Testing device of wafer loading and unloading mechanism

Abstract

The utility model relates to a testing device of a wafer loading and unloading mechanism. Comprising a rack which comprises at least three supporting legs; the first test platform is fixedly arranged on the rack and is used for placing the wafer loading and unloading mechanism; the gas conveying mechanism is used for conveying gas flow with preset gas pressure to the wafer loading and unloading mechanism placed on the test platform; and the first vibration tester is used for measuring the vibration value of the rack when the wafer loading and unloading mechanism conveys the airflow. According to the technical scheme of the invention, the yield of wafers is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a testing device for a wafer loading and unloading mechanism. Background Art

[0002] In wafer manufacturing, with the advancement of process technology and the reduction of conductor and gate dimensions, photolithography technology has placed increasingly stringent requirements on wafer surface flatness. Chemical Mechanical Polish (CMP) technology has rapidly developed and is widely used in the wafer manufacturing industry. CMP, also known as chemical mechanical polishing, is a process that combines chemical etching with mechanical removal. It is the only mechanical processing technology that can achieve global surface flatness.

[0003] The chemical mechanical polishing process requires a chemical mechanical polisher (CMP), which is equipped with a wafer handling mechanism. During wafer loading and unloading, and during the polishing process, the pneumatic mechanism generates vibrations, which in turn cause slight deformations in the wafers and generate additional stress. This additional stress can lead to wafer breakage during CMP. Utility Model Content

[0004] In view of this, the present application provides a testing device for a wafer loading and unloading mechanism to solve at least one problem existing in the background technology.

[0005] To achieve the above objectives, the technical solution of this application is implemented as follows:

[0006] An embodiment of the present application provides a test device for a wafer handling mechanism, which is used to test the wafer handling mechanism. The wafer handling mechanism includes a base and a load cup. The test device for the wafer handling mechanism includes:

[0007] a frame including at least three supporting legs;

[0008] A first test platform, fixedly arranged on the frame, for placing the wafer loading and unloading mechanism;

[0009] An air delivery mechanism, configured to deliver an air flow of a preset pressure to the wafer loading and unloading mechanism placed on the test platform;

[0010] The first vibration tester measures the vibration value of the rack when the wafer handling mechanism is supplied with airflow.

[0011] In an optional embodiment, the testing device of the wafer handling mechanism further includes:

[0012] The second test platform is fixedly arranged on the frame and below the first test platform; and is used for installing the first vibration tester.

[0013] In an optional embodiment, the rack includes four columns, and the four corners of the first test platform are respectively fixed on the columns; the supporting feet are respectively provided under the four columns.

[0014] In an optional embodiment, the columns are all made of aluminum alloy profiles.

[0015] In an optional embodiment, the testing device of the wafer handling mechanism further includes:

[0016] The second vibration tester includes at least two magnetic suction heads, which are respectively sucked on the base and the load cup of the wafer handling mechanism, and measures the vibration value when the wafer handling mechanism is transported by air flow.

[0017] In an optional embodiment, the testing device of the wafer handling mechanism further includes:

[0018] A first level is movably mounted on the first test platform and is used to measure the levelness of the load cup of the wafer loading and unloading mechanism.

[0019] In an optional embodiment, the height of the supporting legs is adjustable to adjust the levelness of the first test platform.

[0020] In an optional embodiment, the testing device of the wafer handling mechanism further includes:

[0021] The third test platform is used to support the load cup of the wafer loading and unloading mechanism and adjust the levelness of the load cup by adjusting its own levelness; the third test platform is installed on the rack.

[0022] In an optional embodiment, the testing device of the wafer handling mechanism further includes:

[0023] The second level is movably mounted on the third test platform and is used to measure the levelness of the third test platform.

[0024] In an optional embodiment, the third test platform is mounted on the frame via a horizontal adjustment screw, and the third test platform can adjust its own levelness via the horizontal adjustment screw.

[0025] The test device for the wafer loading and unloading mechanism provided in the embodiment of the present application includes: a frame including at least three supporting legs; a first test platform fixedly arranged on the frame for placing the wafer loading and unloading mechanism; an air supply mechanism for delivering an airflow of a preset air pressure to the wafer loading and unloading mechanism placed on the test platform; and a first vibration tester for measuring the vibration value of the frame when the wafer loading and unloading mechanism is delivered with the airflow. It can be seen that the test device for the wafer loading and unloading mechanism in the embodiment of the present application, by setting the first vibration tester, adjusts the vibration value to a specified range before the wafer loading and unloading mechanism is installed on the chemical mechanical grinder, thereby reducing the additional stress generated by the wafer due to the large vibration, thereby reducing the breakage of the wafer in the subsequent process, that is, improving the yield rate of the wafer. Therefore, the test device for the wafer loading and unloading mechanism in the embodiment of the present application improves the yield rate of the wafer.

[0026] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0028] Figure 1 Schematic diagram of a test device for a wafer loading and unloading mechanism provided in an embodiment of the present application.

[0029] Description of reference numerals:

[0030] 10. Frame; 11. Support legs; 12. Column; 13. Level adjustment screw; 21. First test platform; 22. Second test platform; 23. Third test platform; 31. First vibration tester; 41. First level; 42. Second level; 91. Base; 92. Load cup. DETAILED DESCRIPTION

[0031] To make the technical solutions and beneficial effects of this application more clearly understood, the following detailed description is given by way of specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly illustrate the details of the local features. Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0032] In the description of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of simplifying the description of this application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation to this application.

[0033] In this application, the terms "first" and "second" are used solely for descriptive purposes and should not be construed as indicating the relative importance of the features indicated or the quantity of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly include at least one of such features. Throughout this application, "plurality" means at least two, such as two or three, and "several" means at least one, such as one, two, or three, unless otherwise specifically defined.

[0034] In this application, unless otherwise expressly defined, the terms "installed," "connected," "connect," "fixed," and "disposed" should be interpreted broadly. For example, "connection" can mean fixed, removable, or integrated; it can mean mechanical or electrical; it can mean direct or indirect connection through an intermediary; it can also mean internal communication between two components or an interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0035] In the present application, unless otherwise explicitly defined, when a first feature is “on,” “above,” “above,” “above,” “below,” “below,” or “below” a second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may be in indirect contact via an intermediate medium. Moreover, when a first feature is “on,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0036] In order to fully understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0037] In response to the technical problems in the related art, an embodiment of the present application provides a test device for a wafer loading and unloading mechanism, which is used to test the wafer loading and unloading mechanism. The wafer loading and unloading mechanism includes a base 91 and a load cup 92.

[0038] refer to Figure 1 , the test device of the wafer handling mechanism includes:

[0039] The frame 10 includes at least three supporting legs 11;

[0040] The first test platform 21 is fixedly mounted on the frame 10 and is used to place the wafer loading and unloading mechanism;

[0041] An air delivery mechanism, configured to deliver an air flow of a preset pressure to the wafer loading and unloading mechanism placed on the test platform;

[0042] The first vibration tester 31 measures the vibration value of the frame 10 when the wafer handling mechanism is supplied with airflow.

[0043] It can be understood that the rack 10 is used to be placed on the ground, and therefore requires at least three supporting legs 11. The three supporting legs 11 form a surface, which can support the rack 10 more stably.

[0044] It can be understood that the first test platform 21 may include a table for placing the wafer handling mechanism, and the table needs to have a prescribed stability to reduce the error of the vibration test.

[0045] Specifically, the gas delivery mechanism can be an air pump or a gas storage tank, and the pressure of the air flow output by the air pump or the gas storage tank is adjustable. In this way, it is possible to understand how much pressure air flow is suitable by adjusting the pressure of the gas.

[0046] It can be understood that since the wafer loading and unloading mechanism is placed on the first test platform 21 and the first test platform 21 is fixedly set on the frame 10, the vibration generated by the wafer loading and unloading mechanism will be transmitted to the frame 10. Therefore, by measuring the vibration value of the frame 10, the vibration value of the wafer loading and unloading mechanism can be known.

[0047] Specifically, the first vibration tester 31 may be a photoelectric speed sensor, which can measure both speed and vibration.

[0048] The test device of the wafer loading and unloading mechanism in the embodiment of the present application is equipped with a first vibration tester 31. Before the wafer loading and unloading mechanism is installed on the chemical mechanical polishing machine, the vibration value is first adjusted to a specified range, thereby reducing additional stress on the wafer due to large vibration, thereby reducing the breakage of the wafer in subsequent processes.

[0049] In some other embodiments of the present application, the testing device of the wafer handling mechanism further includes:

[0050] The second test platform 22 is fixedly mounted on the frame 10 and below the first test platform 21 , and is used for mounting the first vibration tester 31 .

[0051] Setting up a separate test platform can make the material and structure of the first test platform 21 more suitable for placing the wafer handling mechanism, and make the material and structure of the second test platform 22 more suitable for installing the first vibration tester 31.

[0052] In some other embodiments of the present application, the rack 10 includes four columns 12 , and the four corners of the first test platform 21 are respectively fixed on the columns 12 ; the supporting feet 11 are respectively provided under the four columns 12 .

[0053] The four columns 12 can make the rack 10 more stable.

[0054] In other embodiments of the present application, the columns 12 are all made of aluminum alloy profiles.

[0055] Aluminum alloy profiles are high in strength, light in weight, and not easily corroded.

[0056] In some other embodiments of the present application, the testing device of the wafer handling mechanism further includes:

[0057] The second vibration tester (not shown in the figure) includes at least two magnetic suction heads, which are respectively sucked onto the base 91 and the load cup 92 of the wafer handling mechanism, and measures the vibration value when the wafer handling mechanism is transported by air flow.

[0058] In this way, the vibration value of the wafer handling mechanism can be directly measured. This is in contrast to measuring the vibration value of the rack 10 to obtain the vibration value of the wafer handling mechanism. Both measurement methods have their advantages and disadvantages. Therefore, by measuring both, a comprehensive assessment can be performed to reduce the potential for significant errors that may occur in certain situations when using a single measurement method.

[0059] Specifically, the second vibration tester is an electromagnetic vibration tester.

[0060] In some other embodiments of the present application, the testing device of the wafer handling mechanism further includes:

[0061] The first level 41 is movably mounted on the first test platform 21 and is used to measure the levelness of the load cup 92 of the wafer handling mechanism.

[0062] It can be understood that the base 91 and the load cup 92 of the wafer handling mechanism are movably connected, and the levelness of the two can be adjusted separately.

[0063] When the wafer handling mechanism is placed on the first test platform 21, the load cup 92 is above the first test platform 21. There's a significant distance between the bottom of the load cup 92 and the surface of the first test platform 21, for example, through the base 91 and connectors. Therefore, the first level 41 can be mounted on the first test platform 21 to measure the levelness of the bottom of the load cup 92. Since the levelness of the bottom of the load cup 92 is parallel to the support surface of the load cup 92, the levelness of the support surface of the load cup 92 can also be measured.

[0064] It is understood that before measuring the levelness of the load cup 92, the levelness of the first test platform 21 must also be measured to ensure that the levelness of the wafer handling mechanism base 91 meets the required levelness. Only then is the levelness of the load cup 92 measured as necessary. This is because the wafer handling mechanism is installed on the chemical mechanical polisher with the wafer handling mechanism base 91 as the installation reference.

[0065] Specifically, the first level 41 may be a digital inclinometer.

[0066] Testing and adjusting the levelness of the load cup 92 can shorten the installation and commissioning time for installation on the chemical mechanical polishing machine.

[0067] Therefore, in some other embodiments of the present application, the height of the supporting legs 11 is adjustable to adjust the levelness of the first test platform 21 .

[0068] Adjusting the levelness of the first test platform 21 , that is, adjusting the levelness of the base 91 of the wafer handling mechanism.

[0069] In some other embodiments of the present application, the testing device of the wafer handling mechanism further includes:

[0070] The third test platform 23 is used to support the load cup 92 of the wafer loading and unloading mechanism and adjust the levelness of the load cup 92 by adjusting its own levelness; the third test platform 23 is installed on the rack 10 .

[0071] As previously described, the levelness of the load cup 92 can be measured using the first level 41. The third test platform 23 can more conveniently adjust the levelness of the load cup 92. For example, the load cup 92 can be loosened from the base 91, and then the levelness of the load cup 92 can be adjusted by adjusting the levelness of the third test platform 23. After adjustment, the load cup 92 can be fastened to the base 91, for example, using screws.

[0072] In some other embodiments of the present application, the testing device of the wafer handling mechanism further includes:

[0073] The second level 42 is movably mounted on the third test platform 23 and is used to measure the levelness of the third test platform 23 .

[0074] Specifically, the second level 42 may be a level ruler. The movable installation may be that the level ruler is placed on the third test platform 23 .

[0075] In some other embodiments of the present application, the third test platform 23 is installed on the frame 10 through a horizontal adjustment screw 13 , and the third test platform 23 can adjust its own horizontality through the horizontal adjustment screw 13 .

[0076] Specifically, the horizontal adjustment screw 13 includes a threaded column with a vertical axis, and the frame 10 is provided with a threaded hole that cooperates with the threaded column. The height of the horizontal adjustment screw 13 in the vertical direction can be achieved by rotating the threaded column.

[0077] Specifically, there may be four horizontal adjustment screws 13 , and the four horizontal adjustment screws 13 can adjust the horizontality of the third test platform 23 by adjusting the height in the vertical direction respectively.

[0078] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the claims. Various modifications and variations may be made to the above embodiments without departing from the scope disclosed herein. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form additional embodiments of the present application that may not be explicitly described. Therefore, the above embodiments merely represent several implementations of the present application and do not limit the scope of protection of the patent application.

Claims

1. A wafer handling mechanism testing device, used for testing a wafer handling mechanism, wherein the wafer handling mechanism comprises a base and a load cup, and is characterized in that: The test device of the wafer handling mechanism includes: a frame including at least three supporting legs; A first test platform, fixedly arranged on the frame, for placing the wafer loading and unloading mechanism; An air delivery mechanism, configured to deliver an air flow of a preset pressure to the wafer loading and unloading mechanism placed on the test platform; The first vibration tester measures the vibration value of the rack when the wafer handling mechanism is supplied with airflow.

2. The wafer handling mechanism testing device according to claim 1, wherein: The test device of the wafer handling mechanism also includes: The second test platform is fixedly arranged on the frame and below the first test platform; and is used for installing the first vibration tester.

3. The wafer handling mechanism testing device according to claim 2, wherein: The frame includes four columns, and the four corners of the first test platform are respectively fixed on the columns; the supporting feet are respectively arranged under the four columns.

4. The wafer handling mechanism testing device according to claim 3, wherein: The columns are all made of aluminum alloy profiles.

5. The wafer handling mechanism testing device according to claim 1, wherein: The test device of the wafer handling mechanism also includes: The second vibration tester includes at least two magnetic suction heads, which are respectively sucked on the base and the load cup of the wafer handling mechanism, and measures the vibration value when the wafer handling mechanism is transported by air flow.

6. The wafer handling mechanism testing device according to claim 1, wherein: The test device of the wafer handling mechanism also includes: A first level is movably mounted on the first test platform and is used to measure the levelness of the load cup of the wafer loading and unloading mechanism.

7. The wafer handling mechanism testing device according to claim 3, wherein: The height of the supporting feet is adjustable to adjust the levelness of the first test platform.

8. The wafer handling mechanism testing device according to claim 3, wherein: The test device of the wafer handling mechanism also includes: The third test platform is used to support the load cup of the wafer loading and unloading mechanism and adjust the levelness of the load cup by adjusting its own levelness; the third test platform is installed on the rack.

9. The wafer handling mechanism testing device according to claim 8, wherein: The test device of the wafer handling mechanism also includes: The second level is movably mounted on the third test platform and is used to measure the levelness of the third test platform.

10. The wafer handling mechanism testing device according to claim 9, wherein: The third test platform is installed on the frame through a horizontal adjustment screw, and the third test platform can adjust its own horizontality through the horizontal adjustment screw.

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