Liquid cooling device and water cooling assembly

Abstract

The utility model discloses a liquid cooling device and a water cooling assembly. The liquid cooling device comprises the water cooling assembly and a pump. The water cooling assembly comprises a base, a flow guide cover plate and a plurality of fins. The base has a heat exchange chamber. The flow guide cover plate covers the heat exchange cavity and is provided with an upper surface, a lower surface, a first liquid inlet, a first liquid outlet and a flow guide flow channel. The upper surface is opposite to the lower surface. The lower surface faces the heat exchange chamber. The first liquid inlet and the first liquid outlet penetrate through the upper surface and the lower surface and are communicated with the heat exchange cavity. The diversion runner is located on the upper surface. And the flow guide flow channel is communicated with the first liquid outlet. The fins are located in the heat exchange chamber. The fins are connected to the base and the flow guide cover plate. The pump is arranged on the flow guide cover plate. The pump is provided with a second liquid inlet and a second liquid outlet. And the second liquid inlet is communicated with the flow guide runner. And the second liquid outlet is communicated with the first liquid inlet.

Description

Technical Field

[0001] The utility model relates to a liquid cooling device and a water cooling component, in particular to a liquid cooling device and a water cooling component provided with a guide flow channel. Background Art

[0002] With the rapid advancement of technology, the computing performance of various electronic components has increased significantly, generating significant amounts of heat. To protect electronic components from damage due to high heat, heat sinks must be installed on them to dissipate excess heat. For example, liquid cooling systems are generally divided into all-in-one (AIO) liquid cooling systems and modular liquid cooling systems that include multiple components for self-assembly.

[0003] In typical liquid-cooling devices, the position of the cooling plate's inlet and outlet can be arbitrarily set. However, in all-in-one liquid-cooling devices, the presence of a pump limits the placement of the cooling plate's inlet and outlet, requiring them to align with the pump's inlet and outlet. Furthermore, as the heat generated by electronic components has significantly increased with increasing computing power, increasing the coolant's pressure is necessary to speed up the cooling cycle and prevent coolant evaporation. Typically, manufacturers install a silicone guide cap on the top of the cooling plate to direct the coolant flow between the pump and the cooling plate. However, the silicone guide caps in current all-in-one liquid-cooling devices cannot withstand the increased coolant pressure and are easily deformed or damaged, rendering the cooling cycle ineffective. Therefore, finding a balance between directing the coolant flow and improving the structural strength of the liquid cooling device to avoid compromising cooling efficiency is a challenge that researchers must address. Utility Model Content

[0004] The utility model provides a liquid cooling device and a water cooling assembly, which can guide the flow of cooling liquid and improve the structural strength of the liquid cooling device to avoid affecting the cooling efficiency.

[0005] The liquid cooling device disclosed in one embodiment of the present invention includes a water cooling component and a pump. The water cooling component includes a base, a guide cover, and a plurality of fins. The base has a heat exchange chamber. The guide cover covers the heat exchange chamber and has an upper surface, a lower surface, at least one first liquid inlet, at least one first liquid outlet, and a guide channel. The upper surface and the lower surface are opposite to each other. The lower surface faces the heat exchange chamber. The at least one first liquid inlet and the at least one first liquid outlet pass through the upper surface and the lower surface and are connected to the heat exchange chamber. The guide channel is located on the upper surface and does not pass through the lower surface. One end of the guide channel is connected to the at least one first liquid outlet. The fins are located in the heat exchange chamber. The opposite ends of the fins are respectively connected to the base and the guide cover so that the fins support the guide cover. The pump is arranged on the guide cover and is located on the upper surface. The pump has a second liquid inlet and a second liquid outlet. The second liquid inlet is connected to the other end of the diversion channel. The second liquid outlet is connected to at least one first liquid inlet.

[0006] Another embodiment of the present invention discloses a water cooling assembly for a pump, and includes a base, a guide cover, and a plurality of fins. The base has a heat exchange chamber. The guide cover covers the heat exchange chamber and has an upper surface, a lower surface, at least one first liquid inlet, at least one first liquid outlet, and a guide channel. The upper surface and the lower surface are opposite to each other. The lower surface faces the heat exchange chamber. The at least one first liquid inlet and the at least one first liquid outlet pass through the upper surface and the lower surface and are connected to the heat exchange chamber. The guide channel is located on the upper surface and does not pass through the lower surface. One end of the guide channel is connected to the at least one first liquid outlet. The other end of the guide channel is used to connect to the liquid inlet of the pump. The fins are located in the heat exchange chamber. The opposite ends of the fins are respectively connected to the base and the guide cover so that the fins support the guide cover.

[0007] According to the above-described embodiments, the liquid cooling device and water cooling assembly, with the guide cover plate having the flow channel disposed on the base, not only allows the cooling fluid to flow between the pump and the heat exchange chamber through the guide channel, but also enables the liquid cooling device to withstand the increased water pressure of the coolant without causing deformation or damage to the liquid cooling device. This achieves both guiding the flow of the coolant and improving the structural strength of the liquid cooling device, thereby preventing a reduction in cooling efficiency.

[0008] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a three-dimensional schematic diagram of a liquid cooling device according to an embodiment of the present utility model.

[0010] Figure 2 for Figure 1 Exploded diagram of the liquid cooling system.

[0011] Figure 3 for Figure 1 A plan view of the pump corresponding to the base and the guide cover in the liquid cooling device.

[0012] Figure 4 For the Figure 3 A schematic cross-sectional view of the liquid cooling device along the 4-4 cut line, omitting the pump.

[0013] Figure 5 For the Figure 3 Schematic cross-sectional view of the liquid cooling device along the 5-5 cutting line.

[0014] Figure 6 for Figure 1 A plan view of the heat-conducting base plate and fins of a liquid cooling device.

[0015] Figure 7 For the Figure 3 Schematic cross-sectional view of the liquid cooling device along the 7-7 cut line.

[0016] Figure 8 for Figure 1 A plan view of the pump corresponding to the base and the guide cover in the liquid cooling device.

[0017] Figure 9 For the Figure 8 Schematic cross-sectional view of the liquid cooling device along the 9-9 cutting line.

[0018] Wherein, the reference numerals:

[0019] 10: Liquid cooling device

[0020] 20: Water cooling components

[0021] 21: Base

[0022] 211: Thermal base plate

[0023] 212: Ring side panel

[0024] 2121: First connection part

[0025] 22: guide cover

[0026] 221: Second connecting part

[0027] 222: Upper surface

[0028] 223: Lower surface

[0029] 224: First liquid inlet

[0030] 225: first liquid outlet

[0031] 226: diversion channel

[0032] 2261:Branch channel

[0033] 2262: Converging flow channel

[0034] 23: Fins

[0035] 30: Pump

[0036] 31: Second liquid inlet

[0037] 32: Second liquid outlet

[0038] S: Heat exchange chamber

[0039] A~G: Direction DETAILED DESCRIPTION

[0040] See also Figures 1 to 4 . Figure 1 It is a three-dimensional schematic diagram of a liquid cooling device according to an embodiment of the present utility model. Figure 2 for Figure 1 Exploded diagram of the liquid cooling system. Figure 3 for Figure 1 A plan view of the pump corresponding to the base and the guide cover in the liquid cooling device. Figure 4 For the Figure 3 A schematic cross-sectional view of the liquid cooling device along the 4-4 cut line, omitting the pump.

[0041] The liquid cooling device 10 of this embodiment is, for example, an all-in-one (AIO) liquid cooling device. An AIO liquid cooling device is a complete liquid cooling device that integrates components such as a radiator, a fan, a pump, and a water-cooling head. The liquid cooling device 10 is used to accommodate a cooling fluid (not shown) and is thermally coupled to a heat source (not shown). The cooling fluid is, for example, water or a refrigerant. The liquid cooling device 10 includes a water cooling assembly 20 and a pump 30. The water cooling assembly 20 includes a base 21, a guide cover 22, and a plurality of fins 23.

[0042] The base 21 has a heat exchange chamber S. Specifically, the base 21 includes a heat-conducting bottom plate 211 and an annular side plate 212. The heat-conducting bottom plate 211 is thermally coupled to a heat source. The annular side plate 212 surrounds the heat-conducting bottom plate 211 and, together with the heat-conducting bottom plate 211, encloses the heat exchange chamber S. A first connecting portion 2121 is formed on the side of the annular side plate 212 facing away from the heat-conducting bottom plate 211. The first connecting portion 2121 is, for example, a connecting protrusion.

[0043] The guide cover 22 covers the heat exchange chamber S and has a second connection portion 221. The second connection portion 221 is, for example, a connection recess. The first connection portion 2121 and the second connection portion 221 are matched in concave and convex manner, and the first connection portion 2121 and the second connection portion 221 are connected, for example, by brazing. The guide cover 22 has an upper surface 222, a lower surface 223, a first liquid inlet 224, two first liquid outlets 225 and a guide channel 226. The upper surface 222 and the lower surface 223 are opposite to each other, and the lower surface 223 faces the heat exchange chamber S. The first liquid inlet 224 and the two first liquid outlets 225 pass through the upper surface 222 and the lower surface 223 and are connected to the heat exchange chamber S. The first liquid inlet 224 is located between the two first liquid outlets 225. The extending direction of the first liquid inlet 224 and the extending direction of the two first liquid outlets 225 are, for example, parallel to the extending direction of the long side of the guide cover plate 22 .

[0044] The flow channel 226 is located on the upper surface 222 and does not extend through the lower surface 223. It comprises two branch channels 2261 and a converging channel 2262. One end of each of the two branch channels 2261 is connected to the two first liquid outlets 225. The other ends of the two branch channels 2261 converge at one end of the converging channel 2262. In other words, after flowing out of the two first liquid outlets 225, the cooling fluid flows through the two branch channels 2261 and converges at the converging channel 2262.

[0045] These fins 23 are located in the heat exchange chamber S. One end of these fins 23 is connected to the heat-conducting base plate 211. In this way, the heat generated by the heat source can be transferred to these fins 23 through the heat-conducting base plate 211, so that the cooling fluid can absorb the heat generated by the heat source by flowing through these fins 23. The other end of these fins 23 is connected to the guide cover plate 22 so that these fins 23 support the guide cover plate 22. In this way, the structural strength of the liquid cooling device 10 can be improved. Among them, these fins 23 and the guide cover plate 22 are connected, for example, by brazing. In addition, the extension direction of the first liquid inlet 224 and the extension direction of the two first liquid outlets 225 are, for example, perpendicular to the extension direction of each fin 23.

[0046] In this embodiment, after one end of the fins 23 is brazed to the heat-conducting base plate 211, the fins 23 are turned upside down and the other ends of the fins 23 are brazed to the guide cover 22. This prevents the brazing solder from falling into the gaps between the fins 23 during the brazing process and causing blockage in the flow of the cooling fluid.

[0047] The pump 30 is used to drive the cooling fluid. The pump 30 is disposed on the flow guide cover 22 and is located on the upper surface 222. That is, the flow guide cover 22 is located between the heat-conducting base plate 211 and the pump 30. The pump 30 has a second liquid inlet 31 and a second liquid outlet 32. The first liquid inlet 224 and the second liquid outlet 32 ​​are connected, allowing the cooling fluid to flow from the pump 30 through the first liquid inlet 224 and the second liquid outlet 32 ​​into the heat exchange chamber S. The other end of the converging channel 2262 is connected to the second liquid inlet 31, allowing the cooling fluid to flow from the heat exchange chamber S into the pump 30 through the two first liquid outlets 225, the two branch channels 2261, the converging channel 2262, and the second liquid inlet 31.

[0048] In this embodiment, since the guide cover 22, which includes the guide channel 226, is brazed to the base 21, not only does the guide channel 226 allow the cooling fluid to flow between the pump 30 and the heat exchange chamber S, it also allows the liquid cooling device 10 to withstand the increased water pressure of the coolant without causing deformation or damage to the liquid cooling device 10. This achieves both guiding the flow of the coolant and enhancing the structural strength of the liquid cooling device 10, thereby preventing a reduction in cooling efficiency.

[0049] Furthermore, by connecting the two opposite ends of the fins 23 to the heat-conducting base plate 211 and the guide cover plate 22 , the fins 23 can support the guide cover plate 22 , thereby further improving the structural strength of the liquid cooling device 10 .

[0050] In this embodiment, the number of the first liquid inlet 224 is only one, and the number of the first liquid outlet 225 and the number of the branch flow channels 2261 are each two, but this is not limited to this. In other embodiments, the number of the first liquid inlet may also be multiple, and the number of the first liquid outlet may also be only one or more than three. If the number of the first liquid outlet is only one, the diversion flow channel may not include a branch flow channel. If the number of the first liquid outlet is three or more, the number of the branch flow channels may also be three or more and be the same as the number of the first liquid outlets.

[0051] In this embodiment, the first connecting portion 2121 is a convex connecting portion, the second connecting portion 221 is a concave connecting portion, and the first connecting portion 2121 and the second connecting portion 221 have matching convex and concave portions, but this is not limiting. In other embodiments, the first connecting portion and the second connecting portion may be reversed. In other words, the first connecting portion is a concave connecting portion and the second connecting portion is a convex connecting portion.

[0052] In this embodiment, the deflector cover plate 22 has a second connection portion 221, and the deflector cover plate 22 is connected to the annular side plate 212 via the first connection portion 2121 and the second connection portion 221, but the present invention is not limited thereto. In other embodiments, the deflector cover plate may not have a second connection portion, but may be directly connected to the annular side plate via the first connection portion.

[0053] See also Figures 5 to 9 . Figure 5 For the Figure 3 Schematic cross-sectional view of the liquid cooling device along the 5-5 cutting line. Figure 6 for Figure 1 A plan view of the heat-conducting base plate and fins of a liquid cooling device. Figure 7 For the Figure 3 Schematic cross-sectional view of the liquid cooling device along the 7-7 cut line. Figure 8 for Figure 1 A plan view of the pump corresponding to the base and the guide cover in the liquid cooling device. Figure 9 For the Figure 8 Schematic cross-sectional view of the liquid cooling device along the 9-9 cutting line.

[0054] In this embodiment, when the cooling fluid flows into the pump 30, Figure 5 and Figure 6 As shown, the pump 30 drives the cooling fluid to flow out of the second liquid outlet 32 ​​in direction A and into the heat exchange chamber S through the first liquid inlet 224 of the guide cover 22. The cooling fluid then flows in direction B within the heat exchange chamber S. In other words, the cooling fluid flows between the fins 23 within the heat exchange chamber S to absorb heat transferred from the heat source to the fins 23.

[0055] Then, if Figure 7 and Figure 8 As shown, the cooling fluid flows out of the heat exchange chamber S along direction C and flows into the two branch channels 2261 through the two first liquid outlets 225 of the guide cover 22. Then, the cooling fluid in the two branch channels 2261 flows into the converging channel 2262 along directions D and E respectively, and flows in the converging channel 2262 along direction F. Figure 9 As shown, the cooling fluid flows out of the converging channel 2262 in the direction G and enters the pump 30 through the second liquid inlet 31 of the pump 30. The pump 30 then drives the cooling fluid out of the pump 30. In this way, the heat generated by the heat source can be removed by the cooling fluid, allowing the next cooling cycle to begin.

[0056] According to the above-described embodiments, the liquid cooling device and water cooling assembly, with the guide cover plate having the flow channel brazed to the base, not only allows the cooling fluid to flow between the pump and the heat exchange chamber through the guide channel, but also enables the liquid cooling device to withstand the increased water pressure of the coolant without causing deformation or damage to the liquid cooling device. This achieves both guiding the flow of the coolant and improving the structural strength of the liquid cooling device, thereby preventing a reduction in cooling efficiency.

[0057] Furthermore, by connecting the opposite ends of the fins to the heat-conducting base plate and the guide cover plate, the fins can support the guide cover plate, thereby further improving the structural strength of the liquid cooling device.

[0058] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the claims attached to this application.

Claims

1. A liquid cooling device, characterized in that: Include: A water cooling assembly, comprising: a base having a heat exchange chamber; a guide cover plate covering the heat exchange chamber and having an upper surface, a lower surface, at least one first liquid inlet, at least one first liquid outlet, and a guide channel, wherein the upper surface is opposite to the lower surface, and the lower surface faces the heat exchange chamber, the at least one first liquid inlet and the at least one first liquid outlet penetrate the upper surface and the lower surface and communicate with the heat exchange chamber, the guide channel is located on the upper surface and does not penetrate the lower surface, and one end of the guide channel is communicated with the at least one first liquid outlet; as well as A plurality of fins are located in the heat exchange chamber, and opposite ends of the fins are respectively connected to the base and the guide cover plate, so that the fins support the guide cover plate; as well as A pump is provided on the guide cover and located on the upper surface. The pump has a second liquid inlet and a second liquid outlet. The second liquid inlet is connected to the other end of the guide channel, and the second liquid outlet is connected to the at least one first liquid inlet.

2. The liquid cooling device according to claim 1, wherein: The number of the at least one first liquid inlet is single, and the number of the at least one first liquid outlet is two. The first liquid inlet is located between the two first liquid outlets and is connected to the second liquid outlet of the pump. The diversion channel has two branch channels and a converging channel. One end of the two branch channels is respectively connected to the two first liquid outlets, and the other ends of the two branch channels converge at one end of the converging channel. The other end of the converging channel is connected to the second liquid inlet of the pump.

3. The liquid cooling device according to claim 2, wherein: The extending direction of the first liquid inlet and the extending direction of the two first liquid outlets are parallel to the extending direction of the long side of the guide cover plate, and perpendicular to the extending direction of each of the fins.

4. The liquid cooling device according to claim 1, wherein: The base includes a heat-conducting bottom plate and an annular side plate. The annular side plate surrounds the heat-conducting bottom plate and together with the heat-conducting bottom plate surrounds the heat exchange chamber. The guide cover is located between the heat-conducting bottom plate and the pump, and the opposite ends of the fins are respectively connected to the heat-conducting bottom plate and the guide cover.

5. The liquid cooling device according to claim 4, wherein: The side of the annular side plate away from the heat-conducting bottom plate has a first connecting portion, and the guide cover plate is connected to the first connecting portion.

6. The liquid cooling device according to claim 5, wherein: The guide cover plate has a second connection portion. The first connection portion and the second connection portion are matched in concave and convex manner, and the first connection portion and the second connection portion are connected.

7. The liquid cooling device according to claim 6, wherein: The first connection portion and the second connection portion are connected by brazing.

8. The liquid cooling device according to claim 1, wherein: The fins are connected to the guide cover plate by brazing.

9. A water cooling component, characterized in that: For a pump arrangement, the water cooling assembly comprises: a base having a heat exchange chamber; a guide cover plate covering the heat exchange chamber and having an upper surface, a lower surface, at least one first liquid inlet, at least one first liquid outlet, and a guide channel, wherein the upper surface is opposite to the lower surface, and the lower surface faces the heat exchange chamber, the at least one first liquid inlet and the at least one first liquid outlet penetrate the upper surface and the lower surface and communicate with the heat exchange chamber, the guide channel is located on the upper surface and does not penetrate the lower surface, one end of the guide channel is communicated with the at least one first liquid outlet, and the other end of the guide channel is used to communicate with the liquid inlet of the pump; as well as A plurality of fins are located in the heat exchange chamber. Two opposite ends of the fins are respectively connected to the base and the guide cover plate so that the fins support the guide cover plate.

10. The water cooling assembly according to claim 9, wherein: The number of the at least one first liquid inlet is single, and the number of the at least one first liquid outlet is two. The first liquid inlet is located between the two first liquid outlets and is used to be connected to the liquid outlet of the pump. The diversion channel has two branch channels and a converging channel. One end of the two branch channels is respectively connected to the two first liquid outlets, and the other ends of the two branch channels converge at one end of the converging channel. The other end of the converging channel is used to be connected to the liquid inlet of the pump.

11. The water cooling assembly according to claim 10, wherein: The extending direction of the first liquid inlet and the extending direction of the two first liquid outlets are parallel to the extending direction of the long side of the guide cover plate, and perpendicular to the extending direction of each of the fins.

12. The water cooling assembly according to claim 9, wherein: The base includes a heat-conducting bottom plate and an annular side plate. The annular side plate surrounds the heat-conducting bottom plate and together with the heat-conducting bottom plate surrounds the heat exchange chamber. The guide cover is located between the heat-conducting bottom plate and the pump, and the opposite ends of the fins are respectively connected to the heat-conducting bottom plate and the guide cover.

13. The water cooling assembly according to claim 12, wherein: The side of the annular side plate away from the heat-conducting bottom plate has a first connecting portion, and the guide cover plate is connected to the first connecting portion.

14. The water cooling assembly according to claim 13, wherein: The guide cover plate has a second connection portion. The first connection portion and the second connection portion are matched in concave and convex manner, and the first connection portion and the second connection portion are connected.

15. The water cooling assembly according to claim 14, wherein: The first connection portion and the second connection portion are connected by brazing.

16. The water cooling assembly according to claim 9, wherein: The fins are connected to the guide cover plate by brazing.

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