Air compression prevention device
The chip status is detected by the integrated circuit board and multiple sensors to prevent the pressure probe from pressing down when there is no chip or it is placed incorrectly, solving the problems of chip damage and test socket burning, and realizing safe semiconductor testing.
Patent Information
- Application Number
- CN202421972346.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-08-15
AI Technical Summary
During semiconductor testing, if the chip is not placed or placed incorrectly, the pressure probe may press down, causing damage to the chip or burning out the test socket when powered on.
An anti-air pressure device is used, including a pressure measuring device, a test platform, a laser sensor, a warping detection sensor, and a through-beam photoelectric sensor. Multiple sensors are integrated on the circuit board to detect whether the chip exists and is placed correctly, preventing the pressure probe from pressing down when it is not at the origin.
It effectively prevents the pressure probe from pressing down when there is no chip or the chip is placed incorrectly, avoiding chip damage or test socket burnout, and reducing economic losses.
Smart Images
Figure CN223347001U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor testing technology, and in particular to an anti-air pressure device. Background Art
[0002] Semiconductor testing is the process of inspecting semiconductor chips or integrated circuits to determine whether the various functional modules of the chip or integrated circuit are functioning properly, thereby confirming or evaluating the functionality and performance of the integrated circuit components. IC testing includes wafer testing (CP) and finished chip testing (FT). Wafer testing, located between wafer manufacturing and chip packaging, uses silicon-level electrical testing to assess wafer yield and identify substandard chips. This not only reduces packaging and subsequent testing costs but also guides process improvements in wafer manufacturing. Finished chip testing, as the final step before chip shipment, is crucial for improving the overall chip functionality and packaging process. However, the challenges faced in actual industrial-grade chip testing are far more complex than theoretical. Unexpected situations are inevitable during the actual production process. For example, a chip may not be placed properly or may be incorrectly placed during testing. Failure to terminate testing promptly can damage the test socket, resulting in financial losses. Utility Model Content
[0003] The disclosed embodiment provides an anti-air pressure device to solve the problem that when there is no chip in the existing test socket or the chip is placed incorrectly, the pressure probe presses down and destroys the chip and / or contacts the test socket, causing damage to the chip or burning of the test socket when powered on.
[0004] In view of the above problems, the air pressure prevention device provided by the present disclosure includes:
[0005] A pressure measuring device and a test platform are arranged in an upper and lower interval; the pressure measuring device includes: a pulley, a screw guide rail mechanism, a fixing device, a frame, a fixing seat, a laser sensor, and a pressure measuring head; the test platform includes a test seat; the screw guide rail mechanism includes: dual guide rails, a guide rail slider, and a screw located between the dual guide rails;
[0006] The screw guide rail mechanism is vertically arranged, and the upper and lower ends are respectively fixed between the pulley and the frame by the fixing device; the upper end of the screw rod is connected to the pulley; the frame has a middle hollow structure, and the screw rod can pass through the middle hollow structure of the frame and be connected to the pressure probe, so that the pulley drives the screw rod to rotate and the guide rail slider moves up and down along the double guide rails to drive the pressure probe to complete the action of pressing down and returning to the original position;
[0007] The laser sensor is fixed below the rack through the fixing seat so as to detect the chip to be tested in the test seat.
[0008] In a possible embodiment, the fixing seat is provided with a left-right locking fixing plate and a universal rod;
[0009] The left and right locking fixing plates are provided with screw holes on both sides for fixing the fixing base under the rack;
[0010] The universal rod is mounted on one side of the fixing plate, and the laser sensor is mounted on the universal rod; the universal rod is used to drive the laser sensor to adjust the illumination angle by adjusting its own angle, so that the sensor can detect the specified position;
[0011] The fixing seat supports adjusting its own installation position.
[0012] In a possible implementation, the air pressure prevention device further includes: a pressure probe position detection device;
[0013] The pressure probe position detection device includes: a light shielding plate and a through-beam photoelectric sensor; the light shielding plate is fixed to the upper surface of the guide rail slider and moves up and down with the guide rail slider; the through-beam photoelectric sensor is arranged below the fixing device at the upper end of the double guide rail;
[0014] The pressure probe position detection device is used to determine that the pressure probe is at the origin position when the guide rail slider is located at the top of the screw guide rail mechanism, the light shielding plate fixed on the upper surface of the guide rail slider is located between the transmitting end and the receiving end of the through-beam photoelectric sensor, and the receiving end has no sensing.
[0015] In one possible embodiment, the pressure probe position detection device is also used to, when the guide rail slider moves downward, move the light shielding plate away from between the transmitting end and the receiving end of the through-beam photoelectric sensor, and the receiving end receives the light signal emitted by the transmitting end to determine that the pressure probe has left the origin position.
[0016] In a possible embodiment, the air pressure prevention device further includes: a circuit board, the circuit board being electrically connected to the pressure probe position detection device;
[0017] The circuit board is used to send a first electrical signal to the host to control the pressure probe to complete the pressing action when receiving a first level signal triggered by the pressure probe position detection device indicating that the pressure probe is at the origin position.
[0018] In a possible implementation manner, a warping detection sensor is further provided in the test socket for detecting whether warping occurs in the chip to be tested placed in the test socket.
[0019] In a possible implementation, the circuit board is further electrically connected to the warpage detection sensor and the laser sensor respectively;
[0020] The circuit board is used to detect the third level signal sent by the warping detection sensor and the fourth level signal sent by the laser sensor when receiving the second level signal triggered by the pressure probe position detection device, indicating that the pressure probe is not at the origin position; when the third level signal indicates that the chip to be tested has warped, and / or the fourth level signal indicates that no chip is placed in the corresponding test socket, send a second electrical signal to the host to prevent the pressure probe from continuing to press down.
[0021] In a possible implementation, multiple circuit boards are integrated into an integrated circuit board to test multiple test sockets.
[0022] In a possible implementation, the integrated circuit board is installed on the host through an input and output interface; the host is used to send an electrical signal to control the movement of the pressure probe.
[0023] In a possible implementation, the circuit board is provided with an indication module and a manual control module;
[0024] The indicator module includes a plurality of indicator lights and an alarm light; the plurality of indicator lights are used to respectively display the level signals fed back by the pressure probe position detection device, the warpage detection sensor, and the laser sensor for the corresponding test seat; the alarm light is used to light up when the circuit board host sends a second electrical signal;
[0025] The manual control module is used to set a manual switch to enable the user to manually alarm and generate an alarm signal.
[0026] The beneficial effects of the embodiments of the present disclosure include:
[0027] The disclosed embodiments provide an anti-air pressure device for use in the field of power electronics. When testing semiconductor chips, a pressure probe is used to press down on the hardware to power on and test the chip's functionality. When the pressure probe begins to press down and is not at the origin, the device detects whether a chip is present in the corresponding test socket and whether the chip is correctly positioned. If it detects that there is no chip in the test socket and / or the chip is incorrectly positioned, the pressure probe cancels the downward pressure, preventing the pressure probe from directly contacting the test socket and potentially burning the test socket when powered on. The utility model implements the aforementioned function by combining an integrated circuit board with multiple sensors to prevent air pressure issues. The sensors include a warpage detection sensor, a laser sensor, and a through-beam photoelectric sensor, which are electrically connected to the circuit board. The circuit board receives level signals from the sensors, determines the status of each component of the device, and sends electrical signals to the host to prevent air pressure. The utility model effectively prevents the pressure probe from damaging the chip and / or contacting the test socket when there is no chip in the test socket or the chip is incorrectly positioned, thereby reducing economic losses. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 A schematic structural diagram of an anti-air pressure device provided in an embodiment of the present disclosure;
[0029] Figure 2 A structural diagram of an existing test platform provided for an embodiment of the present disclosure;
[0030] Figure 3 A structural diagram of a pressure measurement device provided in an embodiment of the present disclosure;
[0031] Figure 4 This is a design diagram of an integrated circuit board provided in an embodiment of the present disclosure. DETAILED DESCRIPTION
[0032] The present disclosure provides an air pressure prevention device. Preferred embodiments of the present disclosure are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are intended only to illustrate and explain the present disclosure and are not intended to limit the present disclosure. Furthermore, the embodiments and features of the embodiments in this application may be combined with each other unless there is a conflict.
[0033] The embodiment of the present disclosure provides an anti-air pressure device, the structure of which is as follows: Figure 1 As shown, including:
[0034] A pressure measuring device 10 and a test platform 20 are spaced apart from each other. The pressure measuring device 10 includes a pulley 101, a screw guide rail mechanism 102, a fixing device 103, a frame 104, a fixing seat 105, a laser sensor 106, and a pressure measuring head 107. The test platform 20 includes a test seat 201. The screw guide rail mechanism 102 includes a pair of guide rails 1021, a guide rail slider 1022, and a screw rod 1023 located between the pair of guide rails 1021.
[0035] The screw guide rail mechanism 102 is arranged vertically, with its upper and lower ends fixed between the pulley 101 and the frame 104 by fixing devices 103 respectively; the upper end of the screw rod 1023 is connected to the pulley 101; the frame 104 has a hollow structure in the middle, and the screw rod 1023 can pass through the hollow structure in the middle of the frame 104 to connect with the pressure probe 107, so that the pulley 101 drives the screw rod 1023 to rotate, causing the guide rail slider 1022 to move up and down along the dual guide rails 1021, thereby driving the pressure probe 107 to complete the downward pressure and return to the original position.
[0036] The laser sensor 106 is fixed below the rack 104 via the fixing seat 105 so as to detect the chip to be tested in the test seat 201 .
[0037] In the embodiment of the present disclosure, the air pressure prevention device is designed based on the existing semiconductor chip testing machine. The existing testing device structure is as follows: Figure 2 The semiconductor chip testing machine shown in the figure only includes a lower pressure head and a test device. However, the present invention designs a corresponding pressure head 107 for each test socket 201 on the test device. The test sockets 201 and pressure heads 107 are grouped in a one-to-one correspondence, without affecting each other, making control simpler and maintenance more convenient.
[0038] In the disclosed embodiment, in order to achieve the purpose of preventing air pressure, the utility model arranges a laser sensor 106 for each pressure probe 107. The laser sensor 106 is fixed under the rack 104 through the fixing seat 105, and is used to detect whether there is a chip in the corresponding test seat 201. When the chip is replaced during the test and there is no chip placed in the test seat 201, the anti-air pressure device can detect it in time through the laser sensor 106, and comprehensively judge whether the pressure probe 107 continues to press down in combination with other parts in the device.
[0039] In another embodiment provided by the present disclosure, the fixing seat 105 of the anti-air pressure device is provided with a left and right locking fixing plate and a universal rod;
[0040] The left and right locking fixing plates are provided with screw holes on both sides for fixing the fixing base 105 to the bottom of the frame 104;
[0041] The universal rod is mounted on one side of the fixing plate, and the laser sensor 106 is mounted on the universal rod; it is used to drive the laser sensor 106 to adjust the illumination angle by adjusting its own angle, so that the sensor can detect the specified position;
[0042] The fixing base 105 supports adjusting its own installation position.
[0043] In the disclosed embodiment, the fixing base 105 is used to fix the laser sensor 106 below the rack 104 to support the laser sensor 106 in detecting the presence of a chip in the test socket 201 corresponding to the pressure probe 107. The fixing base 105 is provided with left and right locking fixing plates and a universal rod. Screws are passed through the screw holes on the left and right locking fixing plates to fix the fixing base 105 below the rack 104. The multiple screw holes on the left and right locking fixing plates can be used to support the position adjustment of the fixing base 105, so that the fixing base 105 is fixed to a suitable position below the rack 104. The universal rod of the fixing base 105 is connected to the laser sensor 106, and the angle of laser irradiation of the laser sensor 106 is adjusted by the universal rod, so that the laser sensor 106 can detect a specified position.
[0044] In another embodiment provided by the present disclosure, the anti-air pressure device further includes: a pressure probe position detection device 301, such as Figure 3 As shown;
[0045] The pressure probe position detection device includes: a light shielding sheet 3011 and a through-beam photoelectric sensor 3012; the light shielding sheet 3011 is fixed to the upper surface of the guide rail slider 1022 and moves up and down with the guide rail slider 1022; the through-beam photoelectric sensor 3012 is arranged below the fixing device 103 at the upper end of the double guide rail 1021;
[0046] The pressure probe position detection device is used to determine that the pressure probe 107 is at the origin position when the guide rail slider 1022 is located at the top of the screw guide rail mechanism 102, the light shielding plate 3011 fixed on the upper surface of the guide rail slider 1022 is located between the transmitting end and the receiving end of the opposing photoelectric sensor 3012, and the receiving end has no sensing.
[0047] In the disclosed embodiment, the pressure probe position detection device, which comprises a through-beam photoelectric sensor 3012 and a light shielding sheet 3011, determines whether the pressure probe 107 is at the origin. When the pressure probe 107 is at its topmost position, the pressure probe 107 is at the origin. The light shielding sheet 3011, fixed to the upper surface of the guide rail slider 1022, is located between the transmitting and receiving ends of the through-beam photoelectric sensor 3012, blocking light transmission. Consequently, the receiving end does not sense the light. Whether the pressure probe 107 is at the origin is determined by the condition of the receiving end.
[0048] In another embodiment provided by the present disclosure, the pressure probe position detection device of the anti-air pressure device is also used to move the light shielding plate 3011 away from between the transmitting end and the receiving end of the opposing photoelectric sensor 3012 when the guide rail slider 1022 moves downward, and the receiving end receives the light signal emitted by the transmitting end to determine that the pressure probe 107 has left the origin position.
[0049] In the embodiment of the present disclosure, when the pressure probe 107 is pressed downward, the pressure probe 107 moves downward from the origin position, and the light shielding plate 3011 moves downward together with the guide rail slider 1022, leaving the position between the transmitting end and the receiving end of the through-beam photoelectric sensor 3012. Without the obstruction of the light shielding plate 3011, the receiving end receives the light signal; and whether the pressure probe 107 is located at the origin position is determined by the condition of the receiving end. In summary, whether the receiving end of the through-beam photoelectric sensor 3012 receives the light signal is used as the basis for judging whether the pressure probe 107 is located at the origin position; when the receiving end of the through-beam photoelectric sensor 3012 does not receive the light signal, it can be determined that the pressure probe 107 is located at the origin position; when the receiving end of the through-beam photoelectric sensor 3012 receives the light signal, it can be determined that the pressure probe 107 is not located at the origin position.
[0050] In another embodiment provided by the present disclosure, the air pressure prevention device further comprises: a circuit board, the circuit board being electrically connected to the pressure probe position detection device;
[0051] The circuit board is used to send a first electrical signal to the host to control the pressure probe 107 to complete the pressing action when receiving a first level signal triggered by the pressure probe position detection device indicating that the pressure probe 107 is at the origin position.
[0052] In the disclosed embodiment, the circuit board is electrically connected to the pressure probe position detection device via a wire, receives a first level signal from the through-beam photoelectric sensor 3012 in the pressure probe position detection device, and transmits a first electrical signal to the host computer. When the host computer receives the first electrical signal, it indicates that the corresponding pressure probe 107 is at the origin position and can perform the downward pressing action normally.
[0053] In another embodiment provided by the present disclosure, a warping detection sensor is further provided in the test socket 201 of the anti-air pressure device for detecting whether warping occurs in the chip to be tested placed in the test socket 201 .
[0054] In the embodiment of the present disclosure, the chip warping detection sensor in the test socket 201 detects the placement of the chip on the test socket 201 to detect whether the chip in the test socket 201 is placed flat and whether there is any chip warping. The chip warping detection sensor can be a laser displacement sensor.
[0055] In another embodiment provided by the present disclosure, the circuit board of the anti-air pressure device is further electrically connected to the warping detection sensor and the laser sensor 106 respectively;
[0056] The circuit board is used to detect the third level signal sent by the warping detection sensor and the fourth level signal sent by the laser sensor 106 when receiving the second level signal triggered by the pressure probe position detection device, which indicates that the pressure probe 107 is not at the origin position; when the third level signal indicates that the chip to be tested has warped, and / or the fourth level signal indicates that no chip is placed in the corresponding test seat 201, send a second electrical signal to the host to prevent the pressure probe 107 from continuing to press down.
[0057] In the embodiment of the present disclosure, when the host receives the first electrical signal, the pressure probe 107 is located at the origin position and the pressure probe 107 can be pressed down normally. When the host receives the second level signal, the pressure probe 107 is not located at the origin position and has been pressed down. At this time, when the circuit board receives the third level signal indicating that the chip to be tested has warped, and / or the fourth level signal indicating that no chip is placed in the corresponding test seat 201, a second electrical signal is sent to the host to prevent the pressure probe 107 from continuing to press down.
[0058] In another embodiment provided by the present disclosure, multiple circuit boards of the air pressure prevention device are integrated into an integrated circuit board to detect multiple test sockets 201.
[0059] In the disclosed embodiment, an integrated circuit board can integrate multiple circuit boards corresponding to multiple test sockets 201, and is electrically connected to the multiple test sockets 201 and the origin position detection device of the pressure probe 107, receiving the level signals received by the multiple circuit boards corresponding to different test sockets 201. The various parts of the integrated circuit board corresponding to different test sockets 201 are independent of each other and do not affect each other.
[0060] In another embodiment provided by the present disclosure, the integrated circuit board of the anti-air pressure device is installed on the host through an input and output interface; the host is used to send an electrical signal to control the movement of the pressure probe 107.
[0061] In the disclosed embodiment, during actual testing, the upward and downward movement of the pressure probe 107 in the anti-air pressure device is controlled by a host computer. The integrated circuit boards corresponding to the chips in the multiple test sockets 201 are connected to the host computer via input and output interfaces and send electrical signals to the host computer indicating the real-time status of the chips in the device.
[0062] In another embodiment provided by the present disclosure, the circuit board of the air pressure prevention device is provided with an indication module and a manual control module;
[0063] The indicator module includes a plurality of indicator lights and an alarm light; the plurality of indicator lights are used to respectively display the level signals fed back by the pressure probe position detection device, the warpage detection sensor, and the laser sensor 106 corresponding to the test seat 201; the alarm light is used to light up when the circuit board host sends a second electrical signal;
[0064] The manual control module is used to set a manual switch to enable the user to manually alarm and generate an alarm signal.
[0065] In the embodiment of the present disclosure, taking the circuit board corresponding to the three test sockets 201 as an example, the structure of the integrated circuit board is as follows: Figure 4 As shown, three circuit boards as described above are integrated. Each circuit board on the integrated circuit board is provided with an indication module and a manual control module. In addition to collecting the electrical signals provided by each sensor and sending them to the host, the module also indicates the status of the air pressure prevention device corresponding to the circuit board. When the top red LED light on the circuit board lights up, it indicates a fault and the pressure probe 107 will stop pressing down.
[0066] In the embodiment of the present disclosure, during the actual chip testing process, there may be a situation where chips are replaced and the thickness of different chips are different. In this case, the circuit board needs to be responsible for calibrating each level signal to adapt to the detection of chips of different thicknesses.
[0067] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of a preferred embodiment, and the modules or processes in the accompanying drawings are not necessarily required for implementing the present disclosure.
[0068] Those skilled in the art will appreciate that the modules in the devices of the embodiments may be distributed in the devices of the embodiments as described in the embodiments, or may be located in one or more devices different from the embodiments with corresponding changes. The modules of the above embodiments may be combined into one module or further split into multiple submodules.
[0069] The serial numbers of the above-mentioned embodiments of the present disclosure are for description only and do not represent the advantages or disadvantages of the embodiments.
[0070] Obviously, those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include these modifications and variations.
Claims
1. An anti-air pressure device, characterized in that: include: Stress testing devices and test platforms spaced apart at the top and bottom; The pressure measuring device includes: a pulley, a screw guide rail mechanism, a fixing device, a frame, a fixing seat, a laser sensor, and a pressure measuring head; the test platform includes a test seat; the screw guide rail mechanism includes: a double guide rail, a guide rail slider, and a screw located between the double guide rails; The screw guide rail mechanism is vertically arranged, and the upper and lower ends are respectively fixed between the pulley and the frame by the fixing device; the upper end of the screw rod is connected to the pulley; the frame has a middle hollow structure, and the screw rod can pass through the middle hollow structure of the frame and be connected to the pressure probe, so that the pulley drives the screw rod to rotate and the guide rail slider moves up and down along the double guide rails to drive the pressure probe to complete the action of pressing down and returning to the original position; The laser sensor is fixed below the rack through the fixing seat so as to detect the chip to be tested in the test seat.
2. The device according to claim 1, wherein The fixing seat is provided with a fixing piece and a universal rod for locking left and right; The left and right locking fixing plates are provided with screw holes on both sides for fixing the fixing base under the rack; The universal rod is mounted on one side of the fixing plate, and the laser sensor is mounted on the universal rod; the universal rod is used to drive the laser sensor to adjust the illumination angle by adjusting its own angle, so that the sensor can detect the specified position; The fixing seat supports adjusting its own installation position.
3. The device according to claim 1, wherein Also includes: Pressure probe position detection device; The pressure probe position detection device includes: a light shielding plate and a through-beam photoelectric sensor; The light shielding sheet is fixed to the upper surface of the guide rail slider and moves up and down with the guide rail slider; the through-beam photoelectric sensor is arranged below the fixing device at the upper end of the double guide rail; The pressure probe position detection device is used to determine that the pressure probe is at the origin position when the guide rail slider is located at the top of the screw guide rail mechanism, the light shielding plate fixed on the upper surface of the guide rail slider is located between the transmitting end and the receiving end of the through-beam photoelectric sensor, and the receiving end has no sensing.
4. The device according to claim 3, characterized in that The pressure probe position detection device is also used to, when the guide rail slider moves downward, move the light shielding plate away from between the transmitting end and the receiving end of the through-beam photoelectric sensor, and the receiving end receives the light signal emitted by the transmitting end to determine that the pressure probe has left the origin position.
5. The device according to claim 3, wherein Also includes: a circuit board, the circuit board being electrically connected to the pressure probe position detection device; The circuit board is used to send a first electrical signal to the host to control the pressure probe to complete the pressing action when receiving a first level signal triggered by the pressure probe position detection device indicating that the pressure probe is at the origin position.
6. The device according to claim 5, characterized in that The test socket is also provided with a warping detection sensor for detecting whether the chip to be tested placed in the test socket has warped.
7. The device according to claim 6, characterized in that The circuit board is also electrically connected to the warpage detection sensor and the laser sensor respectively; The circuit board is configured to detect the third level signal sent by the warpage detection sensor and the fourth level signal sent by the laser sensor when receiving the second level signal triggered by the pressure probe position detection device, indicating that the pressure probe is not located at the origin position; When the third level signal indicates that the chip under test is warped, and / or the fourth level signal indicates that no chip is placed in the corresponding test socket, a second electrical signal is sent to the host to prevent the pressure probe from continuing to press down.
8. The device according to any one of claims 5 to 7, characterized in that Multiple circuit boards are integrated into an integrated circuit board to test multiple test sockets.
9. The device according to claim 8, wherein The integrated circuit board is installed on the host through an input and output interface; the host is used to send an electrical signal to control the movement of the pressure probe.
10. The device according to claim 7, wherein The circuit board is provided with an indication module and a manual control module; The indicator module includes a plurality of indicator lights and an alarm light; the plurality of indicator lights are used to respectively display the level signals fed back by the pressure probe position detection device, the warpage detection sensor, and the laser sensor for the corresponding test seat; the alarm light is used to light up when the circuit board host sends a second electrical signal; The manual control module is used to set a manual switch to enable the user to manually alarm and generate an alarm signal.