Wafer clamping device

Abstract

The utility model relates to a wafer clamping device which comprises a plurality of clamping wheels distributed around the circumferential direction of a wafer and a power part, and the clamping wheels are divided into a first clamping wheel set and a second clamping wheel set which are located on the two opposite sides of the wafer. The first clamping wheel set and the second clamping wheel set can move close to or away from each other in opposite directions to form a first position for clamping a wafer or a second position for releasing the wafer, and when the first clamping wheel set and the second clamping wheel set are located at the first position, a plurality of clamping areas which are distributed layer by layer from top to bottom are formed between the first clamping wheel set and the second clamping wheel set; wherein the diameters of the plurality of clamping areas are gradually reduced or increased from top to bottom, and wafers with different diameters are clamped in the corresponding clamping areas. According to the utility model, based on the cooperation of the first clamping wheel group and the second clamping wheel group, wafers of different specifications can be clamped or loosened under the equidistant movement, the structure is simple, the space utilization rate of equipment can be effectively improved, and meanwhile, the loading and unloading efficiency of the wafers can be effectively improved.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment, and in particular relates to a wafer clamping device. Background Art

[0002] A wafer, also known as a wafer due to its round shape, is the chip used in the manufacture of semiconductor chips and integrated circuits. By creating various circuit structures on the wafer surface, it can be transformed into electronic components with specific electrical functions. The wafer production process typically involves slicing, grinding, polishing, and cleaning.

[0003] In the last cleaning step, both the front and back sides of the wafer need to be cleaned. The wafer brushing device used in the existing technology generally includes a wafer clamping part, an upper brushing part arranged above the wafer, and a lower brushing part arranged below the wafer. Therefore, when the wafer is clamped and fixed by the clamping part, the upper and lower brushing parts brush the front and back sides of the wafer respectively. After brushing is completed, the wafer is taken out for spin drying or drying.

[0004] However, in the actual production process, the existing clamping parts generally use multiple clamping wheels distributed around the circumference of the wafer, and clamp or release the wafer during the radial movement of the wafer. Therefore, not only is the required driving mechanism structure complex (each clamping wheel needs to control the radial movement separately), but also for wafers of different specifications, each clamping wheel needs to move a corresponding distance. In this way, sufficient space needs to be designed to meet the movement of the clamping wheels, resulting in low internal space utilization of the equipment and large equipment size. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved wafer clamping device.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A wafer clamping device includes multiple clamping wheels and a power component distributed around the circumference of the wafer. The multiple clamping wheels are divided into a first clamping wheel group and a second clamping wheel group located on opposite sides of the wafer. The first clamping wheel group and the second clamping wheel group can move toward or away from each other to form a first position for clamping the wafer or a second position for releasing the wafer. When in the first position, multiple clamping areas are formed between the first clamping wheel group and the second clamping wheel group, which are distributed layer by layer from top to bottom. The diameters of the multiple clamping areas are arranged to gradually decrease or increase from top to bottom, and wafers of different diameters are clamped in the corresponding clamping areas.

[0008] According to a specific implementation and preferred aspect of the present invention, the center lines of the multiple clamping areas are arranged to coincide with each other, which facilitates the positioning and clamping of different wafers.

[0009] According to another specific embodiment and preferred aspect of the present invention, the first and second clamping wheel groups are symmetrically arranged about the center of the wafer, wherein the first and second clamping wheel groups respectively move linearly in a horizontal direction and in opposite directions, thereby improving the stability of wafer clamping.

[0010] Preferably, the first and second gripping wheel groups each include two gripping wheels spaced side by side, wherein the two gripping wheels are arranged perpendicular to the direction of motion. This facilitates synchronous gripping of the wafer by the gripping wheels, preventing the wafer from shifting, and thereby improving the wafer's positioning accuracy.

[0011] According to another specific implementation and preferred aspect of the present invention, the outer wall of each clamping wheel forms a plurality of wheel grooves distributed layer by layer from top to bottom, wherein the outer diameters of the plurality of wheel grooves are gradually increased from top to bottom, and a clamping area is formed between the plurality of wheel grooves of each layer. When clamping, the wafer is pressed against the corresponding wheel groove from the edge.

[0012] Preferably, each clamping wheel comprises a first wheel body, a second wheel body and a third wheel body, the outer diameters of which increase step by step from top to bottom, wherein wheel grooves are formed between the first wheel body and the second wheel body, and between the second wheel body and the third wheel body respectively.

[0013] Furthermore, the outer diameter of the second wheel body is gradually increased from top to bottom. Here, when the wafer is clamped in the upper clamping area, the contact area between the lower surface of the wafer and the second wheel body can be reduced.

[0014] Preferably, the clamping device also includes auxiliary wheels located on opposite sides of the wafer, each with an auxiliary wheel groove flush with the wheel groove below. When the wafer is clamped in the lower clamping area, the edge of the wafer simultaneously abuts against the auxiliary wheel groove. This facilitates processing and use. Furthermore, the auxiliary wheels enhance support and clamping stability for smaller-diameter wafers, allowing wafers of different sizes to be scrubbed at the same speed, effectively improving efficiency.

[0015] According to another specific implementation and preferred aspect of the present invention, a transmission belt is respectively connected between each clamping wheel in the first clamping wheel group and the second clamping wheel group; the power component includes a first movable seat and a second movable seat located on opposite sides of the wafer, a first cylinder and a second cylinder driving the first movable seat and the second movable seat to move toward or away from each other, and a first motor and a second motor respectively arranged on the first movable seat and the second movable seat, wherein the first clamping wheel group and the second clamping wheel group are respectively arranged on the first movable seat and the second movable seat, and the first motor and the second motor respectively drive any clamping wheel in the first clamping wheel group and the second clamping wheel group to rotate around the vertical center line, and the clamping wheel drives the other clamping wheel in the same group to rotate through the above-mentioned transmission belt, so as to realize the rotation of the wafer around its own center line during the scrubbing process.

[0016] In addition, the power component also includes two first limiters and two second limiters correspondingly arranged on the moving paths of the first moving seat and the second moving seat, and the first moving seat and the second moving seat reciprocate between the two first limiters and the two second limiters respectively.

[0017] Due to the implementation of the above technical solution, the utility model has the following advantages compared with the prior art:

[0018] Existing clamping parts generally use multiple clamping wheels distributed around the circumference of the wafer, and clamp or release the wafer during the radial movement of the wafer. Therefore, not only is the required driving mechanism structure complex (each clamping wheel needs to control the radial movement separately), but also for wafers of different specifications, each clamping wheel needs to move a corresponding distance. In this way, it is necessary to design sufficient space to meet the movement of the clamping wheels, resulting in low internal space utilization of the equipment and large equipment volume. The present application makes an overall design of the structure of the wafer clamping device, cleverly solving the shortcomings and defects of the existing technology. After adopting the wafer clamping device, when clamping wafers of different diameters, the wafer is placed on the layer where the corresponding clamping area is located, and the first clamping wheel group and the second clamping wheel group located on opposite sides of the wafer are moved closer to each other, thereby completing the clamping of wafers of different diameters; and then the first clamping wheel group and the second clamping wheel group are moved away from each other to release wafers of different diameters. Therefore, compared with the existing technology, the utility model is based on the cooperation of the first and second clamping wheel groups, and can achieve clamping or loosening of wafers of different specifications under equidistant movement. It has a simple structure and can effectively improve the space utilization of the equipment, while effectively improving the loading and unloading efficiency of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the three-dimensional structure of the wafer clamping device of this embodiment (first perspective);

[0020] Figure 2 Schematic diagram of the three-dimensional structure of the wafer clamping device of this embodiment (second viewing angle);

[0021] Figure 3 Schematic diagram of the three-dimensional structure of the wafer clamping device of this embodiment (third perspective, partially omitted);

[0022] Figure 4 is a schematic front view of the wafer clamping device of this embodiment;

[0023] Wherein: 1, clamping wheel; 11, first wheel body; 12, second wheel body; 13, third wheel body; c0, wheel groove; q, clamping area; z1, first clamping wheel group; z2, second clamping wheel group;

[0024] 2. Power component; 21. First movable seat; 22. Second movable seat; 23. First cylinder; 24. Second cylinder; 25. First motor; 26. Second motor; h1. First slide; h2. Second slide; 27. First stopper; 28. Second stopper;

[0025] 3. Training wheel; c1. Training wheel groove;

[0026] P1, 8-inch wafer; P2, 6-inch wafer. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0030] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0031] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher horizontal height than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower horizontal height than the second feature. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0032] like Figures 1 to 4 As shown, a wafer clamping device of this embodiment includes a clamping wheel 1 and a power component 2.

[0033] Specifically, there are multiple clamping wheels 1 and they are distributed circumferentially around the wafer, wherein the multiple clamping wheels 1 are divided into a first clamping wheel group z1 and a second clamping wheel group z2 located on opposite sides of the wafer, wherein the clamping wheels 1 in the first clamping wheel group z1 and the second clamping wheel group z2 move synchronously and in the same direction, respectively, and the first clamping wheel group z1 and the second clamping wheel group z2 can move toward or away from each other to form a first position for clamping the wafer or a second position for releasing the wafer. When in the first position, a plurality of clamping areas q distributed layer by layer from top to bottom are formed between the first clamping wheel group z1 and the second clamping wheel group z2, wherein the diameters of the plurality of clamping areas q are gradually reduced or increased from top to bottom, and wafers of different diameters can be clamped synchronously in the corresponding clamping areas q.

[0034] In some specific embodiments, the first clamping wheel group z1 and the second clamping wheel group z2 are symmetrically arranged about the center of the wafer, wherein the first clamping wheel group z1 and the second clamping wheel group z2 respectively move linearly along the horizontal direction, and the movement directions are opposite; the first clamping wheel group z1 and the second clamping wheel group z2 are respectively provided with two clamping wheels 1 arranged side by side, wherein the arrangement direction of the two clamping wheels 1 in the first clamping wheel group z1 and the second clamping wheel group z2 is perpendicular to the movement direction; the outer wall of each clamping wheel 1 forms a plurality of wheel grooves c0 distributed layer by layer from top to bottom, wherein the outer diameters of the plurality of wheel grooves c0 gradually increase from top to bottom, and a clamping area q is formed between the plurality of wheel grooves c0 in each layer, and when clamped, the wafer is pressed against the corresponding wheel groove c0 from the edge; the center lines of the plurality of clamping areas q are arranged to coincide.

[0035] For ease of implementation, each clamping wheel 1 includes a first wheel body 11, a second wheel body 12 and a third wheel body 13, the outer diameters of which increase step by step from top to bottom, wherein a wheel groove c0 is formed between the first wheel body 11 and the second wheel body 12, and between the second wheel body 12 and the third wheel body 13 respectively; the outer diameter of the second wheel body 12 is set to gradually increase from top to bottom.

[0036] The clamping device also includes auxiliary wheels 3 located on opposite sides of the wafer and between the two clamping wheels 1 of the corresponding group. Each auxiliary wheel 3 is formed with an auxiliary wheel groove c1 that is flush with the wheel groove c0 located below. When the wafer is clamped in the clamping area q located in the lower layer, the edge of the wafer synchronously abuts against the auxiliary wheel groove c1. The clamping area q of the present application has two layers, of which the clamping area q located in the upper layer matches the 8-inch wafer P1, and the clamping area q located in the lower layer matches the 6-inch wafer P2. This facilitates processing and use. At the same time, the provision of the auxiliary wheels improves the support and clamping stability of wafers with smaller diameters, so that wafers of different specifications can be scrubbed at the same rotation speed, effectively improving efficiency.

[0037] At the same time, transmission belts are respectively connected between the clamping wheels 1 in the first clamping wheel group z1 and the second clamping wheel group z2 to achieve synchronous rotation between the corresponding two clamping wheels 1.

[0038] In this example, the power component 2 includes a first movable seat 21 and a second movable seat 22 located on opposite sides of the wafer, a first cylinder 23 and a second cylinder 24 for driving the first movable seat 21 and the second movable seat 22 to move toward or away from each other, and a first motor 25 and a second motor 26 respectively arranged on the first movable seat 21 and the second movable seat 22, wherein the first clamping wheel group z1 and the second clamping wheel group z2 are respectively arranged on the first movable seat 21 and the second movable seat 22, the first motor 25 and the second motor 26 respectively drive any clamping wheel 1 in the first clamping wheel group z1 and the second clamping wheel group z2 to rotate around the vertical center line, and the clamping wheel 1 drives another clamping wheel 1 in the same group to rotate through the above-mentioned transmission belt, so as to realize the rotation of the wafer around its own center line during the scrubbing process.

[0039] In some specific embodiments, the first cylinder 23 and the second cylinder 24 are respectively fixed on the equipment frame, and the telescopic ends of the first cylinder 23 and the second cylinder 24 are respectively fixedly connected to the first slide h1 and the second slide h2, the first motor 25 and the second motor 26 are respectively fixedly arranged on the first slide h1 and the second slide h2, and their respective output shafts extend upward into the first movable seat 21 and the second movable seat 22 and are connected to the corresponding clamping wheel 1 through a transmission belt.

[0040] To further facilitate implementation, the power component 2 further includes two first stoppers 27 and two second stoppers 28, which are correspondingly disposed along the movement paths of the first and second movable seats 21 and 22. The first and second movable seats 21 and 22 reciprocate between the two first stoppers 27 and the two second stoppers 28, respectively. The two first stoppers 27 and the two second stoppers 28 are disposed on opposite sides of the first and second slides h1 and h2, respectively.

[0041] In summary, after adopting the wafer clamping device, when clamping wafers of different diameters, the wafers are placed on the layer where the corresponding clamping area is located, and the first clamping wheel group and the second clamping wheel group located on opposite sides of the wafer are moved closer to each other, thereby completing the clamping of wafers of different diameters; and then the first clamping wheel group and the second clamping wheel group are moved away from each other to release wafers of different diameters. Therefore, compared with the prior art, the utility model is based on the cooperation of the first and second clamping wheel groups on the one hand, and realizes the clamping or loosening of wafers of different specifications under equidistant movement. It has a simple structure and can effectively improve the space utilization rate of the equipment, while effectively improving the loading and unloading efficiency of the wafers; secondly, the layout of the first and second clamping wheel groups of the present application is adopted, which facilitates the synchronous clamping of the wafers by each clamping wheel to prevent the wafers from being offset, thereby improving the position accuracy of the wafers; thirdly, through the setting of the auxiliary wheels, the support and clamping stability of wafers with smaller diameters are improved, so that wafers of different specifications can be scrubbed at the same speed, effectively improving efficiency.

[0042] The above detailed description of the utility model is intended to enable people familiar with the technology in this field to understand the content of the utility model and implement it. It is not intended to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.

Claims

1. A wafer clamping device comprising a plurality of clamping wheels distributed circumferentially around a wafer and a power component, characterized in that: The multiple clamping wheels are divided into a first clamping wheel group and a second clamping wheel group located on opposite sides of the wafer, wherein each clamping wheel in the first clamping wheel group and the second clamping wheel group moves synchronously and in the same direction, and the first clamping wheel group and the second clamping wheel group can move toward or away from each other to form a first position for clamping the wafer or a second position for releasing the wafer. When in the first position, multiple clamping areas distributed layer by layer from top to bottom are formed between the first clamping wheel group and the second clamping wheel group, wherein the diameters of the multiple clamping areas are gradually reduced or increased from top to bottom, and wafers of different diameters can be clamped synchronously in the corresponding clamping areas.

2. The wafer clamping device according to claim 1, wherein: The center lines of the plurality of clamping areas are arranged to coincide with each other.

3. The wafer clamping device according to claim 2, wherein: The first clamping wheel group and the second clamping wheel group are symmetrically arranged about the center of the wafer, wherein the first clamping wheel group and the second clamping wheel group respectively move linearly along the horizontal direction and in opposite directions.

4. The wafer clamping device according to claim 1, wherein: The first clamping wheel group and the second clamping wheel group are respectively provided with two clamping wheels arranged side by side and spaced apart, wherein the arrangement direction of the two clamping wheels is perpendicular to the movement direction.

5. The wafer clamping device according to claim 1, 2, 3 or 4, characterized in that: The outer wall of each clamping wheel forms a plurality of wheel grooves distributed layer by layer from top to bottom, wherein the outer diameters of the plurality of wheel grooves gradually increase from top to bottom, and the clamping area is formed between the plurality of wheel grooves in each layer. When clamping, the wafer is pressed against the corresponding wheel groove from the edge.

6. The wafer clamping device according to claim 5, wherein: Each of the clamping wheels includes a first wheel body, a second wheel body, and a third wheel body, the outer diameters of which increase step by step from top to bottom, wherein the wheel grooves are respectively formed between the first wheel body and the second wheel body, and between the second wheel body and the third wheel body.

7. The wafer clamping device according to claim 6, wherein: The outer diameter of the second wheel body is gradually increased from top to bottom.

8. The wafer clamping device according to claim 5, wherein: The clamping device also includes auxiliary wheels located on opposite sides of the wafer, wherein each of the auxiliary wheels is formed with an auxiliary wheel groove that is flush with the wheel groove located below. When the wafer is clamped in the clamping area located in the lower layer, the edge of the wafer synchronously abuts against the auxiliary wheel groove.

9. The wafer clamping device according to claim 1, wherein: A transmission belt is respectively connected between each of the clamping wheels in the first clamping wheel group and the second clamping wheel group; the power component includes a first movable seat and a second movable seat located on opposite sides of the wafer, a first cylinder and a second cylinder driving the first movable seat and the second movable seat to move toward or away from each other, and a first motor and a second motor respectively arranged on the first movable seat and the second movable seat, wherein the first clamping wheel group and the second clamping wheel group are respectively arranged on the first movable seat and the second movable seat, and the first motor and the second motor respectively drive any of the clamping wheels in the first clamping wheel group and the second clamping wheel group to rotate around the vertical center line.

10. The wafer clamping device according to claim 9, wherein: The power component further includes two first limiting members and two second limiting members correspondingly arranged on the moving paths of the first moving seat and the second moving seat, and the first moving seat and the second moving seat respectively reciprocate between the two first limiting members and the two second limiting members.

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