Pre-arranging support, vacuum assembly and pressing device

Abstract

The utility model discloses a pre-arrangement support, a vacuum assembly and a press fit device.The pre-arrangement support comprises a stand column and at least two bearing structures, the stand column is vertically arranged, the bearing structures are movably arranged on the stand column in the extending direction of the stand column, and the bearing structures are used for supporting core plates so as to adjust the distance between every two adjacent core plates. By arranging the stand columns and arranging the bearing structures on the stand columns, the bearing structures can be used for bearing the core plates, and the gaps between the core plates can be adjusted by adjusting the positions of the bearing structures on the stand columns, so that on one hand, the core plates of all layers can meet the design requirement of medium thickness; the liquid resin is used for filling the gaps among the core plates and then pressing the core plates, and the cured liquid resin can improve the uniformity of the core plate structure, so that the problem that the medium thickness of a part with a small residual copper rate is too thin is solved, and the filling effect of the resin is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a pre-arranged bracket, a vacuum assembly and a pressing device. Background Art

[0002] PCBs typically require the core board and prepreg to be pressed together. During the pressing process, the resin in the prepreg softens due to high temperature, reducing its viscosity and allowing it to flow and fill the open areas. After etching the core board, areas with a high residual copper ratio (copper area / total area) have less resin filling, while areas with a low residual copper ratio have more resin filling, which results in a thinner dielectric thickness. When the core board has a thicker copper thickness (for example, up to 3 oz), at a similar residual copper ratio, the greater the core board's copper thickness, the larger the empty volume that needs to be filled with resin, resulting in a thinner dielectric thickness. This not only reduces dielectric uniformity, but also affects the reliability of the finished PCB, such as impedance, insertion loss, and withstand voltage.

[0003] In the related art, in order to make the dielectric thickness of the PCB more uniform, a method is usually adopted to first apply resin in the gaps of the core board surface pattern, and then vacuum and cure it. However, this solution has at least the following problems: when the resin is applied to the surface of the core board, due to the fluidity of the liquid resin, the coating thickness is unstable, which can easily cause the dielectric thickness to exceed the tolerance range. Therefore, there is an urgent need for an auxiliary tool that can pre-arrange the core boards and fix the pre-arranged multi-layer core boards to facilitate the filling of the core boards with resin. Utility Model Content

[0004] In order to solve at least one of the above technical problems, the present application provides a pre-arrangement bracket, a vacuum assembly and a pressing device. The pre-arrangement bracket can pre-arrange the core board and fix the pre-arranged multi-layer core board to facilitate the filling of the core board with resin. The technical solution adopted is as follows.

[0005] The pre-arranged bracket provided in the first aspect of the present application includes a column and at least two supporting structures, the column is vertically arranged, the supporting structure is movably arranged on the column along the extension direction of the column, and the supporting structure is used to support the core board to adjust the distance between two adjacent core boards.

[0006] In certain embodiments of the first aspect of the present application, the pre-arranged bracket includes at least one pair of spaced-apart columns, the space formed between the two columns is used to set the core board, and a light-transmitting structure is provided on the supporting structure, and the light-transmitting directions of the light-transmitting structures on the two columns are collinearly arranged.

[0007] In certain embodiments of the first aspect of the present application, the light-transmitting structure includes a light-transmitting through hole, and the light-transmitting through hole is filled with a light-transmitting filling member.

[0008] In certain embodiments of the first aspect of the present application, the pre-arranged bracket further includes a support member, both ends of which are respectively connected to the two supporting structures on the same layer of a pair of columns, and the support member is used to support the core panel.

[0009] In certain embodiments of the first aspect of the present application, a supporting groove is provided on the supporting structure, the supporting groove is spaced apart from the light-transmitting structure, and both ends of the supporting member are disposed in the supporting groove.

[0010] In certain embodiments of the first aspect of the present application, the pre-row bracket further includes a horizontally arranged base, the column is arranged on the base, and the pre-row bracket includes a plurality of the columns, which are arranged at intervals around the periphery of the base.

[0011] In certain embodiments of the first aspect of the present application, the pre-arranged bracket further includes a plurality of clamping structures arranged on the column, the clamping structures and the supporting structures are alternately arranged along the extension direction of the column, the clamping structures are used to abut against the top surface of each layer of core board, and the clamping structure on the top surface and the supporting structure on the bottom surface of each layer of core board are used to clamp and fix the core board.

[0012] In the second aspect, the present application also provides a vacuum assembly, comprising a sealing bag and the pre-arrangement bracket provided in the first aspect, wherein a accommodating space is formed in the sealing bag, and the accommodating space is used to place the pre-arrangement bracket and the pre-arrangement plate, and the sealing bag is provided with a liquid suction port and a first vacuum port connected to the accommodating space.

[0013] In certain embodiments of the second aspect of the present application, the vacuum assembly further includes a pressure vessel and a liquid storage tank, the pressure vessel being used to accommodate the sealed bag, a first opening being provided in the pressure vessel, the liquid suction port being exposed from the first opening, the liquid suction port being connected to the liquid storage tank, the pressure vessel further being provided with a second opening for exposing the first vacuum port, and a second vacuum port for vacuuming the pressure vessel, the first opening, the second opening, and the second vacuum port being arranged at intervals.

[0014] In a third aspect, the present application further provides a pressing device, comprising a press and the pre-arranged bracket provided in the first aspect, wherein a sealed cabin is formed in the press, and the sealed cabin is used to heat and pressurize the core plate and the pre-arranged bracket.

[0015] The embodiments of the present application have at least the following beneficial effects: by setting up columns and setting up supporting structures on the columns, the supporting structures can be used to support the core boards, and by adjusting the position of the supporting structures on the columns, the gaps between the core boards can be adjusted. On the one hand, each layer of core board can meet the design requirements of dielectric thickness, and the core boards are pressed after being filled with liquid resin into the gaps between each layer of core board. The solidified liquid resin can improve the uniformity of the core board structure, thereby overcoming the problem of too thin dielectric thickness in areas with low residual copper rates, improving the filling effect of the resin, and enabling the PCB board product to meet reliability indicators such as dielectric thickness uniformity, impedance, insertion loss, and withstand voltage. On the other hand, compared to the method of stacking semi-cured sheets between two adjacent core boards, the use of pre-arranged brackets to adjust the distance between the core boards can improve the flexibility of adjusting the spacing between the core boards. There is no need to purchase semi-cured sheets of different thicknesses to meet the needs of setting different gaps between the core boards, thereby improving the practicality and convenience of pre-arrangement of the core boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The aspects and advantages described and / or attached in the embodiments of the present application will become apparent and easily understood in conjunction with the following drawings. It should be noted that the embodiments embodied in the following drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0017] Figure 1 A schematic diagram of the structure of the pre-arranged bracket provided in an embodiment of the present application;

[0018] Figure 2 A schematic diagram of pre-arrangement of core panels using pre-arrangement brackets provided in an embodiment of the present application;

[0019] Figure 3 A top view of the pre-arranged bracket provided in an embodiment of the present application;

[0020] Figure 4 A schematic structural diagram of the supporting structure of the pre-arranged bracket provided in an embodiment of the present application;

[0021] Figure 5 A schematic structural diagram of a first example of a vacuum assembly provided in an embodiment of the present application;

[0022] Figure 6 A schematic structural diagram of a second example of a vacuum assembly provided in an embodiment of the present application;

[0023] Figure 7 A schematic diagram of a pressing device provided in an embodiment of the present application.

[0024] 1. The support structure is as follows: 100, pre-arranged bracket; 10, column; 20, supporting structure; 21, light-transmitting structure; 22, supporting groove; 30, supporting member; 40, base; 50, clamping structure; 200, vacuum assembly; 201, sealing bag; 2010, accommodating space; 2011, liquid suction port; 2012, first vacuum port; 203, pressure vessel; 2031, first opening; 2032, second opening; 2033, second vacuum port; 204, liquid storage tank; 205, vacuum equipment; 206, buffer device; 207, electric valve; 208, liquid level measuring instrument; 209, controller; 300, pressing device; 301, press; 3010, sealed cabin; 3011, pressure pump; 3012, heating device; 3013, exhaust device; 400, core board. DETAILED DESCRIPTION

[0025] The following combination Figures 1 to 7 Embodiments of the present application are described in detail, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limiting the present application.

[0026] In the description of this application, it should be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, "multiple" means two or more.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0028] In the prior art, to achieve a more uniform dielectric thickness on a PCB, a common approach is to first apply resin to the gaps between the patterns on the surface of the core substrate 400, and then press-cure the core substrate 400. This approach presents the following issues: First applying liquid resin and then laminating the core substrate 400 leads to an unstable coating thickness due to the fluidity of the liquid resin, which can easily cause the dielectric thickness to exceed the tolerance range, making it difficult to resolve the uneven dielectric thickness issue. This can also make it difficult for the dielectric thickness to meet design requirements, and it can be difficult to guarantee the performance of the PCB product.

[0029] Based on this, the present application proposes a pre-arrangement bracket 100 suitable for a PCB board manufacturing method of sealing and filling pre-arranged core boards 400 with liquid resin, wherein sealing and filling pre-arranged core boards 400 with liquid resin specifically refers to first pre-arranging the core boards 400 according to the stacking order of the PCB board design, then placing the pre-arranged core boards 400 into a sealing bag 201 and sealing it, vacuuming the sealing bag 201, thereby utilizing the negative pressure to draw the liquid resin into the sealing bag 201 and fill it into the gaps between the core boards 400, and finally subjecting the sealing bag 201 containing the core boards 400 to high temperature and high pressure pressing, so that the liquid resin solidifies to achieve the pressing of the core boards 400. In this process, the pre-arrangement bracket 100 can arrange the core boards 400, thereby enabling the above-mentioned PCB board manufacturing method to be realized and improving the dielectric thickness uniformity of the PCB board.

[0030] Therefore, see Figures 1 to 3 In a first aspect, the present application provides a pre-arranged bracket 100, comprising a column 10 and at least two supporting structures 20. The column 10 is vertically arranged, and the supporting structure 20 is movably arranged on the column 10 along the extension direction of the column 10. The supporting structure 20 is used to support the core board 400 to adjust the distance between two adjacent layers of the core board 400. By providing the column 10 and arranging the supporting structure 20 on the column 10, the core board 400 can be supported by the supporting structure 20, and the gap between the core boards 400 can be adjusted by adjusting the position of the supporting structure 20 on the column 10. On the one hand, each layer of the core board 400 can meet the design requirements of the dielectric thickness. After the gap between each layer of the core board 400 is filled with liquid resin, the core board 400 is pressed together. The solidified liquid resin can improve the uniformity of the core board 400 structure, thereby overcoming the problem of too thin dielectric thickness in areas with a small residual copper rate, improving the filling effect of the resin, and enabling the PCB board product to meet reliability indicators such as dielectric thickness uniformity, impedance, insertion loss, and withstand voltage. On the other hand, compared with the method of stacking semi-cured sheets between two adjacent core panels 400, the use of pre-arrangement brackets 100 to adjust the distance between the core panels 400 can improve the flexibility of adjusting the spacing between the core panels 400. In response to the need to set different gaps between the core panels 400, there is no need to purchase semi-cured sheets of different thicknesses, thereby improving the practicality and convenience of the pre-arrangement operation of the core panels 400.

[0031] Exemplarily, the supporting structure 20 and the column 10 can be connected by sliding connection, snap connection, etc. For example, when the sliding connection is adopted, the supporting structure 20 adjusts its position by sliding, and the supporting structure 20 maintains its position by using static friction between itself and the column 10. When the snap connection is adopted, the column 10 can be provided with multiple slots along the height direction, and the supporting structure 20 adjusts its position by snapping with different slots, and maintains its position by snapping with the slots. This is not limited here.

[0032] Optionally, in order to improve the accuracy of adjusting the position of the supporting structure 20 on the column 10, a scale can be set on the column 10, and the position of the supporting structure 20 can be determined by using the scale, thereby achieving precise adjustment of the gap between the core plates 400.

[0033] In some embodiments, see Figure 4 ,in, Figure 4 (a) and Figure 4 (c) is a front view of the supporting structure 20, Figure 4 (b) and Figure 4 (d) is a side view of the supporting structure 20. The pre-arrangement bracket 100 includes at least one pair of columns 10 arranged at intervals. The space formed between the two columns 10 is used to set the core board 400. The supporting structure 20 is provided with a light-transmitting structure 21. The light-transmitting directions of the light-transmitting structures 21 on the two columns 10 are arranged collinearly. The use of the columns 10 arranged at intervals to support the core board 400 can further improve the stability and balance of the support for the core board 400. For example, the shape of the core board 400 is generally rectangular, and the two columns 10 can be arranged on the adjacent two sides, opposite two sides or diagonal corners of the core board 400, so that the core board 400 is subjected to more uniform force during pre-arrangement.

[0034] On this basis, since at least two parts of the core plate 400 are supported by the supporting structure 20, in order to ensure that the core plate 400 has good levelness and that adjacent core plates 400 are parallel to each other, it is necessary to adjust and detect the levelness of the core plate 400. By utilizing the light-transmitting structure 21 provided on the supporting structure 20 on the two columns 10, a light-emitting device can be provided on the outer side of the column 10 and a photosensitive device can be provided on the outer side of the other column 10. When the light-emitting device is turned on, horizontal light can be emitted. By adjusting the supporting structure 20 on the column 10, light can pass through the light-transmitting structure 21 of the supporting structure 20 on the two columns 10 in sequence to reach the photosensitive device. By utilizing the interaction between the light emitting device and the photosensitive device, when the supporting structure 20 is adjusted to the point where the photosensitive device can detect light, it means that the supporting structures 20 on both sides of the same core board 400 are at the same horizontal height. At this time, the opposite sides of the core board 400 can be at the same horizontal height, thereby achieving adjustment and detection of the horizontality of the core board 400, meeting the accuracy requirements of the pre-arrangement of the core board 400, and improving the manufacturing quality of the PCB board. By arranging the light emitting device and the photosensitive device on the outside of the column 10, it is possible not to affect the arrangement of the core boards 400 between the columns 10, so that the light emitting device and the photosensitive device will not interfere with each other between the core boards 400. By using light alignment to adjust the horizontality, the horizontality detection of the core board 400 can be achieved without adding a physical structure, thereby simplifying the structure of the pre-arrangement bracket 100 and making the operation process of adjusting and detecting the horizontality of the core board 400 simpler.

[0035] It is understood that the inner and outer sides of the column 10 are relative to the position of the core plate 400. The side of the column 10 facing the core plate 400 is the inner side, and the side facing away from the core plate 400 is the outer side. For example, the light-transmitting structure 21 can be a light-transmitting through hole, light-transmitting groove, etc. provided on the supporting structure 20. The light-transmitting direction of the light-transmitting structure 21 runs through the inner and outer sides of the column 10, that is, the light-transmitting direction is from the outer side of the column 10 to the inner side of the column 10, or from the inner side of the column 10 to the outer side of the column 10. The detection light can be a laser. The laser has good penetrating power and can maintain parallelism, thereby improving the reliability of the levelness detection of the core plate 400.

[0036] In some embodiments, in order to prevent the liquid resin from entering the light-transmitting structure 21 during the filling process, the light-transmitting structure 21 can be configured as a solid structure with a light-transmitting effect. Taking the light-transmitting through hole as an example, the light-transmitting structure 21 includes a light-transmitting through hole, and the light-transmitting through hole is filled with a light-transmitting filler. The light-transmitting filler can fill the entire light-transmitting through hole, and the supporting structure 20 is made of an opaque material. In this way, the light-transmitting structure 21 can not only allow the detection light to pass through, but also form a solid structure to prevent the liquid resin from entering the light-transmitting through hole during filling, causing the light-transmitting through hole to be blocked, which is beneficial to the recycling of the pre-arranged bracket 100.

[0037] Since the columns 10 and the supporting structure 20 are arranged on the periphery of the core board 400, they play a supporting and fixing role on the periphery of the core board 400. When the area of ​​the core board 400 is large, the middle area of ​​the core board 400 is prone to concave under the action of its own gravity due to lack of support, thereby causing the core board 400 to warp and deform. Therefore, in some embodiments, the pre-arranged bracket 100 also includes a support member 30, and the two ends of the support member 30 are respectively connected to the two supporting structures 20 on the same layer of a pair of columns 10, and the support member 30 is used to support the core board 400. By arranging the support member 30 between the two columns 10, the support member 30 can be used to provide support to the middle area of ​​the core board 400, thereby improving the overall support strength of the core board 400, making the support force distribution of the core board 400 more uniform, avoiding the concave deformation of the core board 400, and thus improving the manufacturing accuracy and manufacturing yield of the PCB board.

[0038] In some embodiments, please refer to Figure 4 (c) and Figure 4 (d) In order to improve the connection stability between the support member 30 and the supporting structure 20, a support groove 22 is provided on the supporting structure 20, and the support groove 22 is spaced apart from the light-transmitting structure 21, and the two ends of the support member 30 are arranged in the support groove 22. In this way, the two ends of the support member 30 can be snapped into the mounting groove, which can avoid relative sliding between the support member 30 and the supporting structure 20, thereby preventing the support member 30 from sliding off the supporting structure 20. When a light-transmitting through hole is provided on the supporting structure 20, the mounting groove and the light-transmitting through hole can be spaced apart, so that the setting of the mounting groove and the light-transmitting through hole can not interfere with each other. Exemplarily, the support member 30 can be a rod or a plate, and the mounting groove can be set to a shape (circular groove, square groove, etc.) that is adapted to the cross-sectional shape of the support member 30 according to the specific shape of the support member 30 (round rod, square rod, etc.).

[0039] In some embodiments, the pre-arranged bracket 100 also includes a horizontally arranged base 40, and the column 10 is arranged on the base 40. The pre-arranged bracket 100 includes a plurality of columns 10, and the plurality of columns 10 are arranged at intervals around the periphery of the base 40. The base 40 can fix the columns 10 and support the core board 400. The bottom plate and the column 10 can be assembled or disassembled in a detachable connection manner, further improving the flexibility of the assembly of the pre-arranged bracket 100. Optionally, a size mark can also be set on the base 40, and the size mark can be used to adjust the position of the column 10 on the base 40 according to the size of the core board 400 to ensure that the column 10 can stably support the core board 400. The column 10 can be fixed to the base 40 by screws, snaps, etc.

[0040] In some embodiments, the pre-arranged support 100 includes at least one group of columns 10 disposed on opposite sides of the core panel 400. A group of columns 10 can provide support for the opposite sides of the core panel 400, thereby improving the balance and stability of the core panel 400 after arrangement. For example, the core panel 400 can be a rectangular structure, thus having two opposite sets of opposite sides. Multiple groups of columns 10 can be provided. Multiple groups of columns 10 can be provided on only one set of opposite sides of the core panel 400, and the multiple groups of columns 10 can be provided at intervals. Of course, columns 10 can also be provided on both sets of opposite sides of the core panel 400 for support, thereby further improving the stability of the arrangement of the core panel 400. Furthermore, multiple groups of columns 10 can also be provided along the outer periphery of the core panel 400, which helps to improve the stability and alignment accuracy of the arrangement of the core panel 400.

[0041] In some embodiments, the pre-arrangement bracket 100 further includes a plurality of clamping structures 50 disposed on the column 10. The clamping structures 50 and the supporting structures 20 are alternately disposed along the extension direction of the column 10. The clamping structures 50 are used to abut against the top surface of each layer of core panels 400. The clamping structures 50 on the top surface and the supporting structures 20 on the bottom surface of each layer of core panels 400 are used to clamp and fix the core panels 400. By utilizing the joint clamping effect of the clamping structures 50 and the supporting structures 20 on the upper and lower surfaces of the core panels 400, on the one hand, the accuracy of the gap adjustment during the pre-arrangement of the core panels 400 can be improved. On the other hand, the contact area between the core panels 400 and the pre-arrangement bracket 100 can be increased, thereby improving the stability of the core panels 400 during pre-arrangement. When filling with liquid resin, the core panels 400 of two adjacent layers can be prevented from moving or interfering with each other, thereby improving the effect of filling the pre-arrangement panel with resin.

[0042] Optionally, the clamping structure 50 can adopt the same structure as the supporting structure 20. For example, the connection method between the clamping structure 50 and the column 10 can be the same as that of the supporting structure 20 (for example, sliding connection, snap connection, etc.). A light-transmitting structure 21 can also be provided on the clamping structure 50 to adjust and detect the horizontality of the clamping structure 50 on the same layer on the two columns 10.

[0043] As an optional embodiment, after the core board 400 is pre-arranged, the core board 400 and the pre-arrangement bracket 100 are placed in the press 301 together and pressed under high temperature and high pressure. The multi-layer core board 400 is connected as a whole under the bonding effect of the cured resin, and the core board 400 and the pre-arrangement bracket 100 are also connected as a whole. Finally, the pre-arrangement bracket 100 can be removed by milling, including removing the column 10, the clamping structure 50, the supporting structure 20 and the base 40. The core board 400 can also be designed with edge material reserved around it, and the edge material can be milled off during milling. At this time, the pre-arrangement bracket 100 attached to the edge material can be removed together, and the finished PCB board is finally obtained.

[0044] The pre-arrangement bracket 100 is removed and has the scrap of the core panel 400 attached to it. In order to recycle the pre-arrangement bracket 100, the scrap of the core panel 400 attached to the pre-arrangement bracket 100 can be removed. Specifically, before using the pre-arrangement bracket 100 to pre-arrange the core panel 400, magnetic inactivation glue can be coated on the surface of the pre-arrangement bracket 100, and the pre-arrangement bracket 100 can be heated to solidify the magnetic inactivation glue. After the pre-arrangement bracket 100 is removed by milling the edges of the pressed core panel 400, the scrap of the core panel 400 still remains in the pre-arrangement bracket 100. At this time, the pre-arrangement bracket 100 with the scrap of the core panel 400 attached is placed in an alternating magnetic field to melt the magnetic inactivation glue and separate the scrap of the core panel 400 from the pre-arrangement bracket 100, so that the pre-arrangement bracket 100 can be recycled.

[0045] The principle behind recycling the pre-arranger 100 in this manner is as follows: after curing, the magnetically inactivated glue remains on the surface of the pre-arranger 100. The magnetically inactivated glue contains iron oxide particles, which are heated in a magnetic field of a specific oscillating frequency, causing the glue to melt and lose its adhesiveness. By pre-coating the magnetically inactivated glue on the surface of the pre-arranger 100 and curing it, when the core panels 400 are arranged in the pre-arranger 100, the presence of the magnetically inactivated glue prevents direct contact between the core panels 400 and the pre-arranger 100. Instead, the magnetically inactivated glue isolates the core panels 400 from the pre-arranger 100. When the pre-arranger 100 needs to be recycled, the magnetically inactivated glue is simply melted, thereby releasing the adhesive bond between the core panel 400 scrap and the pre-arranger 100. The pre-arranger 100 can then be separated from the scrap, allowing the pre-arranger 100 to be recycled. For example, the pre-arranged bracket 100 with the core board 400 scrap attached thereto can be placed into a conveyor belt, and an alternating magnetic field with a certain oscillation frequency is applied to the area of ​​the conveyor belt, so that the iron oxide particles in the magnetically inactivated glue are exposed to the alternating magnetic field and the iron oxide particles are heated to melt the magnetically inactivated glue.

[0046] Second, see Figure 5 and Figure 6The present application further provides a vacuum assembly 200, comprising a sealing bag 201 and the pre-arrangement bracket 100 provided in the first aspect. A accommodating space 2010 is formed in the sealing bag 201, and the accommodating space 2010 is used to place the pre-arrangement bracket 100 and the pre-arrangement plate. The sealing bag 201 is provided with a liquid suction port 2011 and a first vacuum port 2012 connected to the accommodating space 2010. The pre-arrangement plate is accommodated in the sealing bag 201. First, before the pre-arrangement plate is filled with liquid resin, the sealing bag 201 can be vacuumed to expel the air in the gaps between the core plates 400 in the pre-arrangement plate, thereby avoiding the generation of bubbles or bulges when filling with liquid resin, thereby improving the filling quality of the liquid resin. Secondly, the sealing effect of the sealing bag 201 can also be used to suck the liquid resin into the sealing bag 201 through vacuum, and the liquid resin can be filled into the gaps of the core board 400 by utilizing the fluidity of the resin under the action of negative pressure. This solves the problem of small gaps where the resin cannot be filled and form voids or pits, improves the resin filling effect, and makes the dielectric thickness of the core board 400 more uniform after lamination. Finally, the sealing bag 201 can prevent the liquid resin from being lost before being pressed and cured, thereby solving the problem of unstable thickness of the liquid resin in the preset gap, avoiding excessive dielectric thickness, and also avoiding the problem of too thin dielectric thickness in areas with low residual copper rate, which helps to improve the dielectric thickness uniformity of the PCB board.

[0047] In some embodiments, the vacuum assembly 200 further includes a pressure vessel 203 and a liquid storage tank 204. The pressure vessel 203 is used to accommodate the sealed bag 201. The pressure vessel 203 is provided with a first opening 2031, through which the liquid suction port 2011 is exposed. The liquid suction port 2011 is connected to the liquid storage tank 204. The pressure vessel 203 is further provided with a second opening 2032 for exposing the first vacuum port 2012, and a second vacuum port 2033 for vacuuming the pressure vessel 203. The first opening 2031, the second opening 2032, and the second vacuum port 2033 are spaced apart. The liquid storage tank 204 can be used to store liquid resin. The liquid storage tank 204 can be connected to the liquid suction port 2011 of the inner bag via a pipe. During the vacuuming process of the inner bag, the liquid resin can enter the inner bag and fill the gaps between the core plates 400 of the pre-arranged board. The pressure vessel 203 itself has a certain rigidity. On the one hand, it can support and fix the sealing bag 201 during the vacuuming process, thereby improving the stability of the sealing bag 201 during the vacuuming process. On the other hand, the pressure vessel 203 itself can be vacuumed, so that the sealing bag 201 can be attached to the inner wall of the pressure vessel 203, providing sufficient space for the flow of liquid resin in the sealing bag 201, thereby improving the filling effect of the liquid resin. On this basis, the sealing bag 201 can be set as a flexible bag. The flexible sealing bag 201 has a certain deformation ability, which can help adapt to the shape of the core plate 400. When the flexible sealing bag 201 is vacuumed, the flexible sealing bag 201 can be attached to the outer surface of the core plate 400, which helps to better retain the liquid resin filled in the gap of the core plate 400, and further prevent the liquid resin from leaking from the gap before solidification.

[0048] In some embodiments, the vacuum assembly 200 further includes a vacuum pump 205, an electric valve 207, a liquid level meter 208, and a controller 209. The electric valve 207 is connected to the liquid suction port 2011 of the inner bag. The electric valve 207 is configured to be opened to allow liquid resin to enter the inner bag, or closed to prevent the liquid resin from flowing into the inner bag. The liquid level meter 208 can be used to detect the vacuum level in the inner bag. The electric valve 207 is opened only when the vacuum level in the inner bag reaches a preset value. This ensures that the inner bag has a sufficient vacuum level before the liquid resin enters the inner bag, preventing residual air in the inner bag from causing bubbles when the liquid resin is filled, thereby ensuring that the liquid resin can achieve a good filling effect.

[0049] Optionally, both the liquid level meter 208 and the electric valve 207 are electrically connected to a controller 209. The controller 209 uses the liquid level meter 208 to detect the vacuum level of the inner bag. When the air pressure in the inner bag exceeds a preset value, the electric valve 207 remains closed, preventing liquid resin from entering the inner bag. The inner bag is evacuated until the vacuum level reaches a preset value. At this point, the controller 209 controls the electric valve 207 to open, allowing the vacuum device 205 to draw liquid resin into the inner bag to fill the gaps between the sub-plates. For example, a conductive liquid (e.g., mercury) can be placed in the liquid level meter 208. Changes in the liquid level of the conductive liquid can generate different electrical signals, thereby enabling detection of the vacuum level of the inner bag.

[0050] Optionally, a buffer device 206 may be provided between the vacuuming device 205 and the first vacuuming port 2012 of the inner bag. The buffer device 206 is used to store the liquid resin waste extracted from the inner bag, and the resin volatiles can be discharged after condensation.

[0051] Thirdly, please refer to Figure 7 The present application also provides a pressing device 300, which includes a press 301 and the dense pre-arranged bracket 100 provided in the first aspect. A sealed cabin 3010 is formed in the press 301, and the sealed cabin 3010 is used to heat, pressurize and press the core board 400 and the pre-arranged bracket 100. By using the sealed cabin 3010, the cabin can be pressurized and heated, so that the core boards 400 can be pressed against each other under the action of high temperature and high pressure to form a finished PCB board. Exemplarily, the press 301 can be a cabin pressure press 301, which has a sealed cabin 3010 structure.

[0052] In some embodiments, inert gas can be introduced into the press 301 during operation. The inert gas does not react with the core plate 400, resin, etc. The inert gas can be pressurized and heated by the pressure pump 3011 and the heating device 3012, and then introduced into the chamber pressure press 301 after reaching the set pressure and temperature. In a high temperature and high pressure environment, the pressing effect of the pre-arranged plate can be further improved. Figure 7 , Figure 7 The middle arrow indicates the flow direction of the high-temperature, high-pressure inert gas. The inert gas can be introduced through the top, bottom, and peripheral sides of the cabin-pressurized press 301, creating a surrounding airflow around the sealed bag 201 and pre-assembled sheets placed in the cabin-pressurized press 301. This ensures more uniform heating and pressure distribution during the press-fit process, thereby improving the press-fit quality of the pre-assembled sheets. The cabin-pressurized press 301 can also be equipped with an exhaust device 3013 connected to the cabin to extract the inert gas and control the air pressure within the cabin.

[0053] In some embodiments, the sealing bag 201 can be vacuumed before or during the pressing process. By utilizing the liquid storage function of the buffer device 206, the waste liquid formed after the volatile gas in the sealing bag 201 is cooled and the overflowed part of the resin in the sealing bag 201 after the heat expansion can be discharged into the buffer device 206, thereby avoiding the volatile gas and overflowed resin from affecting the pressing quality of the pre-arrangement board, and further improving the pressing effect of the pre-arrangement board.

[0054] In the description of this specification, if the reference terms "one embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" appear, it means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0055] The above describes the implementation methods of the present application in detail in conjunction with the accompanying drawings, but the present application is not limited to the above implementation methods. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present application.

[0056] In the description of this application, if the "," appears in the patent title, it indicates an "and" relationship, not an "or" relationship. For example, if the patent title is "A, B", it means that the content protected by this application is: the technical solution of the subject name A and the technical solution of the subject name B.

Claims

1. A pre-arranged bracket, characterized in that: include A column, wherein the column is arranged vertically; At least two supporting structures are movably arranged on the columns along the extension direction of the columns, and the supporting structures are used to support the core panels to adjust the distance between two adjacent core panels.

2. The pre-arranged bracket according to claim 1, characterized in that: The pre-arranged bracket includes at least one pair of columns arranged at intervals, the space formed between the two columns is used to set the core board, and a light-transmitting structure is provided on the supporting structure, and the light-transmitting directions of the light-transmitting structures on the two columns are arranged collinearly.

3. The pre-arranged bracket according to claim 2, characterized in that: The light-transmitting structure includes a light-transmitting through hole, and the light-transmitting through hole is filled with a light-transmitting filling member.

4. The pre-arranged bracket according to claim 3, characterized in that: The pre-arranged bracket further includes a support member, both ends of which are respectively connected to the two supporting structures on the same layer of a pair of columns, and the support member is used to support the core plate.

5. The pre-arranged bracket according to claim 4, characterized in that: The supporting structure is provided with a supporting groove, the supporting groove is spaced apart from the light-transmitting structure, and both ends of the supporting member are arranged in the supporting groove.

6. The pre-arranged bracket according to any one of claims 1 to 5, characterized in that: The pre-row bracket further includes a horizontally arranged base, the upright column is arranged on the base, and the pre-row bracket includes a plurality of upright columns, which are arranged at intervals around the periphery of the base.

7. The pre-arranged bracket according to any one of claims 1 to 5, characterized in that: The pre-arranged bracket also includes a plurality of clamping structures arranged on the column. The clamping structures and the supporting structures are alternately arranged along the extension direction of the column. The clamping structures are used to abut against the top surface of each layer of core board. The clamping structure on the top surface and the supporting structure on the bottom surface of each layer of core board are used to clamp and fix the core board.

8. A vacuum assembly, characterized in that: It comprises a sealing bag and a pre-arrangement bracket as described in any one of claims 1 to 7, wherein a accommodating space is formed in the sealing bag, the accommodating space is used to place the pre-arrangement bracket and the pre-arrangement plate, and the sealing bag is provided with a liquid suction port and a first vacuum port connected to the accommodating space.

9. The vacuum assembly according to claim 8, wherein: The vacuum assembly also includes a pressure vessel and a liquid storage tank. The pressure vessel is used to accommodate the sealed bag. A first opening is provided in the pressure vessel, and the liquid suction port is exposed from the first opening. The liquid suction port is connected to the liquid storage tank. The pressure vessel is also provided with a second opening for exposing the first vacuum port, and a second vacuum port for vacuuming the pressure vessel. The first opening, the second opening and the second vacuum port are arranged at intervals.

10. A pressing device, characterized in that: It comprises a press and the pre-arranged bracket according to any one of claims 1 to 7, wherein a sealed cabin is formed in the press, and the sealed cabin is used to heat, pressurize and bond the core plate and the pre-arranged bracket.

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