Environment temperature sensor

The double insulation chamber design and sealed structure solve the problem of circuit board heat affecting the temperature of the temperature sensing element, and realize a low-error, waterproof and moisture-proof ambient temperature sensor that adapts to various environments, has a simple structure and is easy to assemble.

CN223346290UActive Publication Date: 2025-09-16XINXIANG NORTH VEHICLE NETEER CO
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Patent Information

Application Number
CN202422854717.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-22
Publication Date
2025-09-16
Estimated Expiration
2034-11-22

AI Technical Summary

Technical Problem

Existing ambient temperature sensors have large measurement errors due to heat accumulation in circuit board components during continuous operation, poor waterproof and moisture-proof performance, complex structure, inconvenient assembly, and low reliability.

Method used

It adopts a double insulation chamber design, with the circuit board components and temperature sensing elements placed in separate insulation chambers. These are sealed with insulation plates and O-rings to isolate heat transfer. It also has waterproof and moisture-proof functions, a simple structure, and is easy to assemble.

Benefits of technology

It achieves low measurement error, strong waterproof and moisture-proof performance and high reliability, adapts to various environments and is easy to assemble.

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    Figure CN223346290U_ABST
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Abstract

The environment temperature sensor comprises a housing, a separator plate, a heat insulation plate and an upper cover, the top end of the housing is of an open structure, a circuit board assembly is arranged in the housing, the separator plate is fixedly arranged at the top end of the housing, and a heat insulation chamber I is formed between the separator plate and the housing; the heat insulation plate is fixedly arranged at the top end of the partition plate, a first wire passing micropore is formed in the partition plate, and sealant used for sealing wires is further arranged in the first wire passing micropore. A second wire passing micropore is formed in the position, corresponding to the first wire passing micropore, of the heat insulation plate. The upper cover is fixedly arranged at the top end of the heat insulation plate, a containing groove is formed in the bottom face of the upper cover, a second heat insulation cavity is formed in the position, corresponding to the containing groove, between the upper cover and the heat insulation plate, and a temperature sensing element is fixedly arranged in the second heat insulation cavity. The utility model has the advantages of water resistance, moisture resistance, small measurement error and the like.
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Description

Technical Field

[0001] The utility model relates to the technical field of temperature sensors, in particular to an environmental temperature sensor. Background Art

[0002] At present, the common ambient temperature sensors on the market are mainly composed of temperature sensing elements, housings, circuit components and connectors, and are mainly used for measuring ambient temperature.

[0003] The structure is one in which a housing completely encloses the temperature sensing element and circuit board assembly, as shown in the temperature sensor packaging structure disclosed in Patent Publication No. CN107167256B. A disadvantage of this sensor structure is that because the temperature sensing element and the circuit board are contained within the same housing, after a period of continuous operation, heat generated by the electronic components on the circuit board assembly accumulates and is difficult to dissipate, causing the temperature inside the sensor to rise, and the temperature of the temperature sensing element to rise accordingly. This results in a significant error between the temperature measured by the temperature sensing element and the external ambient temperature.

[0004] Another design involves enclosing the temperature sensor and circuit board within the same enclosure, but with portions of the enclosure comprised of a breathable sintered filter. This sensor structure has the following drawbacks: while it avoids measurement errors caused by heat accumulation, it suffers from poor environmental adaptability and lacks waterproofing or moisture resistance, preventing outdoor use. This lack of moisture resistance also results in a shorter service life.

[0005] Existing environmental sensors have problems such as being waterproof and moisture-proof but unable to achieve small measurement errors, complex structures, inconvenient assembly, and low reliability. Utility Model Content

[0006] The technical problem to be solved by the present invention is to overcome the existing defects and provide an ambient temperature sensor. The heat generated by the circuit board assembly cannot affect the temperature of the temperature sensing element, so that the measurement error of the ambient temperature sensor is very small. It has strong waterproof and moisture-proof performance, strong environmental adaptability, simple structure, easy assembly, high reliability, waterproof and moisture-proof performance, and small measurement error, which can effectively solve the problems in the background technology.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an ambient temperature sensor, comprising a shell, a partition, a heat insulation plate and an upper cover, the top of the shell being an open structure, a circuit board assembly being provided in the shell, the partition being fixedly arranged at the top of the shell, and a heat insulation chamber 1 being formed between the partition and the shell; the heat insulation plate being fixedly arranged at the top of the partition, a wire passing microhole 1 being provided on the partition, and a wire passing microhole 2 being provided on the heat insulation plate at a position corresponding to the wire passing microhole 1; the upper cover being fixedly arranged at the top of the heat insulation plate, a receiving groove being provided on the bottom surface of the upper cover, a heat insulation chamber 2 being formed between the upper cover and the heat insulation plate at a position corresponding to the receiving groove, and a temperature sensing element being fixedly provided in the heat insulation chamber 2; the circuit board assembly being electrically connected to the temperature sensing element by passing wires through the wire passing microhole 1 and the wire passing microhole 2, and a sealant for sealing the wires is also provided in the wire passing microhole 1, the bottom end of the shell being provided with a step through hole communicating with the heat insulation chamber 1, and a socket being fixedly nested in the step through hole.

[0008] Furthermore, a sealing ring groove 1 is provided on the top surface of the partition, and an O-ring 1 is provided in the sealing ring groove 1; a sealing ring groove 2 is provided on the top surface of the heat insulation board, and an O-ring 2 is provided in the sealing ring groove 2.

[0009] Furthermore, an annular step groove is provided at the bottom end of the circumferential outer wall of the partition, the circumferential contour of the top end of the shell is adapted to the structure of the annular step groove, the top end of the shell abuts against the step surface of the annular step groove and is welded to each other; a threaded hole 1 is provided on the partition, and a through hole is provided on the heat insulation plate and the upper cover at the position corresponding to the threaded hole 1, and a connecting screw 2 is provided in the through hole of the upper cover, and the connecting screw 2 is screwed to the corresponding threaded hole 1 so that the heat insulation plate and the upper cover are detachably fixedly connected to the partition.

[0010] Furthermore, a rubber sealing gasket is provided on the step surface of the step through hole at the bottom end of the shell, a shoulder for squeezing the rubber sealing gasket is provided on the socket, and a mounting hole is provided on the shoulder of the socket. A threaded hole 2 is provided on the step surface of the step through hole at the bottom end of the shell at a position corresponding to the mounting hole, and the socket is detachably fixed to the shell by a connecting screw 1 passing through the mounting hole.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the present ambient temperature sensor is composed of two thermal insulation chambers, a circuit board assembly is installed in thermal insulation chamber one, a temperature sensing element is installed in thermal insulation chamber two, and a thermal insulation board is in the middle. An O-ring one is embedded between the thermal insulation board and thermal insulation chamber two, and an O-ring two is embedded between the thermal insulation board and thermal insulation chamber two. The thermal insulation board can not only block the heat transfer between the two thermal insulation chambers, but also plays a sealing role. The heat generated by the circuit board assembly cannot affect the temperature of the temperature sensing element, so that the error measured by the ambient temperature sensor is very small; at the same time, both the circuit board assembly and the temperature sensing element are sealed by the outer shell and the thermal insulation board, with strong waterproof and moisture-proof performance, strong environmental adaptability, simple structure, easy assembly, high reliability, waterproof and moisture-proof while having small measurement error. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of the utility model;

[0013] Figure 2 This is a cross-sectional view of the partition of the utility model;

[0014] Figure 3 This is a cross-sectional view of the heat insulation board of the utility model;

[0015] Figure 4 This is a cross-sectional view of the upper cover of the utility model;

[0016] Figure 5 This is a schematic diagram of the connection structure of the upper cover, heat insulation plate and partition of the utility model;

[0017] Figure 6 for Figure 1 Partial enlarged image.

[0018] In the figure: 1. Housing; 2. Partition; 21. Micro hole for wire passing 1; 22. Sealing ring groove 1; 23. Annular step groove; 3. Heat insulation board; 31. Micro hole for wire passing 2; 32. Sealing ring groove 2; 4. Upper cover; 41. Accommodating groove; 5. Temperature sensing element; 6. Circuit board assembly; 7. Socket; 8. Connecting screw 1; 9. Connecting screw 2; 10. Rubber sealing gasket; 11. O-ring 1; 12. O-ring 2; 13. Heat insulation chamber 1; 14. Heat insulation chamber 2; 15. Sealant. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example

[0020] See also Figure 1-6 The utility model provides a technical solution: an ambient temperature sensor, comprising a shell 1, a partition 2, a heat insulation plate 3 and an upper cover 4, the top of the shell 1 is an open structure, a circuit board assembly 6 is provided in the shell 1, the partition 2 is fixedly arranged at the top of the shell 1, and a heat insulation chamber 13 is formed between the partition 2 and the shell 1; an annular step groove 23 is provided at the bottom end of the circumferential outer wall of the partition 2, the circumferential contour of the top of the shell 1 is adapted to the structure of the annular step groove 23, the top of the shell 1 abuts on the step surface of the annular step groove 23 and is welded to each other; a sealing ring groove 22 is provided on the top surface of the partition 2, an O-ring 11 is provided in the sealing ring groove 22; the heat insulation plate 3 is fixedly arranged at the top end of the partition 2, a wire passing microhole 21 is provided on the partition 2, and a wire passing microhole 23 is provided at a position corresponding to the wire passing microhole 21 on the heat insulation plate 3 1; the upper cover 4 is fixedly arranged on the top of the heat insulation plate 3, and an accommodating groove 41 is provided on the bottom surface of the upper cover 4, and a heat insulation chamber 2 14 is formed between the upper cover 4 and the heat insulation plate 3 at a position corresponding to the accommodating groove 41, and a sealing ring groove 2 32 is provided on the top surface of the heat insulation plate 3, and an O-ring 2 12 is provided in the sealing ring groove 2 32; and a temperature sensing element 5 is fixedly provided in the heat insulation chamber 2 14; the circuit board assembly 6 is electrically connected to the temperature sensing element 5 through the wire passing microhole 1 21 and the wire passing microhole 2 31, and a sealant 15 for sealing the wire is also provided in the wire passing microhole 1 21; the bottom end of the shell 1 is provided with a step through hole connected to the heat insulation chamber 13, and a socket 7 is fixedly nested in the step through hole, a rubber sealing gasket 10 is provided on the step surface of the step through hole at the bottom end of the shell 1, and a shaft shoulder for squeezing the rubber sealing gasket 10 is provided on the socket 7;

[0021] The temperature sensing element 5 is a PT1000 platinum resistor. The upper cover 4, partition 2, and housing 1 are all made of stainless steel. The thickness of the upper cover 4 at the position corresponding to the contact with the temperature sensing element 5 is only 0.5 mm, which can enable the temperature sensing element 5 to quickly reach thermal equilibrium with the ambient temperature, with a short response time and sensitive reaction. The heat insulation board 3 is made of PEEK material, which has low thermal conductivity, high strength, and good weather resistance.

[0022] Working principle:

[0023] A closed thermal insulation chamber 2 14 is formed by the upper cover 4, the thermal insulation plate 3, and the O-ring 11. A temperature sensing element 5 is installed in the thermal insulation chamber 2 14, and the connecting line of the temperature sensing element 5 is sealed by the sealant 15 to completely seal the temperature sensing element 5 to prevent water and moisture, and at the same time isolate the circuit board assembly 6 from the heat accumulation; a closed thermal insulation chamber 13 is formed by the partition 2, the shell 1, the socket 7 and the rubber sealing gasket 10. The circuit board assembly 6 is installed in the thermal insulation chamber 2 14 to seal the circuit board assembly 6. The shell 1 and the partition 2 are connected by laser welding. A rubber sealing gasket 10 is provided between the socket 7 and the shell 1 to complete the sealing between the socket 7 and the shell 1.

[0024] Furthermore, a threaded hole 1 is provided on the partition 2, and through holes are provided on the heat insulation board 3 and the upper cover 4 at positions corresponding to the threaded hole 1. A connecting screw 2 9 is provided in the through hole of the upper cover 4. The connecting screw 2 9 is screwed to the corresponding threaded hole 1 so that the heat insulation board 3 and the upper cover 4 are detachably fixedly connected to the partition 2.

[0025] Furthermore, a mounting hole is provided on the shoulder of the socket 7, and a threaded hole 2 is provided on the step surface of the step through hole at the bottom end of the shell 1 at the position corresponding to the mounting hole. The socket 7 is detachably fixed to the shell 1 by a connecting screw 8 passing through the mounting hole.

[0026] The ambient temperature sensor disclosed in this embodiment consists of two insulating chambers, wherein a circuit board assembly 6 is installed in the insulating chamber 1 13, and a temperature sensing element 5 is installed in the insulating chamber 2 14, with an insulating plate 3 in the middle. An O-ring 11 is embedded between the insulating plate 3 and the insulating chamber 2 14, and an O-ring 2 12 is embedded between the insulating plate 3 and the insulating chamber 1 13. The insulating plate 3 not only blocks the heat transfer between the two insulating chambers, but also serves as a seal. The heat generated by the circuit board assembly 6 cannot affect the temperature of the temperature sensing element 5, so that the error measured by the ambient temperature sensor is very small. At the same time, both the circuit board assembly 6 and the temperature sensing element 5 are sealed by the housing 1 and the insulating plate 3, and have strong waterproof and moisture-proof properties, strong environmental adaptability, simple structure, easy assembly, and high reliability.

[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ambient temperature sensor comprising a housing, a partition, a heat shield, and an upper cover, characterized in that: The top of the shell is an open structure, and a circuit board assembly is provided in the shell. The partition is fixedly arranged on the top of the shell, and a heat insulation chamber 1 is formed between the partition and the shell; the heat insulation board is fixedly arranged on the top of the partition, and a wire passing microhole 1 is provided on the partition, and a wire passing microhole 2 is provided on the heat insulation board at a position corresponding to the wire passing microhole 1; the upper cover is fixedly arranged on the top of the heat insulation board, and a accommodating groove is provided on the bottom surface of the upper cover, and a heat insulation chamber 2 is formed between the upper cover and the heat insulation board at a position corresponding to the accommodating groove, and a temperature sensing element is fixedly provided in the heat insulation chamber 2; the circuit board assembly is electrically connected to the temperature sensing element by passing wires through the wire passing microhole 1 and the wire passing microhole 2, and the wire passing microhole 1 is also provided with a sealant for sealing the wires, and the bottom end of the shell is provided with a step through hole connected to the heat insulation chamber 1, and a socket is fixedly nested in the step through hole.

2. The ambient temperature sensor according to claim 1, wherein: The top surface of the partition is provided with a sealing ring groove 1, in which an O-ring 1 is arranged; the top surface of the heat insulation board is provided with a sealing ring groove 2, in which an O-ring 2 is arranged.

3. The ambient temperature sensor according to claim 1, wherein: An annular step groove is provided at the bottom end of the circumferential outer wall of the partition, the circumferential contour of the top end of the shell is adapted to the structure of the annular step groove, the top end of the shell abuts against the step surface of the annular step groove and is welded to each other; a threaded hole 1 is provided on the partition, and through holes are provided on the heat insulation plate and the upper cover at the position corresponding to the threaded hole 1, and connecting screws 2 are provided in the through holes of the upper cover, and the connecting screws 2 are screwed to the corresponding threaded hole 1 so that the heat insulation plate and the upper cover are detachably fixedly connected to the partition.

4. The ambient temperature sensor according to claim 1, wherein: A rubber sealing gasket is provided on the step surface of the step through hole at the bottom end of the shell, a shaft shoulder for squeezing the rubber sealing gasket is provided on the socket, and a mounting hole is provided on the shaft shoulder of the socket. A second threaded hole is provided on the step surface of the step through hole at the bottom end of the shell at a position corresponding to the mounting hole, and the socket is detachably fixed to the shell by a connecting screw that passes through the mounting hole.

Citation Information

Patent Citations

  • A temperature sensor packaging structure

    CN107167256B