Heat dissipation plate structure, power module and cooling device

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation plate structure, a power module and a cooling device.The heat dissipation plate structure comprises a heat dissipation bottom plate, and the heat dissipation bottom plate comprises a fluid inflow area, a fluid outflow area and a heat dissipation area located between the fluid inflow area and the fluid outflow area; the heat dissipation area comprises a first heat dissipation area and a second heat dissipation area which are sequentially arranged in the first direction. The first heat dissipation area and the second heat dissipation area are each provided with a heat dissipation pin fin. In the application, the equivalent convective heat transfer coefficient of the first heat dissipation area relatively close to the fluid inflow area is adjusted to be greater than the equivalent convective heat transfer coefficient of the second heat dissipation area relatively far away from the fluid inflow area, so that the heat dissipation capability of the first heat dissipation area is greater than the heat dissipation capability of the second heat dissipation area. In this way, in practical application, the heat dissipation effect difference caused by different fluid flows at all positions of the heat dissipation plate structure can be reduced, so that the heat dissipation effect is balanced in the first direction, the junction temperature difference is reduced, and the heat dissipation effect balancing capacity is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation plate structure, a power module and a cooling device. Background Art

[0002] Liquid cooling methods for electronic components are divided into two types: indirect and direct according to the basic form of contact. In particular, microchannel structures are often used to enhance the liquid cooling performance of high-power density modules. The turbulence problems and heat dissipation effects caused by pin-fin heat sinks have become issues of widespread concern.

[0003] In actual use of a traditional heat sink structure, the fluid flows from the fluid inlet area to the fluid outflow area and exchanges heat with the chip above the heat sink structure to cool the chip. During this process, the fluid flow rate flowing through different parts of the heat sink structure is not exactly the same, resulting in uneven heat dissipation of the chip and large temperature differences, which is not conducive to temperature uniformity. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a heat dissipation plate structure, a power module and a cooling device.

[0005] In a first aspect, an embodiment of the present invention provides a heat dissipation plate structure, comprising: a heat dissipation base plate, the heat dissipation base plate comprising a fluid inflow area, a fluid outflow area, and a heat dissipation area located between the fluid inflow area and the fluid outflow area, the heat dissipation area comprising a first heat dissipation region and a second heat dissipation region sequentially arranged along a first direction, the first heat dissipation region and the second heat dissipation region both being provided with heat dissipation pin fins;

[0006] Among them, the first direction is a direction perpendicular to the second direction, and the second direction is a direction from the fluid inflow area to the fluid outflow area; the equivalent convection heat transfer coefficient of the first heat dissipation area is greater than the equivalent convection heat transfer coefficient of the second heat dissipation area.

[0007] In combination with the first aspect, a width L1 of the first heat dissipation region in the first direction is less than or equal to a width L2 of the second heat dissipation region in the first direction;

[0008] The ratio of the width L2 to the width L1 ranges from 1 to 3.

[0009] In combination with the first aspect, the first heat dissipation area and the second heat dissipation area are both provided with a plurality of heat dissipation pin fins distributed at intervals;

[0010] The spacing SL1 between any two adjacent heat dissipation pin-fins in the first heat dissipation region is smaller than the spacing SL2 between any two adjacent heat dissipation pin-fins in the second heat dissipation region.

[0011] In combination with the first aspect, the ratio of the spacing SL2 to the spacing SL1 is in the range of 1.5-2; the value range of the spacing SL2 is 1.2 mm-1.8 mm; and the value range of the spacing SL1 is 0.8 mm-1.2 mm.

[0012] In combination with the first aspect, the thickness t1 of the heat dissipation base plate in the first heat dissipation region is greater than the thickness t2 of the heat dissipation base plate in the second heat dissipation region.

[0013] In combination with the first aspect, the ratio of the thickness t1 to the thickness t2 is in the range of 1.2-2.

[0014] In combination with the first aspect, the heat dissipation base plate in the first heat dissipation area is connected to the heat dissipation base plate in the second heat dissipation area through a rounded transition or a slope transition, and the slope has an inclination angle ranging from 90° to 120°.

[0015] In combination with the first aspect, the length H1 of the heat dissipation pin fins in the first heat dissipation region is greater than the length H2 of the heat dissipation pin fins in the second heat dissipation region.

[0016] In combination with the first aspect, the heat dissipation pin fins in the first heat dissipation region are configured to extend into the fluid groove and be spaced 0.5-1 mm from the bottom of the fluid groove;

[0017] The heat dissipation pin-fins in the second heat dissipation region are configured to extend into the fluid groove and be spaced 1.2-3.5 mm apart from the bottom of the fluid groove.

[0018] In combination with the first aspect, the cross-sectional shape of the heat dissipation pin fin is one of a diamond shape, an ellipse shape, a cross shape, and a circle shape.

[0019] In combination with the first aspect, the cross-sectional shape of the heat dissipation pin fins in the first heat dissipation region is a diamond, a cross, or a transverse ellipse, with the major axis of the transverse ellipse extending along the first direction; the cross-sectional shape of the heat dissipation pin fins in the second heat dissipation region is a longitudinal ellipse or a circle, with the major axis of the longitudinal ellipse extending along the second direction;

[0020] Alternatively, the first heat dissipation area includes a first sub-heat dissipation area and a second sub-heat dissipation area distributed in sequence along the second direction, the first sub-heat dissipation area is arranged closer to the fluid inflow area than the second sub-heat dissipation area, and both the first sub-heat dissipation area and the second sub-heat dissipation area are provided with heat dissipation pin fins; the second heat dissipation area includes a third sub-heat dissipation area and a fourth sub-heat dissipation area distributed in sequence along the second direction, the third sub-heat dissipation area is arranged closer to the fluid inflow area than the second sub-heat dissipation area, and both the third sub-heat dissipation area and the fourth sub-heat dissipation area are provided with heat dissipation pin fins; the cross-sectional shape of the heat dissipation pin fins in the fourth sub-heat dissipation area is a circular structure; the cross-sectional shape of the heat dissipation pin fins in the third sub-heat dissipation area is a longitudinal ellipse, and the long axis of the longitudinal ellipse extends along the second direction; the cross-sectional shape of the heat dissipation pin fins in the second sub-heat dissipation area is a cross or a diamond; the cross-sectional shape of the heat dissipation pin fins in the first heat dissipation area is a transverse ellipse, and the long axis of the transverse ellipse extends along the first direction.

[0021] In a second aspect, the present application provides a power module comprising the heat dissipation plate structure as described above.

[0022] The embodiments of the utility model bring the following beneficial effects: the utility model provides a heat sink structure, a power module and a cooling device, the heat sink structure including: a heat sink base plate, the heat sink base plate including a fluid inlet area, a fluid outflow area and a heat sink area located between the fluid inlet area and the fluid outflow area, the heat sink area including a first heat sink area and a second heat sink area arranged in sequence along a first direction, the first heat sink area and the second heat sink area are both provided with heat sink pin fins; wherein the first direction is a direction perpendicular to the second direction, and the second direction is a direction from the fluid inlet area to the fluid outflow area; the equivalent convection heat transfer coefficient of the first heat sink area is greater than the equivalent convection heat transfer coefficient of the second heat sink area.

[0023] In this embodiment, the first and second heat dissipation regions are sequentially distributed along a first direction perpendicular to the direction of fluid flow through the heat dissipation baseplate, and the equivalent convection heat transfer coefficient of the first heat dissipation region is greater than that of the second heat dissipation region, thereby increasing the heat dissipation capacity of the first heat dissipation region. This reduces the difference in heat dissipation effect caused by the different fluid flow rates on both sides of the heat dissipation plate structure in the first direction, thereby balancing the heat dissipation effect in the first direction, reducing junction temperature differences, and improving the heat dissipation balance capability.

[0024] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram of the heat dissipation plate structure provided by the utility model;

[0028] Figure 2 A schematic diagram of the distribution of the first heat dissipation area and the second heat dissipation area in a heat dissipation plate structure provided by the present invention;

[0029] Figure 3 A schematic diagram of the distance between two adjacent heat dissipation pin fins in a heat dissipation plate structure provided by the present invention;

[0030] Figure 4 A schematic diagram of the thickness of the heat dissipation base plate in each heat dissipation area of ​​a heat dissipation plate structure provided by the present invention;

[0031] Figure 5 A schematic diagram of the length of the heat dissipation pin fins in each heat dissipation area of ​​a heat dissipation plate structure provided by the present invention;

[0032] Figure 6 A schematic cross-sectional view of a heat dissipation pin-fin having a diamond-shaped topology in a heat dissipation plate structure provided by the present invention;

[0033] Figure 7 A schematic cross-sectional view of a heat dissipation pin-fin having a transverse elliptical topological structure in a heat dissipation plate structure provided by the present invention;

[0034] Figure 8 A schematic cross-sectional view of a heat dissipation pin-fin having a longitudinal elliptical topological structure in a heat dissipation plate structure provided by the present invention;

[0035] Figure 9 A schematic cross-sectional view of a heat dissipation pin-fin having a cross-shaped topology in a heat dissipation plate structure provided by the present invention;

[0036] Figure 10 A schematic diagram of a heat dissipation plate structure provided by the present invention divided into multiple heat dissipation areas;

[0037] Figure 11 A flow chart of a method for preparing the above-mentioned heat dissipation plate structure provided in an embodiment of the present invention;

[0038] Figure 12 Based on Figure 11 Schematic diagram of the target heat sink structure prepared by the provided method.

[0039] Reference numerals:

[0040] 1-heat dissipation base plate, 11-fluid inflow area, 12-fluid outflow area, 13-heat dissipation area, 131-first heat dissipation area, 1311-first sub-heat dissipation area, 1312-second sub-heat dissipation area, 132-second heat dissipation area, 1321-third sub-heat dissipation area, 1322-fourth sub-heat dissipation area, 14-heat dissipation pin fins, 15-groove. DETAILED DESCRIPTION

[0041] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the scope of protection of the present invention.

[0042] To facilitate understanding of this embodiment, the application scenarios and design concepts of the embodiment of this application are briefly introduced below.

[0043] Existing parallel water channels are perpendicular to the power module heat sink. When fluid enters the heat sink from the parallel water channels, eddies form, leading to uneven flow across the heat sink perpendicular to the fluid flow direction. For example, the side of the heat sink perpendicular to the fluid flow direction, closer to the parallel water channel inlet, has a smaller flow rate and poorer heat dissipation, while the side farther from the parallel water channel inlet has a larger flow rate and better heat dissipation. This results in uneven heat dissipation from the chip, large temperature variations, and poor temperature uniformity.

[0044] Based on this, embodiments of the present application provide a heat sink structure, a power module, and a cooling device.

[0045] The present application provides a heat dissipation plate structure, combined with Figure 1As shown, the heat sink structure includes: a heat sink base plate 1, the heat sink base plate 1 includes a fluid inflow area 11, a fluid outflow area 12 and a heat sink area 13; the heat sink area 13 is located between the fluid inflow area 11 and the fluid outflow area 12, and the heat sink area 13 includes a first heat sink area 131 and a second heat sink area 132 arranged in sequence along a first direction, and both the first heat sink area 131 and the second heat sink area 132 are provided with heat sink pin fins 14;

[0046] Among them, the first direction (combined with Figure 1 B direction) is combined with the second direction ( Figure 1 The second direction is perpendicular to the direction A shown in the figure, and the second direction is from the fluid inflow area 11 to the fluid outflow area 12; the equivalent convection heat transfer coefficient of the first heat dissipation area 131 is greater than the equivalent convection heat transfer coefficient of the second heat dissipation area 132.

[0047] In this embodiment, the heat dissipation area 13 includes a first heat dissipation area 131 and a second heat dissipation area 132 arranged in sequence along the first direction. It can also be understood that the heat dissipation area 13 includes the first heat dissipation area 131 and the second heat dissipation area 132 arranged in parallel in the second direction. One end of the heat dissipation pin fin 14 can be connected to the surface of the heat dissipation base plate 1, and the other end can extend in a direction away from the surface of the heat dissipation base plate 1; the equivalent convection heat transfer coefficient can be used to characterize the heat transfer capacity between the fluid and the solid wall. It can be understood that as the equivalent convection heat transfer coefficient increases, the heat dissipation effect improves; the equivalent convection heat transfer coefficient can include the Nusselt number Nu fin .

[0048] In this embodiment, the heat sink structure has a first heat sink area 131 and a second heat sink area 132 arranged in parallel along a first direction perpendicular to the direction from the fluid inflow area 11 to the fluid outflow area 12. The equivalent convection heat transfer coefficient of the first heat sink area 131 is greater than the equivalent convection heat transfer coefficient of the second heat sink area 132. In this way, on any cross-section of the heat sink base plate, the heat dissipation performance of the first heat sink area 131 along the first direction is better than the heat dissipation performance of the second heat sink area 132, which can compensate for the weakening of the heat dissipation performance caused by the small fluid flow rate on the side of the first heat sink area 131, thereby improving the heat dissipation uniformity of the heat sink structure on the same cross-section, reducing the temperature difference between chips with different tubes and / or the same tube, and facilitating temperature uniformity.

[0049] In combination with the first aspect, the width L1 of the first heat dissipation region 131 in the first direction is less than or equal to the width L2 of the second heat dissipation region 132 in the first direction; the ratio of the width L2 to the width L1 is in the range of 1-3.

[0050] In the first direction, combined Figure 2As shown, in the first direction, the width L2 of the second heat dissipation region 132 is greater than or equal to the width L1 of the first heat dissipation region 131 , and the width L1 accounts for one quarter to one half of the total width of the heat dissipation zone 13 .

[0051] By adjusting the width ratio of the first heat dissipation region 131 to the second heat dissipation region 132, the embodiment of the present application can adjust the fluid flow rate and flow rate per unit area within the first heat dissipation region 131 and the second heat dissipation region 132. This adjusts the equivalent convective heat transfer coefficient of the first heat dissipation region 131 to be greater than that of the second heat dissipation region 132, that is, adjusts the heat dissipation capacity of the first heat dissipation region 131 to be relatively greater than that of the second heat dissipation region 132. This can reduce the impact of different fluid flow rates on the heat dissipation effects of the various heat dissipation regions in the first direction, thereby achieving balanced heat dissipation capacity between the first heat dissipation region 131 and the second heat dissipation region 132 along the first direction and improving heat dissipation uniformity between different tubes and / or the same tube.

[0052] As can be understood, in a conventional heat sink structure for parallel water channels, in a first direction, a first heat sink region 131 and a second heat sink region 132 are arranged side by side along the first direction. The first heat sink region 131 can be configured to be located proximate to the fluid inflow end of a first fluid channel connected to the fluid inflow region 11, while the second heat sink region 132 can be configured to be located away from the fluid inflow end of the first fluid channel. The first fluid channel extends along the first direction, and multiple heat sink structures are connected in parallel in the above manner, thereby forming a parallel water channel. The fluid inflow regions 11 of two adjacent heat sink structures are respectively connected to the first fluid channel, which is spatially perpendicular to the heat sink structure. Fluid flows in the first fluid channel in a first direction, and after entering the heat sink structure, flows in a second direction. Therefore, during the fluid flow process, vortices are generated at the connection between the fluid inflow region 11 and the first fluid channel. The vortices change the direction of fluid flow and generate flow resistance, resulting in a reduced water flow rate on the side of the fluid inflow end near the first fluid channel. This results in uneven flow and pressure across the same cross-section in the first direction, leading to increased temperature differences in chips placed on the heat sink structure, such as chips on the same tube. The junction temperature of the single-tube chip at the fluid inflow end close to the first fluid channel was measured, and the junction temperature difference of the single-tube chip was about 11°C.

[0053] Combined with the first aspect: the first heat dissipation area 131 and the second heat dissipation area 132 are both provided with a plurality of heat dissipation pin fins distributed at intervals; the spacing SL1 between any two adjacent heat dissipation pin fins 14 in the first heat dissipation area 131 is less than the spacing SL2 between any two adjacent heat dissipation pin fins 14 in the first heat dissipation area 131 (combined with Figure 3 shown).

[0054] In combination with the first aspect, the ratio of the spacing SL2 to the spacing SL1 is in the range of 1.5-2; the value range of the spacing SL2 is 1.2 mm-1.8 mm; and the value range of the spacing SL1 is 0.8 mm-1.2 mm.

[0055] In this embodiment, the equivalent convection heat transfer coefficient of each heat dissipation area can be adjusted by adjusting the number of heat dissipation pin fins 14 in each heat dissipation area and the spacing between two adjacent heat dissipation pin fins 14, so as to obtain a heat dissipation plate structure with the same heat dissipation capacity in each heat dissipation area along the first direction.

[0056] In addition, combined Figure 3 As shown, ST1 is the distance between any two adjacent heat sink fins 14 in the first heat sink region 131 in the second direction, and ST2 is the distance between any two adjacent heat sink fins 14 in the second heat sink region 132 in the second direction. In this embodiment, ST1 = ST2. It is understood that the heat dissipation capacity of the heat sink region can be further adjusted by adjusting ST1 and ST2.

[0057] Combined with the first aspect: the thickness t1 of the heat dissipation base plate 1 in the first heat dissipation area 131 is greater than the thickness t2 of the heat dissipation base plate 1 in the second heat dissipation area 132 (combined with Figure 4 shown).

[0058] In combination with the first aspect, the ratio of thickness t1 to thickness t2 is in the range of 1.2-2; the heat dissipation base plate 1 in the first heat dissipation area 131 is connected to the heat dissipation base plate 1 in the second heat dissipation area 132 by a rounded transition or a slope transition, and the inclination angle of the slope is in the range of 90°-120°.

[0059] As the fluid flow cross-section decreases and the fluid velocity increases, the turbulence intensity will also be correspondingly enhanced, and the corresponding equivalent convective heat transfer coefficient will also increase. Therefore, in this embodiment, the thickness of the heat dissipation base plate 1 in each heat dissipation area can also be adjusted to adjust the fluid flow rate, thereby balancing the heat dissipation capacity of each heat dissipation area under the same cross-section. Specifically, by increasing t1 and / or decreasing t2, the fluid flow cross-section can be reduced in the first heat dissipation area 131 with relatively poor heat dissipation effect, thereby increasing the fluid flow rate and the equivalent convective heat transfer coefficient to achieve improved heat dissipation capacity. The fluid flow cross-section can be increased in the second heat dissipation area 132 with relatively strong heat dissipation effect, and the fluid flow rate can be reduced in the second heat dissipation area 132 with high fluid flow rate away from the fluid inlet. In this way, the difference in junction temperature between chips on the same tube can be reduced.

[0060] In addition, considering the factors of the extrusion cooling process capability and the actual temperature equalization effect, the heat dissipation base plate 1 in the first heat dissipation area 131 and the heat dissipation base plate 1 in the second heat dissipation area 132 in the first direction are connected by a rounded corner or a slope transition. At the same time, in order to ensure the heat dissipation effect, the angle α of the slope is in the range of 90°-120°.

[0061] In combination with the first aspect, the length H1 of the heat dissipation pin fins 14 in the first heat dissipation region 131 is greater than the length H2 of the heat dissipation pin fins 14 in the second heat dissipation region 132 (in combination with Figure 5 shown).

[0062] In combination with the first aspect, the heat dissipation pin fins 14 in the first heat dissipation region 131 are configured to extend into the fluid groove and be spaced 0.5-1 mm from the bottom of the fluid groove;

[0063] The heat dissipation pin fins 14 in the second heat dissipation region 132 are configured to extend into the fluid groove and be spaced 1.2-3.5 mm apart from the bottom of the fluid groove.

[0064] It is understandable that the smaller the gap between the heat sink fins 14 and the bottom of the fluid groove below the heat sink base plate 1 and the greater the flow rate, the better the heat dissipation effect. Therefore, the length H1 of the heat sink fins 14 in the first heat sink area 131 near the fluid inlet and the length H2 of the heat sink fins 14 in the second heat sink area 132 are adjusted to change the gap between the heat sink fins 14 and the groove bottom, thereby balancing the heat dissipation capacity of each heat sink area in the first direction and obtaining a heat sink structure with better temperature uniformity. The length of the heat sink fins 14 is reduced in the first heat sink area 131 where the flow rate is high to reduce the turbulence effect, thereby reducing the difference in junction temperature between chips on the same tube.

[0065] Considering the processing and assembly accuracy of the heat dissipation base plate 1 and the cooling device, the distance between the heat dissipation pin fins 14 and the groove bottom in each heat dissipation area is adjusted to at least 0.5 mm.

[0066] In combination with the first aspect, the cross-sectional shape of the heat dissipation pin fin 14 is a diamond shape (in combination with Figure 6 As shown), oval (combined Figure 7 The horizontal oval and Figure 8 Longitudinal oval shown), cross-shaped (combined with Figure 9 One of the ones shown).

[0067] It can be understood that when other conditions such as the number of pin fins and the length of pin fins are the same, the heat dissipation effects of the heat dissipation pin fins 14 with different cross-sectional shapes are different. Generally, the heat dissipation effect of the diamond-shaped heat dissipation pin fins 14 is greater than the heat dissipation effect of the cross-shaped heat dissipation pin fins 14 and the heat dissipation effect of the elliptical heat dissipation pin fins 14.

[0068] In combination with the first aspect, the cross-sectional shape of the heat dissipation pin fins 14 in the first heat dissipation region 131 is a diamond, a cross, or a transverse ellipse, with the major axis of the transverse ellipse extending along the first direction; the cross-sectional shape of the heat dissipation pin fins 14 in the second heat dissipation region 132 is a longitudinal ellipse or a circle, with the major axis of the longitudinal ellipse extending along the second direction;

[0069] Alternatively, the first heat dissipation area 131 includes a first sub-heat dissipation area 1311 and a second sub-heat dissipation area 1312 sequentially distributed along the second direction, the first sub-heat dissipation area 1311 is closer to the fluid inflow area 11 than the second sub-heat dissipation area 1312, and the first sub-heat dissipation area 1311 and the second sub-heat dissipation area 1312 are both provided with heat dissipation pin fins 14; the second heat dissipation area 132 includes a third sub-heat dissipation area 1321 and a fourth sub-heat dissipation area 1322 sequentially distributed along the second direction, the third sub-heat dissipation area 1321 is closer to the fluid inflow area than the fourth sub-heat dissipation area 1322 It is configured that heat dissipation pin fins 14 are provided in both the third sub-heat dissipation region 1321 and the fourth sub-heat dissipation region 1322; the cross-sectional shape of the heat dissipation pin fins 14 in the fourth sub-heat dissipation region 1322 is a circular structure; the cross-sectional shape of the heat dissipation pin fins 14 in the third sub-heat dissipation region 1321 is a longitudinal ellipse, and the major axis of the longitudinal ellipse extends along the second direction; the cross-sectional shape of the heat dissipation pin fins 14 in the second sub-heat dissipation region 1312 is a cross or a diamond; the cross-sectional shape of the heat dissipation pin fins 14 in the first heat dissipation region 131 is a transverse ellipse, and the major axis of the transverse ellipse extends along the first direction.

[0070] It can be understood that the heat dissipation effects of the first sub-heat dissipation area 1311 and the second sub-heat dissipation area 1312 in the first heat dissipation area 131 are relatively poor; the heat dissipation effects of the third sub-heat dissipation area 1321 and the fourth sub-heat dissipation area 1322 in the second heat dissipation area 132 are relatively good.

[0071] In this case, a topological form of heat dissipation pin-fins with better heat dissipation performance, such as a cross-shaped cross-section or a transversely elliptical structure with a major axis extending along the first direction, is arranged in the first heat dissipation region 131 to improve the heat dissipation capacity of the first heat dissipation region 131. At the same time, heat dissipation pin-fins with relatively poor heat dissipation performance, such as heat dissipation pin-fins 14 with a longitudinally elliptical or circular cross-section and a major axis extending along the second direction, can also be arranged in the second heat dissipation region 132.

[0072] Furthermore, the first heat dissipation area 131 and the second heat dissipation area 132 can be divided into a plurality of sub-heat dissipation areas along the second direction. Figure 10In this embodiment, the first heat dissipation region 131 is divided into a first sub-heat dissipation region 1311 and a second sub-heat dissipation region 1312 along the second direction; the second heat dissipation region 132 is divided into a third sub-heat dissipation region 1321 and a fourth sub-heat dissipation region 1322 along the second direction. Here, S3>S4≥S1≥S2; S1 represents the heat dissipation effect of the first sub-heat dissipation region 1311, S2 represents the heat dissipation effect of the second sub-heat dissipation region 1312, S3 represents the heat dissipation effect of the third sub-heat dissipation region 1321, and S4 represents the heat dissipation effect of the fourth sub-heat dissipation region 1322. In this case, the flow rate in areas with low fluid flow should be increased and / or the flow rate in areas with high heat dissipation medium flow should be decreased. At this time, the heat dissipation pin fins 14 with the best heat dissipation effect, that is, the heat dissipation pin fins 14 with a cross or diamond cross section are arranged in the second sub-heat dissipation area 1312 with the worst heat dissipation effect; the heat dissipation pin fins 14 with the worst heat dissipation effect, that is, the heat dissipation pin fins with a longitudinal elliptical cross section are arranged in the third sub-heat dissipation area 1321 with the best heat dissipation effect; the heat dissipation pin fins 14 with a circular cross section are arranged in the fourth sub-heat dissipation area 1322 with a heat dissipation effect second only to the third sub-heat dissipation area 1321, and the heat dissipation pin fins 14 with a transverse elliptical cross section are arranged in the first sub-heat dissipation area 1311 with a heat dissipation effect second only to the fourth sub-heat dissipation area 1322.

[0073] In this embodiment, for each heat dissipation area with different heat dissipation effects, heat dissipation pin-fins 14 of different topological forms are selected to achieve a uniform junction temperature of the chip on the heat dissipation plate structure.

[0074] In this embodiment, if Figure 6 The value range of the side length c of the rhombus shown is 0.9-2mm, deta≥45゜; Figure 9 The size d of the cross-shaped heat dissipation pin fin 14 shown in the figure ranges from 1.8 to 3.5 mm. Figure 7 The heat dissipation pin fin 14 of the transverse elliptical structure shown in the figure has a value range of 1.8-3 mm along the second direction of the long axis a and a value range of 0.9-3 mm along the first direction of the long axis b; Figure 8 The longitudinal elliptical heat dissipation pin fin 14 has a first longitudinal axis a ranging from 1.8 to 3 mm and a second longitudinal axis b ranging from 0.9 to 3 mm. It is understood that each dimension varies within a range depending on the fine-tooth processing capability and heat dissipation effect.

[0075] As you can understand, each dimension varies within a certain range based on the fine-pitch processing capability and heat dissipation effect. Thus, by updating the pin-fin topology and adjusting the pin-fin size differences based on the temperature difference (i.e., the difference in heat dissipation effect), the junction temperature of the chips on both sides can be kept consistent.

[0076] It can be understood that the heat dissipation plate structures provided in the above embodiments 1-4 can be used alone or in combination to improve the uniformity of junction temperature based on adjusting the width L of each heat dissipation area in the first direction, the thickness of the heat dissipation base plate, the shape of the heat dissipation pin fins 14, and the distance between two adjacent heat dissipation pin fins 14.

[0077] The heat dissipation plate structure provided in this embodiment can be prepared by the following method: Figure 11 As shown, the method specifically includes:

[0078] S110 , obtaining a heat dissipation effect simulation value of each sampling point on a heat dissipation plate structure configured with initial configuration parameters.

[0079] S120 , combining all the heat dissipation effect simulation values, and dividing the heat dissipation space into a plurality of heat dissipation areas.

[0080] S130 , for each heat dissipation area, determining a target configuration parameter according to the flow rate of the heat dissipation area.

[0081] S140 , processing the heat dissipation base plate according to the target configuration parameters to obtain a target heat dissipation plate structure.

[0082] The target heat dissipation base plate prepared based on the above scheme is as follows Figure 12 As shown, the heat dissipation effect is divided into multiple heat dissipation areas, and then the specific parameters corresponding to the heat dissipation areas are adjusted to obtain heat dissipation areas with relatively balanced heat dissipation effects, thereby improving the consistency of the chip junction temperature effect. Figure 12 The heat dissipation base plate 1 has a groove 15, and the space surrounded by the groove 15 is the overall heat dissipation space of the heat dissipation base plate 1.

[0083] A heat dissipation simulation experiment is performed on the heat dissipation base plate 1 configured with initial configuration parameters through simulation software, and a heat dissipation effect simulation value corresponding to each sampling point is obtained.

[0084] Among them, the heat dissipation medium in the heat dissipation base plate 1 is usually water, and the simulation software is water flow simulation software, which is used to simulate and analyze water flow behavior, such as fluid dynamics simulation software RealFlow, FLUENT, STAR-CCM and other environmental simulation software running on Windows system, thermal fluid system simulation software HYDRUS, etc.

[0085] In combination with the first aspect, step S120 includes:

[0086] S121: Acquire multiple preset heat dissipation effect thresholds.

[0087] S122 , combining all the heat dissipation effect simulation values ​​and a plurality of heat dissipation effect thresholds, and dividing the heat dissipation base plate into a set number of heat dissipation areas.

[0088] For each sampling point, the sampling point is compared with multiple heat dissipation effect thresholds to determine the interval in which the heat dissipation effect simulation value of the sampling point is located. It can be understood that the value of each interval is determined by two adjacent heat dissipation effect thresholds, and the number of intervals should be the number of heat dissipation effect thresholds plus 1. For example, in the heat dissipation plate structure of Example 1-3, the heat dissipation area is divided into two, so the corresponding heat dissipation effect threshold is 1. Based on the comparison relationship between the heat dissipation effect and the heat dissipation effect threshold, the heat dissipation space can be divided into a first heat dissipation area 131 and a second heat dissipation area 132. For example again: there are 3 heat dissipation thresholds, namely A, B, and C, then there should be four intervals, namely: less than A, A to B, B to C, and greater than C, and the number of heat dissipation areas obtained by division is four. Based on this, the heat dissipation area can be divided according to actual needs, and is not limited here.

[0089] In this embodiment, the number of heat dissipation areas is set to four (combined with Figure 3 As shown), specifically, areas 1 to 4, the direction of water flow is as follows Figure 1 Middle A direction.

[0090] The configuration parameters include at least one of the topological shape of the heat dissipation pin fins 14 , the length of the heat dissipation pin fins 14 , and the cross-sectional thickness of the heat dissipation base plate.

[0091] In conjunction with the second aspect, after step S140, the method further includes:

[0092] S210 , simulating the target heat sink structure to obtain a Nusselt number corresponding to the target heat sink structure.

[0093] S220 , determining a thermal resistance performance level of the pin fin based on a comparison relationship between the Nusselt number and a preset evaluation coefficient.

[0094] The evaluation of the thermal resistance performance of the pin-fin can be equivalent to evaluating the convective heat transfer coefficient of the pin-fin array and the substrate wall, that is, the Nusselt number Nu fin , Nu fin Based on this, a heat dissipation simulation is performed on the target heat dissipation plate structure to determine the thermal resistance performance level of the heat dissipation pin fin 14 by combining the Nusselt number obtained by the simulation with a plurality of preset evaluation coefficients.

[0095] In a second aspect, the present application provides a power module, which includes the heat dissipation plate structure as described above.

[0096] In a third aspect, the present application provides a cooling device, which includes a first fluid channel and the heat dissipation plate structure as described above;

[0097] The first fluid channel extends along the first direction, and the first fluid channel has a fluid outflow end close to the heat dissipation plate structure in the first direction and a fluid inflow end away from the heat dissipation plate structure in the first direction; the fluid outflow end of the first fluid channel is connected to the fluid inflow area 11 of the heat dissipation plate structure; in the first direction, the first heat dissipation area 131 is arranged closer to the fluid inflow end of the first fluid channel than the second heat dissipation area 132.

[0098] By connecting a plurality of the above-mentioned heat dissipation plate structures in parallel, uniform heat dissipation in the corresponding area of ​​each heat dissipation plate structure can be achieved, thereby improving the temperature uniformity of the chip to be cooled.

[0099] Furthermore, the present application also provides a cooling device, including a fluid groove and a heat sink structure as described above; the heat sink base plate 1 is installed at the groove of the fluid groove and is enclosed with the fluid groove to form a cooling channel; the heat sink pin fins 14 in the first heat sink area 131 extend into the fluid groove and are spaced 0.5-1mm from the bottom of the fluid groove; the heat sink pin fins 14 in the second heat sink area 132 extend into the fluid groove and are spaced 1.2-3.5mm from the bottom of the fluid groove.

[0100] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems and devices can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0101] In addition, in the description of the embodiments of the present invention, unless otherwise specified or limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; they can refer to mechanical connection or electrical connection; they can refer to direct connection or indirect connection through an intermediate medium; and they can refer to internal communication between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0102] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0103] Finally, it should be noted that the above embodiments are only specific implementation methods of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above embodiments within the technical scope disclosed by the present invention, or replace some of the technical features therein with equivalents. Such modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A heat dissipation plate structure, characterized in that: include: a heat dissipation base plate, the heat dissipation base plate comprising a fluid inflow area, a fluid outflow area, and a heat dissipation area located between the fluid inflow area and the fluid outflow area, the heat dissipation area comprising a first heat dissipation region and a second heat dissipation region sequentially arranged along a first direction, the first heat dissipation region and the second heat dissipation region both being provided with heat dissipation pin fins; The first direction is perpendicular to the second direction, the second direction is from the fluid inflow area to the fluid outflow area; the equivalent convection heat transfer coefficient of the first heat dissipation area is greater than the equivalent convection heat transfer coefficient of the second heat dissipation area.

2. The heat dissipation plate structure according to claim 1, characterized in that: A width L1 of the first heat dissipation region in the first direction is less than or equal to a width L2 of the second heat dissipation region in the first direction; The ratio of the width L2 to the width L1 ranges from 1 to 3.

3. The heat dissipation plate structure according to claim 1, characterized in that: The first heat dissipation area and the second heat dissipation area are both provided with a plurality of heat dissipation pin fins distributed at intervals; A distance SL1 between any two adjacent heat dissipation pin fins in the first heat dissipation region is smaller than a distance SL2 between any two adjacent heat dissipation pin fins in the second heat dissipation region.

4. The heat dissipation plate structure according to claim 3, characterized in that: The ratio of the spacing SL2 to the spacing SL1 is in the range of 1.5-2; the value range of the spacing SL2 is 1.2 mm-1.8 mm; and the value range of the spacing SL1 is 0.8 mm-1.2 mm.

5. The heat dissipation plate structure according to claim 1, characterized in that: A thickness t1 of the heat dissipation base plate in the first heat dissipation region is greater than a thickness t2 of the heat dissipation base plate in the second heat dissipation region.

6. The heat dissipation plate structure according to claim 5, characterized in that: The ratio of the thickness t1 to the thickness t2 is in the range of 1.2-2.

7. The heat dissipation plate structure according to claim 6, characterized in that: The heat dissipation base plate in the first heat dissipation area is connected to the heat dissipation base plate in the second heat dissipation area through a rounded transition or a slope transition, and the slope has an inclination angle ranging from 90° to 120°.

8. The heat dissipation plate structure according to claim 1, characterized in that: A length H1 of the heat dissipation pin fins in the first heat dissipation region is greater than a length H2 of the heat dissipation pin fins in the second heat dissipation region.

9. The heat dissipation plate structure according to claim 8, characterized in that: The heat dissipation pin fins in the first heat dissipation region are configured to extend into the fluid groove and be spaced 0.5-1 mm from the bottom of the fluid groove; The heat dissipation pin-fins in the second heat dissipation region are configured to extend into the fluid groove and be spaced 1.2-3.5 mm apart from the bottom of the fluid groove.

10. The heat dissipation plate structure according to claim 1, characterized in that: The cross-sectional shape of the heat dissipation pin fin is one of a diamond shape, an ellipse shape, a cross shape, and a circle shape.

11. The heat dissipation plate structure according to claim 10, characterized in that: The cross-sectional shape of the heat dissipation pin fins in the first heat dissipation region is a diamond, a cross, or a transverse ellipse, and the major axis of the transverse ellipse extends along the first direction; the cross-sectional shape of the heat dissipation pin fins in the second heat dissipation region is a longitudinal ellipse or a circle, and the major axis of the longitudinal ellipse extends along the second direction; Alternatively, the first heat dissipation area includes a first sub-heat dissipation area and a second sub-heat dissipation area sequentially distributed along the second direction, the first sub-heat dissipation area is arranged closer to the fluid inflow area than the second sub-heat dissipation area, and the first sub-heat dissipation area and the second sub-heat dissipation area are both provided with the heat dissipation pin fins; the second heat dissipation area includes a third sub-heat dissipation area and a fourth sub-heat dissipation area sequentially distributed along the second direction, the third sub-heat dissipation area is arranged closer to the fluid inflow area than the second sub-heat dissipation area, and the third sub-heat dissipation area and the fourth sub-heat dissipation area are both provided with the heat dissipation pin fins; the cross-sectional shape of the heat dissipation pin fins in the fourth sub-heat dissipation area is a circular structure; the cross-sectional shape of the heat dissipation pin fins in the third sub-heat dissipation area is a longitudinal ellipse, and the long axis of the longitudinal ellipse extends along the second direction; the cross-sectional shape of the heat dissipation pin fins in the second sub-heat dissipation area is a cross or a diamond; the cross-sectional shape of the heat dissipation pin fins in the first heat dissipation area is a transverse ellipse, and the long axis of the transverse ellipse extends along the first direction.

12. A power module, characterized in that: It comprises the heat dissipation plate structure according to any one of claims 1 to 11.

13. A cooling device, characterized in that: comprising a first fluid channel and a heat dissipation plate structure according to any one of claims 1 to 11; The first fluid channel extends along the first direction, and the first fluid channel has a fluid outflow end close to the heat dissipation plate structure in the first direction and a fluid inflow end away from the heat dissipation base plate in the first direction; the fluid outflow end of the first fluid channel is connected to the fluid inflow area of ​​the heat dissipation base plate; in the first direction, the first heat dissipation area is arranged closer to the fluid inflow end of the first fluid channel than the second heat dissipation area.

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