Wafer scrubbing device

Abstract

The utility model relates to a wafer scrubbing device which comprises an upper scrubbing part and a lower scrubbing part which are respectively arranged above and below a wafer, a spraying part used for spraying cleaning liquid to the upper surface and the lower surface of the wafer, a synchronizing shaft, a rotation driving part and a lifting driving part, the upper scrubbing part and the lower scrubbing part are respectively connected to the synchronizing shaft, and formed scrubbing ends are aligned up and down. On one hand, the upper and lower scrubbing parts are matched with the synchronizing shaft, so that the upper and lower scrubbing parts can be flexibly adjusted to ensure that a scrubbing area matched with a wafer is formed between the upper and lower scrubbing parts, the scrubbing device is suitable for scrubbing wafers of different specifications, and the scrubbing effect is effectively improved; on the other hand, based on alignment of the upper and lower scrubbing ends, the upper and lower scrubbing parts synchronously rotate around the center line of the synchronizing shaft, so that the stress positions of the upper and lower surfaces of the wafer are accurately aligned, the wafer is effectively prevented from being deformed and damaged, and the product yield is improved.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment, and in particular relates to a wafer scrubbing device. Background Art

[0002] A wafer, also known as a wafer due to its round shape, is the chip used in the manufacture of semiconductor chips and integrated circuits. By creating various circuit structures on the wafer surface, it can be transformed into electronic components with specific electrical functions. The wafer production process typically involves slicing, grinding, polishing, and cleaning.

[0003] In the last cleaning step, both the front and back sides of the wafer need to be cleaned. The wafer brushing device used in the existing technology generally includes a wafer clamping part, an upper brushing part arranged above the wafer, and a lower brushing part arranged below the wafer. Therefore, when the wafer is clamped and fixed by the clamping part, the upper and lower brushing parts brush the front and back sides of the wafer respectively. After brushing is completed, the wafer is taken out for spin drying or drying.

[0004] However, in the actual production process, the existing upper and lower brushes generally rotate around the vertical axis or move linearly along the horizontal plane to adjust the brushing area on the wafer surface, but cannot be adjusted in the up and down directions. Therefore, the thickness of the brushing space formed between the upper and lower brushes cannot be adaptively adjusted according to the thickness of wafers of different specifications or the wear of the brushes. It is easy for the upper and lower brushes to have insufficient contact with the wafers or excessive squeezing of the wafers, resulting in poor brushing effect or damage to the wafers. In addition, the existing upper and lower brushes are generally driven by independent power mechanisms, which cannot form a linkage and are prone to position errors, making it difficult to accurately align the force points on the upper and lower surfaces of the wafer. As a result, the upper and lower surfaces of the wafer are unevenly stressed, and deformation and damage may also occur. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved wafer scrubbing device.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A wafer scrubbing device comprises an upper scrubbing component and a lower scrubbing component respectively arranged above and below the wafer, and a spray component for spraying cleaning liquid onto the upper and lower surfaces of the wafer. The scrubbing device also comprises a synchronous shaft, a rotating drive component and a lifting drive component. The synchronous shaft is vertically extended, and the upper scrubbing component and the lower scrubbing component are respectively connected to the synchronous shaft, and the scrubbing ends formed are aligned up and down, wherein the upper scrubbing component and / or the lower scrubbing component can be arranged to move up and down along the synchronous shaft; the rotating drive component drives the upper scrubbing component and the lower scrubbing component to rotate synchronously around the center line of the synchronous shaft; the lifting drive component drives the upper scrubbing component and / or the lower scrubbing component to move up and down along the synchronous shaft, and maintains a scrubbing area matching the wafer between the upper scrubbing component and the lower scrubbing component.

[0008] According to a specific implementation and preferred aspect of the present invention, one of the upper brushing component and the lower brushing component is fixedly connected to the synchronization shaft, and the other of the two is movably connected to the synchronization shaft up and down. The rotating drive component drives the synchronization shaft to rotate and drives the upper brushing component and the lower brushing component to rotate synchronously.

[0009] Preferably, the upper brush component is fixedly connected to the top of the synchronous shaft; an adjustment slot extending vertically and matching the connection end of the lower brush component is formed in the middle of the synchronous shaft. The lower brush component is inserted into the adjustment slot and can be adjusted up and down along the adjustment slot. Here, by fixing the synchronous shaft to the upper brush component and constraining the lower brush component with the adjustment slot, the upper and lower brush components can rotate synchronously with the rotation of the synchronous shaft, resulting in a simple structure and easy assembly and implementation.

[0010] According to another specific implementation and preferred aspect of the present invention, the rotary drive component includes a rotary seat arranged to rotate around a vertical center line, a drive motor connected to the bottom of the rotary seat, and the synchronous shaft is fixedly connected to the top of the rotary seat from the bottom end.

[0011] According to another specific implementation and preferred aspect of the present invention, the lifting drive component includes a connecting module that is sleeved on the outer periphery of the synchronization shaft and fixedly connected to the lower brushing component, and a driving cylinder fixedly arranged on the rotating seat, wherein the telescopic end of the driving cylinder is fixedly connected to the connecting module, and the driving cylinder drives the connecting module to move up and down along the synchronization shaft, and the lower brushing component moves up and down synchronously.

[0012] Furthermore, the lifting drive assembly includes a lifting rail, a lifting base that slides up and down on the lifting rail, and an electric cylinder for driving the lifting base to slide up and down, wherein the rotation drive assembly is disposed on the lifting base. Thus, the height of the upper and lower scrubbing components can be adjusted synchronously according to the specific position of the wafer, providing great flexibility.

[0013] According to another specific implementation and preferred aspect of the present invention, the upper brushing part and the lower brushing part have the same structure, wherein the upper brushing part and the lower brushing part each include a connecting arm perpendicular to the synchronization shaft, a brush and a two-fluid nozzle arranged at one end of the connecting arm away from the synchronization shaft.

[0014] Preferably, the upper and lower brushes are synchronously driven by the same drive motor.

[0015] Specifically, the synchronous shaft is a hollow shaft, and the drive motor is fixedly arranged at one end of the synchronous shaft, wherein the output shaft of the drive motor is inserted into the inner cavity of the synchronous shaft and is respectively connected to the upper and lower brushes through transmission belts. In this way, space utilization is high and installation and implementation are convenient.

[0016] In addition, the spraying component includes multiple spray heads distributed above and below the wafer, each of which can be flipped up and down to adjust the spray angle, ensuring that the cleaning liquid is sprayed accurately and covers the upper and lower surfaces of the wafer.

[0017] Due to the implementation of the above technical solution, the utility model has the following advantages compared with the prior art:

[0018] The existing upper and lower brushes generally rotate around the vertical axis or move linearly along the horizontal plane to adjust the brushing area on the wafer surface, but cannot be adjusted in the up and down directions. Therefore, the thickness of the brushing space formed between the upper and lower brushes cannot be adaptively adjusted according to the thickness of wafers of different specifications or the wear of the brushes. It is easy for the upper and lower brushes to have insufficient contact with the wafers or excessive squeezing of the wafers, resulting in poor brushing effect or damage to the wafers. In addition, the existing upper and lower brushes are generally driven by independent power mechanisms, which cannot form a linkage and are prone to position errors, making it difficult to accurately align the force points on the upper and lower surfaces of the wafer. As a result, the upper and lower surfaces of the wafer are unevenly stressed, and deformation and damage may also occur. The present application makes an overall design of the structure of the wafer scrubbing device, which cleverly solves the shortcomings and defects of the existing technology. After the wafer scrubbing device is adopted, after the wafer is clamped, the upper and / or lower scrubbing parts are driven by the lifting drive component to move up and down along the synchronous axis to adjust the distance between the upper and / or lower scrubbing parts and the wafer, and to maintain a scrubbing area that matches the wafer between the upper and lower scrubbing parts; then the spray component is opened to spray cleaning liquid onto the upper and lower surfaces of the wafer, and the upper and lower scrubbing parts are driven by the rotating drive component to rotate synchronously around the center line of the synchronous axis to perform the scrubbing operation. Therefore, compared with the existing technology, the present invention can flexibly adjust the upper and lower scrubbing parts to ensure that a scrubbing area that matches the wafer is formed between the upper and lower scrubbing parts through the cooperation of the upper and lower scrubbing parts and the synchronous axis, thereby being suitable for scrubbing wafers of different specifications and effectively improving the scrubbing effect; on the other hand, based on the alignment of the upper and lower scrubbing ends, the upper and lower scrubbing parts are synchronously rotated around the center line of the synchronous axis to ensure that the force positions of the upper and lower surfaces of the wafer are accurately aligned, effectively avoiding wafer deformation and damage, and improving product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the three-dimensional structure of the wafer scrubbing device of this embodiment;

[0020] Figure 2 FIG. 1 is a schematic diagram of the three-dimensional structure of the wafer scrubbing device of this embodiment from another perspective (partially omitted);

[0021] Wherein: 1, upper brushing part; 2, lower brushing part; a0, connecting arm; a1, brush; s, driving motor; a2, nozzle;

[0022] 3. Spray components;

[0023] 4. Synchronous shaft; c. Adjustment slot;

[0024] 5. Rotating drive component; 50. Rotating seat; 51. Driving motor;

[0025] 6. Lifting drive component; 60. Connecting module; 61. Driving cylinder; 62. Lifting guide rail; 63. Lifting seat; 64. Driving electric cylinder;

[0026] Y. Wafer. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0030] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0031] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher horizontal height than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower horizontal height than the second feature. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0032] like Figure 1 and Figure 2 As shown, a wafer scrubbing device of this embodiment includes an upper scrubbing component 1, a lower scrubbing component 2, a spray component 3, a synchronization shaft 4, a rotation drive component 5, and a lifting drive component 6.

[0033] Specifically, after wafer Y is clamped and fixed by any conventional clamping mechanism (not shown in the figure, but it is not difficult to imagine), the upper brushing component 1 and the lower brushing component 2 are respectively arranged above and below wafer Y, wherein the upper brushing component 1 and the lower brushing component 2 have the same structure or are arranged symmetrically up and down, and the formed brushing ends are aligned up and down. The upper brushing component 1 and the lower brushing component 2 both include a connecting arm a0 perpendicular to the synchronous shaft 4, a brush a1 and a two-fluid nozzle a2 arranged at the end of the connecting arm a0 away from the synchronous shaft 4, wherein the upper and lower brushes a1 are synchronously driven by the same drive motor s. Here, the brush and the nozzle that sprays the two fluids are combined for brushing, which effectively improves the efficiency and quality of brushing the wafer.

[0034] In this example, the spraying unit 3 is used to spray cleaning liquid onto the upper and lower surfaces of wafer Y. It includes multiple spray heads distributed above and below wafer Y. Each spray head can be flipped up and down to adjust the spray angle, ensuring that the cleaning liquid is sprayed accurately and covers the upper and lower surfaces of the wafer.

[0035] In this example, the synchronization shaft 4 is connected between the upper brush part 1 and the lower brush part 2 and extends vertically, wherein one of the upper brush part 1 and the lower brush part 2 is fixedly connected to the synchronization shaft 4, and the other of the two is movably connected to the synchronization shaft 4 up and down, and the rotary drive part 5 drives the synchronization shaft to rotate and drives the upper brush part 1 and the lower brush part 2 to rotate synchronously.

[0036] In some specific embodiments, the upper brush component 1 is fixedly arranged on the top of the synchronization shaft 4; an adjustment groove c is formed in the middle of the synchronization shaft 4, which extends up and down and matches the connecting end of the lower brush component 2. The connecting arm a0 in the lower brush component 2 constitutes the connecting end from the end away from the brush a1 and is inserted into the adjustment groove c; that is, under the constraint of the adjustment groove c, the synchronization shaft 4 can drive the lower brush component 2 to rotate synchronously with the upper brush component 1. At the same time, the lower brush component 2 can also move up and down along the extension direction of the adjustment groove c.

[0037] For ease of implementation, the synchronous shaft 4 is a hollow shaft, and the drive motor s is fixedly arranged at the lower end of the synchronous shaft 4, wherein the output shaft of the drive motor s is inserted into the inner cavity of the synchronous shaft 4 and is respectively connected to the upper and lower brushes a1 through transmission belts.

[0038] In this example, the rotary drive component 5 is used to drive the upper brush component 1 and the lower brush component 2 to rotate synchronously around the center line of the synchronous shaft 4.

[0039] In some specific embodiments, the rotating drive component 5 includes a rotating base 50 that is arranged to rotate around a vertical center line and a drive motor 51 connected to the bottom of the rotating base 50, wherein the synchronization shaft 4 is fixedly connected to the top of the rotating base 50 from the bottom end, and the drive motor s is fixedly connected to the rotating base 50.

[0040] In this example, the lifting drive component 6 is used to drive the upper brush component 1 and / or the lower brush component 2 to move up and down along the synchronization axis 4, and maintain a brushing area between the upper brush component 1 and the lower brush component 2 that matches the wafer.

[0041] In some specific embodiments, the lifting drive component 6 includes a connecting module 60 that is sleeved on the outer periphery of the synchronous shaft 4 and fixedly connected to the lower brushing component 2, a driving cylinder 61 fixedly set on the rotating seat 50, a vertically extending lifting guide rail 62, a lifting seat 63 that slides up and down on the lifting guide rail 62 and is connected to the rotating drive component 5, and a driving electric cylinder 64 for driving the lifting seat 63 to slide up and down, wherein the telescopic end of the driving cylinder 61 is fixedly connected to the connecting module 60, and the driving cylinder 61 drives the connecting module 60 to move up and down along the synchronous shaft, and the lower brushing component 2 moves up and down synchronously; the driving motor 51 is fixedly connected to the lifting seat 63, and realizes the synchronous lifting movement of the upper brushing component 1 and the lower brushing component 2 when the lifting seat 63 is lifted up and down.

[0042] In summary, after adopting the wafer scrubbing device, after the wafer is clamped, the upper and / or lower scrubbing parts are driven by the lifting drive component to move up and down along the synchronous axis to adjust the distance between the upper and / or lower scrubbing parts and the wafer, and maintain a scrubbing area matching the wafer between the upper and lower scrubbing parts; then open the spray component to spray cleaning liquid onto the upper and lower surfaces of the wafer, and drive the upper and lower scrubbing parts to rotate synchronously around the center line of the synchronous axis through the rotating drive component to implement the scrubbing operation. Therefore, compared with the prior art, the present invention can, on the one hand, flexibly adjust the upper and lower brushing parts through the cooperation of the upper and lower brushing parts and the synchronous shaft to ensure that a brushing area matching the wafer is formed between the upper and lower brushing parts, thereby being suitable for brushing wafers of different specifications and effectively improving the brushing effect; on the other hand, based on the alignment of the upper and lower brushing ends, the upper and lower brushing parts rotate synchronously around the center line of the synchronous shaft to ensure that the force positions of the upper and lower surfaces of the wafer are accurately aligned, effectively avoiding deformation and damage of the wafer and improving the product yield; thirdly, the synchronous shaft is fixed to the upper brushing part and the adjustment groove constrains the lower brushing part, thereby realizing the synchronous rotation of the upper and lower brushing parts during the rotation of the synchronous shaft, which has a simple structure and is easy to assemble and implement; fourthly, the height of the upper and lower brushing parts can be synchronously adjusted according to the specific position of the wafer, with strong flexibility.

[0043] The above detailed description of the utility model is intended to enable people familiar with the technology in this field to understand the content of the utility model and implement it. It is not intended to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.

Claims

1. A wafer scrubbing device comprising an upper scrubbing member and a lower scrubbing member disposed above and below a wafer, respectively, and a spraying member for spraying a cleaning liquid onto the upper and lower surfaces of the wafer, characterized in that: The brushing device also includes a synchronous shaft, a rotating drive component and a lifting drive component. The synchronous shaft extends vertically, and the upper brushing component and the lower brushing component are respectively connected to the synchronous shaft, and the brushing ends formed are aligned up and down, wherein the upper brushing component and / or the lower brushing component can be moved up and down along the synchronous shaft; the rotating drive component drives the upper brushing component and the lower brushing component to rotate synchronously around the center line of the synchronous shaft; the lifting drive component drives the upper brushing component and / or the lower brushing component to move up and down along the synchronous shaft, and maintains a brushing area matching the wafer formed between the upper brushing component and the lower brushing component.

2. The wafer scrubbing device according to claim 1, wherein: One of the upper brushing component and the lower brushing component is fixedly connected to the synchronous shaft, and the other of the two is movably connected to the synchronous shaft. The rotating drive component drives the synchronous shaft to rotate and drives the upper brushing component and the lower brushing component to rotate synchronously.

3. The wafer scrubbing device according to claim 2, wherein: The upper brush component is fixedly connected to the top of the synchronous shaft; an adjustment groove extending up and down and matching the connecting end of the lower brush component is formed in the middle of the synchronous shaft, and the lower brush component is inserted into the adjustment groove and can be adjusted up and down along the adjustment groove.

4. The wafer scrubbing device according to claim 1, 2 or 3, characterized in that: The rotary drive component includes a rotary seat rotatably arranged around a vertical center line and a drive motor connected to the bottom of the rotary seat, wherein the synchronous shaft is fixedly connected to the top of the rotary seat from the bottom end.

5. The wafer scrubbing device according to claim 4, characterized in that: The lifting drive component includes a connecting module that is sleeved on the outer periphery of the synchronization shaft and fixedly connected to the lower brushing component, and a driving cylinder that is fixedly arranged on the rotating seat, wherein the telescopic end of the driving cylinder is fixedly connected to the connecting module, and the driving cylinder drives the connecting module to move up and down along the synchronization shaft, and the lower brushing component moves up and down synchronously.

6. The wafer scrubbing device according to claim 5, characterized in that: The lifting drive component further includes a lifting guide rail, a lifting seat that slides up and down on the lifting guide rail, and a driving electric cylinder for driving the lifting seat to slide up and down, wherein the rotation drive component is arranged on the lifting seat.

7. The wafer scrubbing device according to claim 1, wherein: The upper brushing part and the lower brushing part have the same structure, wherein the upper brushing part and the lower brushing part each include a connecting arm perpendicular to the synchronization shaft, a brush and a two-fluid nozzle arranged at one end of the connecting arm away from the synchronization shaft.

8. The wafer scrubbing device according to claim 7, wherein: The upper and lower brushes are synchronously driven by the same driving motor.

9. The wafer scrubbing device according to claim 8, characterized in that: The synchronous shaft is a hollow shaft, and the drive motor is fixedly arranged at one end of the synchronous shaft, wherein the output shaft of the drive motor is inserted into the inner cavity of the synchronous shaft and is respectively connected to the upper and lower brushes through transmission belts.

10. The wafer scrubbing device according to claim 1, wherein: The spray component includes a plurality of spray heads distributed above and below the wafer, wherein each of the spray heads can be turned upside down to adjust a spray angle.

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