Collecting device for semiconductor packaging waste

Abstract

The utility model discloses a semiconductor packaging waste collecting device which comprises a semiconductor packaging waste collecting frame body, a plastic waste smashing groove and a metal waste temporary storage groove are formed in the two sides of the upper portion in the semiconductor packaging waste collecting frame body respectively, a smashing hob is arranged in the plastic waste smashing groove, and a metal waste temporary storage groove is arranged in the metal waste temporary storage groove. An anti-blocking stirring rod is arranged in the metal scrap temporary storage groove, a first discharging port is formed in the lower portion of the plastic waste smashing groove, a second discharging port is formed in the lower portion of the metal scrap temporary storage groove, and a fixing plate is arranged between the first discharging port and the second discharging port. According to the semiconductor packaging waste collecting frame, the plastic waste crushing groove and the metal waste temporary storage groove are formed in the two sides of the upper portion of the interior of the semiconductor packaging waste collecting frame body respectively, plastic components and metal components in waste can be collected in a classified mode through the structure, the two kinds of waste can be collected or classified at the same time, and the waste can be arranged and recycled conveniently.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to a collection device for semiconductor packaging waste. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing. After plastic sealing, a series of operations are required, such as post-curing, cutting and forming, electroplating and printing. The typical packaging process flow is: dicing, loading, bonding, plastic sealing, deflashing, electroplating, printing, cutting and forming, appearance inspection, finished product testing, packaging and shipment.

[0003] The existing technology for collecting semiconductor packaging waste still has certain disadvantages in use. Since semiconductor packaging waste is generally divided into two components, plastic and metal, traditional collection devices usually collect the waste of the two components together and then classify them. The process is relatively cumbersome, and the waste of plastic components is larger in volume. During the collection process, it takes up more space and increases capacity. Utility Model Content

[0004] The purpose of the present utility model is to provide a collection device for semiconductor packaging waste to solve the problem raised in the above background technology that since semiconductor packaging waste is generally divided into two components, plastic and metal, traditional collection devices usually collect the two components of waste together and then classify them, which is a relatively cumbersome process. In addition, the waste of plastic components is larger in volume, which takes up more space during the collection process and increases the capacity.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor packaging waste collection device, comprising a semiconductor packaging waste collection frame, wherein a plastic waste crushing trough and a metal waste buffer trough are respectively provided on both sides of the upper interior of the semiconductor packaging waste collection frame, a crushing hob is provided inside the plastic waste crushing trough, an anti-blocking stirring rod is provided inside the metal waste buffer trough, a first discharge port is provided below the plastic waste crushing trough, a second discharge port is provided below the metal waste buffer trough, a fixing plate is provided between the first discharge port and the second discharge port, a cylinder is provided inside the fixing plate, and the lower end of the cylinder is aligned with the flat The semiconductor packaging waste collection frame is connected to the balance lifting plate, and a first pressing plate and a second pressing plate are respectively provided on both sides of the lower side of the balance lifting plate. A partition is provided at the middle position of the lower inside of the semiconductor packaging waste collection frame, and a plastic waste collection basket and a metal waste collection basket are respectively provided on both sides of the partition. A driving motor is provided above one side of the semiconductor packaging waste collection frame, and a plastic waste feeding hopper and a metal waste feeding hopper are respectively provided on both sides of the top of the semiconductor packaging waste collection frame. The bottoms of the plastic waste collection basket and the metal waste collection basket are both provided with universal wheels, and the upper outer sides of the plastic waste collection basket and the metal waste collection basket are both provided with fixed handles.

[0006] In a further embodiment, the anti-blocking stirring rod is connected to the crushing roller by plugging, and one end of the anti-blocking stirring rod is rotatably connected to the metal scrap buffer tank through a bearing.

[0007] In a further embodiment, the first discharge port and the second discharge port are both configured as inverted conical structures, and both ends of the fixing plate are connected to the first discharge port and the second discharge port by welding.

[0008] In a further embodiment, the plastic waste feed hopper and the metal waste feed hopper are fixedly connected via a raised baffle, and the cross-section of the raised baffle is configured as an inverted U-shaped structure.

[0009] In a further embodiment, the two ends of the top of the balancing lifting plate are slidingly connected to the semiconductor packaging waste collection frame through guide pulleys, and the balancing lifting plate is embedded in the first discharge port through a first fixed port, and the balancing lifting plate is embedded in the second discharge port through a second fixed port.

[0010] In a further embodiment, the first pressing plate and the second pressing plate are configured as a centrally symmetrical structure, and the cross-sections of the first pressing plate and the second pressing plate are both configured as an L-shaped structure.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. In the utility model, a plastic waste crushing trough and a metal waste buffer trough are respectively provided on both sides of the upper part of the interior of the semiconductor packaging waste collection frame. This structure can classify and collect the plastic components and metal components in the waste, and can collect or classify the two types of waste at the same time, which is convenient for sorting and recycling the waste. A crushing roller is provided inside the plastic waste crushing trough, and the crushing roller can be used to crush the plastic waste, thereby achieving the purpose of volume reduction and improving the efficiency of waste collection. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the internal structure of a semiconductor packaging waste collection device according to the present invention;

[0014] Figure 2 This is a structural diagram of the balancing lifting plate of the utility model;

[0015] Figure 3 This is a side view of a device for collecting semiconductor packaging waste according to the present invention;

[0016] Figure 4 It is a top view of the balancing lifting plate of the present utility model.

[0017] In the figure: 1. Plastic waste feed hopper; 2. Heightened baffle; 3. Metal waste feed hopper; 4. Semiconductor packaging waste collection frame; 5. Drive motor; 6. Crushing hob; 7. Plastic waste crushing trough; 8. Metal waste buffer trough; 9. Anti-blocking stirring rod; 10. First discharge port; 11. Second discharge port; 12. Fixed plate; 13. Balanced lifting plate; 14. Plastic waste collection basket; 15. Metal waste collection basket; 16. Partition; 17. Universal wheel; 18. Cylinder; 19. Guide pulley; 20. First pressing plate; 21. Second pressing plate; 22. Fixed handle; 23. First fixed port; 24. Second fixed port. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] See also Figure 1-4, the utility model provides an embodiment: a semiconductor packaging waste collection device, including a semiconductor packaging waste collection frame 4, the upper two sides of the interior of the semiconductor packaging waste collection frame 4 are respectively provided with a plastic waste crushing trough 7 and a metal waste buffer trough 8, the interior of the plastic waste crushing trough 7 is provided with a crushing hob 6, the interior of the metal waste buffer trough 8 is provided with an anti-blocking stirring rod 9, a first discharge port 10 is provided below the plastic waste crushing trough 7, a second discharge port 11 is provided below the metal waste buffer trough 8, a fixing plate 12 is provided between the first discharge port 10 and the second discharge port 11, and the fixing plate 12 is provided between the first discharge port 10 and the second discharge port 11. 2 is provided with a cylinder 18, the lower end of the cylinder 18 is connected to the balance lifting plate 13, and the first pressing plate 20 and the second pressing plate 21 are provided on both sides below the balance lifting plate 13, respectively. The first pressing plate 20 and the second pressing plate 21 are set as a central symmetrical structure, and the cross-sections of the first pressing plate 20 and the second pressing plate 21 are both set as an L-shaped structure. A partition 16 is provided in the middle position below the interior of the semiconductor packaging waste collection frame 4, and a plastic waste collection basket 14 and a metal waste collection basket 15 are provided on both sides of the partition 16. A driving motor is provided above one side of the semiconductor packaging waste collection frame 4. The two sides of the top of the semiconductor packaging waste collection frame 4 are respectively provided with a plastic waste feeding hopper 1 and a metal waste feeding hopper 3, and the bottoms of the plastic waste collection basket 14 and the metal waste collection basket 15 are provided with universal wheels 17. The upper sides of the outer sides of the plastic waste collection basket 14 and the metal waste collection basket 15 are provided with fixed handles 22; the plastic waste crushing trough 7 is used to crush the waste with plastic components, the metal waste buffer trough 8 is used to cache the accumulated metal waste, the crushing hob 6 is used to crush the plastic waste, and the anti-blocking stirring rod 9 is used to separate the accumulated metal waste. The waste is stirred and dredged, the first discharge port 10 is used to discharge plastic waste, the second discharge port 11 is used to discharge metal waste, the cylinder 18 is used to lift and adjust the balance lifting plate 13, the balance lifting plate 13 is used to install and fix the first pressing plate 20 and the second pressing plate 21, the first pressing plate 20 is used to compact the waste in the plastic waste collection basket 14, the second pressing plate 21 is used to compact the waste in the metal waste collection basket 15, and the universal wheel 17 is used to move the plastic waste collection basket 14 and the metal waste collection basket 15 with ease.

[0020] The plastic waste feed hopper 1 and the metal waste feed hopper 3 are fixedly connected by a raised baffle 2, and the cross-section of the raised baffle 2 is set to an inverted U-shaped structure. The raised baffle 2 is used to prevent waste from splashing out; the anti-blocking stirring rod 9 is connected to the crushing roller 6 by plugging, and one end of the anti-blocking stirring rod 9 is rotatably connected to the metal waste buffer trough 8 through a bearing. The plug-in connection facilitates the assembly of the anti-blocking stirring rod 9 and the crushing roller 6 into one.

[0021] The outer shapes of the first discharge port 10 and the second discharge port 11 are both set to an inverted cone structure, and the two ends of the fixed plate 12 are connected to the first discharge port 10 and the second discharge port 11 by welding. The welding connection is used to increase the firmness of the installation of the two ends of the fixed plate 12 and the first discharge port 10 and the second discharge port 11. The two ends of the top of the balancing lifting plate 13 are slidingly connected to the semiconductor packaging waste collection frame 4 through the guide pulley 19, and the balancing lifting plate 13 is inlaid with the first discharge port 10 through the first fixed port 23, and the balancing lifting plate 13 is inlaid with the second discharge port 11 through the second fixed port 24. The guide pulley 19 is used to increase the sliding property of the movement of the balancing lifting plate 13.

[0022] Working principle: When in use, the plastic waste and metal waste generated by the packaging are poured into the plastic waste feed hopper 1 and the metal waste feed hopper 3 respectively, and transported to the plastic waste crushing trough 7 and the metal waste buffer trough 8 respectively. The electrical energy is converted into mechanical energy by the driving motor 5, and the crushing roller 6 and the anti-blocking stirring rod 9 are driven to rotate at the same time. The plastic waste is crushed by the crushing roller 6 and discharged to the plastic waste collection basket 14 through the first discharge port 10 for storage. The accumulated metal waste is dredged through the anti-blocking stirring rod 9 and discharged to the metal waste collection basket 15 for storage through the second discharge port 11. When the waste is full, the balance lifting plate 13 is driven downward by the cylinder 18, and the waste is compacted and reduced in volume by the first pressing plate 20 and the second pressing plate 21.

[0023] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A semiconductor packaging waste collection device, comprising a semiconductor packaging waste collection frame (4), characterized in that: A plastic waste crushing trough (7) and a metal waste buffer trough (8) are respectively provided on both sides of the upper part of the interior of the semiconductor packaging waste collection frame (4); a crushing roller (6) is provided inside the plastic waste crushing trough (7); an anti-blocking stirring rod (9) is provided inside the metal waste buffer trough (8); a first discharge port (10) is provided below the plastic waste crushing trough (7); a second discharge port (11) is provided below the metal waste buffer trough (8); a fixing plate (12) is provided between the first discharge port (10) and the second discharge port (11); a cylinder (18) is provided inside the fixing plate (12); the lower end of the cylinder (18) is connected to the balance lifting plate (13); and the two sides below the balance lifting plate (13) are respectively provided with a first discharge port (10); and a second discharge port (11) is provided below the metal waste buffer trough (8). A pressing plate (20) and a second pressing plate (21), a partition (16) is provided at the middle position below the interior of the semiconductor packaging waste collection frame (4), a plastic waste collection basket (14) and a metal waste collection basket (15) are provided on both sides of the partition (16), a driving motor (5) is provided above one side of the semiconductor packaging waste collection frame (4), a plastic waste feed hopper (1) and a metal waste feed hopper (3) are provided on both sides of the top of the semiconductor packaging waste collection frame (4), universal wheels (17) are provided at the bottom of the plastic waste collection basket (14) and the metal waste collection basket (15), and fixed handles (22) are provided on the upper sides of the outer sides of the plastic waste collection basket (14) and the metal waste collection basket (15).

2. The semiconductor packaging waste collection device according to claim 1, wherein: The anti-blocking stirring rod (9) is connected to the crushing roller (6) by plugging, and one end of the anti-blocking stirring rod (9) is rotatably connected to the metal waste buffer tank (8) through a bearing.

3. The semiconductor packaging waste collection device according to claim 1, wherein: The first discharge port (10) and the second discharge port (11) are both configured as inverted conical structures, and both ends of the fixed plate (12) are connected to the first discharge port (10) and the second discharge port (11) by welding.

4. The semiconductor packaging waste collection device according to claim 1, wherein: The plastic waste feed hopper (1) and the metal waste feed hopper (3) are fixedly connected via a raised baffle (2), and the cross-section of the raised baffle (2) is configured as an inverted U-shaped structure.

5. The semiconductor packaging waste collection device according to claim 1, wherein: The two ends of the top of the balancing lifting plate (13) are slidably connected to the semiconductor packaging waste collection frame (4) via a guide pulley (19), and the balancing lifting plate (13) is embedded in the first discharge port (10) via a first fixed port (23), and the balancing lifting plate (13) is embedded in the second discharge port (11) via a second fixed port (24).

6. The semiconductor packaging waste collection device according to claim 1, wherein: The first pressing plate (20) and the second pressing plate (21) are configured as a centrally symmetrical structure, and the cross-sections of the first pressing plate (20) and the second pressing plate (21) are both configured as L-shaped structures.

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