Wafer cutting adhesive tape reworking device and wafer cutting machine table

Abstract

The utility model provides a wafer cutting adhesive tape reworking device and a wafer cutting machine table. The wafer cutting adhesive tape reworking device comprises a film pasting platform, an outer cover, an ultraviolet irradiation device, a cutting adhesive tape conveying device and a cutting device. The outer cover is connected to the film pasting platform in a shaft connection mode, and when the outer cover is in a closed state, the inner side of the outer cover and the film pasting platform form a cavity. The ultraviolet irradiation device is arranged on the inner side of the outer cover to radiate ultraviolet light to the film pasting platform, when the outer cover is in a closed state, a preset distance is reserved between the ultraviolet irradiation device and the film pasting platform, the viscidity of the cutting adhesive tape is reduced through the ultraviolet light, and the cutting adhesive tape is convenient to tear off. The cutting adhesive tape conveying device is arranged on the upstream of the film pasting platform and used for cutting adhesive tape re-pasting. The cutting device is arranged on the inner side of the outer cover and used for cutting the cutting adhesive tape. The whole process of ultraviolet irradiation of the cutting adhesive tape, tearing of the cutting adhesive tape and re-pasting of the cutting adhesive tape is completed through one device, and the operation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a wafer cutting tape reworking device and a wafer cutting machine. Background Art

[0002] Semiconductor manufacturing is a complex process, with the creation of delicate electronic circuits on silicon wafers being a core step. Wafer dicing is a crucial step in this process. Dicing involves using specialized diamond blades to cut the entire wafer into individual dies. Dicing tape supports the dies after dicing, preventing them from dispersing.

[0003] During the wafer dicing process, to ensure the die have a support after dicing, the wafer must be attached to the ring frame with dicing tape while the wafer is still intact. This allows the carrier to support the die even after the wafer is cut. During the dicing process, UV dicing tape is often used to achieve better dicing results and improve dicing yield. This type of tape has a characteristic: when attached to the back of the wafer, it has a high viscosity. When exposed to UV light, the viscosity decreases. During the dicing process, UV dicing tape is used because the increased adhesion and stability of the dicing tape are required. After dicing is complete, the die must be easily removed from the dicing tape, so it is first exposed to UV light to reduce the viscosity of the dicing tape.

[0004] During the UV dicing tape application process, wrinkles or foreign matter often form between the tape and the wafer, necessitating the tape be removed and reapplied. This process is known as dicing tape rework. Because UV dicing tape removal requires exposure to UV light, which generally requires separate equipment that cannot perform the film removal process, dicing tape rework requires separate UV exposure before manually removing the tape. This cumbersome process compromises efficiency. Utility Model Content

[0005] In view of the problems existing in the prior art mentioned above, the present application provides a wafer cutting tape reworking device and a wafer cutting machine, which can complete the entire process of ultraviolet light irradiation of the cutting tape, tearing off the cutting tape, and re-sticking the cutting tape, and has the characteristics of easy operation and high operating efficiency.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a wafer dicing tape reprocessing device, which includes:

[0007] Film platform;

[0008] The outer cover is connected to the film-applying platform in a shaft-connected manner, and when the outer cover is in a closed state, the inner side of the outer cover and the film-applying platform form a cavity;

[0009] An ultraviolet irradiation device is arranged on the inner side of the outer cover to radiate ultraviolet light toward the film-applying platform, and when the outer cover is in a closed state, there is a preset distance between the ultraviolet irradiation device and the film-applying platform;

[0010] A cutting tape conveyor device is provided upstream of the film laminating platform;

[0011] The cutting device is arranged on the inner side of the outer cover.

[0012] Optionally, the ultraviolet irradiation device includes a plurality of ultraviolet lamps, and the plurality of ultraviolet lamps are evenly distributed on the inner side of the outer cover, and the projection of the ultraviolet irradiation device on the film pasting platform is located in the central area of ​​the film pasting platform.

[0013] Optionally, a support frame is provided on the inner side of the outer cover, and the ultraviolet irradiation device is detachably mounted on the support frame.

[0014] Optionally, the distance between the ultraviolet irradiation device and the film-sticking platform is between 1 cm and 7.9 cm.

[0015] Optionally, the radiation area of ​​the ultraviolet irradiation device covers a circular area with the outer edge of the annular frame as the circumference.

[0016] Optionally, the cutting device comprises:

[0017] A main shaft, one end of which passes through the outer cover and is arranged in the direction of the film-sticking platform. When the outer cover is in a closed state, the projection of the main shaft is located at the center of the film-sticking platform;

[0018] The film cutting blade is connected to the main shaft through a connecting shaft.

[0019] Optionally, the film laminating platform includes:

[0020] The wafer placement platform is set in the central area of ​​the film lamination platform;

[0021] The annular frame is in the shape of a ring and is arranged around the periphery of the wafer placement platform and is spaced apart from the wafer placed on the wafer placement platform. The geometric center of the annular frame coincides with the center of the wafer.

[0022] Optionally, the distance between the edge of the wafer and the inner edge of the annular frame is between 20 mm and 30 mm, and the width of the annular frame is between 20 mm and 30 mm.

[0023] Another aspect of the present invention provides a wafer cutting machine, which includes a wafer cutting tape reworking device and a wafer cutting device, wherein the wafer cutting tape reworking device can be the above-mentioned wafer cutting tape reworking device.

[0024] Optionally, the wafer cutting device includes:

[0025] A cutting platform for placing wafers to be cut;

[0026] Wafer cutting device, used for cutting wafers;

[0027] The control system is used to control the wafer cutting device to cut the wafer.

[0028] As described above, the wafer dicing tape reprocessing device and wafer dicing machine provided by the present invention have at least the following beneficial technical effects:

[0029] The wafer dicing tape reprocessing device of the present invention includes a film laminating platform, an outer cover, an ultraviolet irradiation device, a dicing tape conveying device, and a cutting device. The outer cover is connected to the film laminating platform by an axis connection, and when the outer cover is in a closed state, the inner side of the outer cover and the film laminating platform form a cavity. The ultraviolet irradiation device is arranged on the inner side of the outer cover to radiate ultraviolet light to the film laminating platform, and when the outer cover is in a closed state, there is a preset distance between the ultraviolet irradiation device and the film laminating platform. The ultraviolet light reduces the viscosity of the dicing tape, making it easier to tear off the dicing tape. The dicing tape conveying device is arranged upstream of the film laminating platform and is used to re-apply the dicing tape to the wafer after the dicing tape is torn off. The cutting device is arranged on the inner side of the outer cover and is used to cut the re-applied dicing tape. The entire process of ultraviolet light irradiation of the dicing tape, dicing tape tearing, and dicing tape re-applying can be completed by using one device, thereby improving work efficiency.

[0030] The wafer cutting machine of the present invention includes a wafer cutting tape reworking device and a wafer cutting device, wherein the wafer cutting tape reworking device can be the above-mentioned wafer cutting tape reworking device, and also has the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a top view of the wafer dicing tape reprocessing device structure in an embodiment of the present invention.

[0032] Figure 2 This is a top view of a film-sticking platform in one example of the present invention.

[0033] Figure 3 This is a cross-sectional view of the structure of a wafer dicing tape reprocessing device in one example of the present invention.

[0034] Figure 4 This is a cross-sectional view of the structure of a wafer dicing tape reprocessing device in another example of the present invention.

[0035] Reference numerals

[0036] 1. Film laminating platform; 11. Cavity; 12. Outer cover; 121. Cutting device; 1211. Main shaft; 1212. Film cutting blade; 1213. Connecting shaft; 122. Support frame; 123. UV irradiation device; 1231. UV lamp; 13. Wafer; 14. Wafer placement platform; 15. Ring frame; 16. Ring frame platform; 2. Cutting tape conveyor. DETAILED DESCRIPTION

[0037] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0038] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation, the form, quantity, positional relationship and proportion of each component in actual implementation can be changed at will under the premise of realizing the technical solution of this party, and the component layout form may also be more complicated.

[0039] After studying the wafer cutting tape reworking device, the inventor found that in the wafer cutting tape reworking process, since ultraviolet light needs to be exposed before the ultraviolet light cutting tape is torn off, generally speaking, ultraviolet light exposure requires a separate device and this device cannot complete the film tearing action. Therefore, the cutting film reworking needs to be carried out first after a separate ultraviolet light, and then transferred to another device to manually tear off the cutting tape. The operation steps are relatively cumbersome, affecting the work efficiency.

[0040] In order to solve the background technology and the above-mentioned technical problems, this embodiment provides a wafer cutting tape reworking device and a wafer cutting machine, which can complete the entire process of ultraviolet light irradiation of the cutting tape, tearing off the cutting tape, and re-sticking the cutting tape, and has the characteristics of easy operation and high operating efficiency.

[0041] The present invention will be described in detail below with reference to specific embodiments.

[0042] Example 1

[0043] This embodiment provides a wafer dicing tape reprocessing device, such as Figure 1 As shown, the wafer dicing tape reprocessing device of this embodiment includes a film laminating platform 1 , an outer cover 12 , an ultraviolet irradiation device 123 , a dicing tape conveying device 2 and a cutting device 121 .

[0044] like Figure 1As shown, the film laminating platform 1 includes a wafer placement platform 14 and an annular frame 15. The wafer placement platform 14 is arranged in the central area of ​​the film laminating platform 1. An annular frame platform 16 is provided on the film laminating platform 1 to ensure the accuracy and stability of the annular frame 15 during operation. The annular frame 15 is in the shape of a circular ring, which is arranged around the periphery of the wafer placement platform 14 and is separated from the wafer 13 placed on the wafer placement platform 14. The geometric center of the annular frame 15 coincides with the center of the circle of the wafer 13. The distance between the edge of the wafer 13 and the inner edge of the annular frame 15 is between 20mm and 30mm, and further, the distance between the edge of the wafer 13 and the inner edge of the annular frame 15 is between 23mm and 26mm. Specifically, in this embodiment, the distance between the edge of the wafer 13 and the inner edge of the annular frame 15 is 25mm. The width of the annular frame is between 20mm and 30mm, and specifically, in this embodiment, the width of the annular frame is 25mm. Refer to Figure 1 The outer cover 12 is connected to the film-sticking platform 1 in an axial connection manner, and when the outer cover 12 is in a closed state, the inner side of the outer cover 12 and the film-sticking platform 1 form a cavity.

[0045] During the wafer 13 cutting process, in order to ensure that the grains have a support after cutting, it is necessary to use cutting tape to attach the wafer 13 and the annular frame 15 together when the wafer 13 is still a whole, so that the wafer 13 can still be supported by the carrier after being cut into grains. During the cutting process, in order to achieve a better cutting effect and improve the cutting yield, ultraviolet light cutting tape is generally used. When the ultraviolet light cutting tape is attached to the back of the wafer 13, the viscosity is relatively large. When the ultraviolet light cutting tape is irradiated with ultraviolet light, the viscosity becomes very small. Because the ultraviolet light cutting tape has better viscosity, thereby bringing better stability, the ultraviolet light cutting tape is selected to adhere the wafer 13 and the annular frame 15 during the cutting process. After the cutting is completed, the grains need to be removed from the ultraviolet light cutting tape more easily, so it is necessary to irradiate ultraviolet light first to reduce the viscosity of the ultraviolet light cutting tape. In this embodiment, the ultraviolet irradiation device 123 is disposed on the inner side of the outer cover 12 to radiate ultraviolet light toward the film laminating platform 1 , and when the outer cover 12 is in a closed state, there is a preset distance between the ultraviolet irradiation device 123 and the film laminating platform 1 .

[0046] In order to make the ultraviolet irradiation device 123 emit ultraviolet light evenly to the film-sticking platform 1, refer to Figure 3The UV irradiation device 123 includes multiple UV lamps 1231 evenly distributed inside the outer cover 12. The projection of the UV irradiation device 123 on the film-applying platform 1 is located in the center of the film-applying platform 1. The UV irradiation device 123 irradiates a circular area circumscribed by the outer edge of the annular frame 15 to reduce the stickiness of the dicing tape. Optionally, to make the UV irradiation device 123 removable, a support frame 122 is provided inside the outer cover 12, and the UV irradiation device 123 is removably mounted to the support frame 122. In order to make the ultraviolet irradiation device 123 be in the cavity formed by the inner side of the outer cover 12 and the film-sticking platform 1 when the outer cover 12 is in the closed state, the distance between the ultraviolet irradiation device 123 and the film-sticking platform 1 is between 1 cm and 7.9 cm, further, the distance between the ultraviolet irradiation device 123 and the film-sticking platform 1 is between 2 cm and 7.9 cm, further, the distance between the ultraviolet irradiation device 123 and the film-sticking platform 1 is between 4 cm and 7.9 cm. Specifically, in one example, referring to Figure 3 , the distance between the ultraviolet irradiation device 123 and the film-sticking platform 1 is 5 cm, and each ultraviolet lamp 1231 is connected to the outer cover 12 through the support frame 122. In another example, referring to Figure 4 The distance between the ultraviolet irradiation device 123 and the film-sticking platform 1 is 7.8 cm, and each ultraviolet lamp 1231 is arranged on the inner surface of the outer cover 12.

[0047] In order to facilitate the re-taping of the dicing tape on the wafer 13 after the dicing tape is removed, refer to Figure 1 The wafer dicing tape reprocessing device further includes a dicing tape conveying device 2 , which is arranged upstream of the film laminating platform 1 .

[0048] The cutting device 121 is provided on the inner side of the outer cover 12 and is used to cut the reapplied cutting tape. Figure 3 As shown, the cutting device 121 includes a main shaft 1211 and a film cutting blade 1212. One end of the main shaft 1211 extends through the outer cover 12 and is positioned toward the film laminating platform 1. When the outer cover 12 is closed, the projection of the main shaft 1211 is located at the center of the film laminating platform 1. The film cutting blade 1212 is connected to the main shaft 1211 via a connecting shaft 1213.

[0049] In order to more clearly describe the working process and working principle of the wafer dicing tape rework device, the working process of the wafer dicing tape rework device is described below.

[0050] Reference Figure 1, when wrinkles occur when the wafer cutting film is attached or foreign objects are wrapped between the cutting film and the wafer 13, rework is required. First, the wafer 13 with the cutting film attached is placed with the back side facing up, and placed on the film platform 1 together with the ring frame 15 through the wafer placement platform 14 and the ring frame platform 16. Then close the outer cover 12 and turn on the ultraviolet irradiation device 123. The ultraviolet irradiation device 123 emits ultraviolet light to illuminate the entire circular area with the outer edge of the ring frame 15 as the circumference. After ultraviolet light irradiation, the stickiness of the cutting tape becomes less. After the ultraviolet light irradiation is completed, the cutting tape can be directly torn off by hand or with tape along the edge of the ring frame 15.

[0051] Reference Figure 1 After the dicing tape is removed, the dicing tape conveyor 2 transports the wafer 13, wafer placement platform 14, annular frame 15, and annular frame platform 16 to the downstream portion of the dicing tape conveyor 2 for re-taping. After re-taping the dicing tape, the dicing tape conveyor 2 transports the wafer 13, wafer placement platform 14, annular frame 15, and annular frame platform 16 back to the bottom of the outer cover 12. The cutting device 121 cuts the dicing tape into a circular shape along the outer edge of the annular frame 15, completing the dicing tape re-taping process.

[0052] The wafer dicing tape reworking device can use one device to complete the entire process of ultraviolet light irradiation of the dicing tape, dicing tape tearing, and dicing tape re-sticking. It is easy to operate and greatly improves work efficiency.

[0053] Example 2

[0054] This embodiment provides a wafer dicing machine, which includes a wafer dicing tape reprocessing device and a wafer dicing device, wherein the wafer dicing tape reprocessing device can be the wafer dicing tape reprocessing device in the first embodiment.

[0055] The wafer cutting device is arranged downstream of the wafer cutting tape reworking device, and is used to cut the wafer after the wafer cutting tape reworking device completes the cutting tape reworking operation. The wafer cutting device includes a cutting platform, a wafer cutting device and a control system. The cutting platform is used to place the wafer to be cut. The wafer cutting device is used to cut the wafer. The control system is used to control the wafer cutting device to cut the wafer. In order to ensure that the die has a support after cutting, the wafer and the ring frame are attached together with cutting tape before the wafer is cut, so that the wafer can still be supported by the carrier after being cut into die. During the wafer cutting process, the wafer, cutting tape and ring frame that are adhered together are first placed on the cutting platform, and then the control system controls the wafer cutting device to cut the entire wafer into single die.

[0056] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A wafer dicing tape reprocessing device, characterized in that: include: Film platform; an outer cover connected to the film-applying platform in a shaft-connected manner, and when the outer cover is in a closed state, an inner side of the outer cover and the film-applying platform form a cavity; an ultraviolet irradiation device, disposed on the inner side of the outer cover to radiate ultraviolet light toward the film-sticking platform, and when the outer cover is in a closed state, a preset distance exists between the ultraviolet irradiation device and the film-sticking platform; a cutting tape conveying device, arranged upstream of the film laminating platform; The cutting device is arranged on the inner side of the outer cover.

2. The wafer dicing tape reprocessing device according to claim 1, characterized in that: The ultraviolet irradiation device includes a plurality of ultraviolet lamps, and the plurality of ultraviolet lamps are evenly distributed on the inner side of the outer cover. The projection of the ultraviolet irradiation device on the film-sticking platform is located in the central area of ​​the film-sticking platform.

3. The wafer dicing tape reprocessing device according to claim 1 or 2, characterized in that: A support frame is provided on the inner side of the outer cover, and the ultraviolet irradiation device is detachably mounted on the support frame.

4. The wafer dicing tape reprocessing device according to claim 1, wherein: The distance between the ultraviolet irradiation device and the film-sticking platform is between 1 cm and 7.9 cm.

5. The wafer dicing tape reprocessing device according to claim 1, wherein: The cutting device comprises: a main shaft, the main shaft passing through the outer cover and arranged in a direction toward the film-applying platform, wherein when the outer cover is in a closed state, the projection of the main shaft is located at the center of the film-applying platform; A film cutting blade is connected to the main shaft via a connecting shaft.

6. The wafer dicing tape reprocessing device according to claim 1, wherein: The film-sticking platform includes: A wafer placement platform is arranged in the central area of ​​the film laminating platform; The annular frame is in the shape of a circular ring and is arranged around the periphery of the wafer placement platform and is spaced apart from the wafer placed on the wafer placement platform. The geometric center of the annular frame coincides with the center of the wafer.

7. The wafer dicing tape reprocessing device according to claim 6, wherein: The radiation area of ​​the ultraviolet irradiation device covers a circular area with the outer edge of the annular frame as the circumference.

8. The wafer dicing tape reworking device according to claim 6, wherein: The distance between the edge of the wafer and the inner edge of the annular frame is between 20 mm and 30 mm, and the width of the annular frame is between 20 mm and 30 mm.

9. A wafer cutting machine, characterized in that: The wafer cutting machine includes a wafer cutting tape reworking device and a wafer cutting device, wherein the wafer cutting tape reworking device can be the wafer cutting tape reworking device according to any one of claims 1 to 8.

10. The wafer cutting machine according to claim 9, wherein: The wafer cutting device comprises: A cutting platform for placing wafers to be cut; a wafer cutting device, used for cutting the wafer; A control system is used to control the wafer cutting device to cut the wafer.

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