Cutting device for semiconductor production

Abstract

The cutting device for semiconductor production comprises a machine body, a mounting groove is formed in the machine body, a sliding groove is formed in the position, corresponding to the mounting groove, of the machine body, moving rods which are symmetrically arranged are connected into the sliding groove in a sliding mode, and containing grooves are formed in the two moving rods. Pressure-bearing blocks are fixedly connected to the interiors of the two containing grooves, springs are fixedly connected to the faces, away from each other, of the two moving rods, an electric telescopic rod is fixedly mounted in the mounting groove, a lifting rod is fixedly connected to the top end of the output end of the electric telescopic rod, and extrusion grooves which are symmetrically formed are formed in the lifting rod; the top ends of the two moving rods are both fixedly connected with clamping rings, the two clamping rings are both provided with rubber rings, and the wafer cutting device has the beneficial effects that the operation convenience is high, and the phenomenon of loosening and displacement cannot occur after a wafer is clamped by the clamping rings, so that the wafer cutting work can be stably carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a cutting device for semiconductor production. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors, and semiconductors need to be cut during processing.

[0003] Patent document No. 202321359225.7 discloses a cutting device for semiconductor production, comprising a cutting device body, two circular shafts, two gears, a limiting rod, two teeth, two connecting blocks, two clamping members, a rotating rod, an output wheel, a rotating knob, and a mating wheel. The two circular shafts are fixedly connected to the interior of the cutting device body, the two gears are respectively sleeved on the surfaces of the two circular shafts, the limiting rod is fixedly connected to the interior of the cutting device body, the two teeth are respectively meshed and connected to the tops of the two gears and slidably connected to the surfaces of the limiting rod, and one end of the two connecting blocks is respectively fixedly connected to the tops of the two teeth. The utility model solves the problem that the existing cutting clamping mechanism has a relatively complex operating structure and is therefore expensive, and requires an electric drive motor to clamp the semiconductor during clamping, but the motor drive cannot well control the clamping force, so it is easy to over-clamp the semiconductor during clamping, causing damage to the semiconductor. Although the above application has many beneficial effects, it still has the following disadvantages: after the various components cooperate to complete the clamping, the clamping force cannot be effectively maintained, and the clamping member is prone to displacement during cutting. Utility Model Content

[0004] The purpose of the present invention is to provide a cutting device for semiconductor production to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a cutting device for semiconductor production, comprising a body, a mounting groove being provided inside the body, a sliding groove being provided at a position corresponding to the mounting groove on the body, a symmetrically arranged moving rod being slidably connected inside the sliding groove, two of the moving rods being provided with a receiving groove, pressure blocks being fixedly connected inside the two receiving grooves, springs being fixedly connected to the opposing surfaces of the two moving rods, an electric telescopic rod being fixedly installed inside the mounting groove, a lifting rod being fixedly connected to the top end of the output end of the electric telescopic rod, a symmetrically arranged extrusion groove being provided on the lifting rod, a clamping ring being fixedly connected to the top end of the two moving rods, and a rubber ring being provided on the two clamping rings.

[0006] Preferably, the bottom ends of the movable rods slide through the sliding grooves and are located inside the mounting grooves.

[0007] Preferably, the pressure blocks are all arranged in a triangular shape, and the bottom ends of the pressure blocks slide through the extrusion grooves.

[0008] Preferably, the springs are all fixedly connected to the inner wall of the installation groove, and a guide rod is fixedly connected inside the installation groove, and the guide rod slides through the two movable rods and the spring.

[0009] Preferably, both ends of the lifting rod are slidably connected to the inside of the accommodating groove.

[0010] Compared with the existing technology, the beneficial effects of the utility model are: through the linked operation of various components, the two clamping rings can complete the fixation of the wafer, the operation is convenient, the rubber ring on the clamping ring can prevent the clamping ring from causing damage to the wafer, and the clamping ring will not loosen or move after clamping the wafer, so that the wafer cutting work can be carried out stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0012] Figure 2 This is a schematic cross-sectional view of the utility model;

[0013] Figure 3 This is a schematic cross-sectional structural diagram of the mobile rod of the present utility model.

[0014] In the figure: 1. Body; 2. Mounting slot; 3. Sliding slot; 4. Moving rod; 5. Accommodating slot; 6. Pressure block; 7. Spring; 8. Electric telescopic rod; 9. Lifting rod; 10. Extrusion slot; 11. Clamping ring; 12. Rubber ring; 13. Guide rod. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] See also Figure 1-3The utility model provides a technical solution: a cutting device for semiconductor production, comprising a body 1, a mounting groove 2 being provided inside the body 1, a sliding groove 3 being provided at a position corresponding to the mounting groove 2 on the body 1, a symmetrically arranged moving rod 4 being slidably connected inside the sliding groove 3, two moving rods 4 being provided with a receiving groove 5, two receiving grooves 5 being fixedly connected with a pressure block 6, springs 7 being fixedly connected to the opposing surfaces of the two moving rods 4, an electric telescopic rod 8 being fixedly installed inside the mounting groove 2, a lifting rod 9 being fixedly connected to the top of the output end of the electric telescopic rod 8, a symmetrically arranged extrusion groove 10 being provided on the lifting rod 9, a clamping ring 11 being fixedly connected to the top of the two moving rods 4, and a rubber ring 12 being provided on the two clamping rings 11.

[0017] The bottom ends of the moving rods 4 slide through the sliding grooves 3 located inside the mounting grooves 2. The moving rods 4 facilitate driving the clamping rings 11 to move, and the sliding grooves 3 facilitate providing a moving path for the moving rods 4. The pressure blocks 6 are all triangularly arranged, and the bottom ends of the pressure blocks 6 slide through the extrusion grooves 10. When the extrusion grooves 10 follow the lifting rods 9 to move upward, it is convenient to squeeze the obliquely arranged outer walls of the pressure blocks 6. The springs 7 are fixedly connected to the inner walls of the mounting grooves 2. A guide rod 13 is fixedly connected to the inside of the mounting grooves 2. The guide rod 13 slides through the two moving rods 4 and the spring 7. When the spring 7 is squeezed and contracted by the moving rod 4, it is convenient to drive the moving rod 4 to reset. The two ends of the lifting rod 9 are respectively slidably connected to the inside of the accommodating grooves 5, and the accommodating grooves 5 facilitate guiding the movement of the lifting rod 9.

[0018] Specifically, when using the present invention, first start the electric telescopic rod 8. The output end of the electric telescopic rod 8 extends upward, which will drive the lifting rod 9 to move together. The lifting rod 9 will move in the accommodating groove 5 inside the moving rod 4. The lifting rod 9 moves upward, and the inner walls of the two extrusion grooves 10 will squeeze the obliquely arranged outer walls of the pressure block 6. When the two pressure blocks 6 are squeezed, they will move toward the middle direction at the same time. The movement of the pressure blocks 6 will drive the moving rod 4 to move. The movement of the moving rod 4 is guided by the guide rod 13. The movement of the moving rod 4 will stretch the spring 7. At the same time, the moving rod 4 slides inside the sliding groove 3 near the top position. At the same time, the movement of the moving rod 4 will drive the clamping ring 11 to move. The movement of the clamping ring 11 will drive the rubber ring 12 to move. The two rubber rings 12 will clamp the outer ring of the wafer at the same time. At this time, stopping the electric telescopic rod 8 can complete the clamping of the wafer, and the operation is extremely convenient.

[0019] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cutting device for semiconductor production, characterized in that: The invention comprises a body (1), wherein a mounting groove (2) is provided inside the body (1), a sliding groove (3) is provided at a position corresponding to the mounting groove (2) on the body (1), a symmetrically arranged moving rod (4) is slidably connected inside the sliding groove (3), two moving rods (4) are provided with a receiving groove (5), two pressure blocks (6) are fixedly connected inside the receiving grooves (5), and the opposed surfaces of the two moving rods (4) are fixedly connected with springs (7), an electric telescopic rod (8) is fixedly installed inside the mounting groove (2), the top end of the output end of the electric telescopic rod (8) is fixedly connected with a lifting rod (9), the lifting rod (9) is provided with a symmetrically arranged extrusion groove (10), the top ends of the two moving rods (4) are fixedly connected with a clamping ring (11), and the two clamping rings (11) are provided with a rubber ring (12).

2. A semiconductor production cutting device according to claim 1, characterized in that: The bottom end of the moving rod (4) slides through the sliding groove (3) and is located inside the installation groove (2).

3. The semiconductor production cutting device according to claim 1, wherein: The pressure blocks (6) are all arranged in a triangular shape, and the bottom ends of the pressure blocks (6) slide through the extrusion grooves (10).

4. The semiconductor production cutting device according to claim 1, wherein: The springs (7) are fixedly connected to the inner wall of the installation groove (2), and a guide rod (13) is fixedly connected inside the installation groove (2). The guide rod (13) slides through the two moving rods (4) and the spring (7).

5. The semiconductor production cutting device according to claim 1, wherein: Both ends of the lifting rod (9) are respectively slidably connected to the inside of the accommodating groove (5).

Images