Wafer surface defect detection device

Abstract

The utility model relates to the field of wafer detection equipment, in particular to a wafer surface defect detection device which comprises a machine table, a supporting frame and a detection lens, the supporting frame is arranged on the machine table, the detection lens is arranged on the supporting frame, a containing groove is formed in the top of the machine table, and the detection lens is arranged in the containing groove. And an adsorption assembly is arranged in the placing groove and is used for positioning and fixing the circular wafer. The wafer detection device has the effects of reducing the deviation of the position of the wafer and reducing the phenomenon that a detection blind area is easily generated on the surface of the wafer in the detection process.

Description

Technical Field

[0001] The present application relates to the field of wafer inspection equipment, and in particular to a wafer surface defect inspection device. Background Art

[0002] Wafers are silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are ground, polished, and sliced ​​to form silicon wafers, also known as wafers. Wafers require inspection during the wafer production process.

[0003] An existing wafer surface quality inspection device has the following problems: before inspecting the wafer, the current wafer surface quality inspection device needs to place the wafer on a vacuum adsorption table and use the optical inspection equipment above to detect the roughness of the wafer surface. However, when the wafer is placed on the vacuum adsorption table, the position of the wafer is prone to shift, which may cause a blind spot on the surface of the wafer during the inspection process. Summary of the Invention

[0004] In order to reduce the deviation of the position of the wafer, which may cause a detection blind spot on the surface of the wafer during the detection process, the present application provides a wafer surface defect detection device.

[0005] The present application provides a wafer surface defect detection device that adopts the following technical solution:

[0006] A wafer surface defect detection device includes a machine platform, a support frame and a detection lens. The support frame is arranged on the machine platform, the detection lens is arranged on the support frame, and a placement groove is provided on the top of the machine platform. An adsorption component is provided in the placement groove for positioning and fixing the wafer.

[0007] By adopting the above technical solution, the machine, support frame and detection lens can be used to support the wafer and scan the surface to determine whether there are defects on the wafer surface. The detection position of the wafer can be determined by placing the groove and adsorption component. While the adsorption component provides good support for the wafer, it can reduce the displacement deviation during the placement and detection of the wafer, so that the detection position of the wafer is more accurate, thereby eliminating the detection blind area generated during the wafer surface detection process and improving the detection effect.

[0008] Optionally, the adsorption assembly includes a support seat, a power device and a connecting pipe, the support seat and the power device are connected through the connecting pipe, and adsorption holes are opened on the support seat to perform vacuum adsorption on the wafer.

[0009] By adopting the above technical solution and using the vacuum adsorption fixing method, the adsorption force can be adjusted according to the vacuum degree during the process of fixing the circular wafer, and the adsorption force can be controlled more effectively, thereby reducing the bending of the circular wafer during the fixing process. At the same time, the fixation by adsorption reduces the mechanical contact between the external clamp and the circular wafer, reduces the collision between the circular wafer and the external structure, and further reduces the damage to the circular wafer during the detection process.

[0010] Optionally, a telescopic push-pull device is provided between the machine platform and the support base to drive the support base to rise or fall.

[0011] By adopting the above technical solution, the support base is driven up or down by a telescopic push-pull device, and the distance between the detection lens and the wafer can be adjusted, so that the detection lens imaging is clearer, and the detection lens can illuminate the wafer surface within the optimal detection distance, thereby improving the detection efficiency.

[0012] Optionally, the support seat includes an upper support member and a lower support member, both of which are hollow. The lower support member is connected to the connecting pipe, and the upper support member is movably connected to the lower support member in the horizontal direction. A positioning ring is provided on the machine platform, and the inner side wall of the positioning ring is inclined.

[0013] By adopting the above technical solution, the upper support member, the lower support member and the positioning ring that are movable in the horizontal direction are used to make the upper support member move in the horizontal direction, and the positioning ring is used to position the position of the upper support member, so that the upper support member can be used to drive the wafer to move to the accurate detection position, reducing manual positioning of the wafer and making wafer positioning more convenient and accurate.

[0014] Optionally, a connecting portion is provided on the bottom wall of the upper support member, and a limiting portion is provided at the bottom of the connecting portion, which extends horizontally and extends into the lower support member. A connecting hole is provided on the fixed cross-section of the lower support member, and the radius of the connecting portion is smaller than the radius of the connecting hole. The radius of the limiting portion is larger than the radius of the connecting hole and smaller than the inner cavity radius of the lower support member.

[0015] By adopting the above technical solution, the axial positioning between the upper support member and the lower support member is achieved by using the limiting part. The radius of the connecting part is smaller than the radius of the connecting hole, and the radius of the limiting part is larger than the radius of the connecting hole and smaller than the inner cavity radius of the lower support member. Together, the upper support member can only move relative to the lower support member in the horizontal direction, thereby facilitating the calibration of the position of the wafer and improving the inspection effect.

[0016] Optionally, the upper support member is in the shape of an elongated strip.

[0017] By adopting the above technical solution, the upper support member in a strip shape enables the edges of the circular wafer to extend out on both sides in the width direction of the upper support member. During the placement and removal of the circular wafer, it is convenient to pick up the circular wafer, and at the same time, the contact area between the circular wafer and the upper support member is reduced, reducing damage to the circular wafer.

[0018] Optionally, a connection hole for connecting the connecting pipe is provided on the bottom wall of the lower support member. The difference between the inner wall of the connecting portion and the radius of the connection hole is d1, and the difference between the radius of the limiting portion and the inner wall radius of the lower support member is d2. d1 and d2 satisfy: d1 < d2.

[0019] By adopting the above technical solution, d1 and d2 satisfy: d1 < d2, so that during the movement of the upper support member, the inner hole of the connecting portion is always connected to the connection hole, and the connection hole is always within the range of the inner hole of the connecting portion, thereby ensuring the fixing stability of the circular wafer.

[0020] Optionally, both ends in the length direction of the upper support member are provided as concentric arcs, and positioning flanges are convexly provided along the two arc-shaped edges of the upper support member.

[0021] By adopting the above technical solution, the circular wafer can be surrounded inside by using the two arc-shaped positioning flanges. Thus, during the positioning of the circular wafer, the positioning flanges first contact the positioning ring, reducing the direct contact between the circular wafer and the positioning ring, and further reducing damage to the circular wafer.

[0022] Optionally, an elastic layer is provided on the top wall of the upper support member and the inner wall of the positioning flange.

[0023] By adopting the above technical solution, the elasticity of the elastic layer provides a certain buffering effect on the circular wafer during installation, reducing the hard contact between the circular wafer and the upper support member. At the same time, during the vacuum adsorption fixation process, the airtightness between the circular wafer and the upper support member is improved, enhancing the fixing effect of the circular wafer.

[0024] Optionally, the upper support member and the lower support member are slidingly sealed.

[0025] By adopting the above technical solution, the upper support member and the lower support member are slidingly sealed, so that during the movement of the upper support member and the lower support member, the attenuation of the adsorption force through the power device is reduced, enhancing the fixing effect of the circular wafer.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] By adopting the above technical solution, the machine platform, the support frame and the detection lens can support the circular wafer and scan its surface to determine whether there are defects on the surface of the circular wafer. Through the placement groove and the adsorption component, the detection position of the circular wafer can be determined. While the adsorption component provides good support for the circular wafer, it can reduce the displacement deviation during the placement and detection of the circular wafer, making the detection position of the circular wafer more accurate, thus reducing the detection blind area during the detection of the circular wafer surface and improving the detection effect;

[0028] By using the upper support member, the lower support member and the positioning ring which are movably arranged in the horizontal direction, the upper support member can move in the horizontal direction. At the same time, the positioning ring is used to position the position of the upper support member. Thus, the upper support member is used to drive the circular wafer to move to the accurate detection position, reducing the manual positioning of the circular wafer and making the positioning of the circular wafer more convenient and accurate;

[0029] By adopting the above technical solution, d1 and d2 satisfy: d1 < d2, so that during the movement of the upper support member, the inner hole of the connecting portion is always connected to the connecting hole, and the connecting hole is always within the range of the inner hole of the connecting portion, thereby ensuring the fixing stability of the circular wafer. Brief Description of the Drawings

[0030] Figure 1 is a schematic diagram of the overall structure of a wafer surface defect detection device of the present application.

[0031] Figure 2 is a cross-sectional view of a wafer surface defect detection device in an embodiment of the present application.

[0032] Figure 3 is a cross-sectional view of the support base in an embodiment of the present application.

[0033] Figure 4 is a cross-sectional view of the upper support member and the lower support member in an embodiment of the present application.

[0034] Description of the Reference Numerals: 1. Machine platform; 11. Placement groove; 12. Positioning ring; 2. Support frame; 3. Detection lens; 4. Adsorption component; 41. Support base; 411. Upper support member; 4111. Connecting portion; 4112. Limiting portion; 4113. Positioning flange; 4114. Elastic layer; 412. Lower support member; 4121. Connecting hole; 42. Power device; 43. Connecting pipe; 5. Telescopic push-pull device. Detailed Description of the Embodiment

[0035] The following will further describe the present application in detail with reference to the attached Figure 1-4 drawings.

[0036] An embodiment of the present application discloses a wafer surface defect detection device. Refer to Figure 1 and Figure 2The apparatus comprises a platform 1, a support frame 2, and an inspection lens 3. The support frame 2 is vertically fixed on the platform 1. The inspection lens 3 is located at the top of the support frame 2 and is used to inspect wafers. A placement groove 11 is provided on the surface of the platform 1. A suction assembly 4 is installed in the placement groove 11 to position and secure the wafer. During use, the wafer is placed in the suction assembly 4, and the inspection lens 3 is used to scan the surface of the wafer for inspection.

[0037] The machine 1, support frame 2 and detection lens 3 can be used to support the wafer and scan the surface to determine whether there are defects on the wafer surface. The detection position of the wafer can be determined by placing the groove 11 and the adsorption component 4. While the adsorption component 4 provides good support for the wafer, it can reduce the displacement deviation during the placement and detection of the wafer, so that the detection position of the wafer is more accurate, thereby eliminating the detection blind area generated during the wafer surface detection process and improving the detection effect.

[0038] As a preferred embodiment, the adsorption assembly 4 includes a support base 41, a power device 42, and a connecting pipe 43. It should be noted that the power device 42 is an air-powered device 42 for negative pressure adsorption. The connecting pipe 43 is a flexible tube, one end of which is connected to the bottom of the support base 41, and the other end of which is connected to the air-powered device 42, so that the air-powered device 42 generates negative pressure and adsorbs the wafer to the support base 41.

[0039] By using the vacuum adsorption fixing method, the adsorption force can be adjusted according to the vacuum degree during the process of fixing the wafer, and the adsorption force can be controlled more effectively, thereby reducing the bending of the wafer during the fixing process. At the same time, the fixation by adsorption reduces the mechanical contact between the external clamp and the wafer, reduces the collision between the wafer and the external structure, and further reduces the damage to the wafer during the detection process.

[0040] As a preferred embodiment, refer to Figure 2 A telescopic push-pull device 5 is provided between the machine platform 1 and the support base 41 to drive the support base 41 up or down. One end of the telescopic push-pull device 5 is fixedly connected to the machine platform 1, and the other end of the telescopic push-pull device 5 is fixedly connected to the bottom surface of the support base 41, thereby utilizing the power of the telescopic push-pull device 5 to drive the support base 41 up or down. It should be noted that the telescopic push-pull device 5 can be a pneumatic cylinder, a hydraulic cylinder, or an electric push rod. In the embodiment of the present application, an electric push rod is used as an example.

[0041] By using the telescopic push-pull device 5 to drive the support base 41 to rise or fall, the distance between the detection lens 3 and the wafer can be adjusted, so that the imaging of the detection lens 3 is clearer, and the detection lens 3 can illuminate the surface of the wafer within the optimal detection distance, thereby improving the detection efficiency.

[0042] As a preferred embodiment, refer to Figure 2 and Figure 3 The support base 41 includes an upper support member 411 and a lower support member 412, both of which are hollow. A sliding seal is formed between the upper support member 411 and the lower support member 412. This seal reduces the attenuation of the suction force of the power unit 42 during movement of the upper support member 411 and the lower support member 412, thereby improving the wafer fixation effect. The lower support member 412 is connected to the connecting tube 43, and the upper support member 411 is movably connected to the lower support member 412 in a horizontal direction. A positioning ring 12 is provided on the machine 1, and the inner sidewall of the positioning ring 12 is inclined.

[0043] The bottom wall of the upper support member 411 is provided with a connecting portion 4111 protruding downward. Connecting portion 4111 is hollow and tubular, with its top end connected to the bottom end of the upper support member 411 and communicating with the interior of the lower support member 412. The bottom end of connecting portion 4111 extends into the interior of the lower support member 412. A horizontally extending stopper 4112 is fixedly provided at the bottom of connecting portion 4111, which extends into the interior of the lower support member 412. The top wall of the lower support member 412 is provided with a connecting hole 4121. The radius of connecting portion 4111 is smaller than that of connecting hole 4121, allowing connecting portion 4111 to have a certain amount of space for horizontal movement within connecting hole 4121. The radius of the limiting portion 4112 is larger than the radius of the connecting hole 4121 and smaller than the inner cavity radius of the lower support member 412, so that the limiting portion 4112 has a certain horizontal movement space in the lower support member 412, thereby enabling the upper support member 411 and the lower support member 412 to move relative to each other on the horizontal plane.

[0044] By utilizing the upper support member 411, the lower support member 412 and the positioning ring 12 that are movable in the horizontal direction, the upper support member 411 can be moved in the horizontal direction, and the positioning ring 12 is used to position the position of the upper support member 411, so that the upper support member 411 is used to drive the wafer to move to the accurate detection position, reducing manual positioning of the wafer and making wafer positioning more convenient and accurate.

[0045] The axial positioning between the upper support member 411 and the lower support member 412 is achieved by using the limiting portion 4112. The radius of the connecting portion 4111 is smaller than the radius of the connecting hole 4121, and the radius of the limiting portion 4112 is larger than the radius of the connecting hole 4121 and smaller than the inner cavity radius of the lower support member 412, jointly enabling the upper connecting member to only move relative to the lower connecting member in the horizontal direction, thereby facilitating the calibration of the position of the wafer and improving the inspection effect.

[0046] As a preferred embodiment, referring to Figure 2 , the upper support member 411 is in a strip shape. The two ends in the length direction of the upper support member 411 are set as concentric arcs, and positioning flanges 4113 are convexly provided along the two arc-shaped edges of the upper support member 411. An elastic layer 4114 is provided on the top wall of the upper support member 411 and the inner wall of the positioning flange 4113.

[0047] The strip-shaped upper support member 411 enables the edge of the wafer to extend out on both sides in the width direction of the upper support member 41, facilitating the taking of the wafer during the placement and removal of the wafer, and at the same time reducing the contact area between the wafer and the upper support member 411 and reducing the damage to the wafer.

[0048] By using the two arc-shaped positioning flanges 4113, the wafer can be surrounded inside, so that during the positioning of the wafer, the positioning flange 4113 first contacts the positioning ring 12, thereby reducing the direct contact between the wafer and the positioning ring 12 and further reducing the damage to the wafer.

[0049] The elasticity of the elastic layer 4114 enables the wafer to be buffered during installation, reducing the hard contact between the wafer and the upper support member 411. At the same time, during the vacuum adsorption fixation process, the airtightness between the wafer and the upper support member 411 is improved, enhancing the fixing effect of the wafer.

[0050] Furthermore, referring to Figure 2 and Figure 3 , a connecting hole 4121 for connecting the connecting pipe 43 is provided on the bottom wall of the lower support member 412. The difference between the inner wall radius of the connecting portion 4111 and the radius of the connecting hole 4121 is d1, and the difference between the radius of the limiting portion 4112 and the inner wall radius of the lower support member 412 is d2. d1 and d2 satisfy: d1 < d2.

[0051] By adopting the above technical solution, d1 and d2 satisfy: d1 < d2, enabling the inner hole of the connecting portion 4111 to always be connected to the connecting hole 4121 during the movement of the upper support member 411, and the connecting hole 4121 is always within the range of the inner hole of the connecting portion 4111, thereby ensuring the fixing stability of the wafer.

[0052] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A wafer surface defect detection device, comprising a platform (1), a support frame (2) and a detection lens (3), wherein the support frame (2) is arranged on the platform (1), and the detection lens (3) is arranged on the support frame (2), characterized in that: A placement groove (11) is provided on the top of the machine (1), and an adsorption component (4) is provided in the placement groove (11) for positioning and fixing the wafer.

2. The wafer surface defect detection device according to claim 1, characterized in that: The adsorption assembly (4) comprises a support base (41), a power device (42) and a connecting pipe (43); the support base (41) and the power device (42) are connected via the connecting pipe (43); and adsorption holes are provided on the support base (41) for vacuum adsorption of the wafer.

3. The wafer surface defect detection device according to claim 2, characterized in that: A telescopic push-pull device (5) is provided between the machine platform (1) and the support base (41) to drive the support base (41) to rise or fall.

4. The wafer surface defect detection device according to claim 3, characterized in that: The support seat (41) comprises an upper support member (411) and a lower support member (412), both of which are hollow. The lower support member (412) is connected to the connecting pipe (43). The upper support member (411) is movably connected to the lower support member (412) in a horizontal direction. A positioning ring (12) is provided on the machine (1), and the inner side wall of the positioning ring (12) is inclined.

5. The wafer surface defect detection device according to claim 4, characterized in that: The bottom wall of the upper support member (411) is provided with a connecting portion (4111) in a downwardly convex manner, and the bottom of the connecting portion (4111) is provided with a limiting portion (4112) extending horizontally and extending into the lower support member (412). The fixed cross-section of the lower support member (412) is provided with a connecting hole (4121), the radius of the connecting portion (4111) is smaller than the radius of the connecting hole (4121), and the radius of the limiting portion (4112) is larger than the radius of the connecting hole (4121) and smaller than the inner cavity radius of the lower support member (412).

6. The wafer surface defect detection device according to claim 4, characterized in that: The upper support member (411) is in the shape of an elongated strip.

7. The wafer surface defect detection device according to claim 5, characterized in that: The bottom wall of the lower support member (412) is provided with a connection hole (4121) for connecting the connection pipe (43), the difference in radius between the inner wall of the connection portion (4111) and the connection hole (4121) is d1, the difference in radius between the limit portion (4112) and the inner wall of the lower support member (412) is d2, and d1 and d2 satisfy: d1 <d2。 8. The wafer surface defect detection device according to claim 7, characterized in that: The two ends of the upper support member (411) in the length direction are arranged in concentric arc shapes, and positioning flanges (4113) are convexly arranged along the two arc-shaped edges of the upper support member (411).

9. The wafer surface defect detection device according to claim 8, characterized in that: The top wall of the upper support member (411) and the inner wall of the positioning flange (4113) are provided with an elastic layer (4114).

10. The wafer surface defect detection device according to claim 4, characterized in that: A sliding seal is formed between the upper support member (411) and the lower support member (412).

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