Depth control measuring device for circuit board processing and drilling equipment

Abstract

The utility model relates to a depth control measuring device for circuit board processing and drilling equipment, the depth control measuring device for circuit board processing comprises a main shaft head assembly, a driving assembly, a guiding assembly and a measuring assembly, and the driving assembly comprises a plurality of driving units installed on the main shaft head assembly; the guide assembly comprises a connecting plate and a plurality of guide rods which are connected, the guide rods are slidably mounted on the spindle head assembly, the output ends of the driving units are connected to the connecting plate, and the driving assembly can drive the guide rods to move in the first direction through the connecting plate; the measuring assembly is at least partially arranged on the guiding assembly and used for drilling depth control measurement in the first direction. The plurality of guide rods are connected to the same connecting plate, so that the driving force of the plurality of driving units is more balanced, the deformation of the measuring device caused by unequal driving force is avoided, and the stability and reliability of the measuring device are ensured.

Description

Technical Field

[0001] The present application relates to the technical field of PCB processing, and in particular to a depth control measuring device and drilling equipment for circuit board processing. Background Art

[0002] In the field of mechanical processing technology, especially PCB processing technology, the control of processing depth is very important. With the rapid development of the PCB industry, the requirements for back drilling and blind drilling technology to control the processing depth accuracy are becoming increasingly higher.

[0003] In the modern electronic device manufacturing industry, circuit boards are a core component, and their quality directly impacts the performance of these devices. The quality of circuit board processing depends crucially on precision control during the machining process, particularly controlling the depth of the circuit boards. Therefore, accurately measuring and controlling the depth of the circuit boards is a crucial issue in circuit board processing technology. Existing circuit board processing techniques typically employ mechanical methods, such as using tools like drills or milling cutters, to achieve depth control.

[0004] However, existing PCB processing technology still has some problems. First, traditional mechanical processing methods often cannot achieve high precision. Second, due to the complexity of measurement devices and control systems, they may encounter various problems in actual operation, such as measurement errors and control errors, which will affect the processing quality of PCBs. Utility Model Content

[0005] Based on this, it is necessary to provide a depth control measuring device and drilling equipment for circuit board processing to address the problem of PCB processing accuracy.

[0006] A depth control and measurement device for circuit board processing, comprising:

[0007] Spindle head assembly;

[0008] a drive assembly comprising a plurality of drive units each mounted on the spindle head assembly;

[0009] a guide assembly comprising a connecting plate and a plurality of guide rods connected to each other, wherein the plurality of guide rods are slidably mounted on the spindle head assembly, and output ends of the plurality of drive units are connected to the connecting plate, and the drive assembly is capable of driving the plurality of guide rods to move in a first direction through the connecting plate;

[0010] A measuring assembly is at least partially arranged on the guide assembly and is used for drilling depth control measurement along the first direction.

[0011] The depth control measuring device for processing the above-mentioned circuit board has a measuring component part arranged on the guide component, and the measuring component is used to measure the drilling depth of the depth control measuring device for processing the circuit board along the first direction. A plurality of drive units are connected to the connecting plate, a plurality of guide rods of the guide assembly are connected to the connecting plate, and a plurality of guide rods are slidably mounted on the spindle head assembly. When the drive assembly drives the guide assembly to move in the first direction, the drive assembly drives the connecting plate to move in the first direction, thereby driving the plurality of guide rods to move relative to the spindle head assembly in the first direction. At this time, because the plurality of guide rods are connected to the same connecting plate, the driving force of the plurality of drive units is more balanced, thereby avoiding deformation of the measuring device caused by unequal driving force, and ensuring the stability and reliability of the measuring device. Moreover, by connecting the plurality of drive units of the drive assembly to the connecting plate, and by driving the plurality of guide rods to move in the first direction through the movement of the connecting plate in the first direction, the vibration during the processing process can be effectively reduced, thereby improving the accuracy of the measurement.

[0012] In one embodiment, the plurality of guide rods and the plurality of driving units are respectively disposed on both sides of the connecting plate along the first direction.

[0013] In one embodiment, a relief portion is provided on a side of the connecting plate close to the driving assembly along the first direction, and the relief portion is used to avoid the spindle head assembly.

[0014] In one embodiment, the connecting plate is arc-shaped, and a plurality of the guide rods are arranged at intervals around the circumference of the connecting plate.

[0015] In one embodiment, the measuring assembly includes a magnetic scale and a reading head, the magnetic scale is arranged on the spindle head assembly, and the reading head is installed on the guide assembly.

[0016] In one embodiment, the method further comprises a mounting member connected to the connecting plate, and the reading head is mounted on the mounting member.

[0017] In one embodiment, the mounting member and the plurality of guide rods are arranged on the same side of the connecting plate, and a receiving groove is provided on a side of the mounting member close to the spindle head assembly, and the reading head is arranged in the receiving groove.

[0018] In one embodiment, the guide assembly further includes a mounting plate, the connecting plate and the mounting plate are spaced apart along the first direction, one end of the guide rod is connected to the connecting plate, and the other end is connected to the mounting plate;

[0019] The depth control and measuring device for circuit board processing further comprises a chip suction cover assembly, which is connected to the mounting plate and is arranged on a side of the mounting plate away from the guide rod.

[0020] In one embodiment, the guide assembly further includes a buffer pad, which is arranged on a side of the mounting plate facing away from the chip suction cover assembly, and the buffer pad is used to abut against the spindle head assembly.

[0021] In one embodiment, the guide assembly further includes a plurality of linear guide rails, and the plurality of linear guide rails are all mounted on the spindle head assembly, and the plurality of guide rods are passed through the corresponding linear guide rails.

[0022] The present application also provides a drilling device comprising any one of the depth control and measurement devices for circuit board processing described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic structural diagram of a depth control and measurement device for circuit board processing provided in an embodiment of the present application.

[0024] Figure 2 This is an exploded view of the depth control and measurement device for circuit board processing provided in an embodiment of the present application.

[0025] Figure 3 An exploded view of the guide assembly provided in an embodiment of the present application.

[0026] Figure 4 A cross-sectional view of a depth control and measurement device for circuit board processing provided in an embodiment of the present application.

[0027] In the picture:

[0028] 100. Spindle head assembly;

[0029] 200, drive assembly; 210, drive unit;

[0030] 300, guide assembly; 310, connecting plate; 311, avoidance portion; 320, guide rod; 330, mounting plate; 340, buffer pad; 350, linear guide rail;

[0031] 400, chip hood assembly;

[0032] 500, measuring component; 510, magnetic scale; 520, reading head;

[0033] 600, mounting member; 610, receiving slot;

[0034] V. First direction. DETAILED DESCRIPTION

[0035] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0036] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0037] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0038] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0039] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0041] Existing circuit board processing technologies typically rely on mechanical methods for depth control, such as using tools like drills or milling cutters. During these processes, a measuring device is required to monitor and control the processing depth in real time to ensure accuracy. Furthermore, to improve measurement accuracy and stability, high-precision measuring devices and stable control systems are often employed.

[0042] However, existing circuit board processing technology still has some problems. First, traditional mechanical processing methods often have difficulty achieving high precision, especially in micron-level depth control. Second, due to the complexity of the measurement device and control system, they may encounter various problems in actual operation, such as measurement errors and control errors, which will affect the processing quality of the circuit board. Finally, existing guide device designs often lack sufficient rigidity, which may cause vibration and deformation during the processing, thereby affecting the processing accuracy and measurement precision.

[0043] In order to solve the above problems, the present application provides a depth control and measurement device for circuit board processing, such as Figures 1 to 4As shown, the depth control and measurement device for circuit board processing includes a spindle head assembly 100, a drive assembly 200, a guide assembly 300 and a measuring assembly 500. The drive assembly 200 includes a plurality of drive units 210, all of which are installed on the spindle head assembly 100; the guide assembly 300 includes a connected connecting plate 310 and a plurality of guide rods 320, and the plurality of guide rods 320 are all slidably installed on the spindle head assembly 100, and the output ends of the plurality of drive units 210 are all connected to the connecting plate 310. The drive assembly 200 can drive the plurality of guide rods 320 to move along a first direction V through the connecting plate 310. The first direction V measuring assembly 500 is at least partially arranged on the guide assembly 300 for drilling depth control measurement along the first direction V.

[0044] In the depth control and measurement device for circuit board processing, the measurement assembly 500 is partially disposed on the guide assembly 300. The measurement assembly 500 is used to measure the drilling depth of the circuit board processing depth control and measurement device along a first direction V. Multiple drive units 210 are connected to a connecting plate 310, and multiple guide rods 320 of the guide assembly 300 are connected to the connecting plate 310. The multiple guide rods 320 are slidably mounted on the spindle head assembly 100. When the drive assembly 200 drives the guide assembly 300 to move in the first direction V, the drive assembly 200 drives the connecting plate 310 to move in the first direction V, thereby driving the multiple guide rods 320 to move relative to the spindle head assembly 100 in the first direction V. At this time, because the multiple guide rods 320 are connected to the same connecting plate 310, the driving force of the multiple drive units 210 is more balanced, thereby avoiding deformation of the measurement device due to unequal driving force and ensuring the stability and reliability of the measurement device. Moreover, the multiple driving units 210 of the driving assembly 200 are all connected to the connecting plate 310. The connecting plate 310 moves along the first direction V to drive the multiple guide rods 320 to move along the first direction V, which can effectively reduce vibration during the processing process and thus improve the measurement accuracy.

[0045] Specifically, if Figures 1 to 3 As shown, the first direction V is the axial direction of the guide rod 320.

[0046] Specifically, if Figures 1 to 3 As shown, the plurality of guide rods 320 and the plurality of driving units 210 are respectively arranged on both sides of the connecting plate 310 along the first direction V. The plurality of guide rods 320 are arranged on one side of the connecting plate 310 along the first direction V, and the plurality of driving units 210 are arranged on the other side of the connecting plate 310 along the first direction V.

[0047] More specifically, in this embodiment, if Figures 1 to 3As shown, the number of the plurality of guide rods 320 and the number of the plurality of drive units 210 are the same. For example, two groups of guide rods 320 and two groups of drive units 210 are provided. In other embodiments, the number of the plurality of guide rods 320 and the number of the plurality of drive units 210 may be different, and the specific number is set according to actual operation requirements.

[0048] Specifically, if Figures 1 to 3 As shown, the connecting plate 310 is arc-shaped, and a plurality of guide rods 320 are arranged at intervals around the circumference of the connecting plate 310. The connecting plate 310 is configured in an arc shape, extending around the circumference of the spindle head assembly 100, and the connecting plate 310 semi-encloses the spindle head assembly 100. The plurality of guide rods 320 are disposed on one side of the connecting plate 310 along the first direction V and are arranged at intervals around the circumference of the connecting plate 310.

[0049] More specifically, in this embodiment, two groups of guide rods 320 are provided, and the two groups of guide rods 320 are respectively provided at both ends of the arc-shaped connecting plate 310 .

[0050] Specifically, if Figures 1 to 3 As shown, a clearance portion 311 is provided on the side of the connecting plate 310 that is close to the drive assembly 200 along the first direction V. The clearance portion 311 is used to clear the spindle head assembly 100. The clearance portion 311 is provided on the outer wall of the connecting plate 310 that is close to the drive assembly 200 along the first direction V. The clearance portion 311 is used to clear the spindle head assembly 100 to prevent the connecting plate 310 and the spindle head assembly 100 from colliding with each other when the guide assembly 300 and the spindle head assembly 100 move relative to each other.

[0051] Specifically, if Figures 1 to 3 As shown, the guide assembly 300 further includes a plurality of linear guide rails 350, each of which is mounted on the spindle head assembly 100, and a plurality of guide rods 320 are disposed through corresponding linear guide rails 350. By providing the linear guide rails 350, the linear guide rails 350 are mounted on the spindle head assembly 100, and the guide rods 320 are disposed through the linear guide rails 350, thereby achieving a sliding fit between the guide rods 320 and the spindle head assembly 100. Furthermore, a plurality of linear guide rails 350 are provided, and the plurality of linear guide rails 350 correspond one-to-one to the plurality of guide rods 320, with each guide rod 320 being disposed through a corresponding linear guide rail 350.

[0052] Furthermore, if Figures 1 to 4As shown, the depth control measurement device for circuit board processing also includes a measuring assembly 500, which includes a magnetic scale 510 and a reading head 520. The magnetic scale 510 is disposed on the spindle head assembly 100, and the reading head 520 is mounted on the guide assembly 300. By setting up the measuring assembly 500, the magnetic scale 510 of the measuring assembly 500 is disposed on the spindle head assembly 100, and the reading head 520 is mounted on the guide assembly 300. When the guide assembly 300 and the spindle head assembly 100 move relative to each other, the reading head 520 can read the value on the magnetic scale 510, thereby detecting the dimension of the relative movement between the guide assembly 300 and the spindle head assembly 100. By setting up the measuring assembly 500, the present application achieves accurate measurement of the depth of circuit board processing.

[0053] Specifically, if Figures 1 to 4 As shown, the depth control measurement device for circuit board processing further includes a mounting member 600 connected to the connecting plate 310, and the reading head 520 is mounted on the mounting member 600. The mounting member 600 is provided on the connecting plate 310, and the reading head 520 is mounted on the mounting member 600, thereby mounting the reading head 520 on the guide assembly 300.

[0054] Specifically, if Figures 1 to 4 As shown, the mounting member 600 and the plurality of guide rods 320 are both disposed on the same side of the connecting plate 310. A receiving groove 610 is provided on the side of the mounting member 600 proximate to the spindle head assembly 100, and the read head 520 is disposed within the receiving groove 610. The plurality of guide rods 320 are disposed on one side of the connecting plate 310 along the first direction V, and the plurality of drive units 210 are disposed on the other side of the connecting plate 310 along the first direction V. The mounting member 600 and the plurality of guide rods 320 are both disposed on the same side of the connecting plate 310, and a receiving groove 610 is provided on the side of the mounting member 600 proximate to the spindle head assembly 100 to facilitate the installation of the read head 520. In this application, the magnetic scale 510 is pasted on the spindle head assembly 100. By setting a mounting part 600 and setting a receiving groove 610 on the mounting part 600, it is convenient to install the magnetic scale head. The installation structure of the measuring assembly 500 will not affect the maintenance of the verticality of the spindle adjusted by the pressure cover of the spindle head assembly 100, because the magnetic scale 510 allows slight changes in the gap with the magnetic scale 510 without affecting the measurement signal and measurement accuracy.

[0055] Furthermore, if Figures 1 to 4As shown, the guide assembly 300 further includes a mounting plate 330. The connecting plate 310 and the mounting plate 330 are spaced apart along a first direction V. One end of the guide rod 320 is connected to the connecting plate 310, and the other end is connected to the mounting plate 330. The depth control and measurement device for circuit board processing further includes a chip hood assembly 400, which is connected to the mounting plate 330 and disposed on the side of the mounting plate 330 facing away from the guide rod 320. The guide rod 320 is connected to the connecting plate 310 and the mounting plate 330 at both ends along the first direction V, and the chip hood assembly 400 is connected to the mounting plate 330 and disposed on the side of the mounting plate 330 facing away from the guide rod 320. The provision of the mounting plate 330 facilitates the connection between the guide assembly 300 and the chip hood assembly 400.

[0056] Specifically, the depth control and measurement device for circuit board processing further includes a quick-connect structure, and the chip suction cover assembly 400 is connected to the mounting plate 330 via the quick-connect structure, thereby realizing quick disassembly and quick assembly of the chip suction cover assembly 400 .

[0057] It should be noted that the quick-connect structure is a conventional technical means in this field, and the specific structure will not be described here.

[0058] Specifically, if Figures 1 to 4 As shown, the guide assembly 300 further includes a buffer pad 340, which is disposed on a side of the mounting plate 330 facing away from the chip hood assembly 400. The buffer pad 340 is configured to abut against the spindle head assembly 100. The buffer pad 340 is disposed on the side of the mounting plate 330 facing away from the chip hood assembly 400. When the guide assembly 300 and the spindle head assembly 100 move relative to each other in the first direction V, the buffer pad 340 on the mounting plate 330 can abut against the spindle head assembly 100, thereby reducing the impact of a collision between the spindle head assembly 100 and the guide assembly 300.

[0059] More specifically, if Figures 1 to 4 As shown, a first through hole is provided on the mounting plate 330 , a second through hole is provided on the buffer pad 340 , and the spindle head assembly 100 is passed through the second through hole and the first through hole.

[0060] In summary, the depth control and measurement device for circuit board processing of the present application has the following beneficial effects:

[0061] 1. Improved Measurement Accuracy: By mounting the measuring assembly 500 on the highly rigid guide assembly 300, this invention effectively reduces vibration during machining, thereby improving measurement accuracy. Furthermore, the drive assembly 200 drives the guide assembly 300 in the first direction V, enabling real-time and accurate detection of the relative displacement between the chip hood and the spindle, further enhancing measurement accuracy.

[0062] 2. Solve the problem that the depth control and measurement device for circuit board processing is easily deformed due to the unequal driving force of the driving unit 210: This application optimizes the design of the guide assembly 300, connects multiple guide rods 320 to the connecting plate 310, and connects multiple driving units 210 to the connecting plate 310, so that the driving force of the multiple driving units 210 is more balanced, thereby avoiding the deformation of the depth control and measurement device for circuit board processing due to unequal driving force, and ensuring the stability and reliability of the depth control and measurement device for circuit board processing.

[0063] 3. Improved depth control accuracy: This application can achieve precise control of the depth of the circuit board through precise measurement and control, especially in the depth control at the micron level, which greatly improves the depth control accuracy compared to traditional mechanical processing methods.

[0064] 4. Enhanced rigidity of the guide device: The guide assembly 300 of the present application has two guide rods 320 and two linear bearings. The upper parts of the multiple guide rods 320 are connected by a connecting plate 310, and the lower parts of the multiple guide rods 320 are connected by a mounting plate 330 to enhance the rigidity of the guide device, effectively solving the problem of weak rigidity of the guide assembly 300 and inconvenient maintenance of the chip suction cover in the prior art.

[0065] The present application also provides a drilling device comprising any of the aforementioned depth control and measurement devices for circuit board processing. The depth of a hole drilled by the drilling device along a first direction V is measured using the depth control and measurement device for circuit board processing. The movement of the connecting plate 310 along the first direction V drives the movement of the multiple guide rods 320 along the first direction V, effectively reducing vibration during the processing and thereby improving measurement accuracy.

[0066] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A depth control and measurement device for circuit board processing, characterized in that: The depth control and measurement device for circuit board processing includes: Spindle head assembly (100); A drive assembly (200) comprising a plurality of drive units (210) each mounted on the spindle head assembly (100); A guide assembly (300) comprises a connecting plate (310) and a plurality of guide rods (320) connected to each other, wherein the plurality of guide rods (320) are slidably mounted on the spindle head assembly (100), and the output ends of the plurality of drive units (210) are connected to the connecting plate (310), and the drive assembly (200) is capable of driving the plurality of guide rods (320) to move along a first direction (V) via the connecting plate (310); A measuring assembly (500) is at least partially arranged on the guide assembly (300) and is used for drilling depth control measurement along the first direction (V).

2. The depth control and measurement device for circuit board processing according to claim 1, characterized in that: The plurality of guide rods (320) and the plurality of drive units (210) are respectively arranged on both sides of the connecting plate (310) along the first direction (V).

3. The depth control and measurement device for circuit board processing according to claim 2, characterized in that: A relief portion (311) is provided on one side of the connecting plate (310) close to the driving assembly (200) along the first direction (V), and the relief portion (311) is used to avoid the spindle head assembly (100).

4. The depth control and measurement device for circuit board processing according to claim 1, characterized in that: The connecting plate (310) is in an arc shape, and a plurality of the guide rods (320) are arranged at intervals around the circumference of the connecting plate (310).

5. The depth control and measurement device for circuit board processing according to claim 1, characterized in that: The measuring assembly (500) comprises a magnetic scale (510) and a reading head (520), wherein the magnetic scale (510) is arranged on the spindle head assembly (100), and the reading head (520) is installed on the guide assembly (300).

6. The depth control and measurement device for circuit board processing according to claim 5, characterized in that: It also includes a mounting member (600) connected to the connecting plate (310), and the reading head (520) is mounted on the mounting member (600).

7. The depth control and measurement device for circuit board processing according to claim 6, characterized in that: The mounting member (600) and the plurality of guide rods (320) are arranged on the same side of the connecting plate (310); a receiving groove (610) is provided on a side of the mounting member (600) close to the spindle head assembly (100); and the reading head (520) is arranged in the receiving groove (610).

8. The depth control and measurement device for circuit board processing according to claim 1, characterized in that: The guide assembly (300) further includes a mounting plate (330), the connecting plate (310) and the mounting plate (330) are arranged at intervals along the first direction (V), and one end of the guide rod (320) is connected to the connecting plate (310), and the other end is connected to the mounting plate (330); The depth control and measurement device for processing a circuit board further comprises a chip suction cover assembly (400), which is connected to the mounting plate (330) and is arranged on a side of the mounting plate (330) away from the guide rod (320).

9. The depth control and measurement device for circuit board processing according to claim 8, characterized in that: The guide assembly (300) further includes a buffer pad (340), which is arranged on a side of the mounting plate (330) away from the chip suction cover assembly (400), and the buffer pad (340) is used to abut against the spindle head assembly (100).

10. The depth control and measurement device for circuit board processing according to any one of claims 1 to 9, characterized in that: The guide assembly (300) further comprises a plurality of linear guide rails (350), wherein the plurality of linear guide rails (350) are all mounted on the spindle head assembly (100), and the plurality of guide rods (320) are passed through the corresponding linear guide rails (350).

11. A drilling device, characterized in that: It comprises a depth control and measuring device for circuit board processing according to any one of claims 1-10.

Images