Mounting structure for transistor and circuit module

Abstract

The utility model relates to the technical field of circuits, and relates to a mounting structure for a transistor and a circuit module. The mounting structure comprises a seat body and a supporting bridge; the seat body is provided with a mounting groove for accommodating a transistor; the base body is provided with a mounting groove, the supporting bridge is connected to the base body, at least part of the supporting bridge is arranged in the mounting groove in a protruding mode, and the supporting bridge is used for elastically abutting against the side, facing the circuit board, of a welding pin of the transistor. The transistor can be supported through the supporting bridge of the mounting structure fixed on the circuit board, so that the mounting stability of the transistor can be improved, and the problem of stress concentration of the transistor is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuits, and in particular to a mounting structure and a circuit module for transistors. Background Art

[0002] At present, with the rapid development of power electronics technology, IGBT (Insulated Gate Bipolar Transistor) has been widely used in various power systems and control equipment as the main component of high-efficiency and high-reliability power switches.

[0003] However, as IGBTs continue to miniaturize, their solder pins shrink in size. Directly bending and soldering them to the PCB often leaves them suspended in the air, which can lead to pin breakage due to stress concentration. This problem is further exacerbated by the bumps during transportation and the additional stress from bolting and heat dissipation. Furthermore, as the thickness of the IGBT package decreases, the insulation layer also becomes thinner, posing a risk of failure in high-voltage applications. Traditional mounting methods are no longer sufficient, especially in applications requiring high heat dissipation performance.

[0004] Therefore, it is necessary to make improvements to the above problems in order to change the current situation. Utility Model Content

[0005] The utility model provides a mounting structure and a circuit module for transistors, which are used to solve the problem that as the design demand for miniaturization of IGBT transistors increases, small transistors are easily damaged by extra stress generated when they are fixed with bolts.

[0006] The utility model provides a mounting structure for a transistor, which includes:

[0007] The base body is provided with a mounting groove for accommodating the transistor; and

[0008] A support bridge is connected to the seat body, and at least a portion of the support bridge is protruded in the mounting groove. The support bridge is used to elastically press against a side of the transistor's soldering pins facing the circuit board.

[0009] According to one embodiment of the present invention, the seat body is further provided with an avoidance groove connected to the mounting groove, at least one end of the support bridge is connected to the inner wall of the avoidance groove, and at least a portion of the support bridge protrudes toward the mounting groove, and the support bridge is an elastic structure and is pressed against the transistor under elastic action.

[0010] According to one embodiment of the present invention, the mounting structure further includes a positioning protrusion, which is connected to the seat body and protrudes from the inner wall of the mounting groove toward the mounting groove, and the positioning protrusion is used to plug and cooperate with the positioning hole of the transistor.

[0011] According to an embodiment of the present invention, the mounting structure further includes a bottom hole portion, which is connected to the seat body and provided on one side of the seat body, and is used for being connected and fixed with a self-tapping screw.

[0012] The utility model also provides a circuit module, comprising:

[0013] circuit boards;

[0014] An IGBT transistor is welded and fixed to the circuit board, and at least a portion of the IGBT transistor is parallel to and spaced apart from the circuit board;

[0015] As described in any of the above-mentioned mounting structures, the mounting structure is fixedly connected to the circuit board via fasteners, and the welding pins of the IGBT transistor pass through the mounting structure and are fixedly connected to the circuit board and accommodated in the mounting groove, and the support bridge top of the mounting structure is tightly attached to the side of the IGBT transistor facing the circuit board.

[0016] According to one embodiment of the present invention, the welding pin of the IGBT transistor includes a first bent portion and a second bent portion connected in sequence, the second bent portion is passed through the mounting structure and is welded and fixed to the circuit board, the first bent portion is suspended in the mounting groove, and the bending radius of the first bent portion is greater than the bending radius of the second bent portion.

[0017] According to one embodiment of the present invention, the fastener includes a first fastener and a second fastener, the first fastener is self-tapping and is passed through the circuit board and fixedly connected to the mounting structure; the circuit board is provided with a mounting hole, and the second fastener is passed through the mounting structure and the mounting hole in sequence and is used to fix the mounting structure on the circuit board.

[0018] According to one embodiment of the present invention, the mounting structure includes a mounting seat and a metal reinforcement sleeve, the mounting groove is arranged in the mounting seat, and the mounting seat is provided with a fixing hole, the metal reinforcement sleeve is passed through the fixing hole, and the second fastener is passed through the metal reinforcement sleeve and the mounting hole in sequence.

[0019] According to an embodiment of the present invention, the circuit module further includes an insulating thermal pad and a heat dissipation upper shell, and the insulating thermal pad is provided between the heat dissipation upper shell and the IGBT transistor.

[0020] According to an embodiment of the present invention, the circuit module further includes a capacitor, which is welded and fixed on the circuit board. The capacitor and the mounting structure are spaced apart to form a glue-filling groove, and the glue-filling groove is used to be filled with fixing glue.

[0021] The implementation of the present invention has the following beneficial effects:

[0022] In the mounting structure of this embodiment, a support bridge that cooperates with the transistor is provided in the seat body. After the transistor is connected to the circuit board, the transistor can be supported by the support bridge of the mounting structure fixed on the circuit board, thereby improving the installation stability of the transistor and avoiding the problem of stress concentration in the transistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] in:

[0025] Figure 1 is a three-dimensional view of a circuit module in an embodiment of the present utility model;

[0026] Figure 2 is a top view of the circuit module in an embodiment of the present utility model;

[0027] Figure 3 1 is an exploded view of a circuit module in an embodiment of the present utility model;

[0028] Reference numerals:

[0029] 1. Circuit module; 10. Mounting structure; 100. Mounting seat; 110. Seat body; 111. Mounting slot; 112. Avoidance slot; 113. Fixing hole; 120. Support bridge; 130. Positioning protrusion; 140. Bottom hole; 200. Metal reinforcement sleeve; 210. Flat gasket; 220. Metal insert; 221. Positioning knurling; 20. Circuit board; 21. Mounting hole; 30. IGBT transistor; 31. Positioning hole; 32. First bend; 33. Second bend; 40. First fastener; 50. Second fastener; 60. Capacitor; 70. Fixing glue. DETAILED DESCRIPTION

[0030] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will be combined with the accompanying drawings to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] See Figures 1 to 3 As shown, an embodiment of the present invention provides a mounting structure 10 for a transistor, which includes a seat body 110 and a support bridge 120; the seat body 110 is provided with a mounting groove 111 for accommodating the transistor; the support bridge 120 is connected to the seat body 110, and the support bridge 120 is at least partially protruded in the mounting groove 111, and the support bridge 120 is used to elastically press against the side of the transistor's welding pin facing the circuit board 20.

[0032] In the prior art, the IGBT transistor 30 is usually fixedly connected to the circuit board 20 after the pins are bent 90°. In this case, part of the structure of the IGBT transistor 30 is suspended on one side of the circuit board 20, and the entire weight of the IGBT transistor 30 is borne by the bent pins of the IGBT transistor 30. Therefore, this installation method will cause stress concentration on the pins of the IGBT transistor 30, which is not conducive to the stable installation of the IGBT transistor 30.

[0033] In the mounting structure 10 of this embodiment, a support bridge 120 that cooperates with the transistor is provided in the seat body 110. After the transistor is connected to the circuit board 20, the transistor can be supported by the support bridge 120 of the mounting structure 10 fixed on the circuit board 20, thereby improving the installation stability of the transistor and avoiding the problem of stress concentration in the transistor.

[0034] Specifically, the seat body 110 is also provided with an avoidance groove 112 connected to the installation groove 111. At least one end of the support bridge 120 is connected to the inner wall of the avoidance groove 112, and the support bridge 120 is at least partially protruded toward the installation groove 111. The support bridge 120 is an elastic structure and is pressed against the transistor under the elastic action.

[0035] With this arrangement, the avoidance groove 112 can serve as a space for accommodating the deformation of the support bridge 120, and since there is a gap between the support bridge 120 and the inner wall of the avoidance groove 112, when the IGBT transistor 30 is combined with the mounting seat 100, the heat generated by the IGBT transistor 30 can be dissipated through the gap, thereby further improving the heat dissipation effect of the mounting structure 10.

[0036] In a preferred embodiment, the cross-section of the support bridge 120 is a trapezoidal structure. At this time, the end of the support bridge 120 can be connected to the inner wall of the avoidance groove 112, and the structure where the support bridge 120 abuts against the IGBT transistor 30 protrudes toward the inner side of the installation groove 111 and contacts the IGBT transistor 30 to realize the positioning and supporting function of the support bridge 120.

[0037] In one embodiment, the mounting structure 10 further includes a positioning protrusion 130 , which is connected to the base body 110 and protrudes from the inner wall of the mounting groove 111 toward the mounting groove 111 . The positioning protrusion 130 is used to plug and mate with the positioning hole 31 of the transistor.

[0038] In this embodiment, by providing a positioning protrusion 130 to cooperate with the positioning hole 31 of the IGBT transistor 30, when the IGBT transistor 30 is installed in the mounting structure 10, the installation of the IGBT transistor 30 can be positioned by the positioning protrusion 130. Since the positioning protrusion 130 cooperates with the positioning hole 31, in some embodiments, the IGBT transistor 30 can be fixed without additional fasteners such as screws. As a result, the fastener is connected to the mounting base 100, resulting in stress concentration between the fastener and the IGBT transistor 30, thereby achieving the purpose of reducing the internal stress of the IGBT transistor 30 and improving the reliability of the IGBT transistor 30.

[0039] In one embodiment, the mounting structure 10 further includes a bottom hole portion 140 . The bottom hole portion 140 is connected to the base body 110 and is disposed on one side of the base body 110 . The bottom hole portion 140 is used for connection and fixation with a self-tapping screw.

[0040] It is understood that in the mounting structure 10 of this embodiment, when the mounting structure 10 is connected to the circuit board 20, the bottom hole portion 140 of the mounting base 100 can be aligned with the hole position of the circuit board 20. Then, a self-tapping screw is passed through the circuit board 20 from the other side and connected to the bottom hole portion 140. This can fix the mounting base 100 to the circuit board 20, making assembly and disassembly convenient. In a preferred embodiment, the mounting structure 10 can be made of plastic to achieve lightweight mounting structure 10 and also provide insulation.

[0041] The present invention also provides a circuit module 1, which includes a circuit board 20, an IGBT transistor 30 and a mounting structure 10 according to any one of the above embodiments; the IGBT transistor 30 is welded and fixed to the circuit board 20, and the IGBT transistor 30 is at least partially parallel to the circuit board 20 and arranged at a distance; the mounting structure 10 is fixedly connected to the circuit board 20 by fasteners, and the welding pins of the IGBT transistor 30 pass through the mounting structure 10 and are fixedly connected to the circuit board 20 and accommodated in the mounting groove 111, and the support bridge 120 of the mounting structure 10 is pressed against the side of the IGBT transistor 30 facing the circuit board 20.

[0042] It can be understood that in the circuit module 1 of this embodiment, by setting the mounting structure 10 in any one of the above embodiments, the mounting structure 10 of this embodiment sets a support bridge 120 that cooperates with the transistor in the seat body 110. After the transistor is connected to the circuit board 20, the transistor can be supported by the support bridge 120 of the mounting structure 10 fixed on the circuit board 20, thereby improving the installation stability of the transistor and avoiding the problem of stress concentration in the transistor, thereby improving the reliability of the circuit module 1 and facilitating the transfer and transportation of the circuit module 1.

[0043] Furthermore, the welding pin of the IGBT transistor 30 includes a first bending portion 32 and a second bending portion 33 connected in sequence, the second bending portion 33 is passed through the mounting structure 10 and is welded and fixed to the circuit board 20, the first bending portion 32 is suspended in the mounting groove 111, and the bending radius of the first bending portion 32 is greater than the bending radius of the second bending portion 33.

[0044] In this embodiment, the solder pins of the IGBT transistor 30 are configured with first and second bends 32, 33 having different degrees of bending. Due to the larger bending radius of the first bend 32, the stress between the first bend 32 and the device structure of the IGBT transistor 30 is reduced, preventing the device structure from bending and cracking. This also increases the elasticity of the solder pins, facilitating installation. In one embodiment, the first bend 32 bends in a first direction, while the second bend 33 bends in a second direction. This allows the solder pins to maintain a 90-degree angle with the surface of the device structure of the IGBT transistor 30 after both bends, facilitating the installation and layout of the IGBT transistor 30.

[0045] Specifically, the fasteners include a first fastener 40 and a second fastener 50. The first fastener 40 is self-tapping and is passed through the circuit board 20 to be fixedly connected to the mounting structure 10. The circuit board 20 is provided with a mounting hole 21. The second fastener 50 is passed through the mounting structure 10 and the mounting hole 21 in sequence and is used to fix the mounting structure 10 on the circuit board 20.

[0046] When installing the circuit module 1 of this embodiment, the mounting structure 10 is first aligned with the circuit board 20. At this time, the bottom hole portion 140 corresponds to the mounting hole 21 of the circuit board 20, and the avoidance groove 112 of the mounting seat 100 also corresponds to the mounting hole 21. Then, the first fastener 40 is passed through the circuit board 20 from one side of the circuit board 20 and connected to the bottom hole portion 140, so that the mounting structure 10 can be pre-positioned. Then, the second fastener 50 is passed through the mounting structure 10 and the mounting hole 21 to further fix the mounting structure 10 and the circuit board 20. After the two are fixed, a stable and reliable circuit module 1 is formed. At this time, the IGBT transistor 30 is installed in the mounting groove 111 of the mounting seat 100, and the soldering pins of the IGBT transistor 30 are passed through the mounting structure 10 and aligned with the soldering pads on the circuit board 20. After soldering is completed, the IGBT transistor 30 and the mounting structure 10 can be combined to form a complete circuit module 1.

[0047] In one embodiment, the mounting structure 10 includes a mounting base 100 and a metal reinforcement sleeve 200, the mounting groove 111 is provided in the mounting base 100, and the mounting base 100 is provided with a fixing hole 113, the metal reinforcement sleeve 200 is passed through the fixing hole 113, and the second fastener 50 is passed through the metal reinforcement sleeve 200 and the mounting hole 21 in sequence.

[0048] In a preferred embodiment, since the mounting base 100 is made of plastic material, the strength of the mounting base 100 is limited. By providing a metal reinforcement sleeve 200 in the mounting base 100 to cooperate with it, the metal reinforcement sleeve 200 can serve as a structure for connecting the mounting structure 10 with external fasteners, thereby reducing the direct force on the entire mounting base 100, thereby improving the overall strength of the mounting structure 10.

[0049] Furthermore, the circuit module 1 further includes an insulating thermal pad and a heat dissipation upper shell, wherein the insulating thermal pad is provided between the heat dissipation upper shell and the IGBT transistor 30 .

[0050] In this embodiment, the heat dissipation upper shell can adopt a structure such as an aluminum shell, and the combined structure of the mounting structure 10 and the IGBT transistor 30 is fitted with the heat dissipation upper shell. At this time, by providing an insulating thermal pad between the heat dissipation upper shell and the IGBT transistor 30, the thermal conductivity between the IGBT transistor 30 and the heat dissipation upper shell can be improved.

[0051] Specifically, the metal reinforcement sleeve 200 includes a flat gasket 210 and a metal insert 220. The metal insert 220 is embedded in a mounting base 100 made of plastic. The flat gasket 210 is arranged on the side of the mounting structure 10 away from the circuit board 20. The second fastener 50 is passed through the metal insert 220 and connected to the circuit board 20. The outer wall of the metal insert 220 is provided with a positioning knurl 221.

[0052] In this embodiment, by setting a positioning knurl 221 on the outer side of the metal insert 220, during the injection molding process of the mounting base 100, the metal insert 220 can be directly placed in the molding mold of the mounting base 100 to improve the connection strength between the mounting base 100 and the metal insert 220, and the preparation is convenient.

[0053] In one embodiment, the circuit module 1 further includes a capacitor 60 , which is fixed to the circuit board 20 by welding. The capacitor 60 is spaced apart from the mounting structure 10 to form a glue-filling groove for filling with a fixing glue 70 .

[0054] It can be understood that in the circuit module 1, the capacitor 60 is an essential component. By setting a fixing glue 70 in the gap between the capacitor 60 and the mounting structure 10, the capacitor 60 and the mounting structure 10 can be further fixed after the fixing glue 70 is cured, thereby improving the overall strength of the circuit module 1 and avoiding undesirable phenomena such as accidental breakage and separation of components on the circuit module 1 due to the loose internal structure of the circuit module 1 during transportation.

[0055] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0056] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0057] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A mounting structure for a transistor, characterized in that: It includes: The seat body is provided with a mounting groove for accommodating the transistor; as well as A support bridge is connected to the seat body, and at least a portion of the support bridge is protruded in the mounting groove. The support bridge is used to elastically press against a side of the transistor's soldering pins facing the circuit board.

2. The mounting structure for a transistor according to claim 1, wherein: The seat body is also provided with an avoidance groove connected to the mounting groove. At least one end of the support bridge is connected to the inner wall of the avoidance groove, and at least part of the support bridge protrudes toward the mounting groove. The support bridge is an elastic structure and is pressed against the transistor under elastic action.

3. The mounting structure for a transistor according to claim 1, wherein: The mounting structure further includes a positioning protrusion, which is connected to the seat body and protrudes from the inner wall of the mounting groove toward the inside of the mounting groove. The positioning protrusion is used to be plugged into the positioning hole of the transistor.

4. The mounting structure for a transistor according to claim 1, wherein: The mounting structure further includes a bottom hole portion, which is connected to the seat body and is arranged on one side of the seat body. The bottom hole portion is used for connecting and fixing with a self-tapping screw.

5. A circuit module, characterized in that: include: circuit boards; An IGBT transistor is welded and fixed to the circuit board, and at least a portion of the IGBT transistor is parallel to and spaced apart from the circuit board; The mounting structure according to any one of claims 1 to 4, wherein the mounting structure is fixedly connected to the circuit board via fasteners, and the welding pins of the IGBT transistor pass through the mounting structure and are fixedly connected to the circuit board and accommodated in the mounting groove, and the support bridge of the mounting structure is tightly attached to the side of the IGBT transistor facing the circuit board.

6. The circuit module according to claim 5, characterized in that: The welding pin of the IGBT transistor includes a first bent portion and a second bent portion connected in sequence, the second bent portion is passed through the mounting structure and is welded and fixed to the circuit board, the first bent portion is suspended in the mounting groove, and the bending radius of the first bent portion is greater than the bending radius of the second bent portion.

7. The circuit module according to claim 5, wherein: The fastener includes a first fastener and a second fastener, the first fastener is self-tapping and is passed through the circuit board and fixedly connected to the mounting structure; the circuit board is provided with a mounting hole, and the second fastener is passed through the mounting structure and the mounting hole in sequence and is used to fix the mounting structure on the circuit board.

8. The circuit module according to claim 7, wherein: The mounting structure includes a mounting seat and a metal reinforcement sleeve, the mounting groove is arranged in the mounting seat, and the mounting seat is provided with a fixing hole, the metal reinforcement sleeve is passed through the fixing hole, and the second fastener is sequentially passed through the metal reinforcement sleeve and the mounting hole.

9. The circuit module according to claim 5, wherein: The circuit module further includes an insulating thermal pad and a heat dissipation upper shell, wherein the insulating thermal pad is arranged between the heat dissipation upper shell and the IGBT transistor.

10. The circuit module according to any one of claims 5 to 9, characterized in that: The circuit module further includes a capacitor, which is fixed on the circuit board by welding. The capacitor is spaced apart from the mounting structure to form a glue-filling groove, and the glue-filling groove is used to be filled with fixing glue.

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