NTC temperature sensor
By setting stress relief grooves in the NTC temperature sensor, using silicon leads and nanomaterial coatings, and combining temperature fuses and compensation circuits, the stability and accuracy problems of traditional NTC sensors in harsh environments are solved, achieving higher reliability and longer service life.
Patent Information
- Application Number
- CN202422498851.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-10-16
AI Technical Summary
Traditional NTC temperature sensors have unstable performance in harsh environments, inaccurate measurements and are easily damaged, and there is also the problem of thermal expansion stress concentration.
An NTC temperature sensor was designed. A stress relief groove was set on the back of the substrate, silicon leads were used to connect the thermistor, and a nanomaterial coating was applied to the outer shell. A temperature fuse and a temperature compensation circuit were equipped to improve stability and accuracy.
It improves the measurement accuracy and reliability of the sensor in harsh environments, reduces the risk of stress concentration and moisture and mildew, and extends its service life.
Smart Images

Figure CN223332480U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of temperature sensors, and in particular relates to an NTC temperature sensor. Background Art
[0002] NTC temperature sensors, or negative temperature coefficient temperature sensors, are sensors that measure temperature by exploiting the property of a material's resistance changing with temperature. The key characteristic of NTC sensors is that their resistance decreases as temperature increases, making them very useful in a variety of temperature sensing and control applications.
[0003] With the development of industrial automation and smart homes, the demand for accurate and reliable temperature measurement is increasing. While traditional NTC temperature sensors can meet basic temperature measurement needs, their performance is often affected in harsh environments such as high humidity, high vibration, or high temperatures, leading to inaccurate measurements or equipment damage. Furthermore, traditional sensors are prone to stress concentration due to uneven thermal expansion when the temperature changes, affecting the sensor's stability and service life. Summary of the Invention
[0004] To solve the above-mentioned problems, the utility model discloses an NTC temperature sensor, which reduces thermal stress, can improve the accuracy and reliability of temperature measurement, while reducing the risk of moisture and mildew, and has a longer service life.
[0005] To achieve the above objectives, the specific technical solutions of this application are as follows:
[0006] An NTC temperature sensor includes a metal probe, a metal probe wire connected to a housing, a thermistor disposed within the housing, a thermistor solder block connected to a substrate, a plurality of stress relief grooves disposed on the back of the substrate; the thermistor connected to a silicon lead, the silicon lead connected to a Teflon wire, the Teflon wire extending outside the housing, and the Teflon wire connected to a connector.
[0007] Based on the above technical features, further, a temperature compensation circuit is provided on the solder block of the thermistor, and the compensation circuit includes at least one temperature compensation resistor or temperature compensation diode to improve the accuracy of temperature measurement.
[0008] Based on the above technical features, preferably, the multiple stress release grooves on the back of the substrate are semicircular or arc-shaped, and the depth of the stress release grooves is less than half the thickness of the substrate to reduce stress concentration when the substrate is subjected to force.
[0009] Based on the above technical features, further, the silicon lead is connected to the thermistor by ultrasonic welding or hot pressure welding to ensure the reliability and durability of the electrical connection.
[0010] Based on the above technical features, preferably, a temperature fuse is provided between the thermistor and the silicon lead.
[0011] Based on the above technical features, preferably, the outer surface of the shell is provided with a nano material coating, which can provide good waterproof and moisture-proof properties, thereby reducing the risk of moisture and mildew.
[0012] Compared with the prior art, the present invention has the following advantages:
[0013] This application provides a stress relief groove on the back of the substrate to effectively reduce stress concentration on the substrate when it is subjected to force, thereby improving the stability and service life of the sensor;
[0014] The thermistor is transitioned through a silicon lead and then connected to a metal lead. The metal lead is well connected to the resistance area, which significantly improves the reliability of the sensor and reduces the stress in the sensitive area.
[0015] The thermal fuse can automatically disconnect the circuit when the temperature exceeds the preset value, which can protect the NTC temperature sensor and its connected equipment from damage caused by overheating, and also protect the overall safety of the connected equipment;
[0016] By setting a nano material coating on the outside of the shell, it provides good waterproof and moisture-proof performance, reducing the risk of moisture and mildew. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the structure of an NTC temperature sensor of the present utility model;
[0018] Figure 2 This is a partial structural diagram of an NTC temperature sensor of the present utility model;
[0019] List of Figure Symbols:
[0020] 1. Metal probe; 2. Wire; 3. Housing; 4. Thermistor; 5. Solder block; 6. Thermal fuse; 7. Baseboard; 701, stress relief groove; 8. Thermal fuse; 9. Silicon lead; 10. Teflon wire; 11. Connector. DETAILED DESCRIPTION
[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.
[0022] It should be noted that the terms "upper," "lower," "left," "right," "front," and "rear" used in the following description refer to directions in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a particular component, respectively. Furthermore, the terms "mounted," "connected," and "connected" should be interpreted broadly, meaning, for example, fixed, removable, or integral; mechanical or electrical; direct or indirect through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model on a case-by-case basis.
[0023] like Figure 1 As shown, an NTC temperature sensor includes a metal probe 1, which is made of corrosion-resistant material, such as stainless steel or aluminum alloy.
[0024] The wire 2 of the metal probe 1 is connected to the housing 3. A thermistor 4 is provided in the housing 3. The thermistor 4 is connected to the substrate 7 through a solder block 5. A plurality of stress release grooves 701 are provided on the back of the substrate 7.
[0025] The thermistor 4 is connected to a silicon lead 9 , and the silicon lead 9 is connected to a Teflon wire 10 . The Teflon wire 10 extends outside the housing 3 , and the Teflon wire is connected to a connector 11 .
[0026] Furthermore, a temperature compensation circuit is provided on the solder block of the thermistor 4 , and the compensation circuit includes at least one temperature compensation resistor or temperature compensation diode to improve the accuracy of temperature measurement.
[0027] Preferably, the multiple stress release grooves 701 on the back side of the substrate 7 are semicircular or arc-shaped, and the depth of the stress release grooves 701 is less than half the thickness of the substrate 7 to reduce stress concentration when the substrate is subjected to force.
[0028] Furthermore, the silicon lead 9 is connected to the thermistor 4 by ultrasonic welding or thermocompression welding to ensure the reliability and durability of the electrical connection.
[0029] Based on the above technical features, preferably, a temperature fuse 8 is provided between the thermistor 4 and the silicon lead 9 .
[0030] Based on the above technical features, preferably, the outer portion of the housing 3 is provided with a nano material coating, which can provide good waterproof and moisture-proof properties, thereby reducing the risk of moisture and mildew.
[0031] Working principle:
[0032] When the NTC temperature sensor is operating, temperature changes cause thermistor 4's resistance to change, which is transmitted to the connected circuitry via silicon leads 9. The temperature compensation circuit automatically adjusts its output based on temperature fluctuations to compensate for errors caused by temperature fluctuations, thereby improving measurement accuracy. When the temperature exceeds a preset value, thermal fuse 6 trips, protecting the circuitry from damage. The nanomaterial coating on housing 3 effectively prevents the intrusion of moisture and dust, protecting internal components from the effects of humid environments.
[0033] In summary, the present application has a simple structure, reduces thermal stress, can improve the accuracy and reliability of temperature measurement, while reducing the risk of moisture and mildew, and has a long service life.
[0034] It should be noted that the drawings only illustrate the technical ideas of the present invention and cannot limit the scope of protection of the present invention. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications all fall within the scope of protection of the claims of the present invention.
Claims
1. An NTC temperature sensor, characterized in that: It includes a metal probe, the metal probe wire is connected to the shell, the shell is provided with a thermistor, the thermistor solder block is connected to the substrate, the back of the substrate is provided with multiple stress relief grooves; the thermistor is connected to the silicon lead, the silicon lead is connected to the Teflon wire, the Teflon wire extends outside the shell, and the Teflon wire is connected to a connector.
2. The NTC temperature sensor according to claim 1, wherein: A temperature compensation circuit is provided on the solder block of the thermistor, and the compensation circuit includes at least one temperature compensation resistor or a temperature compensation diode.
3. The NTC temperature sensor according to claim 1, wherein: The multiple stress release grooves on the back side of the substrate are semicircular or arc-shaped, and the depth of the stress release grooves is less than half of the thickness of the substrate.
4. The NTC temperature sensor according to claim 1, wherein: The silicon lead is connected to the thermistor by ultrasonic welding or thermocompression welding.
5. The NTC temperature sensor according to claim 1, characterized in that: The outer surface of the shell is provided with a nano material coating.