LED chip packaging anti-shake swing arm motion control assembly and die bonder

By designing a lifting control mechanism and swing control drive, the vibration problem at the end of the swing arm of the crystal bonder was solved, high-precision installation and positioning of the chip was achieved, and the LED production efficiency was improved.

CN223328458UActive Publication Date: 2025-09-12GUIZHOU ANXIN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422736960.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-11
Publication Date
2025-09-12
Estimated Expiration
2034-11-11

AI Technical Summary

Technical Problem

The vibration problem at the end of the swing arm of the existing die bonder leads to insufficient chip installation and positioning accuracy, affecting LED production efficiency.

Method used

A motion control assembly for an anti-shake swing arm for LED chip packaging was designed, including a lifting control mechanism and a swing control drive. Through a combination of a gear set and a connecting rod and driven by a servo motor, the assembly achieves stable movement of the lifting platform and the swing arm, suppresses vibration, and improves positioning accuracy.

Benefits of technology

It effectively suppresses the vibration of the end of the swing arm of the die bonder, improves the installation and positioning accuracy of the chip, and improves the production efficiency of LEDs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductors, in particular to an LED chip packaging anti-shake swing arm motion control assembly and a die bonder, the LED chip packaging anti-shake swing arm motion control assembly comprises an assembly base, a lifting control mechanism, a swing control drive and a swing arm mechanism, the lifting control mechanism is provided with a first rotary drive, a lifting base, a lifting table and a first rod group; the lifting base is directly connected with the assembly base, the overall stability of the structure is ensured, the guide rods are arranged on the two sides of the lifting base in the vertical direction correspondingly, the lifting table is in sliding connection with the guide rods, and through the design of the guide rods, the stability of the lifting table moving in the vertical direction can be improved; the first connecting rod, the second connecting rod and the third connecting rod are sequentially connected, and finally the third connecting rod is rotationally connected with the lifting table, so that a structure similar to a crank sliding block is formed, and through the design of the structure, the reciprocating motion stability of the front swing arm in the vertical direction can be improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to an anti-shake swing arm motion control assembly for LED chip packaging and a die bonding machine. Background Art

[0002] LED packaging is the process of connecting the LED chip to external circuitry and protecting it from environmental influences. The primary purpose of packaging is to improve LED reliability, heat dissipation, and optical performance. The packaging process involves multiple steps, including die bonding, wire bonding, sealing, baking, cutting, and packaging.

[0003] LED die bonders, also known as placement machines, are key equipment in the semiconductor packaging process. They are primarily used to securely connect the electrical connection points (solder joints) between the chip (wafer) and the packaging substrate to achieve both electrical connectivity and physical support. Die bonders play a vital role in the semiconductor packaging process, placing components at high speed and precision, and performing key steps such as positioning, alignment, flip-chip mounting, and continuous placement. As the production pace of die bonders accelerates, vibration issues at the end of the die bonder's swing arm are becoming increasingly severe, significantly impacting the arm's positioning accuracy. Therefore, effectively suppressing vibration at the end of the die bonder's swing arm and improving the accuracy of chip installation and positioning have become important research and development areas. Utility Model Content

[0004] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, it proposes an anti-shake swing arm motion control assembly for LED chip packaging and a die bonder. The assembly aims to effectively suppress vibration at the end of the die bonder's swing arm, improve the accuracy of chip installation and positioning, and enhance LED production efficiency.

[0005] In a first aspect, an LED chip package anti-shake swing arm motion control assembly according to an embodiment of the present invention includes:

[0006] Assembly base;

[0007] The lifting control mechanism is provided with a first rotary drive, a lifting base, a lifting platform and a first rod group. The lifting base is fixedly connected to the assembly base. Guide rods are respectively provided on both sides of the lifting base in the vertical direction. The lifting platform is slidably connected to the guide rods. The first rod group includes a first connecting rod, a second connecting rod and a third connecting rod. One end of the first connecting rod is rotatably connected to the lifting base, and the other end of the first connecting rod is connected to the second connecting rod and the third connecting rod in sequence. One end of the third connecting rod is rotatably connected to the lifting platform. The first rotary drive is transmission-connected to the first connecting rod.

[0008] A swing control drive, wherein the swing control drive is provided with a second rotary drive and a control shaft, the second rotary drive is fixedly connected to the assembly base, and the second rotary drive is drivingly connected to the control shaft;

[0009] The swing arm mechanism includes a swing arm base and a front swing arm, the swing arm base is fixedly connected to the front swing arm, the swing arm base is rotatably connected to the lifting platform, and the swing arm base is slidably connected to the control shaft along its own rotation axis.

[0010] According to some embodiments of the present invention, the lifting control mechanism includes a gear set, the gear set includes a first gear and a second gear, the first gear is fixedly connected to the first connecting rod, the second gear is fixedly connected to the third connecting rod, and the first gear and the second gear are meshed.

[0011] According to some embodiments of the present invention, both the first gear and the second gear are spur gears.

[0012] According to some embodiments of the present invention, both the first gear and the second gear are helical gears.

[0013] According to some embodiments of the present invention, the lifting control mechanism includes a second rod group, the second rod group includes a fourth connecting rod, a fifth connecting rod and a sixth connecting rod, and the second rod group is symmetrically arranged on the other side of the gear group.

[0014] According to some embodiments of the present invention, the output ends of the first rotary drive and the second rotary drive are respectively provided with couplings, and the couplings are interference couplings.

[0015] According to some embodiments of the present invention, limiting surfaces are respectively provided on both sides of the lower end of the control shaft, linear bearings are respectively provided on the limiting surfaces, and the swing arm base is provided with linear guide rails corresponding to the linear bearings.

[0016] According to some embodiments of the present invention, the swing arm base is rotatably connected to the lifting platform via an angular contact ball bearing.

[0017] According to some embodiments of the present invention, the first rotary drive and the second rotary drive are both servo motors.

[0018] In a second aspect, the present invention provides a die bonding machine, characterized in that it comprises the LED chip package anti-shake swing arm motion control assembly described in any one of the above items.

[0019] According to an embodiment of the present invention, an LED chip package anti-shake swing arm motion control assembly and a die bonder have at least the following beneficial effects:

[0020] According to the solution of the present invention, the LED chip package anti-shake swing arm motion control assembly includes an assembly base, a lifting control mechanism, a swing control drive and a swing arm mechanism, wherein the lifting control mechanism is provided with a first rotary drive, a lifting base, a lifting platform and a first rod group; the lifting base is directly connected to the assembly base to ensure the overall stability of the structure, and guide rods are respectively provided on both sides of the lifting base in the vertical direction, and the lifting platform and the guide rods are slidingly connected. Through the design of the guide rods, the stability of the lifting platform when moving in the vertical direction can be increased. In this embodiment, the first rod group is adopted, which is connected in sequence by the first connecting rod, the second connecting rod, and the third connecting rod, and finally the third connecting rod and the lifting platform are rotatably connected to form a structure similar to a crank slider. Through the design of this structure, the stability of the front swing arm in reciprocating motion in the vertical direction can be improved.

[0021] According to the solution of the present invention, the main task of the swing control mechanism is to generate and transmit rotational power to drive the control shaft to complete the predetermined swing motion. The control shaft can effectively and accurately transmit the received power to the swing arm.

[0022] According to the solution of the utility model, the swing arm mechanism includes a swing arm base and a front swing arm. The swing arm base and the front swing arm are fixedly connected, the swing arm base is rotatably connected to the lifting platform, and the swing arm base is slidably connected to the control axis along its own rotation axis. The lifting platform can be effectively controlled to reciprocate along the axis by the lifting control mechanism, and the swing control mechanism can also be used to control the swing arm mechanism to swing. Through the design of this structure, the vibration of the front swing arm end of the die bonder can be effectively suppressed, the accuracy of chip installation and positioning can be improved, and the production efficiency of LEDs can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A structural diagram of the utility model;

[0024] Figure 2 A schematic structural diagram of the utility model from a side perspective;

[0025] Figure 3 This is a structural diagram of the lifting control mechanism of the utility model;

[0026] Figure 4 It is an enlarged schematic diagram of a local structure of the utility model.

[0027] In the picture:

[0028] 100-assembly base;

[0029] 200 - lift control mechanism, 210 - first rotary drive, 220 - lift base, 221 - guide rod, 230 - lift platform, 240 - first rod group, 241 - first connecting rod, 242 - second connecting rod, 243 - third connecting rod, 250 - gear group, 251 - first gear, 252 - second gear, 260 - second rod group, 261 - fourth connecting rod, 262 - fifth connecting rod, 263 - sixth connecting rod;

[0030] 300-swing control drive, 310-second rotary drive, 320-control shaft, 321-limiting surface, 322-linear bearing, 330-coupling;

[0031] 400-swing arm mechanism, 410-swing arm base, 411-linear guide rail, 420-front swing arm. DETAILED DESCRIPTION

[0032] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientation or positional relationship indicated by up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of this utility model, "a plurality" means more than two. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] Reference Figures 1 to 4As shown, the utility model discloses an anti-shake swing arm motion control assembly and a die bonding machine for LED chip packaging, comprising an assembly base 100, a lifting control mechanism 200, a swing control drive 300 and a swing arm mechanism 400. The lifting control mechanism 200 is provided with a first rotary drive 210, a lifting base 220, a lifting platform 230 and a first rod group 240. The lifting base 220 is fixedly connected to the assembly base 100. Guide rods 221 are respectively provided on both sides of the lifting base 220 in the vertical direction. The lifting platform 230 and the guide rods 221 are slidably connected. The first rod group 240 includes a first connecting rod 241, a second connecting rod 242 and a third connecting rod 243. One end of the first connecting rod 241 is rotatably connected to the lifting base 220, and the other end of the first connecting rod 241 is rotatably connected to the second connecting rod 242 and the third connecting rod 243 in sequence. One end of the third connecting rod 243 is rotationally connected to the lifting platform 230; the first rotary drive 210 and the first connecting rod 241 are transmission-connected; the swing control drive 300 is provided with a second rotary drive 310 and a control shaft 320, the second rotary drive 310 is fixedly connected to the assembly base 100, and the second rotary drive 310 is transmission-connected to the control shaft 320; the swing arm mechanism 400 includes a swing arm base 410 and a front swing arm 420, the swing arm base 410 and the front swing arm 420 are fixedly connected, the swing arm base 410 is rotationally connected to the lifting platform 230, and the swing arm base 410 is slidingly connected to the control shaft 320 along its own rotation axis.

[0037] Specifically, in this embodiment, the assembly base 100 provides a solid and stable support platform to ensure the accurate docking and synchronous operation of all components. The lifting control mechanism 200 is equipped with a first rotary drive 210, a lifting base 220, a lifting platform 230 and a first rod group 240. Through a precise mechanical linkage design, it achieves smooth vertical movement and enhances the stability and accuracy of operation. The swing control drive 300 is centered on the second rotary drive 310. Through close connection with the control shaft 320, it provides precise rotational driving force, promoting the swing arm mechanism 400 to swing on demand, thereby adjusting the position of the suction nozzle at the end of the front swing arm 420 in multiple dimensions. The swing arm mechanism 400 includes a swing arm base 410 and a front swing arm 420, which are firmly connected to jointly realize the flexible movement of the suction nozzle at the end of the front swing arm 420. The swing arm base 410 is rotationally connected to the lifting platform 230 and forms a sliding contact with the control shaft 320 to ensure smooth and stable swinging. During operation, through the collaboration between the first rotary drive 210 and the first rod assembly 240, the lifting platform 230 moves smoothly in the vertical direction under the guidance of the guide rod 221, reducing the instability caused by mechanical friction. Specifically, the first rod assembly 240 includes a first connecting rod 241, a second connecting rod 242, and a third connecting rod 243. The first connecting rod 241 and the second connecting rod 242 are rotatably connected, the second connecting rod 242 and the third connecting rod 243 are rotatably connected, the third connecting rod 243 and the lifting platform 230 are rotatably connected, and the lifting platform 230 and the guide rod 221 slide. In this embodiment, without other connecting rods or gear structures, the second connecting rod 242 and the third connecting rod 243 can be fixed to form a crank slider structure driven by the first rotary drive 210. When the angles of the first connecting rod 241 and the third connecting rod 243 are relatively fixed, the second connecting rod 242 and the third connecting rod 243 can rotate to form a crank slider-like structure.

[0038] In this embodiment, the main task of the swing control mechanism is to generate and transmit rotational power to push the control shaft 320 to complete the predetermined swinging motion. The control shaft 320 can effectively and accurately transmit the received power to the swing arm. The swing arm mechanism 400 includes a swing arm base 410 and a front swing arm 420. The swing arm base 410 and the front swing arm 420 are fixedly connected. The swing arm base 410 and the lifting platform 230 are rotatably connected. The swing arm base 410 is slidably connected to the control shaft 320 along its own rotation axis. The lifting platform 230 can be effectively controlled to reciprocate along the axial direction through the lifting control mechanism 200. At the same time, the swing control mechanism can control the swing of the swing arm mechanism 400. Through the design of this structure, the vibration of the end of the front swing arm 420 of the crystal bonding machine can be effectively suppressed, the accuracy of chip installation and positioning can be improved, and the production efficiency of LEDs can be improved.

[0039] In some embodiments of the present invention, the lift control mechanism 200 includes a gear set 250, which includes a first gear 251 and a second gear 252. The first gear 251 is fixedly connected to the first connecting rod 241, and the second gear 252 is fixedly connected to the third connecting rod 243, and the first gear 251 and the second gear 252 are meshed. In this embodiment, by introducing the gear set 250, the rotation angle of the first connecting rod 241 and the third connecting rod 243 can be controlled. The design of this gear set 250 not only enhances the effect of power transmission, but also plays a role in torque amplification and speed conversion, allowing the lift control mechanism 200 to respond quickly and accurately when performing complex operations. The precise meshing relationship between the gears is also an indispensable part of ensuring the long-term stable operation of the entire system, especially in high-frequency and high-intensity usage environments, which improves the durability and reliability of the lift control mechanism 200.

[0040] In some embodiments of the present invention, both the first gear 251 and the second gear 252 are spur gears. Spur gears, with their teeth distributed radially and their tooth surfaces parallel to the axis, create a relatively small but evenly distributed contact area when the first and second gears 251 and 252 engage, facilitating load distribution and reducing wear. Due to their tooth profile, spur gears ensure a stable transmission ratio. Specifically, the speed ratio between the first and second gears 251 and 252 is determined solely by their number of teeth and is unaffected by external forces, thereby improving the control accuracy of the lift control mechanism 200.

[0041] In some embodiments of the present invention, both the first gear 251 and the second gear 252 are helical gears. In this embodiment, the helical gears utilize progressive tooth contact, meaning that tooth contact begins at a single point and gradually expands across the entire tooth width. This design significantly reduces transient shocks, resulting in a smoother transmission and lower noise levels. Because the contact area increases over time, helical gears can withstand greater loads. Furthermore, the pressure distribution on their contact surfaces is more even, extending the gear's service life.

[0042] In some embodiments of the present invention, the lift control mechanism 200 includes a second lever group 260, which includes a fourth link 261, a fifth link 262, and a sixth link 263. The second lever group 260 is symmetrically arranged on the other side of the gear group 250. Specifically, in this embodiment, the lift control mechanism 200 includes a first lever group 240, a second lever group 260, and a gear group 250. The first lever group 240 includes a first link 241, a second link 242, and a third link 243; the second lever group 260 includes a fourth link 261, a fifth link 262, and a sixth link 263; and the gear group 250 includes a first gear 251 and a second gear 252. The first connecting rod 241 and the fourth connecting rod 261 are symmetrically arranged on either side of the first gear 251. One end of the first connecting rod 241 and the fourth connecting rod 261 are respectively rotatably connected to the lifting base 220, and the other ends are respectively rotatably connected to the second connecting rod 242 and the fifth connecting rod 262, while being fixedly connected to the gear shaft of the first gear 251. The third connecting rod 243 and the sixth connecting rod 263 are symmetrically arranged on either side of the second gear 252. One end of the third connecting rod 243 and the sixth connecting rod 263 are respectively rotatably connected to the lifting platform 230, and the other ends are respectively rotatably connected to the second connecting rod 242 and the fifth connecting rod 262, while being fixedly connected to the gear shaft of the second gear 252. This structural design not only improves the stability of the system, but also forms a crank slider structure, thereby improving the control accuracy of the lifting platform 230 in the vertical direction along the guide rod 221.

[0043] In some embodiments of the present invention, the output ends of the first rotary drive 210 and the second rotary drive 310 are each provided with a coupling 330, which is a tamper-evident coupling 330. In this embodiment, the tamper-evident coupling 330 is a connecting component that can transmit torque to a certain extent while allowing for slight misalignment between the two shafts. It is typically used to compensate for misalignment, angular displacement, or axial expansion and contraction of the shafts, ensuring effective and uninterrupted power transmission. This structural design ensures smooth system operation and improves overall efficiency.

[0044] In some embodiments of the present invention, limiting surfaces 321 are provided on both sides of the lower end of the control shaft 320, and linear bearings 322 are provided on the limiting surfaces 321. The swing arm base 410 is provided with linear guides 411 corresponding to the linear bearings 322. The provision of the limiting surfaces 321 can improve the accuracy of the rotation control.

[0045] In some embodiments of the present invention, the swing arm base 410 is rotatably connected to the lifting platform 230 via an angular contact ball bearing. In this embodiment, the angular contact ball bearing design, with its inner and outer raceways at an inclined angle, significantly enhances load-bearing capacity and rigidity. It can withstand large axial and radial loads, making it suitable for combined loads. This structural design further improves the accuracy of system operation.

[0046] In some embodiments of the present invention, both the first rotary drive 210 and the second rotary drive 310 are servo motors. In this embodiment, servo motors are used as the first rotary drive 210 and the second rotary drive 310. The servo motors have built-in encoder feedback systems that can monitor position and speed information in real time, ensuring extremely high position control accuracy.

[0047] In a second aspect, a die bonder is provided, comprising any of the aforementioned anti-shake swing arm motion control assemblies for LED chip packaging. In the die bonder, the anti-shake swing arm motion control assembly primarily uses a nozzle disposed on the front swing arm 420 to pick up the chip and then place it on the substrate. It is understood that the beneficial effects of the second aspect can be found in the relevant description of the first aspect and will not be repeated here.

[0048] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An LED chip package anti-shake swing arm motion control assembly, characterized in that: include: Assembly base (100); A lifting control mechanism (200) is provided with a first rotary drive (210), a lifting base (220), a lifting platform (230) and a first rod group (240); the lifting base (220) and the assembly base (100) are fixedly connected; guide rods (221) are respectively provided on both sides of the lifting base (220) in a vertical direction; the lifting platform (230) and the guide rods (221) are slidably connected; the first rod group (240) The lifting platform (230) comprises a first connecting rod (241), a second connecting rod (242) and a third connecting rod (243); one end of the first connecting rod (241) is rotatably connected to the lifting base (220); the other end of the first connecting rod (241) is sequentially connected to the second connecting rod (242) and the third connecting rod (243); one end of the third connecting rod (243) is rotatably connected to the lifting platform (230); the first rotary drive (210) is transmission-connected to the first connecting rod (241); A swing control drive (300), wherein the swing control drive (300) is provided with a second rotary drive (310) and a control shaft (320), wherein the second rotary drive (310) is fixedly connected to the assembly base (100), and the second rotary drive (310) is transmission-connected to the control shaft (320); A swing arm mechanism (400) includes a swing arm base (410) and a front swing arm (420), wherein the swing arm base (410) and the front swing arm (420) are fixedly connected, the swing arm base (410) and the lifting platform (230) are rotationally connected, and the swing arm base (410) is slidingly connected to the control shaft (320) along its own rotation axis.

2. The LED chip package anti-shake swing arm motion control assembly according to claim 1, characterized in that: The lifting control mechanism (200) includes a gear set (250), the gear set (250) includes a first gear (251) and a second gear (252), the first gear (251) and the first connecting rod (241) are fixedly connected, the second gear (252) and the third connecting rod (243) are fixedly connected, and the first gear (251) and the second gear (252) are meshed.

3. The LED chip package anti-shake swing arm motion control assembly according to claim 2, characterized in that: The first gear (251) and the second gear (252) are both spur gears.

4. The LED chip package anti-shake swing arm motion control assembly according to claim 2, characterized in that: The first gear (251) and the second gear (252) are both helical gears.

5. The LED chip package anti-shake swing arm motion control assembly according to claim 3 or 4, characterized in that: The lifting control mechanism (200) includes a second rod group (260), the second rod group (260) includes a fourth connecting rod (261), a fifth connecting rod (262) and a sixth connecting rod (263), and the second rod group (260) is symmetrically arranged on the other side of the gear group (250).

6. The LED chip package anti-shake swing arm motion control assembly according to claim 5, characterized in that: The output ends of the first rotary drive (210) and the second rotary drive (310) are respectively provided with couplings (330), and the couplings (330) are interference couplings (330).

7. The LED chip package anti-shake swing arm motion control assembly according to claim 1, characterized in that: Limiting surfaces (321) are respectively provided on both sides of the lower end of the control shaft (320), and linear bearings (322) are respectively provided on the limiting surfaces (321), and the swing arm base (410) is provided with linear guide rails (411) corresponding to the linear bearings (322).

8. The LED chip package anti-shake swing arm motion control assembly according to claim 7, characterized in that: The swing arm base (410) is rotatably connected to the lifting platform (230) via an angular contact ball bearing.

9. The LED chip package anti-shake swing arm motion control assembly according to claim 1, characterized in that: The first rotary drive (210) and the second rotary drive (310) are both servo motors.

10. A die bonding machine, characterized in that: It comprises the LED chip package anti-shake swing arm motion control assembly as described in any one of claims 1 to 9.