Grinding disc and grinding device
By setting a bevel grinding head and a spherical universal rod on the grinding disk, combined with V-grooves and spring restrictions, the problem of the grinding disk damaging the wafer edge is solved, and an efficient and low-cost grinding effect is achieved.
Patent Information
- Application Number
- CN202422188448.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-09-06
AI Technical Summary
The grinding blades of existing grinding discs are at right angles, which easily causes damage when grinding the edge of the wafer, and also results in low grinding efficiency and high cost.
The grinding disc uses a beveled grinding head and provides pressure through a spherical universal rod and a grinding ring. Combined with V-grooves and springs, it limits the movement range of the connecting rod to improve stability and angle control.
This avoids damage to the wafer edge, improves grinding efficiency, and reduces grinding costs.
Smart Images
Figure CN223313751U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of wafer grinding, and in particular to a grinding disc and a grinding device. Background Art
[0002] With the rapid development of the semiconductor industry, chemical mechanical polishing (CMP) is required in many wafer formation steps. Chemical agents and abrasive particles are added to the wafer surface. The grinding disk rotates relative to the wafer surface in a pressing and rotating manner, causing friction between the wafer surface and the mask blade to achieve flatness and achieve the purpose of grinding.
[0003] When controlling the grinding wheel to grind the wafer, it is necessary to first control the grinding wheel to move above the wafer, and then use the grinding wheel to apply downward pressure to form the grinding head to grind the wafer. However, in the existing technology, the grinding head of the grinding wheel is all right-angled, and when the grinding wheel grinds the edge of the wafer, it is very easy to cause damage to the edge of the wafer. Utility Model Content
[0004] Based on this, it is necessary to provide a grinding disc and a grinding device to address the problems in the above background technology, which can at least prevent the grinding disc from damaging the edge of the wafer when grinding the edge of the wafer, thereby improving the grinding efficiency and reducing the grinding cost.
[0005] In order to solve the above-mentioned technical problems and other problems, according to some embodiments, one aspect of the present application provides a grinding disk, which includes: a grinding ring; a plurality of spherical universal rods, each of which has a universal ball head formed at one end; a plurality of grinding heads, each of which has a spherical cavity formed on its connecting surface, and the universal ball heads of the plurality of spherical universal rods are located in the spherical cavities of the plurality of grinding heads, so that the plurality of spherical universal rods are rotatably connected to the plurality of grinding heads; wherein the connecting ends of the plurality of spherical universal rods are fixedly connected to the grinding ring, and the grinding surface of each grinding head is a bevel.
[0006] In the grinding disk in the above embodiment, by setting the grinding surface of the grinding head as a bevel and providing pressure to the grinding head through the spherical universal rod and the grinding ring, the right angle of the grinding head is avoided from causing damage to the edge of the wafer, which can improve the grinding efficiency and reduce the grinding cost.
[0007] In some embodiments, each grinding head further includes: a V-shaped groove located on the connecting surface corresponding to the grinding surface, and a spherical cavity is formed at the bottom V-shaped tip of the V-shaped groove.
[0008] In the grinding disc of the above embodiment, the V-shaped groove is provided on the connecting surface to limit the movement range of the connecting rod, thereby preventing the angular deviation of the grinding surface caused by excessive angular deviation of the connecting rod.
[0009] In some embodiments, each grinding head further includes: two springs, one end of one spring is fixedly connected to the first target position of the connecting surface of the grinding head, and the other end is fixedly connected to the grinding ring; one end of the other spring is fixedly connected to the second target position of the connecting surface of the grinding head, and the other end is fixedly connected to the grinding ring; wherein the first target position and the second target position are respectively located at relative positions on both sides of the opening of the V-shaped groove on the connecting surface.
[0010] In the grinding disc in the above embodiment, by providing two springs on the connecting surface, the stability of the grinding head is improved, and the angular deviation of the grinding surface caused by excessive angular deviation of the grinding head is further avoided.
[0011] In some embodiments, the tooth length of each grinding head is 4 mm to 6 mm.
[0012] In some embodiments, the bevel height of the teeth of each grinding head is 24um-26um.
[0013] In the grinding disk in the above embodiment, the inclination angle of the bevel of the grinding head is restricted by limiting the tooth length and tooth bevel height of the grinding head, thereby further improving the grinding efficiency and avoiding damage to the wafer caused by excessive inclination angle of the grinding head.
[0014] In some embodiments, each connecting rod is connected perpendicularly to the grinding ring.
[0015] In some embodiments, the angle of the V-shaped groove is greater than the inclination angle of the bevel surface of the grinding head.
[0016] In the grinding disk of the above embodiment, by limiting the angle of the V-shaped groove, the problem that the angle of the V-shaped groove is too small, resulting in the inclined surface of the grinding head being unable to grind parallel to the wafer, is avoided.
[0017] In some embodiments, the length of the plurality of spherical universal rods is greater than the depth of the V-shaped grooves.
[0018] Another aspect of the present application provides a grinding device, wherein the substrate detection device includes the grinding disk in any one of the above embodiments.
[0019] In some embodiments, the grinding device also includes: a placement table, which is provided with a wafer placement area and a polishing disk placement area; a polishing disk, which is arranged in the polishing disk placement area; an adjustment mechanism, which is connected to the grinding disk and is used to drive the grinding disk to move to a position corresponding to the wafer placement area or the polishing disk placement area; a rotating mechanism, which is arranged on the placement table and / or the grinding ring of the grinding disk to realize relative rotation between the grinding disk and the wafer placement area or the polishing disk placement area; a grinding liquid supply mechanism, which is connected to the adjustment mechanism, and the grinding liquid supply mechanism is connected to the liquid outlet.
[0020] In the grinding disk and grinding device of the above embodiment, by setting the grinding surface of the grinding head as a bevel and providing pressure to the grinding head through the spherical universal rod and the grinding ring, damage to the edge of the wafer caused by the right angle of the grinding head is avoided, which can improve the grinding efficiency and reduce the grinding cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, without paying any creative work, they can also obtain drawings of other embodiments based on these drawings.
[0022] Figure 1 A schematic diagram of a grinding disc in the prior art;
[0023] Figure 2 This is one of the schematic diagrams of a grinding disc provided in one embodiment of the present application;
[0024] Figure 3 This is a second schematic diagram of a grinding disc provided in one embodiment of the present application;
[0025] Figure 4 This is a third schematic diagram of a grinding disc provided in one embodiment of the present application;
[0026] Figure 5 This is the fourth schematic diagram of the grinding disc provided in one embodiment of the present application.
[0027] Description of reference numerals:
[0028] 101. Right-angle cutter head; 102. Wafer; 201. Grinding ring; 202. Spherical universal rod; 203. Grinding cutter head; 204. Universal ball head; 205. Spherical cavity; 206. Connecting surface; 207. Grinding surface; 301. Spring; 302. V-shaped groove. DETAILED DESCRIPTION
[0029] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.
[0031] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.
[0032] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this application.
[0033] In this application, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to direct connection or indirect connection through an intermediate medium, internal communication between two elements, or interaction between two elements. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0034] Considering that the grinding heads of grinding discs are all right-angled at present, it is very easy to cause damage to the edge of the wafer when the grinding disc grinds the edge of the wafer.
[0035] Please refer to Figure 1 , Figure 1 Schematic diagram of a conventional grinding wheel. The conventional grinding wheel comprises a right-angle cutter head 101 and a wafer 102.
[0036] When the right-angled blade head 101 of the existing grinding wheel is grinding the edge of the wafer 102 , the right-angled blade head 101 is very likely to damage the edge of the wafer 102 .
[0037] It should be noted that the grinding disc mentioned in this application is a wafer grinding disc. A wafer grinding disc is a key tool used in the wafer back grinding process in semiconductor manufacturing. The back grinding process is used to reduce the thickness of the wafer to meet the thickness requirements of packaging and integrated circuits.
[0038] Among them, grinding discs can be divided into the following types according to the different grinding processes and applications: (1) Rough Grinding Disc: used for initial removal of large amounts of material, with coarse abrasive particles and high removal rate. (2) Fine Grinding Disc: used for further thinning of wafers, with finer abrasive particles and higher surface quality. (3) Ultra-Fine Grinding Disc: used for final polishing, with very fine abrasive particles and high surface flatness and finish.
[0039] Specifically, the wafer back grinding process is widely used in the following fields: (1) Chip packaging: thinning the wafer to adapt to various packaging forms, such as flip-chip (Flip-Chip), system-in-package (SiP), etc.; (2) High-performance devices: thinning the wafer to improve the device's heat dissipation and electrical performance to meet the needs of high-performance and high-density integrated circuits; (3) MEMS devices: used in the manufacture of micro-electromechanical systems (MEMS) devices, thinning the wafer to meet miniaturization and high-precision requirements.
[0040] Please refer to Figure 2 , Figure 2 Schematic diagram of a grinding disc provided in an embodiment of the present application. The grinding disc provided in this embodiment includes: a grinding ring 201, a spherical universal rod 202 and a grinding cutter head 203.
[0041] The grinding surface 207 of each grinding head 203 is a bevel.
[0042] The connection ends of the plurality of spherical universal rods 202 are fixedly connected to the grinding ring 201 .
[0043] A universal ball head 204 is formed at one end of each spherical universal rod 202 .
[0044] The connection surface 206 of each grinding head 203 is formed with a spherical cavity 205, and the universal ball heads 204 of the multiple spherical universal rods 202 are located in the spherical cavities 205 of the multiple grinding heads 203, so that the multiple spherical universal rods 202 and the multiple grinding heads 203 can be rotatably connected.
[0045] In this way, by setting the grinding surface 207 of the grinding head 203 as a bevel and providing pressure to the grinding head 203 through the spherical universal rod 202 and the grinding ring 201, the right angle of the grinding head 203 is avoided from causing damage to the edge of the wafer 102, which can improve the grinding efficiency and reduce the grinding cost.
[0046] Each connecting rod is vertically connected to the grinding ring 201 .
[0047] Specifically, the tooth length of each grinding head 203 is 4 mm to 6 mm.
[0048] As an example, the tooth length of each grinding head 203 may be 4 mm, 5 mm or 6 mm.
[0049] Specifically, the bevel height of the teeth of each grinding head 203 is 24 μm-26 μm.
[0050] As an example, the tooth pitch height of each grinding head 203 may be 24 um, 25 um, or 26 um.
[0051] Here, by limiting the tooth bevel height and tooth length of the grinding head 203, the inclination angle of the grinding head 203 is limited, thereby avoiding the grinding head 203 from having an excessively large inclination angle, which may cause damage to the wafer 102 during grinding.
[0052] As an example, see Figure 5 , Figure 5 This is a fourth schematic diagram of a grinding disc provided in one embodiment of the present application. Figure 5 As shown, the grinding ring 201 may be in the shape of a ring, and a plurality of connecting rods are vertically connected to the grinding ring 201 .
[0053] In this way, the rotation of the annular grinding disc can drive the multiple grinding heads 203 to grind the wafer 102.
[0054] In an optional embodiment, each grinding head 203 further includes: a V-shaped groove 302 located on the connecting surface 206 corresponding to the grinding surface 207 , and a spherical cavity 205 is formed at the bottom V-shaped tip of the V-shaped groove 302 .
[0055] In the grinding disc of the above embodiment, the V-shaped groove 302 is provided on the connecting surface 206 to limit the movement range of the connecting rod, thereby preventing the angular deviation of the grinding surface 207 caused by excessive angular deviation of the connecting rod.
[0056] In an optional embodiment, each grinding head 203 also includes: two springs 301, one end of one spring 301 is fixedly connected to the first target position of the connecting surface 206 of the grinding head 203, and the other end is fixedly connected to the grinding ring 201; one end of the other spring 301 is fixedly connected to the second target position of the connecting surface 206 of the grinding head 203, and the other end is fixedly connected to the grinding ring 201.
[0057] The first target position and the second target position are respectively located at opposite positions on both sides of the opening of the V-shaped groove 302 on the connecting surface 206 .
[0058] In the grinding disc of the above embodiment, by providing two springs 301 on the connecting surface 206 , the stability of the grinding head 203 is improved, and the angular deviation of the grinding surface 207 caused by excessive angular deviation of the grinding head 203 is further avoided.
[0059] Specifically, the tooth length of each grinding head 203 is 4 mm to 6 mm.
[0060] As an example, the tooth length of each grinding head 203 may be 4 mm, 5 mm or 6 mm.
[0061] Specifically, the bevel height of the teeth of each grinding head 203 is 24 μm-26 μm.
[0062] As an example, the tooth pitch height of each grinding head 203 may be 24 um, 25 um, or 26 um.
[0063] Here, by limiting the tooth bevel height and tooth length of the grinding head 203, the inclination angle of the grinding head 203 is limited, thereby avoiding the grinding head 203 from having an excessively large inclination angle, which may cause damage to the wafer 102 during grinding.
[0064] Each connecting rod is vertically connected to the grinding ring 201 .
[0065] Specifically, the angle of the V-shaped groove 302 is greater than the inclination angle of the inclined surface of the grinding head 203 .
[0066] In this way, by limiting the angle of the V-shaped groove 302 , the problem that the angle of the V-shaped groove 302 is too small, resulting in the inclined surface of the grinding head 203 being unable to grind parallel to the wafer 102 , is avoided.
[0067] Specifically, the length of the plurality of spherical universal rods 202 is greater than the depth of the V-shaped groove 302 .
[0068] As an example, see Figure 3 , Figure 3 This is the second schematic diagram of the grinding disc provided in one embodiment of the present application. Figure 3 As shown, the grinding disc in the above embodiment includes: a grinding ring 201 , a plurality of spherical universal rods 202 and a plurality of grinding cutter heads 203 .
[0069] A universal ball head 204 is formed at one end of each spherical universal rod 202 .
[0070] The connection surface 206 of each grinding head 203 is formed with a spherical cavity 205, and the universal ball heads 204 of the plurality of spherical universal rods 202 are located in the spherical cavities 205 of the plurality of grinding heads 203, so that the plurality of spherical universal rods 202 are rotatably connected to the plurality of grinding heads 203;
[0071] The connection ends of the plurality of spherical universal rods 202 are fixedly connected to the grinding ring 201 , and the grinding surface 207 of each grinding head 203 is an inclined surface.
[0072] Each grinding head 203 further includes: a V-shaped groove 302 located on the connecting surface 206 corresponding to the grinding surface 207 , and a spherical cavity 205 formed at the bottom V-shaped tip of the V-shaped groove 302 .
[0073] Among them, each grinding head 203 also includes: two springs 301, one end of one spring 301 is fixedly connected to the first target position of the connecting surface 206 of the grinding head 203, and the other end is fixedly connected to the grinding ring 201; one end of the other spring 301 is fixedly connected to the second target position of the connecting surface 206 of the grinding head 203, and the other end is fixedly connected to the grinding ring 201.
[0074] The first target position and the second target position are respectively located at opposite positions on both sides of the opening of the V-shaped groove 302 on the connecting surface 206 .
[0075] Each connecting rod is vertically connected to the grinding ring 201 .
[0076] The angle of the V-shaped groove 302 is greater than the inclination angle of the inclined surface of the grinding head 203 .
[0077] The length of the plurality of spherical universal rods 202 is greater than the depth of the V-shaped groove 302 .
[0078] The tooth length of each grinding head 203 is 4 mm to 6 mm.
[0079] As an example, the tooth length of each grinding head 203 may be 4 mm, 5 mm or 6 mm.
[0080] The tooth bevel height of each grinding head 203 is 24um-26um.
[0081] As an example, the tooth pitch height of each grinding head 203 may be 24 um, 25 um, or 26 um.
[0082] For details, please refer to Figure 4 , Figure 4 This is the third schematic diagram of the grinding disc provided in one embodiment of the present application. Figure 4 Schematic diagram of the grinding disc at work is shown in FIG. Figure 4 As shown, when grinding the wafer 102, the grinding ring 201 presses the grinding surface 207 of the grinding head 203 onto the wafer 102 through the spherical direction rod. Based on the rotation of the universal ball head 204 at one end of the spherical universal rod 202 in the spherical cavity 205 and the restriction of the two springs 301, the inclined grinding surface 207 of the grinding head 203 grinds the wafer 102 smoothly.
[0083] In the grinding disk of the above embodiment, by setting the grinding surface 207 of the grinding head 203 as a bevel and providing pressure to the grinding head 203 through the spherical universal rod 202 and the grinding ring 201, it is avoided that the right angle of the grinding head 203 causes damage to the edge of the wafer 102, which can improve the grinding efficiency and reduce the grinding cost.
[0084] In some embodiments, the embodiments of the present disclosure also provide a grinding device, including: the grinding disc in any of the above embodiments, which can at least prevent the grinding disc from causing damage to the edge of the wafer 102 when grinding the edge of the wafer 102, thereby improving grinding efficiency and reducing grinding costs.
[0085] In an optional embodiment, the grinding device also includes: a placement table, on which a wafer 102 placement area and a polishing disk placement area are provided; a polishing disk, which is arranged in the polishing disk placement area; an adjustment mechanism, which is connected to the grinding disk and is used to drive the grinding disk to move to a position corresponding to the wafer 102 placement area or the polishing disk placement area; a rotating mechanism, which is arranged on the placement table and / or the grinding ring 201 of the grinding disk to realize relative rotation between the grinding disk and the wafer 102 placement area or the polishing disk placement area; and a grinding liquid supply mechanism, which is connected to the adjustment mechanism and is connected to the liquid outlet.
[0086] As an example, a first flow channel is also provided in the grinding disc, the adjustment mechanism includes a connecting shaft, the connecting shaft is connected to the second surface of the grinding disc, a channel is provided in the connecting shaft, the grinding liquid supply mechanism is connected to the channel, the channel is connected to the first flow channel, and the first flow channel is connected to the liquid outlet.
[0087] Specifically, there are multiple liquid outlets, and the multiple liquid outlets are evenly spaced apart on the outer peripheral surface.
[0088] Specifically, the adjustment mechanism includes a moving component, which is used to drive the grinding disc to move; or, the adjustment mechanism includes a moving component and a rotating component, the moving component is connected to the rotating component, the rotating component is connected to the grinding disc, and the rotating component is used to drive the grinding disc to rotate.
[0089] Specifically, the rotating mechanism includes a main shaft, which is connected to the placement table; the main shaft is provided with a second flow channel, the polishing disc is provided with a polishing groove, the polishing groove is connected to the second flow channel, and the second flow channel is used to pass the cleaning liquid.
[0090] Specifically, the polishing disc is further provided with a central hole and a third flow channel. The central hole is communicated with the second flow channel. One end of the third flow channel is communicated with the central hole, and the other end is communicated with the polishing groove.
[0091] Optionally, the grinding device further includes a cleaning liquid supply mechanism connected to the main shaft for providing cleaning liquid to the second flow channel.
[0092] Among them, the rotating mechanism includes a first rotating shaft, a first turntable, a second rotating shaft and a second turntable; the first rotating shaft is connected to the first turntable, the first turntable is set in the wafer 102 placement area, and the first turntable is used to place the wafer 102; the second rotating shaft is connected to the second turntable, the second turntable is set in the polishing disk placement area, and the second turntable is used to place the polishing disk; the second rotating shaft is provided with a second flow channel.
[0093] As an example, the working principle of the grinding device proposed in the embodiment of the present application is as follows: first, the wafer 102 to be ground is placed in the wafer 102 placement area, and the polishing disc is installed in the polishing disc placement area. A cleaning liquid supply mechanism is designed inside the second rotating shaft. The cleaning liquid supply mechanism can be connected to the center hole of the polishing disc through a pipeline or a flow channel, so that the polishing liquid enters each polishing groove from the center hole. Secondly, the grinding disc is moved above the wafer 102 through the adjustment mechanism so that the wafer 102 and the grinding disc are arranged relative to each other. At this time, the rotation mechanism and the adjustment mechanism are turned on, and the grinding surface 207 of the grinding disc is brought into contact with the surface of the wafer 102. The grinding liquid or abrasive is sprayed from the liquid outlet on the outer peripheral surface of the grinding disc. The grinding disc and the wafer 102 rotate relative to each other, and the surface of the wafer 102 begins to be ground or polished. After grinding for a period of time, the adjustment mechanism is used to drive the grinding disc to move above the polishing disc, and then the rotation mechanism and the adjustment mechanism are turned on so that the grinding disc and the polishing disc contact and rotate relative to each other, and the grinding disc is polished by the polishing disc. During the polishing process, the polishing groove cleaning area and the outer ring area of the polishing disk are used to remove particles on the surface of the grinding disk and restore the surface roughness of the grinding disk.
[0094] It can be understood that the polishing liquid enters the polishing disk, and the polishing liquid and the polishing disk are used to clean the grinding disk.
[0095] After cleaning, the adjustment mechanism moves the grinding disc to the top of the wafer 102 again and continues to grind the surface of the wafer 102. Among them, the polishing groove cleaning area mainly refers to the circular area on the polishing disc with a radius within the polishing groove. The surface material of this part can be made of carbon fiber, etc., which has a brush cleaning effect. The outer ring area mainly extends from the polishing groove on the polishing disc to the annular area on the polishing disc to the edge of the polishing disc. The material of this part is mainly made of diamond particles or ceramic particles. The diamond particle material can be inconsistent or consistent with the diamond particle material of the grinding disc. If the diamond particle material of the two is consistent, the particles in the cleaning liquid are used to perform a grinding and cleaning function.
[0096] In the grinding disc and grinding device of the above embodiment, by setting the grinding surface 207 of the grinding head 203 as a bevel and providing pressure to the grinding head 203 through the spherical universal rod 202 and the grinding ring 201, it is avoided that the right angle of the grinding head 203 causes damage to the edge of the wafer 102, which can improve the grinding efficiency and reduce the grinding cost.
[0097] Please note that the above embodiments are for illustrative purposes only and are not intended to limit the present invention.
[0098] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0099] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0100] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.
Claims
1. A grinding disc, characterized in that: include: Grinding ring; A plurality of spherical universal rods, each of which has a universal ball head formed at one end; A plurality of grinding heads, each of which has a spherical cavity formed on its connection surface, wherein the universal ball heads of the plurality of spherical universal rods are located in the spherical cavities of the plurality of grinding heads, so that the plurality of spherical universal rods are rotatably connected to the plurality of grinding heads; Wherein, the connection ends of the multiple spherical universal rods are fixedly connected to the grinding ring, and the grinding surface of each grinding head is an inclined surface.
2. The grinding disc according to claim 1, characterized in that Each grinding head also includes: The V-shaped groove is located on the connecting surface corresponding to the grinding surface, and the spherical cavity is formed at the V-shaped tip at the bottom of the V-shaped groove.
3. The grinding disc according to claim 2, characterized in that Each grinding head also includes: Two springs, one end of one spring is fixedly connected to the first target position of the connection surface of the grinding head, and the other end of one spring is fixedly connected to the grinding ring; One end of the other spring is fixedly connected to the second target position of the connection surface of the grinding head, and the other end is fixedly connected to the grinding ring; The first target position and the second target position are respectively located at relative positions on both sides of the opening of the V-shaped groove on the connecting surface.
4. The grinding disc according to claim 1, characterized in that The tooth length of each grinding head is 4mm-6mm.
5. The grinding disc according to claim 1, characterized in that The tooth bevel height of each grinding head is 24um-26um.
6. The grinding disc according to claim 1, characterized in that Each connecting rod is vertically connected to the grinding ring.
7. The grinding disc according to claim 2, characterized in that The angle of the V-shaped groove is greater than the inclination angle of the inclined surface of the grinding head.
8. The grinding disc according to claim 2, characterized in that The lengths of the plurality of spherical universal rods are greater than the depths of the V-shaped grooves.
9. A grinding device, characterized in that: include: The grinding disc according to any one of claims 1 to 8.
10. The grinding device according to claim 9, characterized in that Also includes: A placement table, wherein the placement table is provided with a wafer placement area and a polishing disk placement area; a polishing disc, the polishing disc being arranged in the polishing disc placement area; an adjustment mechanism connected to the grinding disc and configured to move the grinding disc to correspond to the wafer placement area or the polishing disc placement area; A rotating mechanism, the rotating mechanism being arranged on the placement table and / or the grinding ring of the grinding disc to achieve relative rotation between the grinding disc and the wafer placement area or the polishing disc placement area; The grinding liquid supply mechanism is connected to the adjustment mechanism and communicated with the liquid outlet.