rod (11) is arranged on a fixing frame (1).

3. The debonding machine for single crystal silicon wafers according to claim 1, characterized in that: The fixing assembly comprises a slide rail (12) arranged on a fixing frame (1), a motor (13) being arranged at the right end of the slide rail (12), an output end of the motor (13) being connected to a rotating shaft (14), threads (15) being evenly arranged on the rotating shaft (14), and adjacent threads (15) having opposite rotation directions, and a clamping rod (16) being screwed onto the threads (15).

4. The debonding machine for single crystal silicon wafers according to claim 3, characterized in that: The clamping rod (16) is connected to the slide rail (12) in a transverse sliding manner.

5. The debonding machine for single crystal silicon wafers according to claim 3, characterized in that: The rotating shaft (14) is connected to the slide rail (12) via a bearing.

6. The debonding machine for single crystal silicon wafers according to claim 3, characterized in that: The silicon wafer (3) is fixed by clamping rods (16) on both sides.

7. The debonding machine for single crystal silicon wafers according to claim 2, characterized in that: The electric push rod (11) is higher than the silicon chip (3).

Images