Foam structure heat conduction module
The design of the foam structure heat conduction module solves the shortcomings of existing heat conduction devices in heat conduction efficiency and structural design, achieves more efficient heat dissipation performance, and is suitable for electronic products.
Patent Information
- Application Number
- CN202421582430.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-07-05
AI Technical Summary
Existing heat conduction devices have deficiencies in heat conduction efficiency and structural design, and cannot meet the higher requirements of modern electronic products for heat dissipation performance.
A foam structure heat conduction module is adopted, which includes a foam structure and a heat conduction structure. The foam structure has multiple pores, and the heat conduction structure is formed by curing a thermosetting colloid. The joint part and the heat dissipation part are designed. The heat conduction structure has a high thermal conductivity coefficient and can effectively conduct the heat of the heat source to the surrounding environment.
In a limited space, the foam structure heat conduction module has a larger contact area with air or cooling liquid, which improves the heat conduction and heat dissipation efficiency, reduces electromagnetic interference, and the structural design fits closely to the heat source to improve heat conduction efficiency.
Smart Images
Figure CN223322301U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat conduction device, in particular to a foam structure heat conduction module. Background Art
[0002] With the rapid development of technology, the performance of various electronic products has increased dramatically, but power consumption has also increased dramatically. This causes electronic components to generate a large amount of heat during operation. If heat is not dissipated effectively and promptly, the excessively high temperatures can lead to performance degradation or permanent damage to the electronic components. In more serious cases, it can even cause safety issues. Thermal conductivity devices can conduct heat from electronic components to the surrounding environment, thereby maintaining component temperatures within a safe range. This not only improves the performance and reliability of electronic products, but also extends their service life. Therefore, the use of thermal conductivity devices is particularly important in electronic products.
[0003] Conventional heat conducting devices are generally formed with a plurality of protrusions or fins by die extrusion or metal processing to increase the contact area between the heat conducting device and the air, thereby improving heat dissipation efficiency.
[0004] The above-mentioned heat-conducting device still has a lot of room for improvement in terms of heat conduction efficiency and structural design. In order to solve these problems, the present invention aims to provide a heat-conducting device with higher heat conduction efficiency and better structural design to meet the higher requirements of modern electronic products for heat dissipation performance. Utility Model Content
[0005] In view of this, an object of the present invention is to provide a heat conducting device that can have better heat conducting efficiency to meet the heat dissipation performance requirements of electronic components.
[0006] In order to achieve the above-mentioned purpose, the utility model provides a foam structure heat conduction module comprising a foam structure and a heat conduction structure, wherein the foam structure has a plurality of pores, and the foam structure has a joint portion and a heat dissipation portion; the heat conduction structure is formed by solidifying a heat-curing colloid, and the heat conduction structure has a first side and a second side opposite to each other, the first side is connected to the joint portion, and the second side heat conduction structure is used to receive heat from a heat source; therefore, the heat energy of the heat source is transferred to the joint portion of the foam structure via the heat conduction structure, and then conducted to the heat dissipation portion for heat dissipation.
[0007] In one embodiment, the second side of the heat conducting structure has a plane.
[0008] In one embodiment, the foam structure is made of at least one or a combination of graphene, silver, copper, gold, aluminum, or nickel.
[0009] In one embodiment, the porosity of the foam structure is between 60% and 95%.
[0010] In one embodiment, the diameter of each of the pores is between 0.1 and 10 mm.
[0011] In one embodiment, the thermal conductivity of the heat-conducting structure is greater than or equal to 70 W / mK.
[0012] In one embodiment, a ratio of a thickness of the heat dissipation portion of the foam structure to a thickness of the heat conducting structure is between 2:1 and 10:1.
[0013] In one embodiment, the pore density of the foam structure is between 5 and 130 ppi.
[0014] In one embodiment, the thickness of the heat-conducting structure is between 1 mm and 2 mm.
[0015] In one embodiment, the foam structure heat conduction module includes a heat conduction medium disposed on the second side of the heat conduction structure.
[0016] The effect of the present invention is that, compared with the protruding structure or fin structure of the existing heat-conducting device, the foam structure has a larger contact area with the air or cooling liquid per unit volume. Therefore, through the conduction of the heat-conducting structure and the foam structure, the foam structure heat-conducting module can more efficiently conduct the heat of the heat source to the surrounding environment within the constraints of a limited space. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a three-dimensional diagram of a foam structure heat conduction module according to the first preferred embodiment of the present invention.
[0018] Figure 2 This is a top view of the foam structure heat conduction module according to the first preferred embodiment of the present invention.
[0019] Figure 3 for Figure 2 Cross-sectional view in the 3-3 direction.
[0020] Figure 4 This is an exploded view of the foam structure heat conduction module according to the first preferred embodiment of the present invention.
[0021] Figure 5 This is an exploded view of a foam structure heat conduction module according to the second preferred embodiment of the present invention.
[0022] Description of reference numerals:
[0023] 100, 200: Foam structure thermal conductivity module
[0024] 10: Foam structure
[0025] 12: Porosity
[0026] 14: Joint
[0027] 16: Heat dissipation
[0028] 20: Thermal conductive structure
[0029] 22: First side
[0030] 24: Second side
[0031] 242: Plane
[0032] 30: Thermal Conductive Medium
[0033] H: Heat source
[0034] L1, L2: thickness DETAILED DESCRIPTION
[0035] In order to more clearly illustrate the present invention, a preferred embodiment is given below with detailed description in conjunction with the accompanying drawings. Figures 1 to 4 FIG. 1 shows a foam structure heat conduction module 100 according to a first preferred embodiment of the present invention. The foam structure heat conduction module 100 is used to conduct heat from a heat source H to the surrounding environment. It should be noted that the surrounding environment can be common air or cooling liquid in immersion cooling. In this embodiment, the heat source H is described using an electronic chip as an example. In practice, the heat source H can also be other electronic products that generate heat energy during operation, such as a solid-state drive (SSD) in a desktop computer host.
[0036] like Figure 3 As shown, the foam structure heat conduction module 100 includes a stacked foam structure 10, a heat conducting structure 20, and a heat conducting medium 30. In this embodiment, the foam structure 10 is illustrated as copper foam. In other embodiments, the foam structure 10 may be made of at least one or a combination of graphene, silver, copper, gold, aluminum, or nickel. The foam structure 10 includes a plurality of pores 12. Therefore, heat energy generated by the heat source H is transferred to the foam structure 10 via the heat conducting medium 30 and the heat conducting structure 20 for dissipation. Compared to conventional heat conducting bumps or heat dissipation fins formed by machining metal blocks, the foam structure 10 significantly increases the contact area with air or cooling liquid per unit volume, thereby effectively improving heat conduction and heat dissipation efficiency. Furthermore, the foam structure 10 can effectively absorb and reflect electromagnetic waves, reducing damage to electronic chips caused by electromagnetic interference (EMI).
[0037] Furthermore, the pores 12 each have a pore diameter ranging from 0.1 to 10 mm; the porosity of the foam structure 10 ranges from 60% to 95%; and the pore density of the foam structure 10 ranges from 5 to 130 ppi. Users can select the corresponding pore size, porosity, or pore density depending on the usage environment or heat source. By designing the pore size, porosity, or pore density within the aforementioned numerical ranges, the contact area between the foam structure 10 and the air or cooling liquid can be significantly increased, thereby improving thermal conductivity and heat dissipation efficiency.
[0038] Please continue to cooperate Figure 3 The foam structure 10 has a joint portion 14 and a heat dissipation portion 16. The heat-conducting structure 20 is formed by heating and curing a heat-curing colloid. The thermal conductivity of the heat-conducting structure 20 is greater than or equal to 70 W / mK. The operating temperature of the heat-conducting structure 20 is between -25 and 150 degrees. In this embodiment, the heat-curing colloid is illustrated as a silicone-type heat-conducting liquid glue. In other embodiments, the heat-curing colloid can also be other heat-conducting liquid glues with thermal conductivity, which can also achieve the purpose of transferring the heat energy generated by the heat source H to the foam structure 10 for heat dissipation; wherein the heat-conducting structure 20 has a first side 22 and a second side 24 opposite to each other, the first side 22 is connected to the joint portion 14, and the second side 24 is connected to the heat-conducting medium 30. Therefore, the heat energy of the heat source H is transferred to the joint portion 14 of the foam structure 10 via the heat-conducting medium 30 and the heat-conducting structure 20, and then conducted to the heat dissipation portion 16 for heat dissipation.
[0039] For example, the user can apply the heat-curing colloid to the joint 14 of the foam structure 10, so that the heat-curing colloid covers the joint 14 of the foam structure 10 and fills the pores 12 of the joint 14. After the heat-curing colloid is heated and cured to form the thermal conductive structure 20, the thermal conductive structure 20 is connected to the foam structure 10. The cured heat-curing colloid can not only improve the mechanical properties of the joint 14 of the foam structure 10, but also form a uniform shielding layer, thereby more effectively blocking electromagnetic interference.
[0040] Preferably, if Figure 3 As shown, the heat-curing colloid completely covers the connecting portion 14 of the foam structure 10, and the second side 24 of the heat-conducting structure 20 has a plane 242. Therefore, the connecting portion 14 of the foam structure 10 is prevented from being unfavorable for contact with the heat source or the heat-conducting medium 30 due to an uneven surface, thereby preventing the problem of poor heat conduction. In addition, through the provision of the plane 242, the plane 242 of the heat-conducting structure 20 can be closely fitted with the surface of the heat source or the heat-conducting medium 30, thereby improving the heat conduction efficiency.
[0041] It is to be noted that, generally speaking, since the thermal conductivity of the heat-conducting structure 20 is lower than that of the foam structure 10, in order to effectively improve the thermal conductivity of the foam structure heat-conducting module 100, while avoiding the cracking of the heat-curing colloid surface of the heat-conducting structure 20 and the heat-curing colloid can be completely formed, Figure 3 As shown, the thinner the thickness L2 of the heat-conducting structure 20 is, the better. Preferably, the thickness L2 of the heat-conducting structure 20 is between 1 and 2 mm. The ratio of the thickness L1 of the heat dissipation portion 16 of the foam structure 10 to the thickness L2 of the heat-conducting structure 20 is between 2:1 and 10:1.
[0042] The thickness ratio of the heat dissipation portion 16 of the foam structure 10 to the thermally conductive structure 20 can be adjusted according to different application scenarios, heat source temperature conditions or environmental cleanliness. For example, when the joint of the foam structure 10 and the thermally conductive structure 20 requires higher mechanical strength, the ratio of the thickness L1 of the heat dissipation portion 16 of the foam structure 10 to the thickness L2 of the thermally conductive structure 20 can be designed to be 7:3, and the structural strength of the joint of the foam structure 10 and the thermally conductive structure 20 is enhanced by increasing the ratio of the thermally conductive structure 20; and when, for example, a solid-state hard drive in a computer host has space limitations, the ratio of the thermally conductive structure 20 can be reduced, and the ratio of the thickness L1 of the heat dissipation portion 16 of the foam structure 10 to the thickness L2 of the thermally conductive structure 20 can be designed to be 9:1, so as to reduce the overall thickness of the foam structure thermal conductive module 100.
[0043] Please cooperate Figure 3 One side of the heat-conducting medium 30 is in contact with the heat source H, and the other side is in contact with the plane 242 of the heat-conducting structure 20. Therefore, the heat of the heat source H is transferred to the heat-conducting structure 20 via the heat-conducting medium 30. In this embodiment, the heat-conducting medium 30 is a heat dissipation patch. The heat dissipation patch has a certain degree of elasticity and can buffer and absorb expansion or contraction caused by temperature changes, thereby reducing the mechanical stress between the heat source H and the heat-conducting structure 20. In other embodiments, the heat-conducting medium 30 can also be a paste medium. The paste medium is applied between the heat-conducting structure 20 and the heat source H. The paste medium is in close contact with the heat-conducting structure 20 and the heat source H respectively through the fluidity and viscosity of its own material, thereby effectively improving the heat conduction efficiency.
[0044] It should be noted that the area of the foam structure heat conductive module 100 can be adjusted according to the area of the heat source H. For example, if the area of the heat source H is 10×10 mm (length×width), the area of the foam structure heat conductive module 100 can be adjusted to 12×12 mm (length×width) without interfering with other hardware to facilitate assembly fault tolerance and ensure that the heat source H is completely covered by the foam structure heat conductive module 100.
[0045] like Figure 5 As shown, the foam structure heat conductive module 200 of the second preferred embodiment of the present invention has a structure substantially the same as the foam structure heat conductive module 100 of the first preferred embodiment. The foam structure heat conductive module 200 also includes the foam structure 10 and the heat conductive structure 20. The difference is that the foam structure heat conductive module 200 does not provide the heat conductive medium 30. The first side 22 of the heat conductive structure 20 is connected to the joint 14 of the foam structure 10. The plane 242 of the second side 24 of the heat conductive structure 20 is directly abutted against the heat source H, so that the heat energy of the heat source H is directly conducted to the heat conductive structure 20. In this way, the heat energy of the heat source H can also be transferred to the joint 14 of the foam structure 10 via the heat conductive structure 20, and then conducted to the heat dissipation portion 16 for heat dissipation.
[0046] In summary, the present invention combines the heat-conducting structure 20 with the foam structure 10, and the heat energy generated by the heat source H is transferred to the foam structure 10 through the heat-conducting structure 20 for heat dissipation. Compared with the convex structure or fin structure of the existing heat-conducting device, the foam structure 10 of the foam structure heat-conducting module 100 of the present invention has a larger area in contact with the air or cooling liquid per unit volume. Therefore, through the conduction of the heat-conducting structure 20 and the foam structure 10, under the limitation of a limited space, the foam structure The heat conducting module 100 can more efficiently conduct the heat from the heat source H to the surrounding environment. In addition, the design of the second side 24 of the heat conducting structure 20 having the flat surface 242 can solve the problem of poor heat conduction caused by the uneven surface of the connecting portion 14 of the foam structure 10, which is not conducive to contact with the heat source or the heat conducting medium 30. Through the design of the flat surface 242, the flat surface 242 of the heat conducting structure 20 can be closely attached to the heat source H, so that the heat conducting structure 20 and the heat source H have good contact.
[0047] The above description is only the preferred feasible embodiment of the present invention. Any equivalent changes made by applying the description and claims of the present invention should be included in the patent scope of the present invention.
Claims
1. A foam structure heat conduction module, characterized in that: Include a foam structure having a plurality of pores, and the foam structure having a bonding portion and a heat dissipation portion; as well as a heat-conducting structure formed by curing a heat-curing colloid, the heat-conducting structure having a first side and a second side opposite to each other, the first side being connected to the connecting portion, and the second side heat-conducting structure being configured to receive heat from a heat source; The heat-conducting structure is used to transfer the heat energy of the heat source to the connecting portion of the foam structure, and then conduct it to the heat dissipation portion for heat dissipation.
2. The foam structure heat conduction module according to claim 1, characterized in that: The second side of the heat conducting structure has a plane.
3. The foam structure heat conduction module according to claim 1, characterized in that: The porosity of the foam structure is between 60% and 95%.
4. The foam structure heat conduction module according to claim 1, characterized in that: The pore diameter of each pore is between 0.1 mm and 10 mm.
5. The foam structure heat conduction module according to claim 1, characterized in that: The thermal conductivity of the heat-conducting structure is greater than or equal to 70 W / mK.
6. The foam structure heat conduction module according to claim 1, characterized in that: The ratio of the thickness of the heat dissipation portion of the foam structure to the thickness of the heat conducting structure is between 2:1 and 10:
1.
7. The foam structure heat conduction module according to claim 1, characterized in that: The pore density of the foam structure is between 5 ppi and 130 ppi.
8. The foam structure heat conduction module according to claim 1, characterized in that: The thickness of the heat-conducting structure is between 1 mm and 2 mm.
9. The foam structure heat conduction module according to claim 1, characterized in that: A heat-conducting medium is disposed on the second side of the heat-conducting structure.