Water absorption plate, silicon wafer separating device and wafer inserting system

Abstract

The utility model discloses a water absorbing plate, a silicon wafer separating device and a wafer inserting system, the water absorbing plate is suitable for being matched with a conveying belt, a plurality of wafer absorbing holes distributed at intervals in the first direction are formed in the conveying belt, the water absorbing plate comprises a plate body, the plate body is an integrally formed part, a plurality of water absorbing holes corresponding to the wafer absorbing holes are formed in the plate body, and the wafer inserting system is arranged in the plate body. The water absorption holes are suitable for being communicated with a water pumping device. Compared with a traditional water absorption plate of a split structure, the water absorption plate is arranged to be the integrally-formed piece, the glue failure problem at the connecting position in the water absorption plate can be effectively avoided, mounting and dismounting are convenient, and the sealing design in the water absorption plate can be reduced. Besides, when the inner hole channels are formed in the water absorption plate of the integrated structure, compared with a water absorption plate of a split structure, installation matching gaps existing in the inner walls of the hole channels can be effectively avoided, and therefore accumulation of impurities at the matching gaps can be avoided, the cleaning frequency can be reduced, and the influence of the accumulated impurities on suction conducted by the hole channels can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of silicon wafer processing technology, and specifically relates to a water absorption plate, a silicon wafer separating device and a wafer inserting system. Background Art

[0002] Monocrystalline silicon material is drawn into ingots through the single crystal process. The ingots then proceed to the machining process, where they undergo cutting, squaring, and polishing. After gluing, slicing, and degumming, they enter the wafer cleaning process. During wafer cleaning, a water jet is typically used to separate stuck-together wafers. The separated wafers are then adsorbed by a water absorbent plate and transported via a conveyor to a wafer basket for cleaning.

[0003] In the prior art, water jets are typically used to separate stacked silicon wafers one by one. The separated wafers are then transported to subsequent processes using conveyor belts. During this process, absorbent plates are required to provide suction to the conveyor belts. However, these absorbent plates are prone to debonding and are complex to operate, hindering the transport of the wafers. Utility Model Content

[0004] The present application aims to provide a water absorbing plate, a silicon wafer separating device and a wafer inserting system, which can solve the problems of the water absorbing plate in the related art being prone to debonding and complicated operation during use.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In the first aspect, an embodiment of the present application proposes a water absorption plate, which is suitable for cooperating with a conveyor belt, and the conveyor belt is provided with a plurality of suction holes arranged at intervals along a first direction. The water absorption plate includes: a plate body, the plate body is an integrally formed part, and the plate body is provided with a plurality of water absorption holes corresponding to the suction holes, and the plurality of water absorption holes are arranged at intervals along the first direction, and the water absorption holes are suitable for connecting with a water pumping device.

[0007] In a second aspect, an embodiment of the present application provides a silicon wafer slicing device, comprising:

[0008] A transmission mechanism, wherein a transmission channel is provided in the transmission mechanism;

[0009] The wafer lifting mechanism includes a conveyor belt and the water absorption plate described in the first aspect, wherein the conveyor belt is arranged at one end of the conveyor channel, and the water absorption plate is arranged on the side of the conveyor belt away from the conveyor channel. The conveyor belt is provided with a plurality of wafer absorption holes arranged at intervals along the first direction for absorbing and removing the silicon wafers in the conveyor channel.

[0010] In a third aspect, an embodiment of the present application proposes a wafer inserting system, comprising the water absorption plate described in the first aspect, or comprising the silicon wafer separating device described in the second aspect.

[0011] In the embodiments of the present application, by designing the absorbent plate as a one-piece component, the debonding problem at the internal joints of the absorbent plate can be effectively avoided, compared to conventional split-structure absorbent plates. This not only facilitates installation and disassembly, but also reduces the need for sealing within the absorbent plate. Furthermore, by providing internal channels within the one-piece absorbent plate, compared to split-structure absorbent plates, the presence of installation gaps on the inner walls of the channels can be effectively avoided, thereby preventing the accumulation of impurities in these gaps. This not only reduces the frequency of cleaning but also reduces the impact of accumulated impurities on the suction force transmitted through the channels.

[0012] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0014] Figure 1 is a three-dimensional diagram of a water absorption plate according to an embodiment of the present application;

[0015] Figure 2 is a front view of a water absorbing plate according to an embodiment of the present application;

[0016] Figure 3 is a left side view of a water absorbing plate according to an embodiment of the present application;

[0017] Figure 4 is a top view of a water absorbing plate according to an embodiment of the present application;

[0018] Figure 5 According to the embodiment of the present application Figure 2 Sectional view along line AA.

[0019] Figure 6 This is one of the schematic diagrams of the film lifting mechanism according to an embodiment of the present application;

[0020] Figure 7 This is a second schematic diagram of the film lifting mechanism according to an embodiment of the present application;

[0021] Figure 8 is a schematic diagram of a silicon wafer slicing device according to an embodiment of the present application;

[0022] Figure 9 is a side view of a silicon wafer slicing apparatus according to an embodiment of the present application;

[0023] Figure 10 It is a schematic diagram of the distribution structure of the liquid spray holes in the slicing mechanism according to an embodiment of the present application.

[0024] Reference numerals:

[0025] 10: Conveying mechanism; 101: Conveying channel; 11: Bottom conveying mechanism; 12: Side conveying mechanism; 20: Lifting mechanism; 21: Driving assembly; 22: Conveying belt; 222: Suction hole; 23: Water absorption plate; 23a: First end; 23b: Second end; 230: Plate body; 2301: Suction hole; 2302: First surface; 2303: Raised portion; 2304: Sink; 231: Suction channel; 2311 : First through hole; 2312: First plug; 232: Connecting channel; 2321: Second through hole; 2322: Second plug; 233: Drain hole; 2331: First drain hole; 2332: Second drain hole; 24: Connector; 30: Slicing mechanism; 301: Spray hole; 40: Detection mechanism; 50: Slice feeding mechanism; 60: Silicon wafer assembly; 61: Silicon wafer; X: First direction; Y: Second direction; Z: Third direction. DETAILED DESCRIPTION

[0026] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0030] The water absorption plate, silicon wafer separating device and wafer inserting system provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0031] like Figure 1 and Figure 6 As shown, according to some embodiments of the present application, the water absorption plate 23 is suitable for cooperating with the conveyor belt 22. The conveyor belt 22 is provided with a plurality of suction holes 222 arranged at intervals along the first direction X. The water absorption plate 23 includes: a plate body 230, which is an integrally formed part. The plate body 230 is provided with a plurality of water absorption holes 2301 corresponding to the suction holes 222. The plurality of water absorption holes 2301 are arranged at intervals along the first direction X, and the water absorption holes 2301 are suitable for communicating with a water pumping device.

[0032] In the embodiment of the present application, by forming the water absorption plate 23 as a one-piece component, the problem of debonding at the joints can be effectively avoided compared to conventional split-structure water absorption plates. This not only facilitates installation and removal, but also reduces the need for sealing design within the water absorption plate 23. Furthermore, when internal channels are provided in the one-piece water absorption plate 23, compared to split-structure water absorption plates, the presence of installation gaps on the inner walls of the channels can be effectively avoided, thereby preventing the accumulation of impurities in the gaps. This not only reduces the frequency of cleaning but also reduces the impact of accumulated impurities on the suction force transmitted by the channels.

[0033] It can be understood that in the silicon wafer 61 processing technology, the silicon rod enters the slicing process after the cutting, squaring, polishing and other processes. After gluing, slicing and degumming, multiple silicon wafers 61 can be obtained. Multiple silicon wafers 61 are stacked together to form a silicon wafer group 60, and then the silicon wafer group 60 is transferred to the slicing process for slicing operation.

[0034] The water absorption plate 23 in the present application can be applied to the silicon wafer slicing device in the slicing process. Specifically, the water absorption plate 23 can be applied to the wafer lifting mechanism 20 of the silicon wafer slicing device. Figure 8 and Figure 9As shown, the silicon wafer separating device includes a transmission mechanism 10, a wafer lifting mechanism 20 and a wafer separating mechanism 30. The transmission mechanism 10 is provided with a transmission channel 101 for transmitting a silicon wafer group 60. Several silicon wafers 61 in the silicon wafer group 60 are stacked along the extension direction of the transmission channel 101; the wafer separating mechanism 30 is arranged opposite to the transmission channel 101, and is used to separate the silicon wafer group 60 in the transmission channel 101; the wafer lifting mechanism 20 is arranged at one end of the transmission channel 101, and is used to move the separated silicon wafers 61 in the transmission channel 101 out of the transmission channel 101.

[0035] Among them, Figure 6 and Figure 7 As shown, the film lifting mechanism 20 includes a driving assembly 21, a conveyor belt 22 and a water absorption plate 23. The driving assembly 21 is arranged at one end of the conveying channel 101, and the conveyor belt 22 is installed on the driving assembly 21. The driving assembly 21 is used to drive the conveyor belt 22 to move; the water absorption plate 23 is arranged on the side of the conveyor belt 22 away from the conveying channel 101; the conveyor belt 22 is provided with a plurality of film absorption holes 222 passing through, and the water absorption plate 23 is provided with a plurality of water absorption holes 2301 (as shown in FIG. 1 ) corresponding to the film absorption holes 222. Figure 1 As shown), multiple water suction holes 2301 are suitable for communicating with a water pumping device.

[0036] Specifically, the slicing mechanism 30 can be connected to an external liquid supply system, which provides a slicing medium, such as water, at a certain pressure to the slicing mechanism 30. The slicing medium is ejected from the slicing mechanism 30 to form a fluid. Furthermore, as the silicon wafer assembly 60 passes through the slicing mechanism 30, the slicing mechanism 30 sprays the slicing medium onto the silicon wafer assembly 60, thereby separating the silicon wafers 61 in the silicon wafer assembly 60. The separated silicon wafers 61 are then transferred to the vicinity of the conveyor belt 22. A water pumping device applies suction through the water absorption holes 2301 in the water absorption plate 23 to the wafer absorption holes 222 in the conveyor belt 22, thereby adsorbing the silicon wafers 61 onto the conveyor belt 22. The conveyor belt 22 then pulls the silicon wafers 61 upward, thereby enabling the transport of the silicon wafers 61.

[0037] It should be noted that the conventional water-absorbing plate 23 usually adopts a split structure. The water-absorbing plate 23 is composed of two independent plates buckled together. In order to ensure the seal between the two plates, it is necessary to apply adhesive at the connection between the two plates and set a sealant for sealing. The water-absorbing plate 23 with this split structure is relatively cumbersome to install and disassemble. In addition, this split structure is in the sliced ​​medium for a long time, and there is a risk of debonding. After debonding, the internal sealing of the water-absorbing plate 23 will deteriorate, and the suction force transmitted by the water-absorbing plate 23 to the conveyor belt 22 will be reduced, affecting the transmission capacity of the conveyor belt 22. In the present application, the plate body 230 is set as an integral molded part, that is, the water-absorbing plate 23 is an integral structure. This is convenient for actual processing and manufacturing, and also convenient for the installation and disassembly of the water-absorbing plate 23 during use. At the same time, it can also ensure the sealing of the internal channel of the water-absorbing plate 23.

[0038] Alternatively, as Figure 1 As shown, the plate body 230 is provided with a through hole (including Figure 1 2311 and 2321), both ends of the through hole are provided with plugs (including Figure 1 2312 and 2322) are used to block the two ends of the through hole, and multiple water absorption holes 2301 are respectively connected to the through holes, and the through holes are used to connect the water absorption holes 2301 with the pumping device.

[0039] In the embodiment of the present application, a through hole is provided in the integrally formed plate body 230, and both ends of the through hole are sealed with a plug. The through hole can then be used to connect the water absorption hole 2301 to the pumping device, and the pumping device provides suction to the water absorption hole 2301 via the through hole. In this way, when the interior of the through hole needs to be cleaned and maintained, the cleaning operation can be performed by simply removing the plug, which is simple and convenient to operate and easy to clean and maintain. At the same time, because the through hole is a through structure, it can be formed in one step during processing, which ensures the smoothness of the hole wall. This can reduce the accumulation of impurities on the hole wall during use, effectively extending the maintenance cycle of the water absorption plate 23, and reducing production costs.

[0040] Alternatively, as Figures 1 to 5 As shown, the through hole includes a first through hole 2311 passing through the plate body 230 along the first direction X, and the plug includes a first plug 2312 provided at both ends of the first through hole 2311. The first plug 2312 blocks both ends of the first through hole 2311 to form a water suction channel 231. Multiple water suction holes 2301 are connected to the water suction channel 231, and the water suction channel 231 is suitable for connecting with a water pumping device.

[0041] In the embodiment of the present application, a first through hole 2311 is provided in the water absorption plate 23, and both ends of the first through hole 2311 are sealed with a first plug 2312 to form a sealed water absorption channel 231, so that the pumping device can simultaneously provide suction to multiple water absorption holes 2301 through the water absorption channel 231. Since the water absorption channel 231 is formed by the through first through hole 2311, when the water absorption channel 231 needs to be cleaned and maintained, it is only necessary to remove the first plug 2312 to perform the cleaning operation, which is simple and convenient to operate and easy to clean and maintain. At the same time, since the first through hole 2311 is a through structure, it can be processed and formed in one step during processing, which can ensure the smoothness of the hole wall. Therefore, during use, it can reduce the accumulation of impurities on the hole wall, effectively extend the maintenance cycle of the water absorption plate 23, and reduce production costs.

[0042] Specifically, a first through hole 2311 can be set in the water absorption plate 23 along the extension direction of the conveyor belt 22 (that is, the first direction X), and internal threads can be set on the hole walls at both ends of the first through hole 2311, and then the two ends of the first through hole 2311 can be sealed using a first plug 2312 with external threads, so that the installation and disassembly of the first plug 2312 are convenient.

[0043] Alternatively, as Figures 1 to 5 As shown, the through hole also includes a second through hole 2321 passing through the water absorption plate 23 along the second direction Y, and the second direction Y intersects with the first direction X. The plug includes a second plug 2322 provided at both ends of the second through hole 2321. The second plug 2322 blocks both ends of the second through hole 2321 to form a connecting channel 232. The connecting channel 232 is connected to the water absorption channel 231, and the connecting channel 232 is suitable for connecting a water pumping device.

[0044] In the embodiment of the present application, a second through hole 2321 is provided through the water absorption plate 23, and both ends of the second through hole 2321 are sealed with a second plug 2322 to form a connecting channel 232. The connecting channel 232 is connected to the water absorption channel 231. The provision of the connecting channel 232 facilitates the connection of the water absorption channel 231 with an external pumping device. Furthermore, by providing the second through hole 2321 through the water absorption plate 23 to form the connecting channel 232, when the connecting channel 232 needs to be cleaned and maintained, the cleaning operation can be performed by simply removing the second plug 2322, which is simple and convenient to operate and easy to clean and maintain. Furthermore, since the second through hole 2321 is a through structure, it can be formed in one step during processing, thus ensuring the smoothness of the hole wall. This reduces the accumulation of impurities on the hole wall during use, effectively extending the maintenance cycle of the water absorption plate 23 and reducing production costs.

[0045] In some embodiments, as Figure 3 and Figure 4 As shown, a connector 24 can also be provided on the water absorption plate 23, one end of the connector 24 being connected to the communication channel 232, and the other end of the connector 24 being used to connect to the water pumping device. For example, the connector 24 can be a pagoda connector, which facilitates the connection and removal of the connector 24 to the water pumping device.

[0046] Alternatively, as Figure 1 and Figure 2 As shown, the water absorption plate 23 is provided with two rows of water absorption holes 2301 , and correspondingly, the water absorption plate 23 is formed with two water absorption channels 231 , each water absorption channel 231 corresponds to a row of water absorption holes 2301 , and further, the communication channel 232 is respectively connected to the two water absorption channels 231 .

[0047] In an embodiment of the present application, the axis of the connecting channel 232 intersects with the axis of the water absorption channel 231, and the connecting channel 232 is used to connect the two water absorption channels 231, so that the pumping device can provide suction to the two water absorption channels 231 at the same time through the connecting channel 232, thereby ensuring that the negative pressure between the two conveyor belts 22 and the silicon wafer 61 is relatively balanced.

[0048] In some embodiments, the first through hole 2311 and the second through hole 2321 are both set as circular holes to ensure that the hole walls of the first through hole 2311 and the second through hole 2321 are smoother, which can not only reduce the accumulation of impurities on the hole walls, but also reduce the loss of suction force provided by the pumping device to the water suction hole 2301 through the connecting channel 232 and the water suction channel 231.

[0049] In some embodiments, as Figure 1 As shown, the axis of the second through hole 2321 in the water absorption plate 23 (ie, the second direction Y) is perpendicular to the axis of the first through hole 2311 (ie, the first direction X). In addition, the two first through holes 2311 provided in the water absorption plate 23 have the same aperture.

[0050] Alternatively, as Figure 1 and Figure 2 As shown, the side of the plate 230 facing the conveyor belt 22 is a first surface 2302 . The first surface 2302 is provided with a protrusion 2303 at a position corresponding to the conveyor belt 22 , and the water absorption hole 2301 passes through the protrusion 2303 .

[0051] In the embodiment of the present application, a protrusion 2303 is provided on the side of the plate 230 facing the conveyor belt 22. The position of the protrusion 2303 corresponds to the position of the conveyor belt 22. When the absorbent plate 23 and the conveyor belt 22 are used together, the protrusion 2303 can be used to support the conveyor belt 22, so that a certain gap exists between the edge of the conveyor belt 22 and the first surface 2302 of the absorbent plate 23. This can reduce friction between the conveyor belt 22 and the absorbent plate 23 during movement and also reduce obstruction of other structures in the absorbent plate 23 (such as the drainage holes 233) by the conveyor belt 22.

[0052] Specifically, the raised portion 2303 in the water absorption plate 23 extends from the first surface 2302 in a direction away from the plate body 230. The position and number of the raised portion 2303 are adapted to the conveyor belt 22 and can be flexibly set according to actual conditions, and are not limited here.

[0053] Alternatively, as Figure 1 and Figure 2As shown, the plate body 230 is provided with a plurality of drainage holes 233 extending along a third direction Z. The plurality of drainage holes 233 include a plurality of first drainage holes 2331, which are disposed on either side of the protrusion 2303. The first surface 2302 is provided with recessed grooves 2304 at corresponding positions on either side of the protrusion 2303, with at least some of the first drainage holes 2331 located within the recessed grooves 2304. The third direction Z is perpendicular to both the first direction X and the second direction Y.

[0054] In the example of the present application, first drainage holes 2331 are provided on both sides of the raised portion 2303 so that the residual slicing medium in the transmission channel 101 can be discharged by utilizing the first drainage holes 2331. At the same time, sink grooves 2304 are provided on both sides of the raised portion 2303 so that at least part of the first drainage holes 2331 are located in the sink grooves 2304 so as to increase the gap size between the first drainage holes 2331 and the transmission belt 22, thereby avoiding the transmission belt 22 from blocking the first drainage holes 2331 and improving the drainage effect of the first drainage holes 2331.

[0055] In a specific application, the extension direction of the protrusion 2303 is the same as the extension direction of the conveyor belt 22, both extending along the first direction, and then a plurality of first drainage holes 2331 are respectively arranged on both sides of the protrusion 2303. The plurality of first drainage holes 2331 can be arranged at intervals along the first direction, and the first drainage holes 2331 pass through the plate body 230.

[0056] Furthermore, because the conveyor belt 22 covers the raised portion 2303, when the width of the conveyor belt 22 is greater than the width of the raised portion 2303, the edge of the conveyor belt 22 will partially block the first surface 2302 on both sides of the raised portion 2303. To this end, in the present application, by providing a recessed groove 2304 on both sides of the raised portion 2303, at least a portion of the first drainage hole 2331 is located within the recessed groove 2304, thereby reducing the obstruction of the first drainage hole 2331 by the conveyor belt 22.

[0057] The two sides of the protrusion 2303 refer to the two sides perpendicular to the extension direction of the protrusion 2303, that is, Figure 1 The middle protrusion 2303 is located along two sides of the second direction Y.

[0058] Alternatively, as Figure 1 and Figure 2 As shown, the plurality of drainage holes 233 further include a plurality of second drainage holes 2332, which are provided in the plate body 230 in areas other than the two sides of the protrusion 2303. By providing a plurality of second drainage holes 2332 in areas other than the first drainage holes 2331 in the plate body 230, the second drainage holes 2332 can be used to drain residual sheet medium in the corresponding area of ​​the transmission channel 101.

[0059] It should be noted that the second drainage hole 2332 and the first drainage hole 2331 can be set as a circular hole, an elliptical hole, a polygonal hole, etc. The apertures of the second drainage hole 2332 and the first drainage hole 2331 can be set to be the same or different, and can be flexibly set according to actual conditions, and are not limited here.

[0060] Alternatively, as Figure 8 and Figure 9 As shown, a silicon wafer slicing device is also provided in an embodiment of the present application, including: a transmission mechanism 10 and a wafer lifting mechanism 20. The transmission mechanism 10 is provided with a transmission channel 101, and the wafer lifting mechanism 20 includes a transmission belt 22 and a water absorption plate 23 as described in any of the above embodiments. The transmission belt 22 is provided at one end along the transmission channel 101, and the water absorption plate 23 is provided on the side of the transmission belt 22 away from the transmission channel 101. The transmission belt 22 is provided with a plurality of wafer absorption holes 222 arranged at intervals along the first direction X, which are used to absorb and remove silicon wafers in the transmission channel 101.

[0061] In the embodiment of the present application, by configuring the water absorption plate 23 in the lifting mechanism 20 as an integrally formed component, the problem of debonding at the joints can be effectively avoided compared to conventional split-structure water absorption plates. This not only facilitates installation and removal, but also reduces the need for sealing design within the water absorption plate 23. Furthermore, when internal channels are provided in the integral water absorption plate 23, compared to split-structure water absorption plates, the presence of installation gaps on the inner walls of the channels can be effectively avoided, thereby preventing the accumulation of impurities in the gaps. This not only reduces the frequency of cleaning but also reduces the impact of accumulated impurities on the suction force transmitted by the channels.

[0062] In some embodiments, as Figure 8 As shown, the transmission mechanism 10 may include a bottom transmission mechanism 11 and two side transmission mechanisms 12. The two side transmission mechanisms 12 are respectively arranged on both sides of the bottom transmission mechanism 11 to enclose a transmission channel 101. When the silicon wafer group 60 is placed in the transmission channel 101, the lower end surface of the silicon wafer group 60 contacts the bottom transmission mechanism 11, and the two opposite side end surfaces of the silicon wafer group 60 contact the corresponding side transmission mechanisms 12 respectively.

[0063] Furthermore, the side transfer mechanism 12 can be set at a position in the middle and upper part of the side end surface of the silicon wafer group 60. In this way, the side transfer mechanism 12 can not only realize the transfer function of the silicon wafer group 60, but also play a role in side protection of the silicon wafer group 60 and the separated silicon wafers 61.

[0064] In a specific application, during the process of transferring the silicon wafer group 60 to the slicing mechanism 30 , the transfer speeds of the bottom transfer mechanism 11 and the two side transfer mechanisms 12 can be kept consistent to achieve smooth transfer of the silicon wafer group 60 and avoid relative displacement between the silicon wafer group 60 and the transfer mechanism 10 .

[0065] For example, the bottom transmission mechanism 11 and the side transmission mechanism 12 in the present application can both adopt belt transmission mechanisms. Of course, other types of transmission mechanisms can also be adopted. Those skilled in the art can flexibly select them according to actual conditions, and no limitation is made here.

[0066] In some embodiments, as Figure 6 and Figure 7 As shown, the film lifting mechanism 20 also includes a driving component 21, which is arranged at one end of the transmission channel 101, and the transmission belt 22 is installed on the driving component 21. The driving component 21 is used to drive the transmission belt 22 to move, and then the transmission belt 22 carries the silicon wafer 61 to move.

[0067] Specifically, the driving assembly 21 may include a mounting seat, a driving shaft, a driven shaft and a driving member. The mounting seat is arranged at one end of the transmission channel 101, and the driving shaft and the driven shaft are arranged on the mounting seat at intervals. The transmission belt 22 is connected to the driving shaft and the driven shaft. The lower end of the transmission belt 22 is docked with the transmission channel 101, and the driving member is connected to the driving shaft. The driving shaft can be driven to rotate through the driving member to drive the transmission belt 22 to move, thereby realizing transmission from bottom to top.

[0068] Furthermore, a water absorption plate 23 is disposed between the driving shaft and the driven shaft. The water absorption plate 23 is provided with multiple water absorption holes 2301, which are spaced apart along the conveying direction of the conveyor belt 22. Accordingly, the conveyor belt 22 is provided with multiple wafer suction holes 222. Before the conveyor belt 22 transports the silicon wafer 61, the wafer suction holes 222 communicate with the water absorption holes 2301. The multiple water absorption holes 2301 are connected to an external pumping device. During operation, the pumping device applies suction to the water absorption holes 2301 and the wafer suction holes 222, creating a negative pressure between the silicon wafer 61 and the conveying surface 221, thereby adsorbing the silicon wafer 61 onto the conveyor belt 22, thereby enabling the conveyor belt 22 to carry the silicon wafer 61 upward.

[0069] For example, the driving member may be a driving motor, and the pumping device may be a water pump. Of course, the driving member and the pumping device may also have other structures, which can be flexibly selected according to actual conditions and are not limited here.

[0070] Alternatively, as Figure 2 and Figure 8 As shown, a plurality of drainage holes 233 are provided in the water absorption plate 23. The water absorption plate 23 includes a first end 23a close to the transmission channel 101 and a second end 23b away from the transmission channel 101. The number of drainage holes 233 in the first end 23a is greater than the number of drainage holes 233 in the second end 23b.

[0071] In the embodiment of the present application, by setting the number of drainage holes 233 of the water absorption plate 23 close to the transmission channel 101 to be greater than the number of drainage holes 233 at the end away from the transmission channel 101, the drainage capacity of the water absorption plate 23 close to the transmission channel 101 can be increased, thereby helping to improve the water absorption plate 23's ability to remove residual slicing medium in the transmission channel 101.

[0072] Specifically, if Figure 2 As shown, with the dotted line O passing through the center of the first surface as the boundary, the water absorbing plate 23 includes a first end 23a close to the transmission channel 101, that is, located at Figure 2 The portion above the dotted line O, including the second end 23b away from the transmission channel 101, that is, located at Figure 2 The part below the dotted line O.

[0073] It should be noted that the number and positions of the drainage holes 233 in the first end 23a and the second end 23b can be flexibly set according to actual needs and are not limited here.

[0074] Alternatively, as Figure 2 and Figure 6 As shown, along the conveying direction of the conveyor belt 22 , the water absorption holes 2301 correspond to the suction plate holes 222 one by one, and the cross-sectional area of ​​each water absorption hole 2301 is larger than the cross-sectional area of ​​the corresponding suction plate hole 222 .

[0075] In the embodiment of the present application, the cross-sectional area of ​​the water suction hole 2301 is set to be larger than the cross-sectional area of ​​the corresponding suction hole 222, so that when the position of the conveyor belt 22 is offset, the suction hole 222 can be ensured to be connected to the water suction hole 2301, thereby reducing the requirements for the position accuracy of the conveyor belt 22.

[0076] In some embodiments, along the conveying direction of the conveyor belt 22 , the cross-sectional areas of the plurality of water absorption holes 2301 gradually decrease.

[0077] It is understood that after the silicon wafers 61 are separated, suction is applied to the wafer suction holes 222 of the conveyor belt 22 through the suction holes 2301 of the suction plate 23, thereby generating a negative pressure between the conveyor surface 221 and the silicon wafers 61. This overcomes the suction force between the two adjacent silicon wafers 61, thereby adsorbing and securing the silicon wafers 61 on the conveyor belt 22, and allowing the conveyor belt 22 to transport the silicon wafers 61 upward. As the conveyor belt 22 drives the silicon wafers 61 upward, the silicon wafers 61 gradually move away from the conveyor channel 101, and the contact area between the silicon wafer 61 on the conveyor belt 22 and the adjacent silicon wafer 61 gradually decreases. Accordingly, the required suction force also gradually decreases.

[0078] To this end, in the embodiment of the present application, a plurality of water absorption holes 2301 are provided, and the cross-sectional areas of the plurality of water absorption holes 2301 gradually decrease along the transmission direction of the conveyor belt 22, thereby ensuring that the water absorption holes 2301 close to the transmission channel 101 have a larger cross-sectional area and can provide a greater suction force, and the water absorption holes 2301 away from the transmission channel 101 have a smaller cross-sectional area and only need to provide a smaller suction force, so that the structure of each water absorption hole 2301 better matches the transmission requirements of the silicon wafer 61.

[0079] It should be noted that the cross-sectional area of ​​the water absorption hole 2301 is equal to the orthographic projection area of ​​the water absorption hole 2301 along its axis. The cross-sectional area of ​​the suction plate hole 222 is equal to the orthographic projection area of ​​the suction plate hole 222 along its axis.

[0080] Among them, the water absorption hole 2301 can be set as a round hole, a square hole, a strip hole, a waist hole, etc., and can also be set as other hole structures, which are not limited here.

[0081] Alternatively, as Figures 8 to 10 As shown, the silicon wafer slicing device also includes a slicing mechanism 30, which is arranged on at least one side of the transmission channel 101 and close to the lifting mechanism 20, and is used to separate the silicon wafer group 60 in the transmission channel 101, so as to absorb the separated silicon wafers 61 through the transmission surface 221 of the lifting mechanism 20 and move them out of the transmission channel 101; the transmission direction of the transmission channel 101 is the third direction Z; the slicing mechanism 30 is provided with a plurality of spray holes 301 on the side facing the transmission channel 101, and the plurality of spray holes 301 are arranged in rows at intervals perpendicular to the third direction Z, and the two adjacent rows of spray holes 301 are staggered with each other, and the plurality of spray holes 301 are suitable for being connected to an external liquid supply system so as to allow slicing medium to be passed into the plurality of spray holes 301 through the liquid supply system.

[0082] In an embodiment of the present application, a plurality of liquid spray holes 301 are provided on the side of the slicing mechanism 30 facing the transmission channel 101, and the plurality of liquid spray holes 301 are connected to an external liquid supply system so that the liquid supply system can simultaneously supply slicing medium to the plurality of liquid spray holes 301. After the slicing medium is ejected through the liquid spray holes 301, the impact of the slicing medium is utilized to separate the stacked silicon wafers 61.

[0083] And, as Figure 10 As shown, a plurality of liquid spray holes 301 in the slicing mechanism 30 are arranged in rows at intervals perpendicular to the third direction Z, and two adjacent rows of liquid spray holes 301 are staggered with each other. In this way, through the cooperation of two adjacent rows of liquid spray holes 301, the coverage area of ​​the liquid spray holes 301 can be increased, the slicing effect of the slicing mechanism 30 is improved, and the connection rate of the silicon wafer 61 is reduced.

[0084] It is understood that to ensure the structural strength of the portion of the slicing mechanism 30 where the spray holes 301 are provided, a certain spacing is provided between adjacent spray holes. This spacing is generally greater than the thickness of a single silicon wafer 61. If only a single row of spray holes 301 were provided, a blind spot would exist between adjacent spray holes 301, thus affecting the slicing effect. To this end, the present application provides at least two spray holes 301, and staggers the adjacent rows of spray holes 301. This allows the coordination of the adjacent rows of spray holes 301 to increase the coverage area of ​​the spray holes 301 and reduce the blind spot.

[0085] For example, two rows of liquid spray holes 301 can be provided in the slicing mechanism 30, wherein the plurality of liquid spray holes 301 in each row of liquid spray holes 301 are evenly spaced along the third direction Z, and the two rows of liquid spray holes 301 are staggered. Of course, the number of liquid spray holes 301 in the slicing mechanism 30 can be flexibly set according to actual needs and is not limited here.

[0086] It should be noted that the staggered arrangement means that along the direction in which the liquid spray holes 301 are arranged in rows, the orthographic projections of two adjacent rows of liquid spray holes 301 at least partially do not overlap.

[0087] In some embodiments, the slicing mechanism 30 may include a mechanism body and a slicing panel. The slicing panel is connected to the mechanism body to enclose a liquid injection cavity. The slicing panel is provided with a plurality of liquid spray holes 301 connected to the liquid injection cavity, and the liquid injection cavity is connected to an external liquid supply system. Then, the slicing medium can be injected into the liquid injection cavity through the liquid supply system. The slicing medium is then ejected from the plurality of liquid spray holes 301 to form a fluid, which impacts the side of the silicon wafer group 60 to achieve the slicing effect.

[0088] like Figure 8 and Figure 9 As shown, slicing mechanisms 30 are provided on both sides of the transmission channel 101, so that the slicing mechanisms 30 on both sides can be used to simultaneously spray slicing medium onto the silicon wafer group 60 in the transmission channel 101, so as to improve the slicing effect of the silicon wafer group 60. At the same time, both sides of the silicon wafer 61 are subjected to force at the same time, so as to avoid damage to the silicon wafer 61 due to local uneven force.

[0089] The specific type of slicing medium can be flexibly selected according to actual needs, and can be liquid or gas, which is not limited here.

[0090] In some embodiments, as Figures 8 and 9As shown, the silicon wafer separation device also includes a wafer feeding mechanism 50, which is located at the end of the conveyor belt 22 away from the conveyor mechanism 10. In other words, the wafer feeding mechanism 50 is located above the wafer separation mechanism 30. The wafer feeding mechanism 50 may include a wafer feeding plate, a wafer feeding belt, a rotating shaft, and a drive motor. The wafer feeding plate is located at the end of the conveyor belt 22 away from the conveyor mechanism 10. The rotating shaft is located at both ends of the wafer feeding plate. The wafer feeding belt is mounted on the wafer feeding plate and connected to the rotating shaft. The wafer feeding plate is curved on the side facing the wafer feeding belt, so that the wafer feeding belt has an arc shape.

[0091] Furthermore, a drive motor is connected to a rotating shaft at one end of the wafer feeding plate. The drive motor drives the rotating shaft to rotate, thereby driving the wafer feeding belt. After the conveyor belt 22 in the wafer lifting mechanism 20 transfers the silicon wafer 61 to the corresponding position of the wafer feeding mechanism 50, the silicon wafer 61 is transferred from the conveyor belt 22 to the wafer feeding belt. The movement of the wafer feeding belt then flips the vertical silicon wafer 61 to a horizontal position, enabling the insertion of the silicon wafer 61.

[0092] Alternatively, as Figure 9 As shown, a detection mechanism 40 is also included. The detection mechanism 40 is arranged in the water absorption plate 23 and is used to detect the relative position of the silicon wafer 61 and the water absorption plate 23.

[0093] In an embodiment of the present application, a detection mechanism 40 is provided in the water absorption plate 23 so that the detection mechanism 40 can be used to detect the relative distance between the separated silicon wafer 61 and the water absorption plate 23, that is, the distance from the separated silicon wafer 61 to the transmission surface 221 can be detected. Furthermore, the transmission rate of the transmission structure can be flexibly adjusted according to the distance to improve work efficiency.

[0094] Specifically, a controller is also provided in the silicon wafer slicing device. The detection mechanism 40 can be electrically connected to the controller, and the controller is electrically connected to the transmission mechanism 10. The detection mechanism 40 can then be used to detect the actual distance between the silicon wafer 61 separated at the front end of the silicon wafer group 60 and the water absorption plate 23, so that the controller can flexibly increase or decrease the transmission efficiency of the transmission mechanism 10 according to the actual distance.

[0095] In some embodiments, the detection mechanism 40 may use distance measuring elements such as laser sensors, distance measuring sensors, and photoelectric sensors, and may be flexibly selected according to actual conditions, and is not limited here.

[0096] Optionally, an embodiment of the present application further provides a wafer inserting system, including the silicon wafer separating device in the above embodiment, or including the water absorption plate in the above embodiment.

[0097] In the embodiment of the present application, by forming the water absorption plate 23 as a one-piece component, the problem of debonding at the joints can be effectively avoided compared to conventional split-structure water absorption plates. This not only facilitates installation and removal, but also reduces the need for sealing design within the water absorption plate 23. Furthermore, when internal channels are provided in the one-piece water absorption plate 23, compared to split-structure water absorption plates, the presence of installation gaps on the inner walls of the channels can be effectively avoided, thereby preventing the accumulation of impurities in the gaps. This not only reduces the frequency of cleaning but also reduces the impact of accumulated impurities on the suction force transmitted by the channels.

[0098] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0099] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A water-absorbing plate, suitable for cooperating with a conveyor belt, wherein the conveyor belt is provided with a plurality of suction holes arranged at intervals along a first direction, characterized in that: The water absorption plate includes: a plate body, which is an integrally formed part. The plate body is provided with a plurality of water absorption holes corresponding to the suction plate holes. The plurality of water absorption holes are arranged at intervals along the first direction, and the water absorption holes are suitable for communicating with a water pumping device.

2. The water-absorbing plate according to claim 1, characterized in that: A through hole is provided in the plate body, and plugs are provided at both ends of the through hole to seal the two ends of the through hole. The multiple water absorption holes are respectively connected to the through holes, and the through holes are used to connect the water absorption holes with the water pumping device.

3. The water-absorbing plate according to claim 2, characterized in that: The through hole includes a first through hole passing through the plate body along the first direction, and the plug includes a first plug provided at both ends of the first through hole, the first plug blocks both ends of the first through hole to form a water absorption channel, and the multiple water absorption holes are respectively connected to the water absorption channel, and the water absorption channel is suitable for connecting with a water pumping device.

4. The water-absorbing plate according to claim 3, characterized in that: The through hole also includes a second through hole passing through the plate body along a second direction, the second direction intersecting with the first direction, the plug includes a second plug provided at both ends of the second through hole, the second plug blocks both ends of the second through hole to form a connecting channel, the connecting channel is connected to the water suction channel, and the connecting channel is suitable for connecting a water pumping device.

5. The water-absorbing plate according to any one of claims 1 to 4, characterized in that: The side of the plate body facing the conveyor belt is a first surface. The first surface is provided with a convex portion at a position corresponding to the conveyor belt, and the water absorption hole passes through the convex portion.

6. The water-absorbing plate according to claim 5, characterized in that: The plate body is provided with a plurality of through drainage holes, and the plurality of drainage holes include a plurality of first drainage holes and / or a plurality of second drainage holes, and the plurality of first drainage holes are respectively arranged on both sides of the protrusion; the first surface is provided with grooves at corresponding positions on both sides of the protrusion, and at least part of the first drainage holes is located in the grooves; the second drainage holes are arranged in the area of ​​the plate body other than the two sides of the protrusion.

7. A silicon wafer slicing device, characterized in that: include: A transmission mechanism, wherein a transmission channel is provided in the transmission mechanism; as well as The wafer lifting mechanism comprises a conveyor belt and a water absorption plate as described in any one of claims 1 to 6, wherein the conveyor belt is arranged at one end of the conveyor channel, and the water absorption plate is arranged on the side of the conveyor belt away from the conveyor channel. The conveyor belt is provided with a plurality of wafer absorption holes arranged at intervals along a first direction for absorbing and removing the silicon wafers in the conveyor channel.

8. The silicon wafer separating device according to claim 7, wherein: The water absorption plate is provided with a plurality of drainage holes. The water absorption plate includes a first end close to the transmission channel and a second end away from the transmission channel. The number of drainage holes in the first end is greater than the number of drainage holes in the second end.

9. The silicon wafer separating device according to claim 7, wherein: Along the conveying direction of the conveyor belt, the water absorption holes correspond to the sheet suction holes one by one, and the cross-sectional area of ​​each water absorption hole is larger than the cross-sectional area of ​​the corresponding sheet suction hole; And / or, along the conveying direction of the conveyor belt, the cross-sectional areas of the plurality of water absorption holes gradually decrease.

10. The silicon wafer separating device according to any one of claims 7 to 9, characterized in that: Also includes: A wafer separation mechanism, disposed on at least one side of the transmission channel and close to the wafer lifting mechanism, for separating the silicon wafer group in the transmission channel; The transmission direction of the transmission channel is a third direction, and the slicing mechanism is provided with a plurality of spray holes on a side facing the transmission channel. The plurality of spray holes are arranged in rows at intervals perpendicular to the third direction, and the two adjacent rows of spray holes are staggered with each other. The plurality of spray holes are suitable for communicating with an external liquid supply system so as to allow slicing medium to be introduced into the plurality of spray holes through the liquid supply system.

11. The silicon wafer separating device according to any one of claims 7 to 9, characterized in that: It also includes a detection mechanism, which is arranged in the water absorption plate and is used to detect the relative position of the silicon wafer and the water absorption plate.

12. A sheet inserting system, characterized in that: It comprises the water absorption plate as described in any one of claims 1-6, or comprises the silicon wafer slicing device as described in any one of claims 7-11.

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