Adapter heat dissipation structure

Abstract

An adapter heat dissipation structure relates to the technical field of new energy automobile charging and comprises an adapter shell, a copper bar and a cooling mechanism. The copper bar and the cooling mechanism are arranged in the adapter shell; the cooling mechanism comprises a heat conduction base, a heat dissipation pipe and a fan. The heat conduction base is in heat conduction connection with the copper bar; at least part of the heat dissipation pipe penetrates through the heat conduction base; the fan is used for dissipating heat of the part, located outside the heat conduction base, of the heat dissipation pipe. The cooling mechanism is arranged on the copper bar, the heat conduction base of the cooling mechanism can absorb heat of the copper bar, a part of the heat dissipation pipe is located outside the heat conduction base, the fan blows the heat dissipation pipe, air is blown to quickly take away the heat of the heat dissipation pipe, the heat dissipation pipe is cooled, and therefore the purpose of cooling the copper bar is achieved. The air holes can enable the fan to quickly blow hot air in the adapter shell out of the adapter shell, so that the temperature in the adapter shell is quickly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of new energy vehicle charging, in particular to an adapter heat dissipation structure. Background Art

[0002] To ensure a normal energy supply for new energy vehicles, a corresponding charging station is required. Currently, there are multiple standards for electric vehicle charging interfaces: Electric vehicles with different standard interfaces can be compatible with charging stations through adapters, thereby improving the charging convenience of electric vehicles. However, when using current adapters, the internal copper busbars often generate excessive heat due to high current, causing the temperature to rise continuously, increasing resistance and reducing charging efficiency, which is more likely to cause fires and endanger personal and property. Therefore, a new solution is urgently needed in the existing technology to solve the above problems. Utility Model Content

[0003] The problem to be solved by the utility model is how to reduce the temperature of the adapter during operation.

[0004] An adapter heat dissipation structure includes an adapter housing, a copper busbar, and a cooling mechanism;

[0005] The copper busbar and the cooling mechanism are arranged in the adapter housing;

[0006] The cooling mechanism includes a heat-conducting base, a heat dissipation pipe and a fan;

[0007] The heat-conducting base is thermally connected to the copper busbar;

[0008] The heat dissipation pipe at least partially passes through the heat conductive base;

[0009] The fan is used to dissipate heat from the portion of the heat dissipation pipe located outside the heat-conducting base.

[0010] The heat dissipation pipe is a heat pipe.

[0011] A heat sink is provided on the portion of the heat pipe outside the heat-conducting base, and the fan air outlet faces the heat sink.

[0012] The heat-conducting base is fixed on the copper busbar by bolts.

[0013] Thermally conductive silica gel is arranged between the thermally conductive base and the copper busbar.

[0014] The heat-conducting base is provided with a through channel, the heat dissipation pipe is partially located in the channel, and both ends of the heat dissipation pipe are located outside the channel.

[0015] At least two fans are provided between the two ends of the heat dissipation pipe, and the two fans discharge air toward the two ends of the heat dissipation pipe respectively.

[0016] There are multiple channels that are evenly distributed in the heat-conducting base, and at least one heat dissipation pipe passes through each channel.

[0017] Two ends of the copper bus are connected to a first terminal and a second terminal respectively.

[0018] The adapter housing is provided with an air vent, and the air outlet of the fan faces the air vent.

[0019] The present invention has the following beneficial effects: a cooling mechanism is provided on the copper busbar. The heat-conducting base of the cooling mechanism absorbs the heat of the copper busbar. A portion of the heat pipe is located outside the heat-conducting base. A fan blows air toward the heat pipe, rapidly removing the heat from the heat pipe, thereby cooling the copper busbar. The air vents enable the fan to quickly blow hot air out of the adapter housing, thereby rapidly reducing the temperature inside the adapter housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be described in further detail below with reference to the accompanying drawings and specific implementation methods.

[0021] Figure 1 This is a schematic diagram of the copper busbar of an adapter heat dissipation structure of the present invention.

[0022] Figure 2 This is an assembly diagram of an adapter heat dissipation structure of the utility model.

[0023] The reference numerals in the figures indicate:

[0024] 1- adapter housing, 11- air vent, 2- copper busbar, 3- cooling structure, 31- heat-conducting base, 32- heat pipe, 33- fan, 4- first terminal, 5- second terminal. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] An adapter heat dissipation structure, such as Figure 1-Figure 2 As shown, it includes an adapter housing 1, a copper busbar 2 and a cooling mechanism 3;

[0027] The copper busbar 2 and the cooling mechanism 3 are arranged in the adapter housing 1;

[0028] The cooling mechanism 3 includes a heat-conducting base 31, a heat dissipation pipe 32 and a fan 33;

[0029] The heat-conducting base 31 is thermally connected to the copper bus 2;

[0030] The heat dissipation pipe 32 at least partially passes through the heat-conducting base 31;

[0031] The fan 33 is used to dissipate heat from the portion of the heat pipe 32 located outside the heat-conducting base 31 .

[0032] When the adapter is in use, a large current often flows through it, causing the copper busbar 2 inside the adapter housing 1 to heat up very high, posing a safety hazard during prolonged use. The present application provides a cooling mechanism 3 on the copper busbar 2. A heat-conducting base 31 of the cooling mechanism 3 is disposed on the copper busbar 2 to absorb the heat from the copper busbar 2. A heat pipe 32 is disposed within the heat-conducting base 31, with a portion of the heat pipe 32 located outside the heat-conducting base 31. A fan 33 blows toward the heat pipe 32, blowing air to quickly remove the heat from the heat pipe 32, thereby cooling it and thereby achieving the purpose of cooling the copper busbar 22.

[0033] In some embodiments, the heat dissipation pipe 32 is a heat pipe that utilizes evaporative cooling to create a large temperature difference between the portion inside the heat-conducting base 31 and the portion outside the heat-conducting base 31 , thereby rapidly conducting heat.

[0034] A heat sink 34 is provided on the portion of the heat pipe 32 outside the heat-conducting base 31, and the air outlet of the fan 33 faces the heat sink 34. The heat sink 34 can increase the heat dissipation area, thereby making the heat pipe 32 dissipate heat more efficiently.

[0035] In some embodiments, the heat-conducting base 31 is fixed to the copper bus 2 by bolts. Bolt connection is convenient and efficient, and the installation of the heat-conducting base 31 can be completed quickly.

[0036] In some embodiments, thermally conductive silicone is provided between the thermally conductive base 31 and the copper bus 2. The thermally conductive silicone can fully connect the copper bus 2 and the thermally conductive base 31, making heat exchange more sufficient and the cooling effect better.

[0037] In some embodiments, the heat-conducting base 31 is provided with a through channel, with the heat pipe 32 partially located within the channel and both ends of the heat pipe located outside the channel. The heat-conducting base is provided with a through channel, through which the heat pipe 32 passes, and thermally conductive silicone is provided between the heat pipe 32 and the channel wall to ensure sufficient heat exchange between the two.

[0038] In some embodiments, at least two fans 33 are provided between the two ends of the heat pipe 32, and the two fans blow air toward the two ends of the heat pipe 32. Each fan 33 dissipates heat from the heat pipe 32 on one side, which increases heat dissipation efficiency and improves cooling effect.

[0039] In some embodiments, the channels are multiple and evenly distributed within the heat-conducting base 31, and each channel passes through at least one heat pipe 32. The multiple heat pipes 32 work together to quickly cool the heat-conducting base 31, thereby rapidly cooling the copper busbar 2.

[0040] In some embodiments, the ends of the copper busbar 2 are connected to a first terminal 4 and a second terminal 5, respectively. The first terminal 4 and the first terminal 5 are respectively a male terminal and a female terminal, or both male and female terminals, or flat terminals or other terminal forms. The first terminal 4 and the second terminal 5 can be connected to other terminals or wiring harnesses to achieve electrical transmission.

[0041] In some embodiments, the adapter housing 1 is provided with a vent hole 11, such as Figure 2 As shown, the air outlet of the fan 33 faces the air vent 11. The air vent 11 enables the fan 33 to quickly blow the hot air in the adapter housing 1 out of the adapter housing 1, thereby quickly reducing the temperature in the adapter housing 1.

[0042] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. An adapter heat dissipation structure, characterized in that: Including adapter housing, copper busbar and cooling mechanism; The copper busbar and the cooling mechanism are arranged in the adapter housing; The cooling mechanism includes a heat-conducting base, a heat dissipation pipe and a fan; The heat-conducting base is thermally connected to the copper busbar; The heat dissipation pipe at least partially passes through the heat conductive base; The fan is used to dissipate heat from the portion of the heat dissipation pipe located outside the heat-conducting base.

2. The adapter heat dissipation structure according to claim 1, characterized in that: The heat dissipation pipe is a heat pipe.

3. The adapter heat dissipation structure according to claim 1, characterized in that: A heat sink is provided on the portion of the heat pipe outside the heat-conducting base, and the fan air outlet faces the heat sink.

4. The adapter heat dissipation structure according to claim 1, characterized in that: The heat-conducting base is fixed on the copper busbar by bolts.

5. The adapter heat dissipation structure according to claim 4, characterized in that: Thermally conductive silica gel is arranged between the thermally conductive base and the copper busbar.

6. The adapter heat dissipation structure according to claim 1, characterized in that: The heat-conducting base is provided with a through channel, the heat dissipation pipe is partially located in the channel, and both ends of the heat dissipation pipe are located outside the channel.

7. The adapter heat dissipation structure according to claim 6, characterized in that: At least two fans are provided between the two ends of the heat dissipation pipe, and the two fans discharge air toward the two ends of the heat dissipation pipe respectively.

8. The adapter heat dissipation structure according to claim 6, characterized in that: There are multiple channels that are evenly distributed in the heat-conducting base, and at least one heat dissipation pipe passes through each channel.

9. The adapter heat dissipation structure according to claim 1, characterized in that: Two ends of the copper bus are connected to a first terminal and a second terminal respectively.

10. The adapter heat dissipation structure according to claim 1, characterized in that: The adapter housing is provided with an air vent, and the air outlet of the fan faces the air vent.

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