LC passive sensor packaging structure
The packaging structure of the ceramic shell and ceramic probe solves the problem of poor consistency and reliability of LC sensors in high temperature environments, achieves stable measurement and signal integrity in high temperature environments, and is suitable for high temperature and harsh environments.
Patent Information
- Application Number
- CN202422895289.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-11-26
AI Technical Summary
Existing LC sensor packaging solutions have poor consistency and reliability in high-temperature environments. Polymer packaging has poor temperature resistance, while metal packaging is expensive and affects signal transmission, making it unable to meet application requirements in harsh high-temperature environments.
The packaging structure adopts a ceramic shell and ceramic probe, including a cylindrical ceramic shell, base, air guide groove, ceramic probe, ceramic connecting column and ceramic flange cover. It is combined with high-performance industrial ceramic materials and designed into a combed ladder structure and through-hole structure to ensure the stability and signal integrity of the sensor in high-temperature environments.
It provides stability and signal integrity in high temperature environments, reduces packaging stress, ensures measurement accuracy and signal transmission reliability, and is suitable for high temperature and harsh environments.
Smart Images
Figure CN223346196U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of LC sensors, and in particular to an LC passive sensor packaging structure. Background Art
[0002] An LC sensor is a passive sensor based on the resonant principle of inductance (L) and capacitance (C). It relies on changes in the resonant frequency of the LC circuit to sense changes in external physical quantities (such as temperature, pressure, and strain). By measuring the resonant frequency or impedance changes of the LC circuit, the LC sensor can convert the measured physical quantity into a readable electrical signal, thereby achieving non-contact, passive, and wireless measurement. This type of sensor is widely used to monitor environmental parameters such as temperature, pressure, and strain, and is particularly suitable for use in high-temperature and harsh environments. However, a mature high-temperature packaging solution is still lacking. Conventional polymer or metal packaging cannot meet the operating requirements in high-temperature environments, resulting in poor consistency and reliability of the packaging structure.
[0003] Polymer packaging is widely used in sensor manufacturing, typically using injection molding to encapsulate the sensor element in a plastic housing. This packaging method, primarily made of thermoplastics (such as polycarbonate, ABS, and PPS), offers advantages such as low cost and light weight. Plastic packaging solutions can meet the demands for lightweight, low-cost, and custom-shaped packaging. Metal packaging typically utilizes materials such as stainless steel and aluminum alloys, encapsulating the sensor element in a metal housing through precision stamping, welding, and laser welding. Metal packaging provides excellent structural protection and high-pressure sealing, ensuring the sensor's proper operation under high pressure and suitable for applications in extreme environments.
[0004] Polymer packaging has a high coefficient of thermal expansion and poor temperature resistance, with a maximum operating temperature typically between 150°C and 300°C. Furthermore, chemical resistance and long-term sealing performance are poor in high-humidity or harsh environments, which can easily lead to internal component failure. Metal packaging is expensive to produce, heavy, and has good conductivity, which can easily shield the signal from the internal LC sensor core, affecting signal transmission and integrity. Furthermore, its coefficient of thermal expansion is mismatched with that of silicon- or ceramic-based sensor cores, resulting in increased package stress and even seal failure. Summary of the Invention
[0005] The present disclosure is proposed in view of the above problems. The present disclosure provides an LC passive sensor packaging structure.
[0006] According to one aspect of the present disclosure, an LC passive sensor packaging structure is proposed, which includes a ceramic housing and a ceramic probe;
[0007] The ceramic housing is cylindrical, and a base is provided in the middle thereof; the base divides the ceramic housing into a first installation cavity and a second installation cavity;
[0008] The base is provided with an air guide groove, the air guide groove communicating with the first installation cavity and the second installation cavity; the base is provided with a sensor chip;
[0009] The ceramic probe is installed in the first installation cavity.
[0010] The LC passive sensor packaging structure as described above, wherein, optionally, one end of the ceramic probe is threadedly connected to the inner wall of the first mounting cavity;
[0011] A limiting surface for limiting the ceramic probe is provided in the first installation cavity, and a distance between the limiting surface and the base is not less than 2 mm.
[0012] The LC passive sensor packaging structure as described above, wherein, optionally, the ceramic probe includes a connecting portion, an intermediate step portion, and an end portion in sequence along a direction away from the base;
[0013] The outer diameters of the connecting portion, the intermediate step portion, and the end head decrease in sequence;
[0014] The ceramic probe is provided with a detection hole which passes through the connecting portion, the middle step portion and the end head.
[0015] In the LC passive sensor packaging structure as described above, optionally, an air guide groove is provided on the base, and the air guide groove is a cross-shaped structure.
[0016] The LC passive sensor packaging structure as described above, wherein, optionally, further comprises a ceramic connecting column;
[0017] The ceramic connecting column is threadedly connected to the second mounting cavity;
[0018] The outer periphery of the ceramic connecting column is provided with a groove arranged along the length direction thereof;
[0019] The groove cooperates with the inner wall of the second installation cavity to form a through hole for allowing the antenna connected to the sensor chip to pass through.
[0020] The LC passive sensor packaging structure as described above, optionally, further includes a ceramic sleeve, which is sleeved on the periphery of the antenna.
[0021] The LC passive sensor packaging structure as described above, wherein, optionally, it further includes a ceramic flange cover;
[0022] The ceramic flange cover is bolted to one end of the ceramic connection column away from the base.
[0023] In the LC passive sensor packaging structure as described above, optionally, the sensor chip is bonded to the base by glue.
[0024] In the LC passive sensor packaging structure as described above, optionally, the thickness of the base is 2-4 mm.
[0025] As will be described in detail below, the packaging structure designed according to the present disclosure adopts high-performance industrial ceramics, which have sufficient strength to withstand high temperatures and can effectively protect the sensor core even in high-temperature environments; it has good sealing and insulation properties, which can not only isolate interference from the external environment, but also ensure that the sensor core is connected to the measurement environment, and will not generate electromagnetic interference to the signal of the LC sensor; and the ceramic packaging structure designed in this application brings less stress to the sensor chip compared to plastic packaging, thereby ensuring the accuracy of the sensor measurement results.
[0026] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The above and other purposes, features, and advantages of the present disclosure will become more apparent through a more detailed description of the embodiments of the present disclosure in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and are not intended to limit the present disclosure. In the drawings, the same reference numerals generally represent the same components or steps.
[0028] Figure 1 is a perspective view of an LC passive sensor packaging structure proposed in one embodiment of the present disclosure;
[0029] Figure 2 is a schematic structural diagram of a ceramic housing proposed in one embodiment of the present disclosure;
[0030] Figure 3 is a cross-sectional view of a ceramic housing proposed in one embodiment of the present disclosure;
[0031] Figure 4 is a schematic structural diagram of a ceramic probe proposed in one embodiment of the present disclosure;
[0032] Figure 5 is a cross-sectional view of a ceramic probe proposed in one embodiment of the present disclosure;
[0033] Figure 6 is a schematic structural diagram of a ceramic connecting column proposed in one embodiment of the present disclosure;
[0034] Figure 7 yes Figure 6 Right view;
[0035] Figure 8 This is a schematic structural diagram of a ceramic flange cover proposed in one embodiment of the present disclosure;
[0036] Figure 9 It is a cross-sectional view of a ceramic flange cover proposed in one embodiment of the present disclosure.
[0037] Description of reference numerals:
[0038] 1-ceramic housing, 2-ceramic probe, 3-ceramic connecting column, 4-ceramic flange cover;
[0039] 11-base, 12-first installation cavity, 13-second installation cavity, 14-air guide groove, 15-limiting surface,
[0040] 21-connecting part, 22-middle step part, 23-end, 24-detection hole;
[0041] 31-Groove. DETAILED DESCRIPTION
[0042] In order to make the purpose, technical solutions and advantages of the present disclosure more apparent, the following will describe in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure, and it should be understood that the present disclosure is not limited to the exemplary embodiments described herein.
[0043] Please refer to Figures 1 to 9 The present disclosure proposes an LC passive sensor packaging structure, including a ceramic housing 1 and a ceramic probe 2; the ceramic housing 1 is used to provide support for the entire structure.
[0044] The ceramic housing 1 is cylindrical, specifically, cylindrical, with a base 11 disposed in the middle thereof; the base 11 divides the ceramic housing 1 into a first mounting cavity 12 and a second mounting cavity 13. Specifically, the base 11 is used to mount a sensor chip.
[0045] The base 11 is provided with an air guide groove 14, which connects the first mounting cavity 12 and the second mounting cavity 13. A sensor chip is mounted on the base 11, and the ceramic probe 2 is mounted within the first mounting cavity 12. In a specific implementation, the air guide groove 14 extends through the base 11, allowing the space between the first mounting cavity 12 and the second mounting cavity 13 to communicate with each other, thereby ensuring consistent pressure protection on both sides of the sensor chip.
[0046] In practice, one end of the ceramic probe 2 is threadedly connected to the inner wall of the first mounting cavity 12. A limiting surface 15 is provided within the first mounting cavity 12 to constrain the ceramic probe 2. The distance between the limiting surface 15 and the base 11 is no less than 2 mm. The limiting surface 15 constrains the end face of the ceramic probe 2, preventing it from pressing against the sensor chip during installation, thereby improving measurement accuracy and operational stability.
[0047] Please refer to Figure 4 and Figure 5 In a specific implementation, the ceramic probe 2 includes a connecting portion 21, an intermediate step portion 22 and an end 23 in sequence along a direction away from the base 11;
[0048] The outer diameters of the connecting portion 21 , the middle step portion 22 and the end head 23 decrease in sequence; that is, the ceramic probe 2 is made into a stepped structure, which can ensure the fracture strength of the structure.
[0049] The ceramic probe 2 is provided with a detection hole 24 that passes through the connecting portion 21, the intermediate step portion 22, and the end 23. The detection hole 24 is designed as a through-hole structure to ensure that the sensor chip is connected to the test environment. Due to the thermal conductivity of the ceramic and the design of the through-hole, the sensor can achieve in-situ measurement, which is conducive to ensuring measurement accuracy.
[0050] In a specific implementation, the base 11 is provided with an air guide groove 14, which is a cross-shaped structure. In a specific implementation, the air guide groove 14 can also be a plurality of round holes, square holes, etc. distributed on the base 11.
[0051] Please refer to Figure 1 、 Figure 6 and Figure 7 In a specific implementation, it also includes a ceramic connecting column 3; the outer periphery of the entire ceramic connecting column 3 can be a nearly cylindrical structure, and the ceramic connecting column 3 is threadedly connected to the second mounting cavity 13; the outer periphery of the ceramic connecting column 3 is provided with a groove 31 arranged along its length direction; in a specific implementation, the groove 31 can be a groove with an arc-shaped cross-section.
[0052] The groove 31 cooperates with the inner wall of the second mounting cavity 13 to form a through-hole for the antenna connected to the sensor chip. Specifically, the ceramic connecting post 3 cooperates with the groove 31 to form a through-hole for the antenna. In practical applications, a ceramic sleeve may also be included, which is positioned around the outer periphery of the antenna. This ceramic sleeve protects the antenna and dissipates heat.
[0053] Please refer to Figure 1 、 Figure 8 and Figure 9 In order to facilitate the installation and fixation of the entire packaging structure, a ceramic flange cover 4 is also included; the ceramic flange cover 4 is bolted to the end of the ceramic connecting column 3 away from the base 11. When in use, the ceramic flange cover 4 is bolted to the aviation plug.
[0054] In a specific implementation, the sensor chip is bonded to the base 11 by glue. Since the base 11 is located inside the ceramic housing, such a configuration facilitates the installation of the sensor chip.
[0055] In a specific implementation, the thickness of the base 11 is 2-4 mm. In a preferred implementation, the thickness of the base 11 is 3 mm.
[0056] In actual use, the ceramic housing 1, ceramic probe 2, ceramic connecting column 3 and ceramic flange cover 4 are all made of high-performance industrial ceramics, which have sufficient strength and high temperature resistance and can effectively protect the sensor core in high temperature environments.
[0057] The production and installation process is as follows: First, prepare the required ceramic blank. The ceramic blank undergoes precision machining, sequentially including cutting, rough grinding, fine grinding, CNC machining, lapping, and polishing. Before packaging the sensor, prepare a high-temperature-resistant antenna for the LC passive sensor as needed. A 1mm diameter wire can be used to create the antenna, with a distance of 5cm between the antenna base and the aviation plug. Two ceramic sleeves are placed over the antenna transmission line to protect the antenna and dissipate heat. Apply a sufficient amount of high-temperature-resistant adhesive to the base 11 in the ceramic housing 1. The sensor chip is then attached to the adhesive. The ceramic housing 1, with the sensor chip mounted, is then placed in a high-temperature furnace for curing, ensuring a secure bond between the sensor chip and the ceramic housing 1. The prepared high-temperature-resistant antenna is inserted into the groove 31 of the ceramic connecting post 3 and then mated to the other end of the ceramic housing 1. The high-temperature aviation plug is connected to the ceramic flange cover 4 using four hexagonal bolts. The protruding portion of the antenna is inserted into the insulator socket of the aviation plug, and the ceramic flange cover is then mated to the connecting post.
[0058] The basic principles of the present disclosure have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this disclosure are merely illustrative and not restrictive, and should not be construed as necessarily possessed by each embodiment of the present disclosure. Furthermore, the specific details disclosed above are provided for illustrative purposes and to facilitate understanding, rather than as limitations. These details do not limit the present disclosure to necessarily being implemented using these specific details.
[0059] The block diagrams of the devices, devices, equipment, and systems involved in this disclosure are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.
[0060] Additionally, as used herein, "or" used in a list of items beginning with "at least one" indicates a separate list, so that, for example, a list of "at least one of A, B, or C" means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). Furthermore, the word "exemplary" does not mean that the example described is preferred or better than other examples.
[0061] It should also be noted that in the system and method of the present disclosure, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present disclosure.
[0062] Various changes, substitutions, and modifications may be made to the technology described herein without departing from the teachings defined by the appended claims. Moreover, the scope of the claims of this disclosure is not limited to the specific aspects of the processes, machines, manufactures, compositions of things, means, methods, and actions described above. Currently existing or later developed processes, machines, manufactures, compositions of things, means, methods, or actions that perform substantially the same function or achieve substantially the same results as the corresponding aspects described herein may be utilized. Accordingly, the appended claims include within their scope such processes, machines, manufactures, compositions of things, means, methods, or actions.
[0063] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0064] The above description has been provided for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.
Claims
1. An LC passive sensor packaging structure, characterized in that: It comprises a ceramic housing (1) and a ceramic probe (2); The ceramic housing (1) is cylindrical, and a base (11) is provided in the middle thereof; the base (11) divides the ceramic housing (1) into a first installation cavity (12) and a second installation cavity (13); An air guide groove (14) is provided on the base (11), and the air guide groove (14) is connected to the first installation cavity (12) and the second installation cavity (13); a sensor chip is installed on the base (11); The ceramic probe (2) is installed in the first installation cavity (12).
2. The LC passive sensor packaging structure according to claim 1, wherein: One end of the ceramic probe (2) is threadedly connected to the inner wall of the first mounting cavity (12); A limiting surface (15) for limiting the ceramic probe (2) is provided in the first installation cavity (12), and the distance between the limiting surface (15) and the base (11) is not less than 2 mm.
3. The LC passive sensor packaging structure according to claim 1, wherein: The ceramic probe (2) comprises a connecting portion (21), an intermediate step portion (22) and an end portion (23) in sequence in a direction away from the base (11); The outer diameters of the connecting portion (21), the intermediate step portion (22), and the end head (23) decrease in sequence; The ceramic probe (2) is provided with a detection hole (24) that passes through the connecting portion (21), the middle step portion (22) and the end head (23).
4. The LC passive sensor packaging structure according to claim 1, wherein: An air guide groove (14) is provided on the base (11), and the air guide groove (14) is a cross-shaped structure.
5. The LC passive sensor packaging structure according to claim 1, wherein: Also includes a ceramic connecting column (3); The ceramic connecting column (3) is threadedly connected to the second mounting cavity (13); The outer periphery of the ceramic connecting column (3) is provided with a groove (31) arranged along the length direction thereof; The groove (31) cooperates with the inner wall of the second mounting cavity (13) to form a through hole for allowing an antenna connected to the sensor chip to pass through.
6. The LC passive sensor packaging structure according to claim 5, wherein: It also includes a ceramic sleeve, which is sleeved on the outer circumference of the antenna.
7. The LC passive sensor packaging structure according to claim 5, wherein: Also includes a ceramic flange cover (4); The ceramic flange cover (4) is bolted to one end of the ceramic connection column (3) away from the base (11).
8. The LC passive sensor packaging structure according to any one of claims 1 to 7, characterized in that: The sensor chip is bonded to the base (11) by glue.
9. The LC passive sensor packaging structure according to any one of claims 1 to 7, characterized in that: The thickness of the base (11) is 2-4 mm.