Embedded industrial edge computing DPU controller

Abstract

The utility model relates to the technical field of industrial data processing equipment, in particular to an embedded industrial edge computing DPU controller. The embedded industrial edge computing DPU controller provided by the utility model solves the technical problems that the DPU controller in the prior art is poor in heat dissipation performance, and the function is not easy to expand. An embedded industrial edge computing DPU controller comprises a shell and a control assembly arranged in the shell. According to the DPU controller, the semiconductor chilling plate is arranged, the semiconductor chilling plate is arranged in the sealing cavity, and current is supplied to the semiconductor chilling plate, so that the semiconductor chilling plate can generate cooling capacity, the interior of the sealing cavity is cooled through the control assembly, it is ensured that the control assembly can work within a reasonable temperature range, and therefore the heat dissipation performance of the DPU controller is good; and the service life of the DPU controller is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial data processing equipment, and in particular to an embedded industrial edge computing DPU controller. Background Art

[0002] The embedded industrial edge computing DPU (Data Processing Unit) controller market features a variety of products, each with distinct features and design advantages tailored to specific application scenarios. However, these products also commonly have flaws or areas for improvement. The following are some common features, advantages, and potential flaws.

[0003] Features of similar products on the market:

[0004] High integration: Many existing DPU controller products have a highly integrated design, integrating data processing, communication, and interface management into a single device for easy deployment and maintenance.

[0005] Support for multi-protocol communication: To meet the needs of industrial automation, these controllers usually support multiple communication protocols, such as Modbus, PROFINET, EtherCAT, etc., to ensure compatibility with existing industrial equipment.

[0006] Real-time performance: To meet the requirements of real-time data processing, these products usually have good real-time performance and can quickly respond to external events and data changes.

[0007] Industrial-grade build: Designed to meet the requirements of industrial environments, such as dustproof, waterproof, high-temperature resistant, and anti-vibration, suitable for harsh industrial environments.

[0008] Common flaws and room for improvement:

[0009] Limited modularity and scalability: Many existing products have limitations in modular design and scalability, making it difficult to adapt to rapidly changing technology requirements and diverse application scenarios. When users need to upgrade or expand functionality, they may need to replace the entire system rather than individual modules.

[0010] Poor heat dissipation performance: In order to maintain better sealing and adapt to more complex working environments, DPU controllers on the market usually use external heat sinks for heat dissipation, which has poor heat dissipation effect.

[0011] Therefore, the DPU controller in the prior art has technical problems such as poor heat dissipation performance and difficulty in function expansion. Utility Model Content

[0012] The utility model provides an embedded industrial edge computing DPU controller, which solves the technical problems of poor heat dissipation performance and difficult function expansion of DPU controllers in the prior art.

[0013] Some implementation plans adopted to solve the above technical problems include:

[0014] An embedded industrial edge computing DPU controller includes a housing and a control component disposed in the housing;

[0015] The housing includes a base, the base cover is provided with an upper shell, and a sealed cavity for accommodating the control component is formed between the upper shell and the base;

[0016] The base is provided with a boss extending into the sealed cavity, and the control assembly is mounted on the boss, wherein the control assembly includes a circuit board fixed to the boss, and a data processing module, a communication module and an auxiliary module, wherein the communication module and the auxiliary module both communicate with the data processing module via the circuit board;

[0017] The boss is a hollow structure, and the upper end of the boss is open. A semiconductor cooling plate is provided in the boss, and the semiconductor cooling plate contacts the control component through the upper end of the boss;

[0018] The base is also provided with a sealing tube, one end of which is connected to the sealing cavity, and the other end of which is connected to the outside world. The control component also includes a data connector, which is installed in the sealing tube, and a resin layer is filled between the data connector and the sealing tube.

[0019] Preferably, the boss is fixed to the base via a heat insulation layer, the heat insulation layer is bonded to the base, and the boss is bonded to the heat insulation layer.

[0020] Preferably, the semiconductor refrigeration chip is controlled by the control component, the circuit board is provided with a temperature sensor for detecting the temperature in the sealed cavity, and the control component controls the semiconductor refrigeration chip according to the parameters detected by the temperature sensor.

[0021] Preferably, the upper shell is provided with a heat sink, the heat sink is located outside the sealed cavity, and the heat sink and the upper shell are an integrated structure.

[0022] Preferably, the heat sinks are arranged on the top wall of the upper shell, and all the heat sinks are parallel to each other.

[0023] Preferably, the base is provided with a support body for supporting the sealing tube, the support body and the base are an integrated structure, and the sealing tube is bonded to the upper end of the support body.

[0024] Preferably, the base is further provided with a partition, which separates the sealed cavity into an inner cavity and a buffer cavity communicating with the inner cavity, the control component is located in the inner cavity, and a portion of the sealing tube is located in the buffer cavity.

[0025] Preferably, the partition includes a plate body and sealing plates arranged at both ends of the plate body. The plate body and the sealing plate are an integrated structure. The end of the sealing plate away from the plate body contacts the inner wall of the upper shell, and a sealing layer is provided between the sealing plate and the inner wall of the upper shell.

[0026] Preferably, the sealing layer is an adhesive layer, or the sealing layer is a rubber layer.

[0027] Preferably, the upper shell is bonded to the base.

[0028] Compared with the prior art, the present invention has the following advantages:

[0029] 1. By setting up a semiconductor refrigeration chip, and the semiconductor refrigeration chip is set in a sealed cavity, the semiconductor refrigeration chip can generate cold energy by supplying current to the semiconductor refrigeration chip, thereby cooling the interior of the sealed cavity through the control component, ensuring that the control component can operate within a reasonable temperature range, thereby making the DPU controller have good heat dissipation performance and extending the service life of the DPU controller.

[0030] 2. By setting up a sealing tube and filling a resin layer between the data connector and the sealing tube, the sealing tube has better sealing performance, and the sealed cavity is not easily exposed to the outside world, that is, external dust cannot enter the sealed cavity through the sealing tube, thereby providing the control component with a better working environment.

[0031] 3. By setting up a circuit board and a data processing module, a communication module and an auxiliary module, the communication module and the auxiliary module communicate with the data processing module through the circuit board. When the function needs to be expanded, it is only necessary to install the corresponding module on the circuit board to achieve the function expansion, or, when some functions need to be replaced, it is only necessary to replace some modules, so that the DPU controller has better scalability and broadens the application field of the DPU controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] For the purpose of explanation, several embodiments of the present invention are described in the following drawings. The following drawings are incorporated into this document and constitute a part of the detailed description. In some cases, well-known structures and components are shown in block diagram form to avoid obscuring the concepts of the present invention.

[0033] Figure 1 It is a schematic diagram of the present utility model.

[0034] Figure 2 This is an exploded view of the present invention.

[0035] Figure 3 for Figure 2 The schematic diagram of the first angle after the upper shell is omitted.

[0036] Figure 4 for Figure 2 The schematic diagram of the second angle after the upper shell is omitted.

[0037] Figure 5 This is a schematic diagram of the upper shell from the first angle.

[0038] Figure 6 This is a schematic diagram of the upper shell from the second angle.

[0039] As shown in the figure:

[0040] 1. Housing, 11. Base, 111. Boss, 12. Upper shell, 121. Heat sink, 13. Support body, 14. Partition, 141. Plate body, 142. Sealing plate, 15. Buffer chamber.

[0041] 2. Control component, 21. Circuit board, 22. Data processing module, 23. Communication module, 24. Auxiliary module, 25. Semiconductor cooling plate, 26. Sealing tube. DETAILED DESCRIPTION

[0042] The specific embodiments shown below are intended to serve as descriptions of various configurations of the subject technology of the present invention and are not intended to represent the only configuration in which the subject technology of the present invention can be practiced. The specific embodiments include specific details intended to provide a thorough understanding of the subject technology of the present invention. However, it will be clear and apparent to those skilled in the art that the subject technology of the present invention is not limited to the specific details shown herein and can be practiced without these specific details.

[0043] It will be understood that, herein, relational terms such as “first” and “second” are intended to distinguish one entity or operation from another entity or operation, and are not intended to express or imply any actual relationship or order between these entities or operations.

[0044] The terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0045] Reference Figures 1 to 6 As shown, an embedded industrial edge computing DPU controller includes a housing 1 and a control component 2 disposed in the housing 1;

[0046] The housing 1 includes a base 11, and the base 11 is covered with an upper shell 12, and a sealed cavity for accommodating the control component 2 is formed between the upper shell 12 and the base 11;

[0047] The base 11 is provided with a boss 111 extending into the sealed cavity, and the control assembly 2 is mounted on the boss 111. The control assembly 2 includes a circuit board 21 fixed to the boss 111, as well as a data processing module 22, a communication module 23, and an auxiliary module 24. The communication module 23 and the auxiliary module 24 communicate with the data processing module 22 via the circuit board 21.

[0048] The boss 111 is a hollow structure, and the upper end of the boss 111 is open. A semiconductor cooling sheet 25 is provided in the boss 111, and the semiconductor cooling sheet 25 contacts the control component 2 through the upper end of the boss 111.

[0049] The base 11 is also provided with a sealing tube 26, one end of the sealing tube 26 is communicated with the sealed cavity, and the other end of the sealing tube 26 is communicated with the outside world. The control component 2 also includes a data connector, which is installed in the sealing tube 26, and a resin layer is filled between the data connector and the sealing tube 26.

[0050] Reference Figures 1 to 6 As shown, in some embodiments, the boss 111 is fixed to the base 11 via a thermal insulation layer, which is bonded to the base 11, and the boss 111 is bonded to the thermal insulation layer. The opening at the top of the boss 111 can be covered by a circuit board 21. The circuit board 21 can be a circuit board 21 with integrated circuits, or it can be a circuit board 21 with only a small amount of circuitry. The data processing module 22, communication module 23, and auxiliary module 24 can all be plugged into the circuit board 21 to facilitate the replacement or addition of corresponding functional modules.

[0051] In some embodiments, the semiconductor refrigeration chip 25 is controlled by the control component 2, the circuit board 21 is provided with a temperature sensor for detecting the temperature in the sealed cavity, and the control component 2 controls the semiconductor refrigeration chip 25 according to the parameters detected by the temperature sensor.

[0052] In some embodiments, the upper shell 12 is provided with a heat sink 121 . The heat sink 121 is located outside the sealed cavity. The heat sink 121 and the upper shell 12 are an integrated structure.

[0053] The heat sinks 121 are disposed on the top wall of the upper shell 12 , and all the heat sinks 121 are parallel to each other.

[0054] The heat sink 121 is used for natural heat dissipation, that is, during operation, the DPU controller can be cooled on both the inside and outside by the semiconductor cooling sheet 25 in cooperation with the heat sink 121, thereby making the DPU controller have better heat dissipation performance.

[0055] Reference Figures 1 to 6 As shown, in some embodiments, the base 11 is provided with a support body 13 supporting the sealing tube 26 , the support body 13 and the base 11 are an integrated structure, and the sealing tube 26 is bonded to the upper end of the support body 13 .

[0056] In some embodiments, the base 11 is further provided with a partition 14, which separates the sealed cavity into an inner cavity and a buffer cavity 15 communicating with the inner cavity. The control component 2 is located in the inner cavity, and a portion of the sealing tube 26 is located in the buffer cavity 15.

[0057] The partition 14 includes a plate body 141 and a sealing plate 142 arranged at both ends of the plate body 141. The plate body 141 and the sealing plate 142 are an integrated structure. The end of the sealing plate 142 away from the plate body 141 contacts the inner wall of the upper shell 12, and a sealing layer is provided between the sealing plate 142 and the inner wall of the upper shell 12.

[0058] The sealing layer is an adhesive layer, or the sealing layer is a rubber layer.

[0059] Reference Figures 1 to 6 As shown, in some preliminary examples, the upper shell 12 is bonded to the base 11 .

[0060] In order to make the inner cavity have better sealing performance, an adhesive layer can be set between the top wall of the upper shell 12 and the partition 14, the sealing plate 142, and the sealing tube 26 to completely isolate the inner cavity from the outside and prevent dust from entering the inner cavity.

[0061] The following further introduces the embedded industrial edge computing DPU controller provided by this utility model:

[0062] The main purpose of an embedded industrial edge computing DPU controller is to propose a more efficient, reliable, flexible and secure solution to the product defects and user needs in the current market.

[0063] DPU controllers often lack sufficient modularity and scalability, making it difficult for users to easily upgrade or expand system functions when faced with rapidly changing technological environments and diverse application requirements.

[0064] A highly modular DPU controller is designed so that individual modules, such as the data processing module 22, the communication module 23, etc., can be easily replaced or upgraded as needed, thereby providing greater flexibility and future compatibility.

[0065] The complex configuration and management process of DPU controllers increases the technical burden on users, especially for non-professional users, which limits the usability and popularity of the product.

[0066] A user-friendly configuration and management interface can be developed to support automatic device recognition, configuration wizards, and intelligent fault diagnosis to simplify installation, configuration, and daily maintenance.

[0067] Regarding energy consumption, ordinary controllers consume high energy when performing high-performance data processing tasks, which is not ideal in application scenarios that are sensitive to energy costs or have limited power supply.

[0068] Low-power design and intelligent energy management strategies can be adopted, such as adjusting energy consumption according to real-time workload, to optimize the overall energy efficiency ratio and reduce operating costs.

[0069] Regarding security issues: With the development of the Industrial Internet of Things, data and network security have become major concerns. Existing products may be insufficient in data encryption, device authentication, and defense against network attacks.

[0070] Advanced encryption technology, secure boot mechanism, device-level authentication and real-time security monitoring can be adopted to ensure data security and system reliability.

[0071] The embedded industrial edge computing DPU controller can be divided into the following main functional modules or components. Each module contains a series of sub-modules to achieve efficient, flexible and safe operation of the entire system.

[0072] Data processing module 22:

[0073] Main functional modules:

[0074] Data processing unit DPU.

[0075] Submodules and their functions:

[0076] Central Processing Unit CPU: responsible for executing program instructions and processing data computing tasks.

[0077] Graphics Processing Unit (GPU): used to handle parallel computing tasks and is particularly suitable for processing and analyzing large amounts of data.

[0078] Memory management unit: responsible for data caching and fast access, improving data processing efficiency.

[0079] The CPU is the core processing unit, working in conjunction with the GPU to handle parallel computing tasks. The memory management unit is directly connected to the CPU, providing the necessary data caching and fast access capabilities to optimize processing speed and response time.

[0080] Communication Module 23:

[0081] Main functional modules:

[0082] Written name: Communication Interface Unit.

[0083] Submodules and their functions:

[0084] Wired communication interface: including Ethernet, serial communication, etc., supporting data exchange with external devices.

[0085] Wireless communication interface: including Wi-Fi, Bluetooth, etc., providing flexible wireless data transmission capabilities.

[0086] Protocol processing unit: responsible for processing various communication protocols to ensure correct transmission and reception of data.

[0087] Wired and wireless communication interfaces provide physical connection capabilities, and the protocol processing unit is responsible for parsing and encapsulating data packets to ensure compatibility with external devices and accuracy of data exchange.

[0088] Supplementary Module 24:

[0089] Energy management module:

[0090] Energy management unit.

[0091] Submodules and their functions:

[0092] Power control unit: responsible for the distribution and management of power and optimizing energy consumption.

[0093] Temperature monitoring unit: monitors system temperature to prevent overheating damage.

[0094] The power control unit is directly connected to each functional module and dynamically adjusts power distribution according to the system load. The temperature monitoring unit monitors the system temperature in real time and collaborates with the power control unit to make necessary adjustments to protect the system.

[0095] Security management module:

[0096] Safety control unit.

[0097] Submodules and their functions:

[0098] Data encryption unit: responsible for encrypting transmitted and stored data to ensure data security.

[0099] Access Control Unit: Manages device access rights and prevents unauthorized access.

[0100] Security monitoring unit: monitors system security status in real time and executes security policies.

[0101] The data encryption unit is tightly integrated with the communication module 23 to ensure data security during transmission. The access control unit connects to the system's management interface and external interfaces to control device access. The security monitoring unit runs throughout the entire system, monitoring system operation status and detecting and responding to security threats in real time.

[0102] The design of the embedded industrial edge computing DPU controller combines multiple advantages in structure and function to meet the stringent requirements of modern industrial automation and intelligent manufacturing.

[0103] The modular design concept allows various functional modules, such as the data processing module 22, the communication module 23, the energy management module, and the security management module, to be flexibly combined and expanded according to application requirements. This design not only facilitates maintenance and upgrades but also allows for customized configuration for specific applications, greatly improving the product's applicability and future compatibility.

[0104] The structural design incorporates an advanced thermal management system, namely a semiconductor cooler 25. Using heat pipe technology and other cooling structures, the semiconductor cooler 25 effectively disperses and removes heat generated by the processor and other key components. This ensures stable operation even under high loads, extending the device's lifespan.

[0105] By integrating the latest processor technology and optimized algorithms, the DPU controller can quickly process large amounts of data from various sensors and devices, supporting complex data analysis and real-time decision-making, which is crucial for achieving efficient automated control and intelligent manufacturing processes.

[0106] The communication module 23 supports multiple communication standards including Ethernet, Wi-Fi, Bluetooth and industrial communication protocols such as Modbus and PROF I NET, ensuring high compatibility and interoperability with various industrial equipment and systems.

[0107] The security management module provides comprehensive security measures, including data encryption, secure boot, access control, and real-time monitoring, to prevent data leakage and unauthorized access, ensuring the security and reliability of industrial control systems.

[0108] The energy management module uses intelligent algorithms to dynamically adjust power consumption and optimize energy usage according to actual workload, which not only improves energy efficiency but also reduces operating costs.

[0109] These advantages together constitute the core competitiveness of this embedded industrial edge computing DPU controller, making it an ideal choice to meet the needs of various industrial application scenarios.

[0110] Some specific application examples:

[0111] To demonstrate the application range and flexibility of embedded industrial edge computing DPU controllers, the following are several specific best practices, each optimized for different industrial scenarios and requirements.

[0112] Application Example 1:

[0113] Smart manufacturing workshop:

[0114] Scenario Description

[0115] In a highly automated smart manufacturing workshop, DPU controllers are deployed at key nodes of the production line, responsible for collecting and processing real-time data from sensors, including machine status, production progress, and quality monitoring data.

[0116] The data processing module 22 uses a high-performance CPU and a dedicated graphics processing unit GPU to meet the computing requirements of complex data analysis and machine learning models.

[0117] The communication module 23 integrates a high-speed Ethernet interface and a wireless communication interface, supporting fast data exchange with various equipment and management systems in the workshop.

[0118] The energy management module optimizes energy consumption through an intelligent power control unit, especially automatically reducing energy consumption during low loads.

[0119] The security management module uses advanced data encryption and access control technologies to protect production data and network security.

[0120] Application Example 2:

[0121] Remote monitoring and maintenance:

[0122] DPU controllers used for remote monitoring of energy facilities, such as wind farms or solar power stations, can collect facility operation data in real time, perform preliminary analysis, and send the data to the central monitoring room via secure and encrypted communication channels.

[0123] The data processing module 22 is equipped with a low-power CPU optimized for energy efficiency, and is suitable for long-term operation in remote, power-limited environments.

[0124] The communication module 23 focuses on using LPWAN technologies with long-distance coverage capabilities, such as LoRa, to ensure stable communication even in remote areas.

[0125] The energy management module includes a solar panel interface to achieve self-sufficient energy supply and reduce operation and maintenance costs.

[0126] The security management module strengthens the security of data transmission and ensures the safety and integrity of sensitive information during transmission.

[0127] Application Example 3:

[0128] Intelligent Transportation Systems:

[0129] In intelligent transportation systems, DPU controllers are deployed at traffic lights and surveillance cameras, responsible for real-time analysis of traffic flow data and adjusting traffic light strategies to optimize traffic flow and reduce congestion.

[0130] The data processing module 22 utilizes real-time data processing capabilities to quickly respond to changes in traffic flow and dynamically adjust traffic lights.

[0131] The communication module 23 communicates with the central traffic management system in real time through a wireless communication interface to share data and control instructions.

[0132] The energy management module is designed to operate with low energy consumption, ensuring continuous operation even in environments with unstable power supply.

[0133] The security management module implements strict data security and device access control to prevent data tampering and unauthorized access.

[0134] Each example demonstrates the flexibility and customizability of the DPU controller in different application scenarios, achieving optimal performance and efficiency by adjusting module configuration and functions to specific needs.

[0135] The above describes the technical solution and corresponding details of the subject matter of the present invention. It can be understood that the above description is only some implementation plans of the technical solution of the subject matter of the present invention, and some details may be omitted during its specific implementation.

[0136] In addition, in some embodiments of the above utility model, multiple embodiments may be implemented in combination. Due to space limitations, various combination schemes are not listed one by one. Those skilled in the art can freely combine and implement the above embodiments as needed in specific implementation to obtain a better application experience.

[0137] When implementing the technical solution of the present invention, those skilled in the art may obtain other detailed configurations or drawings based on the technical solution of the present invention and the drawings. Obviously, these details still fall within the scope covered by the technical solution of the present invention without departing from the technical solution of the present invention.

Claims

1. An embedded industrial edge computing DPU controller, characterized by: It comprises a housing (1) and a control component (2) arranged in the housing (1); The housing (1) comprises a base (11), the base (11) is covered with an upper shell (12), and a sealed cavity for accommodating the control component (2) is formed between the upper shell (12) and the base (11); The base (11) is provided with a boss (111) extending into the sealed cavity, and the control assembly (2) is mounted on the boss (111), wherein the control assembly (2) comprises a circuit board (21) fixed to the boss (111) and a data processing module (22), a communication module (23) and an auxiliary module (24), and the communication module (23) and the auxiliary module (24) both communicate with the data processing module (22) via the circuit board (21); The boss (111) is a hollow structure, and the upper end of the boss (111) is open. A semiconductor refrigeration sheet (25) is provided in the boss (111), and the semiconductor refrigeration sheet (25) contacts the control component (2) through the upper end of the boss (111); The base (11) is further provided with a sealing tube (26), one end of which is in communication with the sealing cavity, and the other end of which is in communication with the outside world. The control component (2) further comprises a data connector, which is installed in the sealing tube (26), and a resin layer is filled between the data connector and the sealing tube (26).

2. The embedded industrial edge computing DPU controller according to claim 1, characterized in that: The boss (111) is fixed to the base (11) via a heat insulation layer, the heat insulation layer is bonded to the base (11), and the boss (111) is bonded to the heat insulation layer.

3. The embedded industrial edge computing DPU controller according to claim 1, characterized in that: The semiconductor refrigeration chip (25) is controlled by the control component (2), the circuit board (21) is provided with a temperature sensor for detecting the temperature in the sealed cavity, and the control component (2) controls the semiconductor refrigeration chip (25) according to the parameters detected by the temperature sensor.

4. The embedded industrial edge computing DPU controller according to any one of claims 1 to 3, characterized in that: The upper shell (12) is provided with a heat sink (121), the heat sink (121) is located outside the sealed cavity, and the heat sink (121) and the upper shell (12) are an integrated structure.

5. The embedded industrial edge computing DPU controller according to claim 4, characterized in that: The heat sinks (121) are arranged on the top wall of the upper shell (12), and all the heat sinks (121) are parallel to each other.

6. The embedded industrial edge computing DPU controller according to claim 1, characterized in that: The base (11) is provided with a support body (13) supporting the sealing tube (26); the support body (13) and the base (11) are an integrated structure, and the sealing tube (26) is bonded to the upper end of the support body (13).

7. The embedded industrial edge computing DPU controller according to claim 6, characterized in that: The base (11) is further provided with a partition (14), wherein the partition (14) divides the sealed cavity into an inner cavity and a buffer cavity (15) communicating with the inner cavity; the control component (2) is located in the inner cavity; and a portion of the sealed tube (26) is located in the buffer cavity (15).

8. The embedded industrial edge computing DPU controller according to claim 7, characterized in that: The partition (14) includes a plate body (141) and sealing plates (142) arranged at both ends of the plate body (141); the plate body (141) and the sealing plate (142) are an integrated structure; one end of the sealing plate (142) away from the plate body (141) contacts the inner wall of the upper shell (12); and a sealing layer is provided between the sealing plate (142) and the inner wall of the upper shell (12).

9. The embedded industrial edge computing DPU controller according to claim 8, characterized in that: The sealing layer is an adhesive layer, or the sealing layer is a rubber layer.

10. The embedded industrial edge computing DPU controller according to claim 1, characterized in that: The upper shell (12) is bonded to the base (11).

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