Large-size LED backlight source with high heat dissipation performance

Abstract

The large-size LED backlight source with the high heat dissipation performance comprises an installation bottom plate, the top of the installation bottom plate is fixedly connected with a connecting frame, a heat conduction cushion block is fixedly connected between the inner walls of the connecting frame and located on the top of the installation bottom plate, and a backlight module is fixedly installed on the top of the heat conduction cushion block and located between the inner walls of the connecting frame. The top of the connecting frame is slidably connected with a sealing plate. Through the arrangement of the heat conduction cushion block, the heat dissipation holes, the heat dissipation frame, the heat dissipation grooves, the rotating shaft and the heat dissipation fan blades, the heat dissipation performance of the LED backlight source is remarkably improved, in the using process, heat can be generated when the backlight module works, the heat conduction cushion block can effectively absorb part of the heat, then the heat is discharged to the outer side of the connecting frame through the heat dissipation holes and the heat dissipation grooves, and the heat dissipation efficiency is improved. When the heat flow passes through the heat dissipation grooves, the rotating shaft and the heat dissipation fan blades are driven to start to rotate, the heat dissipation effect is further enhanced, and therefore the heat dissipation performance of the LED backlight source is improved, and the service life of the LED backlight source is effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED backlight sources, in particular to a large-size LED backlight source with high heat dissipation. Background Art

[0002] LED backlight is a backlight technology that uses LEDs (light-emitting diodes) as light sources. It is widely used in liquid crystal displays (LCDs), televisions, mobile phones, tablets and other devices. LED backlight provides uniform lighting by placing LED lights behind or on the side of the liquid crystal panel. The liquid crystal panel itself does not emit light, but adjusts the light transmittance by controlling the arrangement of liquid crystal molecules to display images.

[0003] During the use of traditional LED backlights, when the display panel in the electrical equipment needs to be constantly on, the power consumption and heat of the LED backlight increase accordingly. However, the heat dissipation efficiency of traditional LED backlights is low, which may cause damage to the LED backlight and electrical equipment. At the same time, traditional LED backlights are also inconvenient in later disassembly and maintenance, which reduces their efficiency and service life, and may ultimately lead to an increase in usage costs. Utility Model Content

[0004] The purpose of the present invention is to provide a large-sized LED backlight source with high heat dissipation performance to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a large-size LED backlight source with high heat dissipation, comprising a mounting base, a connecting frame fixedly connected to the top of the mounting base, a thermal pad fixedly connected between the inner walls of the connecting frame and located at the top of the mounting base, a backlight module fixedly installed on the top of the thermal pad and located between the inner walls of the connecting frame, a sealing plate slidably connected to the top of the connecting frame, two T-slots are provided on the top of the sealing plate, and two T-blocks are fixedly connected to the bottom of the sealing plate, and the two T-blocks are slidably connected between the inner walls of the two T-slots respectively.

[0006] As a further preferred embodiment of the present technical solution, mounting grooves are provided on both sides of the connecting frame, both mounting grooves are connected to the interior of the connecting frame, a heat dissipation frame is slidably connected between the inner walls of the two mounting grooves, and a card slot is provided on the outer sides of the two heat dissipation frames, and the inner sides of the two card slots are slidably connected to the inner sides of the two mounting grooves respectively.

[0007] As a further preferred embodiment of the present technical solution, a heat dissipation groove is provided on one side of the two heat dissipation frames, a rotating shaft is rotatably connected between the inner walls of the two heat dissipation grooves, and heat dissipation fan blades are fixedly connected to the outer sides of the two rotating shafts.

[0008] As a further preferred embodiment of the present technical solution, heat dissipation holes are provided on both sides of the connection frame, and the heat dissipation holes are communicated with the interior of the connection frame.

[0009] As a further preferred embodiment of the present technical solution, limiting grooves are provided on both sides of the connection frame, and limiting blocks are slidably connected between the inner walls of the two limiting grooves.

[0010] As a further preferred embodiment of the present technical solution, one side of each of the two limit blocks is fixedly connected with a pull plate.

[0011] As a further preferred embodiment of the present technical solution, a mounting hole is provided on the top of the mounting base plate, and the mounting hole passes through the mounting base plate.

[0012] The utility model provides a large-size LED backlight source with high heat dissipation performance, which has the following beneficial effects:

[0013] (1) The present invention significantly improves the heat dissipation performance of the LED backlight source by providing a thermal pad, heat dissipation holes, a heat dissipation frame, a heat dissipation slot, a rotating shaft and heat dissipation fan blades. During use, the backlight module generates heat when it is working, and the thermal pad can effectively absorb part of the heat. The heat is then discharged to the outside of the connecting frame through the heat dissipation holes and the heat dissipation slot, forming a heat flow. When the heat flow passes through the heat dissipation slot, it drives the rotating shaft and the heat dissipation fan blades to start rotating, further enhancing the heat dissipation effect, thereby improving the heat dissipation performance of the LED backlight source and effectively extending its service life.

[0014] (2) The utility model fixes the backlight module on the top of the thermal pad and uses two T-shaped blocks to slide between the inner walls of the two T-shaped grooves, thereby firmly fixing the sealing plate between the inner walls of the connecting frame, and at the same time fixes the two heat dissipation frames between the inner walls of the two installation grooves. By manually moving the two pull plates, the two limit blocks slide between the inner walls of the two limit grooves, thereby effectively avoiding the displacement of the sealing plate position, thereby further improving the convenience of disassembly and maintenance of the LED backlight source, and also improving the efficiency of the use of the LED backlight source. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the connection frame structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the sealing plate structure of the present utility model;

[0018] Figure 4 This is a schematic diagram of the heat dissipation frame structure of the present utility model;

[0019] Figure 5 This is a schematic diagram of the limit block structure of the utility model;

[0020] In the figure: 1. Installation base plate; 2. Connection frame; 3. Sealing plate; 4. Backlight module; 5. Heat dissipation frame; 6. Heat dissipation holes; 7. T-slot; 8. Pull plate; 9. Installation slot; 10. Limiting slot; 11. Thermal pad; 12. T-block; 13. Heat dissipation slot; 14. Card slot; 15. Rotating shaft; 16. Heat dissipation fan blades; 17. Limiting block; 18. Installation hole. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0022] The utility model provides a technical solution: Figure 1-Figure 5 As shown, in this embodiment, a large-size LED backlight source with high heat dissipation includes a mounting base 1, a connecting frame 2 is fixedly connected to the top of the mounting base 1, a thermal pad 11 is fixedly connected between the inner walls of the connecting frame 2 and located at the top of the mounting base 1, a backlight module 4 is fixedly installed on the top of the thermal pad 11 and located between the inner walls of the connecting frame 2, a sealing plate 3 is slidably connected to the top of the connecting frame 2, two T-slots 7 are provided on the top of the sealing plate 3, two T-blocks 12 are fixedly connected to the bottom of the sealing plate 3, the two T-blocks 12 are respectively slidably connected between the inner walls of the two T-slots 7, mounting grooves 9 are provided on both sides of the connecting frame 2, the two mounting grooves 9 are connected to the interior of the connecting frame 2, and the inner walls of the two mounting grooves 9 are fixedly connected. A heat dissipation frame 5 is slidably connected between the two heat dissipation frames 5, a card slot 14 is provided on the outer side of the two card slots 14, and the inner sides of the two card slots 14 are slidably connected to the inner sides of the two mounting slots 9 respectively, a heat dissipation slot 13 is provided on one side of the two heat dissipation frames 5, and a rotating shaft 15 is rotatably connected between the inner walls of the two heat dissipation slots 13, and the outer sides of the two rotating shafts 15 are fixedly connected with heat dissipation fan blades 16, heat dissipation holes 6 are provided on both sides of the connecting frame 2, and the heat dissipation holes 6 are connected to the interior of the connecting frame 2, and limiting slots 10 are provided on both sides of the connecting frame 2, and a limiting block 17 is slidably connected between the inner walls of the two limiting slots 10, and a pull plate 8 is fixedly connected to one side of the two limiting blocks 17, and a mounting hole 18 is provided on the top of the mounting base plate 1, and the mounting hole 18 passes through the mounting base plate 1.

[0023] When the LED backlight source is installed, first install and connect the mounting base plate 1 to the device through the mounting hole 18, then install the backlight module 4 on the top of the thermal pad 11, and at the same time slide between the inner walls of the two mounting grooves 9 through the inner sides of the two card slots 14, so that the two heat dissipation frames 5 are respectively installed between the inner walls of the two mounting grooves 9, and then slide between the inner walls of the two T-shaped blocks 12, thereby driving the sealing plate 3 to fix the backlight module 4 between the inner walls of the connection frame 2, and fix the two heat dissipation frames 5 at the same time, and then manually move the two The pull plate 8 enables the two limit blocks 17 to slide between the inner walls of the two limit grooves 10 respectively, thereby fixing the sealing plate 3. When the LED backlight source is working, the backlight module 4 generates a large amount of heat, part of which is absorbed by the thermal pad 11, and the remaining heat is discharged to the outside of the connecting frame 2 through the heat dissipation holes 6 and the heat dissipation groove 13, thereby forming a heat flow. When the heat flow passes through the heat dissipation groove 13, it drives the rotating shaft 15 and the heat dissipation fan blades 16 to rotate, thereby accelerating the heat dissipation of the LED backlight source, thereby improving the heat dissipation performance of the LED backlight source and the convenience of disassembly and maintenance of the LED backlight source.

[0024] The utility model provides a large-size LED backlight with high heat dissipation. The specific working principle is as follows: when the LED backlight is installed, the mounting base 1 is first connected to the device through the mounting hole 18, and then the backlight module 4 is installed on the top of the thermal pad 11. At the same time, the inner sides of the two card slots 14 are respectively slid between the inner walls of the two mounting slots 9, so that the two heat dissipation frames 5 are respectively installed between the inner walls of the two mounting slots 9, and then the two T-blocks 12 are respectively slid between the inner walls of the two T-slots 7, thereby driving the sealing plate 3 to fix the backlight module 4. The two heat dissipation frames 5 are fixed between the inner walls of the connecting frame 2 at the same time, and then the two pull plates 8 are manually moved to make the two limit blocks 17 slide between the inner walls of the two limit grooves 10 respectively, so as to fix the sealing plate 3. When the LED backlight source is working, the backlight module 4 generates a large amount of heat, part of which is absorbed by the thermal pad 11, and the remaining heat is discharged to the outside of the connecting frame 2 through the heat dissipation holes 6 and the heat dissipation groove 13, thereby forming a heat flow. When the heat flow passes through the heat dissipation groove 13, it drives the rotating shaft 15 and the heat dissipation fan blades 16 to rotate, thereby accelerating the heat dissipation of the LED backlight source.

[0025] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A large-size LED backlight source with high heat dissipation performance, comprising a mounting base (1), characterized in that: The top of the mounting base plate (1) is fixedly connected to a connecting frame (2); a heat-conducting pad (11) is fixedly connected between the inner walls of the connecting frame (2) and located at the top of the mounting base plate (1); a backlight module (4) is fixedly installed on the top of the heat-conducting pad (11) and located between the inner walls of the connecting frame (2); the top of the connecting frame (2) is slidably connected to a sealing plate (3); two T-shaped slots (7) are provided on the top of the connecting frame (2); two T-shaped blocks (12) are fixedly connected to the bottom of the sealing plate (3); and the two T-shaped blocks (12) are slidably connected between the inner walls of the two T-shaped slots (7), respectively.

2. The large-size LED backlight with high heat dissipation according to claim 1, characterized in that: Both sides of the connection frame (2) are provided with mounting grooves (9), the two mounting grooves (9) are connected to the interior of the connection frame (2), the inner walls of the two mounting grooves (9) are slidably connected to a heat dissipation frame (5), the outer sides of the two heat dissipation frames (5) are provided with card grooves (14), and the inner sides of the two card grooves (14) are slidably connected to the inner sides of the two mounting grooves (9) respectively.

3. The large-size LED backlight with high heat dissipation according to claim 2, characterized in that: A heat dissipation groove (13) is provided on one side of the two heat dissipation frames (5), a rotating shaft (15) is rotatably connected between the inner walls of the two heat dissipation grooves (13), and heat dissipation fan blades (16) are fixedly connected to the outer sides of the two rotating shafts (15).

4. The large-size LED backlight with high heat dissipation according to claim 1, characterized in that: Heat dissipation holes (6) are provided on both sides of the connection frame (2), and the heat dissipation holes (6) are connected to the interior of the connection frame (2).

5. The large-size LED backlight with high heat dissipation according to claim 1, characterized in that: Limiting grooves (10) are provided on both sides of the connection frame (2), and a limiting block (17) is slidably connected between the inner walls of the two limiting grooves (10).

6. The large-size LED backlight with high heat dissipation according to claim 5, characterized in that: One side of each of the two limit blocks (17) is fixedly connected with a pull plate (8).

7. The large-size LED backlight with high heat dissipation according to claim 1, characterized in that: A mounting hole (18) is provided on the top of the mounting base plate (1), and the mounting hole (18) passes through the mounting base plate (1).

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