Wafer bearing device and epitaxial growth equipment

Through the combination of rotation and lifting mechanisms, the problem of uneven temperature and gas distribution in the reaction chamber is solved, the uniformity of the epitaxial thin film of the wafer is achieved, and the crystal quality is improved.

CN223329426UActive Publication Date: 2025-09-12ZHEJIANG QIUSHI SEMICON EQUIP CO LTD +1
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Patent Information

Application Number
CN202421780559.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-25
Publication Date
2025-09-12
Estimated Expiration
2034-07-25

AI Technical Summary

Technical Problem

In the prior art, the uneven distribution of temperature and gas in the reaction chamber affects the quality of the epitaxial thin film on the wafer, resulting in a decrease in crystal quality.

Method used

The wafer carrier device adopts a rotating mechanism and a lifting mechanism. Through the combination of the rotating inner shaft and the screw module, the synchronous rotation and lifting of the wafer are realized, and the air flow height is adjusted to achieve gas and temperature uniformity.

Benefits of technology

The uniformity of gas and temperature at the wafer reaction surface is improved, and the quality of epitaxial growth processing is enhanced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of wafer growth, and discloses a wafer bearing device and epitaxial growth equipment, the wafer bearing device comprises a rotating mechanism, a bearing assembly and a lifting mechanism, the rotating mechanism comprises a rotating inner shaft, and the rotating inner shaft has a rotating freedom degree of rotating around the axis of the rotating inner shaft; the bearing assembly is connected with the rotating inner shaft and can synchronously move along with the rotating inner shaft; the lifting mechanism comprises a lead screw module and a lifting base, the lead screw module comprises at least one moving part, the moving part has the moving freedom degree in the vertical direction, the lifting base is connected with the moving part and used for installing the rotating mechanism, and the lifting base can drive the rotating mechanism to synchronously ascend and descend along with the moving part. The technical problem of uniformity of gas and temperature at the reaction surface of the wafer is solved, and the technical effect of improving the uniformity of gas and temperature at the reaction surface of the wafer so as to improve the epitaxial growth processing quality is achieved.
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Description

Technical Field

[0001] The present application relates to the field of wafer growth technology, and in particular to a wafer carrier and epitaxial growth equipment. Background Art

[0002] In the field of semiconductor materials, vapor phase epitaxy technology is often used in the preparation of compound semiconductor thin film materials and devices. The principle of this technology is to grow a high-quality thin film on the corresponding chip through chemical or physical means in a reaction chamber with certain conditions.

[0003] The uniformity of the gas and temperature in the reaction chamber will affect the crystal quality of the epitaxial thin film. In the prior art, a tray and a carrying device for carrying the tray are provided in the reaction chamber, and the wafer is placed on the tray. Due to differences in design and structure, the temperature of each point on the heating device in the reaction chamber is not completely consistent, so that the temperature of each point in the chamber is not uniformly distributed. At the same time, the distance between the surface of the tray and the gas source nozzle above is also different, and the uniformity of the airflow sprayed onto the reaction surface will also have a significant difference. The superposition of the non-uniformity of the gas and temperature in the reaction chamber will affect the quality of the epitaxial thin film crystal of the wafer.

[0004] Therefore, the technical problem of the prior art is how to improve the uniformity of gas and temperature at the wafer reaction surface. Summary of the Invention

[0005] The present application provides a chip carrier device and epitaxial growth equipment, which solves the technical problem of how to improve the uniformity of gas and temperature at the chip reaction surface, thereby achieving the technical effect of improving the uniformity of gas and temperature at the chip reaction surface to improve the quality of epitaxial growth processing.

[0006] The present application provides a wafer carrier device, which adopts the following technical solution:

[0007] It includes: a rotating mechanism, a bearing assembly and a lifting mechanism, the rotating mechanism includes a rotating inner shaft; the bearing assembly is connected to the rotating inner shaft and can move synchronously with the rotating inner shaft; the lifting mechanism includes: a screw module and a lifting base, the screw module includes at least one moving part, the moving part has a vertical degree of freedom of movement, the lifting base is connected to the moving part and is used to install the rotating mechanism, and the lifting base can drive the rotating mechanism to rise and fall synchronously with the moving part.

[0008] Preferably, the screw module includes multiple linear screws, which are evenly arranged on the outside of the rotating mechanism; the lifting mechanism also includes a first transmission belt, which is respectively connected to the multiple screw modules, and the first transmission belt can drive the moving parts on the multiple linear screws to move synchronously.

[0009] Preferably, the lifting mechanism further includes a first driving member, which is installed on the lifting base and drives the first transmission belt to rotate.

[0010] Preferably, the lifting mechanism further includes a tensioning wheel, which is mounted on the lifting base and is used to tension the first transmission belt.

[0011] Preferably, the rotating mechanism comprises a sealed outer shaft, a second driving member and a second transmission belt, the sealed outer shaft is sleeved on the rotating inner shaft, the sealed outer shaft is connected to the lifting base, and the sealed outer shaft is provided with at least one transmission opening; the second driving member is installed on the lifting base; the second transmission belt can pass through the transmission opening and be connected to the rotating inner shaft, and the second transmission belt can drive the rotating inner shaft to rotate under the drive of the second driving member.

[0012] Preferably, the bearing assembly includes: a bearing seat and a tray, the bearing seat is arranged at the top of the rotating inner shaft; the tray is arranged at the top of the bearing seat, the bottom of the tray is provided with a step surface, and the tray is cooperatively connected with the bearing seat.

[0013] The present application also provides an epitaxial growth device, including a frame, a reaction chamber and the aforementioned wafer carrying device, the frame including a mounting base, the reaction chamber being mounted on the upper surface of the mounting base, the reaction chamber having a movable channel, the lifting mechanism being mounted on the lower surface of the mounting base; the rotating mechanism sealing the end of the movable channel, the carrying assembly being at least partially located within the movable channel.

[0014] Preferably, the epitaxial growth equipment also includes: a connecting component, which is arranged between the end of the rotating inner shaft and the supporting seat, and the connecting component includes a first pad and a retaining ring, the first pad is connected to the supporting seat, the first pad is used to support the supporting seat, and there are multiple first pads, and the multiple first pads are arranged in a ring-shaped manner; the retaining ring is arranged on the outside of the annularly arranged first pad, and the inner wall of the retaining ring is spaced apart from the first pad; the epitaxial growth equipment also includes an air-sealing channel, and the air-sealing channel includes: an air inlet channel and an air outlet channel, the air inlet channel axially passes through the rotating inner shaft, the air outlet channel is located in the connecting component, and the air inlet channel is connected to the air outlet channel.

[0015] Preferably, the connecting assembly also includes a second pad and an adjusting bolt, the second pad is annular, the second pad is arranged at the bottom of the first pad, and the second pad is used to support the first pad and the bearing seat; the adjusting bolt is threadedly connected to the second pad, and the adjusting bolt is used to adjust the horizontality of the bearing seat; wherein, there are multiple adjusting bolts, and multiple adjusting bolts are arranged corresponding to the first pad.

[0016] Preferably, the epitaxial growth device further comprises a bellows having a first end and a second end, wherein the first end of the bellows is connected to the lower surface of the mounting base, and the second end of the bellows is connected to the end of the sealing outer shaft.

[0017] In summary, the beneficial technical effects of this application are:

[0018] 1. A wafer carrier device is provided, comprising a rotating mechanism and a lifting mechanism, wherein the rotating mechanism comprises a rotating inner shaft with rotational freedom, which can drive the carrier and wafer assembly to rotate synchronously, and the lifting mechanism is connected to the rotating mechanism, which can drive the rotating mechanism and the wafer to rise and fall synchronously; because the lifting mechanism can adjust the height of the wafer according to the airflow above when depositing wafers of different sizes according to processing needs, the wafer carrier device in the present application can achieve the technical effect of adjusting the uniformity of the airflow above the wafer and the uniformity of the wafer surface temperature by lifting and lowering when depositing wafers of different sizes.

[0019] 2. Provide a chip carrier device, in which the lifting mechanism uses multiple screw modules evenly arranged outside the rotating mechanism to drive the lifting and lowering of the rotating mechanism. The multiple screw modules are driven by a driving component, which can save costs and improve the stability of lifting. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of a wafer carrier device in one embodiment of the present application;

[0021] Figure 2 is a front view of a wafer carrier device according to an embodiment of the present application;

[0022] Figure 3 This is a left side view of a wafer carrier device according to one embodiment of the present application;

[0023] Figure 4 yes Figure 3 Cross-sectional view along AA direction;

[0024] Figure 5 This is a schematic structural diagram of a wafer carrier device from another perspective in one embodiment of the present application;

[0025] Figure 6is a schematic structural diagram of an epitaxial growth device in one embodiment of the present application;

[0026] Figure 7 is a front view of an epitaxial growth apparatus according to one embodiment of the present application;

[0027] Figure 8 yes Figure 7 Cross-sectional view along direction BB;

[0028] Figure 9 yes Figure 8 A partial enlarged view of point C in the middle;

[0029] Figure 10 It is a schematic diagram of a partial structure of an epitaxial growth device in one embodiment of the present application.

[0030] Explanation of the accompanying drawings: 100, rotating mechanism; 110, rotating inner shaft; 120, sealed outer shaft; 121, transmission opening; 130, second driving member; 140, second transmission belt; 200, bearing assembly; 210, bearing seat; 220, tray; 221, step surface; 300, chip; 400, lifting mechanism; 410, screw module; 411, moving member; 412, linear screw; 420, lifting base; 430, first transmission belt; 440, first driving member; 500, frame; 510, mounting base; 600, reaction chamber; 610, moving channel; 700, connecting assembly; 710, first pad; 720, retaining ring; 730, second pad; 740, adjusting bolt; 750, fixing bolt; 800, airtight channel; 810, air inlet channel; 820, air outlet channel; 900, bellows DETAILED DESCRIPTION

[0031] The serial numbers of the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application include direct and indirect connections (couplings) unless otherwise specified. In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are orientations or positional relationships based on the drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0032] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] The embodiment of the present application provides a polishing liquid storage and output device, which solves the technical problem that the existing polishing liquid storage and output device cannot control the specific flow direction of the polishing liquid, thereby achieving the technical effect of improving the polishing quality of the finished product and enhancing the working efficiency of the polishing equipment.

[0034] In order to better understand the above technical solution, the following will be described in detail with reference to the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0035] In the field of semiconductor materials, vapor phase epitaxy (VPE) is often used to prepare compound semiconductor thin film materials and devices. The principle of this technique is to grow a high-quality thin film on a corresponding wafer 300 through chemical or physical means within a reaction chamber 600 that meets certain conditions. The uniformity of the gas and temperature within the reaction chamber 600 can affect the crystal quality of the epitaxial thin film. In the prior art, the reaction chamber 600 is equipped with a tray 220 and a support device for the tray 220, and the wafer 300 is placed on the tray 220. Due to design and structural differences, the temperature at each point on the heating device within the reaction chamber 600 is not completely consistent, resulting in an uneven temperature distribution at various points within the chamber. Furthermore, the distance between the surface of the tray 220 and the gas source nozzle above varies, resulting in significant variations in the uniformity of the gas flow sprayed onto the reaction surface. The combined effects of these gas and temperature non-uniformities within the reaction chamber 600 can affect the crystal quality of the epitaxial thin film grown on the wafer 300.

[0036] To solve the above problems, the present application provides a wafer carrier and epitaxial growth equipment. The equipment achieves the technical effect of improving the quality of epitaxial growth processing by improving the uniformity of gas and temperature at the reaction surface of the wafer 300. The specific structure is as follows:

[0037] Please refer to Figure 1The present application provides a wafer carrier device, which adopts the following technical solution: it includes: a rotating mechanism 100, a carrying assembly 200 and a lifting mechanism 400, the rotating mechanism 100 includes a rotating inner shaft 110; the carrying assembly 200 is connected to the rotating inner shaft 110 and can move synchronously with the rotating inner shaft 110; the lifting mechanism 400 includes: a screw module 410 and a lifting base 420, the screw module 410 includes at least one moving part 411, the moving part 411 has a vertical degree of freedom of movement, the lifting base 420 is connected to the moving part 411, the rotating mechanism 100 is installed on the lifting base 420, and the rotating mechanism 100 can be lifted and lowered synchronously with the lifting base 420.

[0038] Specifically, the present application includes a rotating mechanism 100, which includes a rotating inner shaft 110 and a connecting portion sleeved outside the rotating inner shaft 110, and the rotating inner shaft 110 has a rotational freedom of rotation around its axis; the supporting assembly 200 is used to support the chip 300, and the supporting assembly 200 is connected to the rotating inner shaft 110 in the rotating mechanism 100, and the connection method is one of the following methods: snap connection, screw connection, bonding, etc.; the supporting assembly 200 can move synchronously with the rotating inner shaft 110 under the drive of the rotating inner shaft 110. In some embodiments, when the rotating inner shaft 110 rotates, it drives the supporting assembly 200 to rotate synchronously. At the same time, the rotating inner shaft 110 has a vertical degree of freedom of movement, and can drive the supporting assembly 200 to move synchronously in the vertical direction; the rotating mechanism 100 is preferably a magnetorheological rotating mechanism that can maintain rotation while sealing, and can also be other sealing forms, such as sealing ring sealing, oil and gas sealing, etc.

[0039] Please refer to Figure 1-4In the present application, the lifting mechanism 400 includes a screw module 410, which is preferably a ball screw module 410, or may be a cylindrical thread screw module 410, a trapezoidal thread screw module 410, or other screw modules 410. The screw module 410 includes at least one moving part 411, and the moving part 411 includes a nut with an internal thread, so that it can move in the vertical direction on the screw; the lifting mechanism 400 also includes a lifting base 420, which is fixedly connected to the moving part 411 and is synchronously lifted and lowered in the vertical direction under the drive of the moving part 411. The lifting base 420 has an installation plane, and the rotating mechanism 100 is fixedly installed on the lifting plane of the lifting base 420 by a flange and bolts. The lifting base 420 can drive the rotating mechanism 100 and the bearing assembly 200 to move in the vertical direction. The present application provides a chip carrying device, including a rotating mechanism 100 and a lifting mechanism 400, wherein the rotating mechanism 100 is connected to the carrying component 200, and can drive the carrying component 200 to move synchronously. The rotating mechanism 100 includes a rotating inner shaft 110 with rotational freedom, which can drive the carrying component 200 to rotate synchronously, and the lifting mechanism 400 can drive the rotating mechanism 100 to rise and fall synchronously, so that the chip 300 can both rotate and rise and fall, thereby improving the uniformity of gas and temperature at the reaction surface of the chip 300.

[0040] The screw module 410 includes a plurality of linear screws 412, which are evenly arranged on the outside of the rotating mechanism 100. In the present application, a plurality of linear screws refers to two or more, and the plurality of screws are arranged in parallel on the outside of the fluid mechanism. In some embodiments, three linear screws 412 are arranged in a triangular row, and the three screws are arranged on the outside of the fluid mechanism. A moving part 411 is provided at the same height on the three linear screws 412, and the three moving parts 411 are respectively connected to the lifting base 420; wherein, the lifting base 420 is provided with a through hole for the linear screw 412 to pass through, and the moving part 411 can be partially interference fit with the through hole, or connected to the lifting base 420 through a flange. By providing three linear screws 412, the lifting and lowering of the lifting base 420 is more stable, avoiding possible deflection.

[0041] Furthermore, the lifting mechanism 400 also includes a first transmission belt 430, which is respectively connected to the multiple linear screws 412. The first transmission belt 430 can drive the moving parts 411 on the multiple linear screws 412 to move synchronously. In some embodiments, the multiple linear screws 412 are connected by the first transmission belt 430, so that the multiple screws can rotate synchronously. In order to improve the efficiency of the synchronous belt transmission, a tensioning wheel is also provided to tension the synchronous belt; the screw rod is provided with a rotating sleeve, which is sleeved on the outside of the screw rod and is threadedly connected to the screw rod. The synchronous belt is sleeved on the outside of the rotating sleeve. Under the action of the tensioning wheel, the synchronous belt can drive the rotating sleeve to rotate by friction. The rotating sleeve is connected to the moving part 411, or the rotating sleeve itself is the moving part 411.

[0042] For further information, please refer to Figure 1 The lifting mechanism 400 further includes a first driving member 440, which is mounted on the lifting base 420 and connected to the first transmission belt 430. In some embodiments, the first driving member 440 is further included and mounted on the lifting base 420. The first driving member 440 is preferably a stepping motor, but may also be other types of motors. The output end of the first driving member 440 abuts against the aforementioned synchronous belt, and the output end of the first driving member 440 can drive the synchronous belt to rotate synchronously when rotating.

[0043] The lifting mechanism 400 also includes a tensioning wheel 450, which is installed on the lifting base 420, and the tensioning wheel 450 is used to tension the first transmission belt 430; in some embodiments, the lifting mechanism 400 also includes a tensioning wheel 450, which is fixed to the lifting base 420 by bolts, and the outer surface of the tensioning wheel 450 is connected to the first transmission belt 430, which can tension the first transmission belt 430, so that the first transmission belt 430 remains in a taut state, which can improve the transmission efficiency.

[0044] The rotating mechanism 100 also includes a sealed outer shaft 120, which is sleeved on the rotating inner shaft 110. The sealed outer shaft 120 has a vertical degree of freedom of movement. The sealed outer shaft 120 is connected to the lifting base 420, and the sealed outer shaft 120 can move in the vertical direction with the lifting base 420. Specifically, in the present application, the rotating mechanism 100 also includes a sealed outer shaft 120, which is sleeved on the outside of the rotating inner shaft 110. The rotating inner shaft 110 and the sealed outer shaft 120 are movably connected. The sealed outer shaft 120 can drive the rotating inner shaft 110 to move synchronously in the vertical direction, and at the same time, the rotating inner shaft 110 can keep rotating independently of the sealed outer shaft 120; the outer peripheral surface of the sealed outer shaft 120 is sleeved with a connecting flange, and the connecting flange is connected to the lifting base 420 by bolts, so that the ginger base can drive the sealed outer shaft 120 to rise and fall synchronously when it rises and falls. In some embodiments, the outer peripheral surface of the rotating inner shaft 110 is provided with a protruding step portion, and the inside of the sealing outer shaft 120 is provided with a portion that can be clamped therewith, so that the sealing outer shaft 120 can drive the rotating inner shaft 110 to rise and fall without affecting the rotation of the rotating inner shaft 110; it is conceivable that the rotating inner shaft 110 and the sealing outer shaft 120 can also be connected by bearings or the like.

[0045] For further information, please refer to Figure 6 The sealed outer shaft 120 is provided with at least one transmission opening 121, and the outer periphery of the rotating inner shaft 110 is provided with a connecting portion corresponding to the transmission opening 121. The transmission opening 121 is used for the second transmission belt 140 to pass through to connect the output end and the connecting portion of the second driving member 130. In some embodiments, the rotating inner shaft 110 is connected to the second transmission belt 140 and rotates under the action of the second transmission belt 140. A transmission opening 121 through which the second transmission belt 140 passes is provided on the sealed outer shaft 120, and the transmission opening 121 is corresponding to the transmission connection part on the rotating inner shaft 110; in these embodiments, a second driving member 130 is also included, and the second driving member 130 can move synchronously with the lifting base 420. The second driving member 130 is preferably installed on the lifting base 420, and the output end of the second driving member 130 is connected to the connecting part bracket of the rotating inner shaft 110 through the first transmission belt 430; by connecting each component to the lifting base 420, the second transmission member, the second transmission belt 140, the rotating inner shaft 110 and the sealed outer shaft 120 remain relatively stationary in the vertical direction.

[0046] Please refer to Figure 3-4The carrier assembly 200 includes: a carrier seat 210 and a tray 220. The carrier seat 210 is arranged on the top of the rotating inner shaft 110; the bottom of the tray 220 is provided with a step surface 221, and the bottom of the tray 220 is matched with the top of the carrier seat 210, wherein the tray 220 and the carrier seat 210 are quartz parts. In some embodiments, the carrier assembly 200 includes the carrier seat 210 and the tray 220, and the tray 220 and the carrier seat 210 are made of quartz material. The tray 220 is used to carry the wafer 300. The size of the tray 220 can be selected according to actual conditions. The carrier seat 210 is arranged between the tray 220 and the inner shaft, and the carrier seat 210 is fixedly connected to the rotating inner shaft 110. The rotating inner shaft 110 can drive the carrier seat 210 to rotate synchronously. By separating the tray 220 from the carrier seat 210, when replacing the tray 220, there is no need to replace the connecting part of the rotating inner shaft 110 together, which saves steps.

[0047] In some embodiments, the tray 220 is connected to the supporting seat 210 by snapping, and the bottom of the tray 220 extends downward to form a connecting structure with a step surface 221. The top of the supporting seat 210 is provided with a step surface 221 that can cooperate with it. The tray 220 can be directly placed and sleeved on the top of the supporting seat 210 without the need for additional connecting components, thereby avoiding possible contamination while improving the connection.

[0048] Please refer to Figure 7 The present application also provides an epitaxial growth device, including a frame 500, a reaction chamber 600 and the aforementioned wafer 300 carrying device, the frame 500 includes a mounting base 510, the reaction chamber 600 is mounted on the upper surface of the mounting base 510, the reaction chamber 600 has a movable channel 610, and the lifting mechanism 400 is mounted on the lower surface of the mounting base 510; the rotating mechanism 100 seals the end of the movable channel 610, and the carrying assembly 200 is at least partially located in the movable channel 610.

[0049] In some embodiments, the epitaxial growth equipment also includes a rack 500, which is used to install the remaining components. The rack 500 is fixed to the ground as a whole. The rack 500 includes a mounting base 510, and the mounting base 510 includes an upper surface and a lower surface arranged opposite to each other; the reaction chamber 600 is installed on the upper surface of the mounting base 510, and the reaction chamber 600 is provided with other components for the growth of the chip 300. A movable channel 610 is provided at the bottom of the reaction chamber 600, and the reaction chamber 600 is also provided with multiple gas outlets at the bottom. The gas outlets are used for gas discharge, and the gas outlets are arranged around the movable channel 610. Preferably, an outlet pipe is also provided corresponding to the outlet, and the outlet pipe passes through the mounting base 510 to guide the discharged gas.

[0050] In some embodiments, a circular through hole is provided on the mounting base 510, through which the rotating inner shaft 110 of the rotating mechanism 100 or the supporting assembly 200 can pass. The reaction chamber 600 is connected to the upper surface of the mounting base 510 by a flange. The sealed outer shaft 120 in the rotating mechanism 100 is connected to the lower surface of the mounting base 510 by a flange. The rotating mechanism 100 includes a sealing portion to seal the end of the movable channel 610; at the same time, the diameter of the supporting seat 210 and the tray 220 in the supporting assembly 200 is smaller than the diameter of the movable channel 610, so that at least part of them can move in the movable channel 610. The supporting assembly 200 is connected to the rotating inner shaft 110 and can synchronously complete lifting and rotation in the movable channel 610 with the movement of the rotating inner shaft 110.

[0051] Please refer to Figure 8-10 The epitaxial growth equipment also includes an airtight channel 800 and a connecting component 700. The connecting component 700 is arranged between the end of the rotating inner shaft 110 and the supporting seat 210. The airtight channel 800 includes: an air inlet channel 810 and an air outlet channel 820. The air inlet channel 810 axially passes through the rotating inner shaft. The air inlet channel 810 is used to seal the entry of gas. The air outlet channel 820 is located on the connecting component 700, and the air inlet channel 810 is connected to the air outlet channel 820.

[0052] Specifically, the epitaxial growth apparatus is provided with gases required for the reaction. By providing an airtight channel 800, the gases can flow out of a designated fluid channel, thereby preventing possible gas backflow in the fluid channel and improving the overall service life of the epitaxial growth apparatus. In some embodiments, the airtight channel 800 includes an inlet channel 810 extending through the rotating inner shaft and an outlet channel 820 located on the connecting assembly 700. The inlet channel 810 and the outlet channel 820 are connected to form a fluid channel for gas exhaust. The inlet channel 810 is connected to an external gas source that can supply nitrogen. Nitrogen enters through the inlet channel 810 and is discharged through the outlet channel 820.

[0053] Furthermore, the connection assembly 700 includes: a first pad 710 and a retaining ring 720. The first pad 710 includes a plurality of first pads 710, and the plurality of first pads 710 are arranged in an annular manner; the retaining ring 720 is sleeved on the outside of the annular first pad 710, and the inner wall of the retaining ring 720 is spaced apart from the first pad 710. Specifically, in some embodiments, the connection assembly 700 includes the first pad 710, which is preferably made of metal. The plurality of first pads 710 are spaced apart, and gaps for gas to pass through are left between adjacent first pads 710. The spaced first pads 710 together form an air outlet channel 820; the retaining ring 720 is arranged on the outside of the first pad 710, and the space between the retaining ring 720 and the first pad 710 is connected to the gap between the first pads 710, together forming an air outlet channel 820, and the air outlet channel 820 is connected to the outside.

[0054] The first pad 710 is arranged between the magnetic fluid flange and the supporting seat 210. The first pad 710 can be used to support the supporting seat 210. In some embodiments, the first pad 710 includes a supporting portion, which is located at one end of the first pad 710 close to the supporting seat 210. At least one horizontal plane is provided on the supporting portion. The supporting portion can abut against the outer side of the supporting seat 210, especially the bottom plane, and support the supporting seat 210 by abutting against two horizontal planes; multiple first pads 710 are arranged in a horizontal ring shape, so that multiple supporting portions can form a placement space adapted for the supporting seat 210, which can be used to place the supporting seat 210 and keep the supporting seat 210 level. At the same time, the horizontality of the supporting seat 210 and the tray 220 located on the supporting seat 210 can be adjusted by adjusting the relative position between the supporting seat 210 and the first pad 710.

[0055] Furthermore, the connecting assembly 700 also includes: a second pad 730 and an adjusting bolt 740, the second pad 730 is annular, the second pad 730 is arranged at the bottom of the first pad 710, and the second pad 730 is used to support the first pad 730; the adjusting bolt 740 passes through the supporting seat 210 and the first pad 710 and is threadedly connected to the second pad 730, and the adjusting bolt 740 is used to adjust the horizontality of the supporting seat 210; wherein, there are multiple adjusting bolts 740, and the multiple adjusting bolts 740 are arranged corresponding to the first pad 710.

[0056] Specifically, in the present application, the second pad 730 is arranged between the first pad 710 and the magnetic fluid flange, and the second pad 730 is annular and is used to support the first pad 710 and the bearing seat 210; the outer surface of the adjusting bolt 740 is provided with a distance adjustment thread, and the second pad 730 is provided with an internal thread that can cooperate with the adjustment thread on the outer surface of the adjusting bolt 740. The adjusting bolt 740 is threadedly connected to the second pad 730. The horizontality of the second pad 730 can be adjusted by adjusting the bolt 740, and the horizontality of the first pad 710 and the bearing seat 210 located on the second pad 730 can be further adjusted. In some embodiments, a portion for connection is provided on the outer edge of the support base 210 near the bottom, which protrudes from the cylindrical body of the support base 210 and includes a light hole provided in the vertical direction; the first pad 710 and the second pad 730 are also provided with light holes corresponding to the aforementioned light holes, and the three are fixedly connected to the magnetic fluid flange by a fixing bolt 750 that can pass through the three; in this embodiment, by rotating the adjusting bolt 740, the support base 210 can be adjusted in the longitudinal direction of the adjusting bolt 740 under the action of the pitch adjusting thread, and further, the adjustment of the first pad 710 and the support base 210 can be driven to complete the adjustment of the pallet in the horizontal direction; in order to better complete the adjustment of the horizontality, a plurality of adjusting bolts 740 can be provided, and the adjusting bolts 740 are provided corresponding to the first pad 710 and arranged in a more stable shape such as a triangle.

[0057] The epitaxial growth apparatus further includes a bellows 900 having a first end and a second end. The first end of the bellows 900 is connected to the lower surface of the mounting base 510, and the second end of the bellows 900 is connected to the end of the sealing outer shaft 120. In some embodiments, the epitaxial growth apparatus further includes a bellows 900, which is sleeved over the rotating inner shaft 110. The first and second ends of the bellows 900 are connected to the lower surface of the mounting base and the end of the sealing outer shaft 120, respectively. The bellows 900 has a telescopic sealing function, maintaining a seal while expanding and contracting.

[0058] In some embodiments, a limit member is also installed on the frame, which is movably connected to the outer shaft of the seal to limit the vertical displacement of the sealing device. The limit member has two states: moving and fixed, and the seal can be fixed after the adjustment of the sealing position is completed.

[0059] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0060] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A wafer carrier device, characterized in that: include: A rotating mechanism (100), the rotating mechanism (100) comprising a rotating inner shaft (110); A bearing assembly (200), the bearing assembly (200) being connected to the rotating inner shaft (110) and used for bearing a wafer (300), the bearing assembly (200) moving synchronously with the rotating inner shaft (110); as well as Lifting mechanism (400); The lifting mechanism (400) comprises: A screw module (410), the screw module (410) comprising at least one moving member (411), the moving member (411) having a vertical degree of freedom of movement; and A lifting base (420) is connected to the moving part (411), and the lifting base (420) is used to install the rotating mechanism (100). The lifting base (420) can drive the rotating mechanism (100) to rise and fall synchronously with the moving part (411).

2. The wafer carrier device according to claim 1, wherein: The screw rod module (410) includes a plurality of linear screw rods (412), and the plurality of linear screw rods (412) are evenly arranged outside the rotating mechanism (100); The lifting mechanism (400) further comprises a first transmission belt (430), wherein the first transmission belt (430) drives the moving parts (411) on the plurality of linear screw rods (412) to move synchronously.

3. The wafer carrier according to claim 2, wherein: The lifting mechanism (400) further includes a first driving member (440), wherein the first driving member (440) is mounted on the lifting base (420), and the first driving member (440) drives the first transmission belt (430) to rotate.

4. The wafer carrier according to claim 3, wherein: The lifting mechanism (400) further includes a tensioning wheel (450), which is mounted on the lifting base (420) and is used to tension the first transmission belt (430).

5. The wafer carrier device according to claim 1, wherein: The rotating mechanism (100) further comprises: A sealed outer shaft (120), the sealed outer shaft (120) being sleeved on the rotating inner shaft (110), the sealed outer shaft (120) being connected to the lifting base (420), and the sealed outer shaft (120) being provided with at least one transmission opening (121); A second driving member (130), the second driving member (130) being mounted on the lifting base (420); and A second transmission belt (140) can pass through the transmission opening (121) and be connected to the rotating inner shaft (110). The second transmission belt (140) can drive the rotating inner shaft (110) to rotate under the drive of the second driving member (130).

6. The wafer carrier according to claim 1, wherein: The bearing assembly (200) comprises: A bearing seat (210), the bearing seat (210) being arranged on the top of the rotating inner shaft (110); A tray (220) is provided on the top of the bearing seat (210), a step surface (221) is provided on the bottom of the tray (220), and the tray (220) is cooperatively connected with the bearing seat (210).

7. An epitaxial growth device, characterized in that: include: A frame (500), the frame including a mounting base (510); A reaction chamber (600), the reaction chamber (600) being mounted on the upper surface of the mounting base (510), the reaction chamber (600) having a moving channel (610); and According to the wafer carrying device as described in any one of claims 1 to 6, the lifting mechanism (400) is installed on the lower surface of the mounting base (510); the rotating mechanism (100) seals the end of the moving channel (610), and the carrying assembly (200) is at least partially located in the moving channel (610).

8. The epitaxial growth apparatus according to claim 7, wherein: The epitaxial growth equipment further comprises: A connecting assembly (700), the connecting assembly (700) being arranged between the end of the rotating inner shaft (110) and the bearing seat (210), the connecting assembly (700) comprising: a first cushion block (710), the first cushion block (710) being connected to the bearing seat (210), the first cushion block (710) being used to bear the bearing seat (210), the first cushion block (710) being provided in plurality, and the plurality of first cushion blocks (710) being arranged in an annular pattern; a retaining ring (720), wherein the retaining ring (720) is sleeved on the outside of the annular first pad (710), and the inner wall of the retaining ring (720) is spaced apart from the first pad (720); An airtight channel (800), the airtight channel (800) comprising: an air intake channel (810), the air intake channel (810) axially penetrating the rotating inner shaft (110); An air outlet channel (820), wherein the air outlet channel (820) is located in the connecting assembly (700), and the air inlet channel (810) is in communication with the air outlet channel (820).

9. The epitaxial growth apparatus according to claim 8, characterized in that: The connection component further includes: a second pad (730), the second pad (730) being annular, the second pad (730) being disposed at the bottom of the first pad (710), and the second pad (730) being used to support the first pad (710); an adjusting bolt (740), the adjusting bolt (740) being threadedly connected to the second cushion block (730), the adjusting bolt (740) being used to adjust the levelness of the first cushion block (710) and the bearing seat (210); There are multiple adjusting bolts (740), and the multiple adjusting bolts (740) are arranged corresponding to the first cushion block (710).

10. The epitaxial growth apparatus according to claim 7, wherein: The epitaxial growth device further includes a bellows (900), which is sleeved on the outside of the rotating inner shaft (110). The bellows (900) has a first end and a second end. The first end of the bellows (900) is connected to the lower surface of the mounting base (510), and the second end of the bellows (510) is connected to the end of the sealed outer shaft (120).