Liquid cooling heat dissipation device for server solid state disk

Abstract

The utility model provides a server solid state disk liquid cooling heat dissipation device, and relates to the technical field of server heat dissipation, the server solid state disk liquid cooling heat dissipation device comprises a first liquid cooling plate, one surface of the first liquid cooling plate is connected with a plurality of second liquid cooling plates, gaps are reserved among the plurality of second liquid cooling plates, and the side surfaces of the second liquid cooling plates are used for being attached to a solid state disk to realize heat conduction. According to the server, the second liquid cooling plate is arranged, and the second liquid cooling plate is attached to the solid state disk during use, so that the heat dissipation contact surface is effectively increased, the heat dissipation effect on the solid state disk is improved, the stability and the operation efficiency of the server are remarkably improved, a heat pipe does not need to be additionally arranged on the solid state disk, and the difficulty and the cost of system integration are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, in particular to a liquid cooling heat dissipation device for a server solid state hard disk. Background Art

[0002] In the field of heat dissipation for liquid-cooled server systems in data centers, traditional heat dissipation methods often use flattened heat pipes for contact cooling. However, this method has obvious drawbacks: a small contact surface leads to limited heat dissipation performance, making it difficult to meet the urgent needs of modern data centers for high-performance server cooling. This is particularly problematic for solid-state drives (SSDs), due to their unique operating principles and high workloads. Traditional cooling solutions often require the installation of additional heat pipes on the SSDs, which not only increases system complexity and manufacturing costs, but also remains unsatisfactory in terms of heat dissipation. Therefore, we have improved this by proposing a liquid-cooled heat dissipation device for server SSDs. Summary of the Invention

[0003] The purpose of the utility model is to solve the problem that the existing flattened heat pipe contact heat dissipation method has a small contact surface and requires additional heat pipes to be installed on the solid state hard disk.

[0004] In order to achieve the above-mentioned purpose of the invention, the present invention provides a liquid cooling device for a server solid state hard disk to improve the above-mentioned problem.

[0005] The specific application is as follows:

[0006] A liquid cooling device for a server solid-state hard drive includes a first liquid cooling plate, one side of which is connected to a plurality of second liquid cooling plates, with gaps left between the plurality of second liquid cooling plates. The side surfaces of the second liquid cooling plates are used to fit the solid-state hard drive to achieve heat conduction.

[0007] As a preferred technical solution of the present application, a reinforcement strip is provided between the side surfaces of the first liquid cooling plate and the second liquid cooling plate.

[0008] As a preferred technical solution of the present application, a conveying portion is provided on the first liquid cooling plate, and the conveying portion is used for conveying the cooling liquid;

[0009] The conveying portion includes a guide groove, and the guide groove is opened on a surface of the first liquid cooling plate away from the second liquid cooling plate.

[0010] As a preferred technical solution of the present application, the guide groove is arranged in a serpentine shape, and the position of the guide groove corresponds to the position of the second liquid cooling plate.

[0011] As a preferred technical solution of the present application, a liquid inlet pipe and a liquid outlet pipe are provided on one side of the first liquid cooling plate, and both the liquid inlet pipe and the liquid outlet pipe are connected to the guide groove.

[0012] As a preferred technical solution of the present application, the liquid inlet pipe and the liquid outlet pipe are used together to realize the connection between the guide groove and the refrigeration equipment.

[0013] As a preferred technical solution of the present application, a sealing plate is connected to a surface of the first liquid cooling plate away from the second liquid cooling plate, and the sealing plate covers the guide groove.

[0014] As a preferred technical solution of the present application, the outer surface of the second liquid cooling plate is provided with a thermal conductive coating.

[0015] As a preferred technical solution of the present application, a solid state drive mounting bracket is connected to a surface of the first liquid cooling plate close to the second liquid cooling plate, and the solid state drive mounting bracket is used to install a solid state drive.

[0016] As a preferred technical solution of the present application, a temperature sensor is provided in the solid state drive mounting frame, and the temperature sensor is used to detect the temperature of the solid state drive.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] In the scheme of this application:

[0019] In order to solve the problem in the prior art that the contact heat dissipation using flattened heat pipes has a small contact surface and requires additional heat pipes to be installed on the solid-state hard drive, the present application sets up a second liquid cooling plate, which fits with the solid-state hard drive when in use, effectively increasing the heat dissipation contact surface, improving the heat dissipation effect on the solid-state hard drive, and significantly improving the stability and operating efficiency of the server. There is no need to install additional heat pipes on the solid-state hard drive, reducing the difficulty and cost of system integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the liquid cooling device for server solid state drives provided in this application;

[0021] Figure 2 This is a schematic diagram of the structure of the second liquid cooling plate of the liquid cooling heat dissipation device for server solid state drives provided in this application;

[0022] Figure 3 This is a schematic diagram of the structure of the guide groove of the liquid cooling device for the server solid state drive provided in this application;

[0023] Figure 4 The server solid state hard disk liquid cooling device provided in this application Figure 2 Schematic diagram of the upward-looking structure.

[0024] Indicated in the figure:

[0025] 1. First liquid cooling plate; 2. Second liquid cooling plate; 3. Guide groove; 4. Liquid inlet pipe; 5. Liquid outlet pipe; 6. Sealing plate; 7. SSD mounting bracket; 8. Reinforcement strip. DETAILED DESCRIPTION

[0026] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0027] As described in the background technology, traditional heat dissipation methods mostly use flattened heat pipes for contact heat dissipation. However, this method has obvious defects, namely, the small contact surface leads to limited heat dissipation performance, which is difficult to meet the urgent needs of modern data centers for high-performance server heat dissipation. Especially for solid-state drives, due to their special working principles and high workloads, the heat dissipation problem is particularly prominent. Traditional heat dissipation solutions often require additional heat pipes to be installed on the solid-state drives, which not only increases the complexity and manufacturing cost of the system, but also the heat dissipation effect is still unsatisfactory.

[0028] In order to solve this technical problem, the utility model provides a liquid cooling heat dissipation device for a server solid state hard disk, which is applied to the heat dissipation of a server solid state hard disk.

[0029] Specifically, please refer to Figure 1-Figure 4 The server solid state drive liquid cooling device specifically includes:

[0030] A first liquid cooling plate 1 is provided, and one side of the first liquid cooling plate 1 is connected to a plurality of second liquid cooling plates 2, with gaps being left between the plurality of second liquid cooling plates 2. The side surfaces of the second liquid cooling plates 2 are used to fit with the solid state drive to achieve heat conduction.

[0031] The utility model provides a liquid cooling heat dissipation device for a server solid-state hard drive. The application sets a second liquid cooling plate 2, which is in contact with the solid-state hard drive during use, thereby effectively increasing the heat dissipation contact surface, improving the heat dissipation effect on the solid-state hard drive, and significantly improving the stability and operating efficiency of the server. There is no need to install additional heat pipes on the solid-state hard drive, which reduces the difficulty and cost of system integration.

[0032] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0033] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions therein can be combined with each other.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] Example 1, please refer to Figure 1-Figure 4 , a liquid cooling heat dissipation device for a server solid-state hard drive includes a first liquid cooling plate 1, a plurality of second liquid cooling plates 2 are connected to one side of the first liquid cooling plate 1, gaps are left between the plurality of second liquid cooling plates 2, and the side surfaces of the second liquid cooling plates 2 are used to fit with the solid-state hard drive to achieve heat conduction; the second liquid cooling plate 2 is provided in the present application, and the second liquid cooling plate 2 fits with the solid-state hard drive when in use, thereby effectively increasing the heat dissipation contact surface, improving the heat dissipation effect of the solid-state hard drive, significantly improving the stability and operation efficiency of the server, eliminating the need to install additional heat pipes on the solid-state hard drive, and reducing the difficulty and cost of system integration;

[0036] The provision of the second liquid cooling plate 2 increases the contact area with the solid-state hard drive, and the heat conduction path increases and becomes shorter, so that heat can be conducted from the solid-state hard drive to the second liquid cooling plate 2 more quickly, thereby improving the heat dissipation efficiency, thereby ensuring the stable operation of the server and reducing problems such as performance degradation caused by overheating.

[0037] A reinforcement strip 8 is provided between the sides of the first liquid cooling plate 1 and the second liquid cooling plate 2. The reinforcement strip 8 and the first liquid cooling plate 1 are integrally provided. The provision of the reinforcement strip 8 ensures a firm connection between the second liquid cooling plate 2 and the first liquid cooling plate 1, thereby ensuring the continuity and stability of the heat dissipation effect. In terms of increasing the flow rate of cooling liquid, the reinforcement strip 8 increases the depth of the guide groove 3, so that more cooling liquid can flow through the guide groove 3 per unit time, thereby improving the heat exchange efficiency between the cooling liquid and the second liquid cooling plate 2, and further enhancing the heat dissipation effect, which helps to extend the service life of the solid-state hard drive and improve the reliability of the server.

[0038] Furthermore, a conveying portion is provided on the first liquid cooling plate 1 for conveying cooling liquid, so that the cooling liquid can perform heat exchange with the second liquid cooling plate 2 to take away the heat of the solid state drive and achieve heat dissipation.

[0039] Further, such as Figure 3 As shown, the conveying part includes a guide groove 3, which is opened on the side of the first liquid cooling plate 1 away from the second liquid cooling plate 2. When the cooling liquid flows in the guide groove 3, heat exchange with the second liquid cooling plate 2 can be achieved.

[0040] Example 2 further optimizes the server solid state drive liquid cooling device provided in Example 1. Specifically, Figure 3 As shown, the guide groove 3 is arranged in a serpentine shape, and the position of the guide groove 3 corresponds to the position of the second liquid cooling plate 2. The serpentine shape of the guide groove 3 greatly extends the flow path of the cooling liquid in the guide groove 3, so that the heat exchange between the cooling liquid and the second liquid cooling plate 2 is more sufficient, which can more effectively take away the heat on the second liquid cooling plate 2 and improve the heat dissipation efficiency. At the same time, the design corresponding to the position of the second liquid cooling plate 2 ensures that the heat concentration area can be cooled more effectively, further improving the heat dissipation effect, providing a more stable working temperature environment for the solid-state hard drive, and ensuring its performance and life.

[0041] Further, such as Figure 1-Figure 2 As shown, a liquid inlet pipe 4 and a liquid outlet pipe 5 are provided on one side of the first liquid cooling plate 1 , and both the liquid inlet pipe 4 and the liquid outlet pipe 5 are communicated with the guide groove 3 .

[0042] Furthermore, the liquid inlet pipe 4 and the liquid outlet pipe 5 are used together to realize the connection between the guide groove 3 and the refrigeration equipment. The refrigeration equipment can use an existing water chiller. After the liquid inlet pipe 4 and the liquid outlet pipe 5 are connected to the water chiller through pipes, the water chiller injects cold water into the guide groove 3 through the liquid inlet pipe 4, and the cold water flows back to the water chiller through the liquid outlet pipe 5 after heat exchange.

[0043] Further, such as Figure 1 As shown, a sealing plate 6 is connected to the side of the first liquid cooling plate 1 away from the second liquid cooling plate 2, and the sealing plate 6 covers the guide groove 3. The sealing plate 6 protects the guide groove 3 to prevent coolant leakage, thereby avoiding damage to other components inside the server due to coolant leakage, and ensuring the safe operation of the server.

[0044] Furthermore, the outer surface of the second liquid cooling plate 2 is provided with a thermally conductive coating, and the provision of the thermally conductive coating further improves the heat conduction efficiency. The thermally conductive coating can enhance the heat transfer capability between the second liquid cooling plate 2 and the solid-state hard disk, so that the heat generated by the solid-state hard disk can be conducted to the second liquid cooling plate 2 more quickly, and then transferred to the cooling liquid by the second liquid cooling plate 2 for heat dissipation, which helps to reduce the temperature of the solid-state hard disk, improve its performance and stability, and extend its service life. The thermally conductive coating can be made of graphene, which has extremely high thermal conductivity, and its thermal conductivity far exceeds that of many traditional materials. It can quickly conduct the heat generated by the solid-state hard disk, effectively improving the heat dissipation efficiency.

[0045] Example 3 further optimizes the server solid state drive liquid cooling device provided in Example 1 or 2. Specifically, Figure 1 As shown, a solid state drive mounting bracket 7 is connected to a surface of the first liquid cooling plate 1 close to the second liquid cooling plate 2 , and the solid state drive mounting bracket 7 is used for mounting a solid state drive.

[0046] Furthermore, a temperature sensor is provided in the solid-state hard disk mounting frame 7. The temperature sensor is used to detect the temperature of the solid-state hard disk, providing a basis for the intelligent control of the heat dissipation system. Through the temperature sensor, the temperature changes of the solid-state hard disk can be timely understood. When the temperature is too high, corresponding measures can be taken, such as adjusting the power of the chiller, increasing the flow rate of the cooling liquid, etc., to ensure the heat dissipation effect. At the same time, the temperature sensor can also provide data support for the server management system, helping managers to discover and solve problems in a timely manner, and improve the reliability and stability of the server.

[0047] The use process of the liquid cooling heat dissipation device for server solid state hard disk provided by the utility model is as follows:

[0048] For ease of description and understanding, this application uses A to represent a solid-state hard drive and marks it in the figure. Multiple solid-state hard drives are inserted into the solid-state hard drive mounting rack 7. At this time, the two sides of the second liquid cooling plate 2 are respectively fitted with the solid-state hard drives, and the chiller injects cold water into the guide groove 3 through the liquid inlet pipe 4. When the cold water flows in the guide groove 3, it can realize heat exchange with the second liquid cooling plate 2 to dissipate heat for the solid-state hard drive. After heat exchange, the cold water flows back to the chiller through the liquid outlet pipe 5.

[0049] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0050] Obviously, the embodiments described above are only some of the embodiments of the present invention, rather than all of the embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of protection of the patent of the present invention.

Claims

1. A liquid cooling device for a server solid state hard drive, characterized in that: It comprises a first liquid cooling plate (1), one side of the first liquid cooling plate (1) is connected to a plurality of second liquid cooling plates (2), gaps are left between the plurality of second liquid cooling plates (2), and the side surfaces of the second liquid cooling plates (2) are used to fit with the solid state hard disk to achieve heat conduction; The first liquid cooling plate (1) is provided with a conveying portion, which is used for conveying cooling liquid; The conveying portion comprises a guide groove (3), wherein the guide groove (3) is provided on a surface of the first liquid cooling plate (1) away from the second liquid cooling plate (2); The guide groove (3) is arranged in a serpentine shape, and the position of the guide groove (3) corresponds to the position of the second liquid cooling plate (2); A liquid inlet pipe (4) and a liquid outlet pipe (5) are provided on one side of the first liquid cooling plate (1), and both the liquid inlet pipe (4) and the liquid outlet pipe (5) are in communication with the guide groove (3); A sealing plate (6) is connected to a surface of the first liquid cooling plate (1) away from the second liquid cooling plate (2), and the sealing plate (6) covers the guide groove (3).

2. The liquid cooling device for a server solid state drive according to claim 1, wherein: A reinforcement strip (8) is provided between the side surfaces of the first liquid cooling plate (1) and the second liquid cooling plate (2).

3. The liquid cooling device for a server solid state drive according to claim 1, wherein: The liquid inlet pipe (4) and the liquid outlet pipe (5) cooperate to realize the connection between the guide groove (3) and the refrigeration equipment.

4. The liquid cooling device for a server solid state drive according to claim 1, wherein: The outer surface of the second liquid cooling plate (2) is provided with a heat-conducting coating.

5. The liquid cooling device for a server solid state drive according to claim 1, wherein: A solid state hard disk mounting frame (7) is connected to a surface of the first liquid cooling plate (1) close to the second liquid cooling plate (2), and the solid state hard disk mounting frame (7) is used for mounting a solid state hard disk.

6. The liquid cooling device for a server solid state drive according to claim 5, characterized in that: A temperature sensor is provided in the solid state hard disk mounting frame (7), and the temperature sensor is used to detect the temperature of the solid state hard disk.

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