Semiconductor wafer box storage structure

Abstract

The utility model provides a semiconductor wafer cassette storage structure, which comprises a plurality of storage units, each storage unit comprises a plurality of layers of storage plates, and a support is used for fixedly connecting the storage plates to form an integral frame. The storage plate is provided with a clamping groove used for placing the wafer box, and the wafer box can be inserted into the clamping groove and stably placed. The guide device comprises two guide plates which are oppositely arranged and have an inclined angle of 30-60 degrees, and the guide plates are used for guiding the wafer box to be inserted into and taken out of the clamping groove. The storage plate structure is in a parallel long strip shape, a U-shaped groove with a narrow opening and a wide rear end is formed in the center of the storage plate, and connecting plates are arranged on the two sides of the storage plate, are perpendicular to the storage plate and are connected with the stand columns of the frame body through screws. According to the utility model, by optimizing the structural design, the utilization rate of the storage space is improved, the stability of the whole structure is enhanced, the access operation of the wafer box is simplified, and the influence of external pollution on wafers is effectively prevented.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing equipment, and in particular to a double-deep storage structure for storing semiconductor wafer boxes, which aims to improve storage efficiency and operational convenience, and enhance structural stability and protective performance. Background Art

[0002] Wafers are one of the most critical building blocks in semiconductor manufacturing. Wafer cassettes, crucial for storing and transporting wafers, have a design and quality that directly impacts wafer safety and manufacturing efficiency. Existing wafer cassette storage systems suffer from practical issues such as large space requirements, inconvenient access, unstable structures, fragility, difficulty managing, and susceptibility to external contamination.

[0003] Existing wafer cassettes are typically made of antistatic plastic to reduce the adhesion of dust and particulate matter and protect the cleanliness of the wafers. Several horizontal support bars are designed inside the cassette to hold the wafers, ensuring that the wafers do not come into contact or rub against each other during transportation and storage. Existing wafer cassette storage devices are generally single-layer or stacked in small quantities. Each storage unit can only accommodate one or a small number of wafer cassettes, resulting in a large overall footprint. In addition, when storing and accessing wafer cassettes, the other wafer cassettes on the storage unit need to be moved one by one, which is cumbersome and prone to collisions, causing damage to the wafer cassettes and wafers.

[0004] There are many problems with these storage devices: First, due to the single-layer design, the overall space occupied is large, and the vertical space cannot be effectively utilized, resulting in low space utilization. Secondly, during the storage and access process, multiple wafer boxes need to be moved, which increases the complexity and time cost of the operation and makes storage and access inconvenient. Thirdly, the existing storage devices have a simple structure and lack sufficient support and fixing measures. They are easily damaged during transportation and storage, and the structure is unstable. In addition, the storage and classification management of wafer boxes is difficult, and the lack of independent storage units increases management costs and makes management difficult. Finally, due to the lack of effective protective measures in the storage device, the wafer box is easily contaminated by dust and particulate matter, which affects the quality of the wafer and poses a risk of contamination.

[0005] To overcome the shortcomings of the prior art, a novel semiconductor wafer cassette storage structure has been proposed. This innovative design improves storage space utilization, simplifies cassette access, enhances overall structural stability, reduces damage risks, simplifies management processes, and effectively prevents external contamination from affecting wafers.

[0006] In the prior art, CN117508957A discloses an 8-inch wafer box transmission and storage system. The system includes a storage warehouse and at least one stacker. The storage warehouse is provided with a plurality of storage racks, and the width of each storage rack is smaller than the width of the wafer box. The system also has at least two workstations for taking and placing materials on the outside of the storage warehouse. Although the system has solved the problems of wafer box transmission and storage to a certain extent, there are still problems such as insufficient space utilization, poor operational convenience, insufficient structural stability, difficulty in management, and the need to strengthen protective measures. In order to solve the above problems, the present application proposes a new type of semiconductor wafer box storage structure, which not only improves the utilization of storage space, but also ensures the safety of the wafer box during the access process through a guide structure, and further optimizes the management and protective measures. Utility Model Content

[0007] The purpose of the utility model is to provide a semiconductor wafer box storage structure, which improves the utilization of storage space through innovative design, simplifies the storage and access operations of the wafer box, enhances the stability of the overall structure, and reduces the risk of damage.

[0008] To achieve the above objectives, the present invention provides a semiconductor wafer cassette storage structure comprising multiple storage units, each comprising several layers of storage plates. Brackets are used to securely connect the storage plates to form a single, integrated framework. Slots are provided on the storage plates for accommodating wafer cassettes, which can be inserted into the slots and securely positioned. Guides are provided on the storage plates, and connectors are used to connect the storage units to form a single, integrated framework.

[0009] Furthermore, the guiding device includes two guiding plates, which are arranged opposite to each other and have an oblique inclination angle of 30-60 degrees, and are used to guide the insertion and removal of the wafer box into the card slot.

[0010] Furthermore, the storage plates are parallel to each other in a horizontal structure, with sufficient spacing between each layer of storage plates to accommodate wafer cassettes. Multiple slots are provided on both sides of each layer of storage plates to securely hold the wafer cassettes, and guide plates are provided on both sides of the storage plates to facilitate the insertion and removal of the wafer cassettes.

[0011] Furthermore, in terms of the structure of the guide plate, the guide plate is long and has raised fixing holes on both sides for installing bolts. The guide plate is fixed to the side of the storage plate to ensure that it is firmly connected to form an oblique inclination angle of 30-60°.

[0012] Furthermore, the storage plate structure is a parallel strip, with a U-shaped groove in the center that is narrow at the front and wide at the back. The groove is narrow at the front and gradually expands toward the back, becoming wider at the back. Multiple screw holes are provided at both ends and the middle of the storage plate, which are fixed to the guide plate via screws.

[0013] Furthermore, connecting plates are provided on both sides of the storage plate structure. The connecting plates are perpendicular to the storage plates and are provided with a plurality of rectangular holes for installing bolts and connecting with the columns of the frame body.

[0014] Furthermore, the frame is composed of multiple vertical and horizontal support structures, with multiple corresponding screw holes on the columns. To enhance structural stability, the frame includes diagonal bracing structures, which are arranged diagonally and connect the columns and beams of the frame body. The bracing structures are fixed by bolts or welding to form triangular support units.

[0015] Furthermore, mounting holes are provided on the diagonal bracing structure for connecting and fixing with other components of the frame body to ensure the stability and firmness of the overall structure.

[0016] Furthermore, positioning pins and baffles are provided on the storage plate.

[0017] The beneficial effects of the present invention are:

[0018] Improved storage space utilization: The double-deep storage structure features parallel horizontal storage plates, with ample spacing between each layer to accommodate wafer cassettes, fully utilizing vertical space. Each storage unit comprises several layers of plates, allowing the overall framework to accommodate more wafer cassettes, significantly increasing storage capacity and saving floor space. This design effectively optimizes space utilization and is suitable for semiconductor manufacturing environments requiring high-density storage.

[0019] Simplified access: The guide mechanism consists of two guide plates, positioned opposite each other at a 30-60° angle, effectively guiding the insertion and removal of wafer cassettes into and out of the slots. The slots on the storage plates are used to accommodate the wafer cassettes, ensuring they are securely positioned on the plates. The guide plates are elongated and have raised mounting holes on either side for bolt installation. They are fixed to the sides of the storage plates, ensuring a secure connection and forming a 30-60° angle. This design simplifies operation, reduces the complexity and error rate of manual operation, and improves work efficiency.

[0020] Enhanced Structural Stability: The overall frame is composed of multiple vertical and horizontal support structures, with corresponding screw holes on the columns. The frame includes diagonal bracing, which connects the columns and crossbeams of the frame and is secured by bolts or welding to form triangular support units. The bracing is equipped with mounting holes for connecting and securing to other components of the frame. This structural design increases the rigidity and stability of the overall frame, ensuring the stability and seismic resistance of the storage unit during storage and handling, and reducing the risk of structural deformation and collapse.

[0021] Reduced Damage Risk: The storage plates are constructed in the form of parallel, long strips, with a U-shaped groove in the center, narrow at the front and widening toward the rear. The groove is narrow at the front and gradually widens toward the rear, becoming wider at the rear. Multiple screw holes are located at both ends and in the center of the storage plates, securing them to the guide plates. The U-shaped groove prevents the wafer cassette from tilting or moving during insertion and removal. The rounded edges of the groove effectively prevent damage to the cassette during storage and retrieval, thereby protecting the wafers.

[0022] Simplified Management: Connecting plates are installed on both sides of the storage plate, running perpendicular to the plate and equipped with multiple rectangular holes for mounting bolts and connecting to the frame's columns. The frame is composed of multiple vertical and horizontal support structures. This modular design allows for easy installation, removal, and maintenance of the storage units and the overall frame structure. Multiple fixing points ensure the overall structural strength and reliability, significantly improving the efficiency of wafer cassette storage and management while reducing management costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is an oblique view of the semiconductor wafer box storage structure of the present invention.

[0024] Figure 2 This is the main view of the storage unit.

[0025] Figure 3 This is the left view of the storage unit.

[0026] Figure 4 It is a schematic diagram of the shelf of the semiconductor wafer box storage structure. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "several" means two or more, unless otherwise specifically defined.

[0030] The utility model provides a semiconductor wafer box storage structure, such as Figures 1 to 4 As shown, it includes a plurality of storage units 1, and each storage unit includes several layers of storage plates 2. The bracket 3 is used to fix the storage plates to form an integral frame. The card slot 4 is provided on the storage plate for placing the wafer box, and the wafer box can be inserted into the card slot and placed firmly. The storage plate 2 is provided with a positioning pin 7, which is adapted to the positioning hole at the bottom of the wafer box to limit the movement of the wafer box in the card slot. The storage plates 2 are horizontal structures parallel to each other, and there is sufficient spacing between each layer of storage plates to accommodate the wafer box. The card slot 4 has a U-shaped groove with a narrow opening and a wide rear end. The front opening of the groove is narrower and gradually expands backward to make the rear end wider. Baffles 12 are provided at both ends of the storage plate to limit the movement of the wafer box.

[0031] The bracket 3 is used to fix the storage plate to form an integral frame. The bracket is connected to the storage plate by screws, providing sufficient support and stability to ensure that the storage plate does not deform or loosen during use.

[0032] In one embodiment, the frame is composed of multiple vertical and horizontal support structures, including columns 5 and beams 6. The frame is secured by screws, bolts, or welding to ensure the rigidity and stability of the overall structure. Diagonal bracing structures 8 are arranged diagonally, connecting the columns and beams of the frame and securing them by screws or welding to form triangular support units. The diagonal bracing structures are provided with mounting holes for connecting and securing to other components of the frame, further enhancing the stability of the overall frame.

[0033] Connecting plates 9 are installed on both sides of the storage unit. These plates are perpendicular to the storage plates and connect to the frame's columns through rectangular holes 10. These connecting plates are secured with screws or bolts, ensuring a tight connection between the storage plates and the frame. During installation, select a suitable location for the storage unit, ensuring sufficient spacing between each layer of storage plates to accommodate the wafer cassettes. Ensure that the U-shaped grooves in the storage plates are narrow at the front and gradually expand toward the rear, making them wider at the back to facilitate secure placement of the wafer cassettes.

[0034] During installation, first assemble the frame's columns and beams according to the design requirements and secure them with screws, bolts, or welding. Next, install the diagonal bracing structure, which connects the columns and beams diagonally and secures them with screws or welding to form a triangular support unit. Ensure that the mounting holes on the bracing structure align with the other components and secure them with screws or bolts to further enhance the frame's stability.

[0035] A guide device is installed on the storage plate to guide the wafer cassettes during insertion and removal from the slots. The guide device comprises two guide plates 11, positioned opposite each other and tilted at an angle of 30-60°. The guide plates are long, with raised fixing holes on either side for mounting bolts. These fasten to the sides of the storage plate, ensuring a secure connection. This design allows for smooth insertion and removal of the wafer cassettes, preventing damage from improper handling.

[0036] The embodiments of the present invention have been described in detail above. These specific embodiments are provided to illustrate the principles and applications of the present invention and are not intended to limit the scope of the present invention. Any modifications or variations made by a person of ordinary skill in the art based on the basic principles of the present invention after reading this specification shall fall within the scope of protection of the present invention.

[0037] In further implementation, the present invention can be further improved. For example, the material selection of the storage plate and guide plate can be optimized to improve their wear resistance and durability; more shock-resistant features can be added to the overall frame structure to improve the stability and safety of the equipment under extreme conditions; and more automated controls can be introduced during storage and transportation to further improve operational efficiency and safety.

[0038] These improvements and optimizations can be tailored to specific application requirements to ensure the optimal performance of the present invention in a variety of environments. Furthermore, these improvements and optimizations broaden the adaptability and application prospects of the present invention, providing a more reliable guarantee for efficient and safe production in the semiconductor manufacturing field. Through continuous technological innovation and optimization, the present invention will continue to play an important role in the semiconductor manufacturing field, driving the industry's progress and development.

[0039] Those skilled in the art should understand that the present invention is not limited to the above-described embodiments. The above-described embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer box storage structure, characterized in that: include: Multiple storage units, each of which includes several layers of storage plates; a bracket for fixedly connecting the storage plates to form an overall frame; a card slot provided on the storage plates for placing a wafer box, the wafer box can be inserted into the card slot and placed firmly; a guide device provided on the storage plates; a connector for connecting the storage units to form an overall frame structure.

2. The semiconductor wafer box storage structure according to claim 1, characterized in that: The guiding device includes two guiding plates, which are arranged opposite to each other and have an oblique inclination angle of 30-60 degrees, and are used to guide the wafer box to be inserted into and removed from the card slot.

3. The semiconductor wafer box storage structure according to claim 1, characterized in that: The storage plates are parallel to each other in a horizontal structure, with sufficient spacing between each layer of storage plates to accommodate wafer boxes. Multiple card slots are provided on both sides of each layer of storage plates for firmly placing wafer boxes. Guide plates are provided on both sides of the storage plates to facilitate the insertion and removal of wafer boxes.

4. The semiconductor wafer box storage structure according to claim 3, characterized in that: The guide plate has a long strip structure with raised fixing holes on both sides for installing bolts. The guide plate is fixed to the side of the storage plate to ensure a firm connection and form an oblique inclination angle of 30-60 degrees.

5. The semiconductor wafer box storage structure according to claim 4, characterized in that: The storage plate structure is in the shape of parallel long strips, and the central part has a U-shaped groove with a narrow opening and a wide rear end. The front end opening of the groove is narrower and gradually expands backward to make the rear end wider. Multiple screw holes are provided at both ends and the middle of the storage plate, which are fixedly connected to the guide plate by screws.

6. The semiconductor wafer box storage structure according to claim 5, characterized in that: Connecting plates are provided on both sides of the storage plate structure, which are perpendicular to the storage plates. A plurality of rectangular holes are provided on the connecting plates for installing bolts and connecting with the columns of the frame body.

7. The semiconductor wafer box storage structure according to claim 6, characterized in that: The frame body is composed of a plurality of vertical and horizontal supporting structures, and a plurality of corresponding screw holes are arranged on the columns.

8. The semiconductor wafer box storage structure according to claim 7, characterized in that: The frame body includes a diagonal bracing structure, which is arranged diagonally, connects the columns and beams of the frame body, and is fixed by bolts or welding to form a triangular support unit.

9. The semiconductor wafer box storage structure according to claim 8, characterized in that: The diagonal bracing structure is provided with mounting holes for connecting and fixing with other components of the frame body.

10. The semiconductor wafer box storage structure according to claim 9, characterized in that: The storage plate is provided with a positioning pin and a baffle.

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