Industrial personal computer

Abstract

The utility model provides an industrial personal computer. The industrial personal computer comprises a case, a mainboard and a radiator, the mainboard is located in the case, a main heat dissipation opening is formed in one installation surface of the case, the radiator is arranged on the outer side of the case and detachably connected with the case, the radiator covers the main heat dissipation opening, a main power device is arranged on the side, facing the main heat dissipation opening, of the mainboard, and the main power device is detachably connected with the mainboard. Relative to the plane where the mainboard is located, the outline of the main power device is located on the inner side of the outline of the main heat dissipation opening. According to the utility model, the maintenance difficulty of the main power device on the mainboard can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of computer equipment, in particular to an industrial control computer. Background Art

[0002] With the gradual popularization of automated production and the rapid development of computing technology, the requirements for heat dissipation and maintainability of industrial computers are becoming increasingly higher.

[0003] However, when maintaining the main components on the motherboard of an existing industrial computer, especially a fanless industrial computer, such as the CPU (central processing unit), it is necessary to first open the chassis, then remove the IO (input and output) panel, hard disk bracket and IO bracket on the motherboard one by one, and then remove the motherboard. Only then can the CPU be removed from the motherboard. This operation is very inconvenient and increases the difficulty of maintaining the components on the motherboard. Utility Model Content

[0004] In order to solve the above problems, the industrial computer provided by the present invention can reduce the difficulty of maintaining the main power components on the mainboard by providing a main heat dissipation opening.

[0005] The utility model provides an industrial computer, which comprises: a chassis, a mainboard and a radiator;

[0006] The motherboard is located in the chassis, a main heat dissipation opening is opened on a mounting surface of the chassis, a radiator is arranged on the outside of the chassis and is detachably connected to the chassis, the radiator covers the main heat dissipation opening, and a main power device is arranged on a side of the mainboard facing the main heat dissipation opening, and the main power device is detachably connected to the mainboard;

[0007] Relative to the plane where the main board is located, the outline of the main power device is located inside the outline of the main heat dissipation opening.

[0008] Optionally, the industrial computer further includes: an adapter bracket;

[0009] The adapter bracket is fixedly set on the side of the mainboard facing the main heat dissipation opening, and an elastic top pressure piece is fixedly set on the surface of the adapter bracket facing away from the mainboard.

[0010] The elastic pressing member contacts the heat sink and is used to apply a force to the heat sink in a direction away from the mainboard;

[0011] The heat sink contacts the main power components on the main board through the main heat dissipation opening.

[0012] Optionally, the adapter bracket is located in the main heat dissipation opening and is adapted to the main heat dissipation opening;

[0013] A communication opening is formed on the inner side of the adapter bracket, and the heat sink contacts the main power device through the communication opening;

[0014] Relative to the plane where the main board is located, the outline of the main power device is located inside the outline of the communication opening.

[0015] Optionally, the industrial computer further comprises: a main heat block;

[0016] The main heat block is located on the side of the heat sink facing the main board, and the heat sink contacts the main power device through the main heat block.

[0017] Optionally, the surface of the adapter bracket facing the radiator is flush with the mounting surface, and a storage groove is provided on the surface of the adapter bracket facing the radiator;

[0018] The elastic pressing piece is located in the storage groove, and the protrusion of the elastic pressing piece extends out of the storage groove and contacts the radiator.

[0019] Optionally, the adapter bracket is further provided with an avoidance groove on the bottom surface of the storage groove, and the opening of the avoidance groove faces the protrusion.

[0020] Optionally, the mounting surface is further provided with a secondary heat dissipation opening, a first secondary power device is further provided on the side of the mainboard facing the primary heat dissipation opening, and the radiator contacts the first secondary power device through the secondary heat dissipation opening.

[0021] Optionally, the industrial computer further comprises: a first secondary heat conducting block, the heat sink passes through the secondary heat dissipation opening through the first secondary heat conducting block and contacts the first secondary power device;

[0022] The first secondary power device includes a first memory bar, which is parallel to the mainboard and detachably connected to the mainboard through a physical interface.

[0023] Optionally, the industrial computer further comprises: a reinforcement member, a second secondary power device and a second secondary heat conducting block;

[0024] The reinforcement, the second secondary power device and the second secondary heat conductive block are all located on the side of the mainboard away from the radiator. The second secondary power device is connected to the chassis through the second secondary heat conductive block. The reinforcement is fixedly connected to the mainboard, and the reinforcement and the main power device overlap in the direction perpendicular to the mainboard.

[0025] Optionally, the industrial computer further comprises: an expansion housing, a first interface module, a second interface module and a physical interface panel;

[0026] The expansion housing and the first interface module are both located on a side of the mainboard facing the radiator, the second interface module is located on a side of the mainboard facing away from the radiator, and the first interface module is located in an expansion space provided by the expansion housing, which is in communication with the internal space of the chassis;

[0027] The physical interface panel is used to close the opening at one end of the expansion housing and the opening at one end of the chassis. The physical interface on the first interface module and the physical interface on the second interface module are both exposed through the opening on the physical interface panel.

[0028] The industrial computer provided by the present invention, by providing a main heat dissipation opening, allows maintenance of the main power components on the mainboard by simply removing the heat sink and then removing the main power components from the mainboard through the main heat dissipation opening for maintenance or replacement, thereby reducing the difficulty of maintaining the main power components. Furthermore, the main power components do not need to transfer heat to the heat sink through the chassis, reducing the amount of intermediate heat transfer medium that the heat generated by the main power components passes through on the way to the heat sink, thereby improving the heat dissipation efficiency of the heat sink for the main power components. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 This is a schematic exploded view of an industrial computer according to an embodiment of the present application;

[0031] Figure 2 This is a schematic structural diagram of an adapter bracket according to an embodiment of the present application;

[0032] Figure 3 A schematic cross-sectional view of an industrial computer according to an embodiment of the present application;

[0033] Figure 4 This is a schematic partial exploded view of an industrial computer according to an embodiment of the present application;

[0034] Figure 5 This is a schematic partial structural diagram of an industrial computer according to an embodiment of the present application;

[0035] Figure 6 This is a schematic structural diagram of an industrial computer according to an embodiment of the present application;

[0036] Figure 7 This is a schematic structural diagram of an industrial computer according to an embodiment of the present application.

[0037] Reference numerals:

[0038] 1. Chassis; 11. Positioning rod; 12. Mounting stud; 13. Main heat dissipation opening; 14. Secondary heat dissipation opening; 2. Motherboard; 3. Radiator; 31. Baseboard; 32. Fins; 4. Adapter bracket; 41. Lower stud; 42. Upper stud; 43. Storage groove; 44. Avoidance groove; 45. Connecting opening; 46. Elastic top pressure piece; 51. Main power device; 52. Main heat block; 53. First secondary power device; 531. First memory module; 54. First secondary heat block; 55. Second secondary power device; 551. Second Memory stick; 552, power board; 56, second auxiliary heat conduction block; 561, steering heat conduction block; 562, straight heat conduction block; 61, reinforcement; 62, expansion case; 63, physical interface panel; 71, first interface module; 72, second interface module; 81, HDMI interface; 82, DP port; 83, serial port; 84, USB interface; 85, network interface; 86, audio interface; 87, GPIO interface; 88, fan interface; 89, power interface; 91, power indicator light; 92, hard disk indicator light. DETAILED DESCRIPTION

[0039] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0041] Spatially relative terms such as "under," "beneath," "beneath," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, the element or feature described as "under" or "beneath" or "beneath" the other elements will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" can include both upper and lower orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0042] It should be noted that when an element is referred to as being "fixedly connected" to another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element. Conversely, when an element is referred to as being "directly on" another element, there are no intermediate elements. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0043] It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0044] The utility model provides an industrial control computer, see Figure 1 The industrial computer includes: a chassis 1, a mainboard 2 and a radiator 3.

[0045] The motherboard 2 is located within the chassis 1. A primary heat dissipation opening 13 is defined on one mounting surface of the chassis 1. A heat sink 3 is disposed on the outside of the chassis 1 and is removably connected to the chassis 1. The heat sink 3 covers the primary heat dissipation opening 13. A primary power device 51 is disposed on the side of the motherboard 2 facing the primary heat dissipation opening 13. The primary power device 51 is removably connected to the motherboard 2. The outline of the primary power device 51 is located inward of the outline of the primary heat dissipation opening 13 relative to the plane of the motherboard 2.

[0046] In this embodiment, the mounting surface is the upper surface of the chassis 1, the motherboard 2 is horizontally fixed to the top of the chassis 1, and the main power device 51 is a CPU, but this is not limited to this. In addition, positioning holes are provided at a pair of diagonal positions on the base plate 31 of the heat sink 3, and mounting holes are provided at the four corners of the base plate 31; a positioning rod 11 is fixedly provided at a set of diagonal positions on the mounting surface of the chassis 1, and a mounting stud 12 is fixedly provided at each of the four corners of the mounting surface of the chassis 1. The positioning rods 11 correspond one-to-one with the positioning holes, and the mounting studs 12 correspond one-to-one with the mounting holes. The fins 32 of the heat sink 3 are arranged on the upper surface of the base plate 31.

[0047] When installing the radiator 3 to the chassis 1, first insert the positioning rod 11 into the corresponding positioning hole on the radiator 3, and then use a screw to insert it into the mounting hole from top to bottom and thread it into the mounting stud 12 in the mounting hole to fix the radiator 3.

[0048] By providing the main heat dissipation opening 13, the industrial computer can, when maintenance of the main power device 51 on the mainboard 2 is required, simply remove the heat sink 3 and remove the main power device 51 from the mainboard 2 through the main heat dissipation opening 13 for maintenance or replacement, thereby reducing the difficulty of maintaining the main power device 51. At the same time, the main power device 51 does not need to transfer heat to the heat sink 3 through the chassis 1, reducing the number of intermediate heat-conducting media that the heat generated by the main power device 51 passes through on the way to the heat sink 3, thereby improving the heat dissipation efficiency of the heat sink 3 for the main power device 51. Furthermore, by providing the positioning rod 11 and the positioning hole, the position of the heat sink 3 installed on the chassis 1 can be quickly located, allowing the mounting studs 12 to be accurately inserted into the corresponding mounting holes, thereby improving the efficiency of installing the heat sink 3.

[0049] Combine Figure 2 and Figure 3 The industrial computer also includes an adapter bracket 4. The adapter bracket 4 is fixedly mounted on the side of the motherboard 2 facing the main heat dissipation opening 13. An elastic pressure member 46 is fixedly mounted on the surface of the adapter bracket 4 facing away from the motherboard 2. The elastic pressure member 46 contacts the heat sink 3 and applies a force away from the motherboard 2. The heat sink 3 contacts the main power components 51 on the motherboard 2 through the main heat dissipation opening 13.

[0050] In this embodiment, the adapter bracket 4 is a square, plate-shaped bracket structure. The main heat dissipation opening 13 is adapted to the outer contour of the adapter bracket 4. The surface of the adapter bracket 4 facing the heat sink 3 is flush with the mounting surface. The adapter bracket 4 is detachably connected to the motherboard 2 and the heat sink 3.

[0051] Specifically, a lower stud 41 is fixedly mounted at each of the four corners of the lower surface of the adapter bracket 4, and an upper stud 42 is fixedly mounted at each of the four corners of the upper surface of the adapter bracket 4. The adapter bracket 4 is fixedly connected to the base plate 31 of the heat sink 3 and the motherboard 2 respectively through the cooperation of the upper stud 42 and the lower stud 41 with corresponding screws.

[0052] Among them, the upper stud 42 is sunk into the hole of the base plate 31, so as to ensure that the chassis 1 and the adapter bracket 4 can stably support the radiator 3; the lower stud 41 is in conflict with the motherboard 2, so that sufficient stable space can be reserved between the motherboard 2 and the top plate of the chassis 1 to avoid collision between other devices on the upper surface of the motherboard 2 and the top plate of the chassis 1.

[0053] The elastic pressing member 46 can be a compression spring, a U-shaped spring or a Z-shaped spring, etc. In this embodiment, the elastic pressing member 46 is a U-shaped spring, and there are two of them, which are respectively fixed to the left and right ends of the upper surface of the adapter bracket 4.

[0054] Specifically, a storage groove 43 is defined on each of the left and right ends of the upper surface of the adapter bracket 4. The two bottom ends of each elastic pressing member 46 are located within the storage groove 43 and are fixedly connected to the adapter bracket 4. The raised portion in the middle of each elastic pressing member 46 extends out of the storage groove 43 and contacts the lower surface of the radiator 3.

[0055] By providing an elastic top pressure piece 46, the elastic top pressure piece 46 can provide an upward pressure to the radiator 3, thereby not only providing an upward pressure when the radiator 3 is installed, and preventing the screws fixing the radiator 3 from loosening, but also being able to push the radiator 3 upward through the elastic force generated by itself when replacing the CPU, so as to separate the radiator 3 from the thermal paste on its lower surface, making the process of disassembling the radiator 3 smoother and more labor-saving.

[0056] Furthermore, the adapter bracket 4 further includes an escape groove 44 on the bottom surface of each storage groove 43. The opening of the escape groove 44 faces the protrusion. The provision of the escape groove 44 provides space for the protrusion to move downward, thereby ensuring that the radiator 3 can be stably installed on the chassis 1.

[0057] The adapter bracket 4 is positioned within and aligned with the main heat dissipation opening 13. A communication opening 45 is formed on the inside of the adapter bracket 4. The heat sink 3 contacts the main power device 51 through the communication opening 45. The outline of the main power device 51 is positioned inward of the outline of the communication opening 45 relative to the plane of the motherboard 2.

[0058] Specifically, when maintenance on the CPU is required, the screws on the heat sink 3 are first removed to remove the heat sink 3 from the chassis 1. The wrench component on the CPU is then used to pull the wrench through the communication opening 45 to remove the CPU from the motherboard 2. After maintenance is complete, the CPU can be placed on the motherboard 2 through the communication opening 45 and then secured to the motherboard 2 using the wrench component on the CPU. In this embodiment, the wrench component is a standard component on the CPU and will not be described in detail in this embodiment.

[0059] It is understandable that the substrate 31 may form a downward protrusion at the position of the communication opening 45 to contact the main power device 51 , and the substrate 31 may also contact the main power device 51 through other heat-conducting devices.

[0060] Combine Figure 1 、 Figure 3 and Figure 4In this embodiment, the industrial computer further includes a main heat block 52. The main heat block 52 is located on the side of the heat sink 3 facing the mainboard 2. The heat sink 3 passes through the communication opening 45 through the main heat block 52 and contacts the main power device 51. The main heat block 52 is coated with thermal paste on both the upper and lower surfaces that connect to the substrate 31 and the main power device 51 to improve heat dissipation efficiency of the main power device 51.

[0061] In addition, the mounting surface is provided with a secondary heat dissipation opening 14. A first secondary power device 53 is also provided on the side of the mainboard 2 facing the primary heat dissipation opening 13. The heat sink 3 contacts the first secondary power device 53 through the secondary heat dissipation opening 14.

[0062] In this embodiment, the first secondary power device 53 is a first memory stick 531. The first memory stick 531 is parallel to the motherboard 2 and is removably connected to the motherboard 2 via a physical interface fixed thereto. By providing the secondary heat dissipation opening 14, the heat sink 3 can dissipate heat not only from the primary power device 51 but also from the secondary power devices. By defining the position of the first memory stick 531 relative to the motherboard 2, the heat dissipation efficiency of the secondary power devices is improved.

[0063] The industrial computer also includes a first secondary heat conducting block 54. The heat sink 3 passes through the secondary heat dissipation opening 14 through the first secondary heat conducting block 54 and contacts the first secondary power device 53. The first secondary heat conducting block 54 is coated with thermal paste on both the upper and lower surfaces connecting to the substrate 31 and the first secondary power device 53 to improve the heat dissipation efficiency of the main power device 51.

[0064] Combine Figure 3 、 Figure 4 and Figure 5 The industrial computer also includes a reinforcement member 61, a second secondary power device 55, and a second secondary heat conducting block 56. The reinforcement member 61, the second secondary power device 55, and the second secondary heat conducting block 56 are all located on the side of the mainboard 2 facing away from the heat sink 3. The second secondary power device 55 is connected to the chassis 1 via the second secondary heat conducting block 56. The reinforcement member 61 is fixed to the mainboard 2 via screws, and the reinforcement member 61 overlaps with the main power device 51 in a direction perpendicular to the mainboard 2.

[0065] In this embodiment, the geometric center of the reinforcement member 61 coincides with the geometric center of the portion of the CPU that contacts the motherboard 2. It is understood that, for example, the wrench component on the CPU does not contact the motherboard 2 and therefore does not constitute a portion of the CPU that contacts the motherboard 2. The second auxiliary power device 55 includes a second memory module 551 and a power board 552. The second auxiliary heat conducting block 56 includes a diverting heat conducting block 561 and a straight heat conducting block 562.

[0066] The cross section of the diverting heat conducting block 561 is L-shaped, and is used to conduct the heat of the heat source to the component perpendicular to the heat source; the straight heat conducting block 562 is a flat plate structure, and is used to conduct the heat of the heat source to the component opposite to the heat source.

[0067] In this embodiment, the second memory module 551 is parallel to and detachably connected to the motherboard 2. The power board 552 is fixed to the right side wall of the chassis 1, perpendicular to the motherboard 2. The ends of the diverting heat conducting block 561 respectively contact the lower surface of the second memory module 551 and the rear side wall of the chassis 1 to conduct heat generated by the second memory module 551 to the rear side wall of the chassis 1. The diverting heat conducting block 561 is fixed to the rear side wall of the chassis 1 via screws. The straight heat conducting block 562 is clamped between the right side wall of the chassis 1 and the power board 552, so that the power board 552 conducts heat generated by itself to the right side wall of the chassis 1 through the straight heat conducting block 562.

[0068] Combine Figure 4 、 Figure 6 and Figure 7 The industrial computer further includes: an expansion housing 62 , a first interface module 71 , a second interface module 72 and a physical interface panel 63 .

[0069] The expansion housing 62 and the first interface module 71 are both located on the side of the mainboard 2 facing the heat sink 3. The second interface module 72 is located on the side of the mainboard 2 facing away from the heat sink 3. The first interface module 71 is located within the expansion space provided by the expansion housing 62, which communicates with the interior of the chassis 1. The physical interface panel 63 is used to close the opening at one end of the expansion housing 62 and the opening at one end of the chassis 1. The physical interfaces on the first interface module 71 and the second interface module 72 are both exposed through the openings in the physical interface panel 63.

[0070] The first interface module 71 includes an HDMI port 81, a DP port 82, a serial port 83, a USB port 84, a network port 85, and an audio port 86. The second interface module 72 includes a serial port 83, a network port 85, and a GPIO port 87. The heat sink 3 is located at the rear of the expansion housing 62. The top surface of the heat sink 3 is flush with the top surface of the expansion housing 62. The left side of the heat sink 3 is flush with the left side wall of the expansion housing 62 and the chassis 1. The right side of the heat sink 3 is flush with the right side wall of the expansion housing 62 and the chassis 1. The rear side of the heat sink 3 is flush with the rear side wall of the chassis 1.

[0071] In this embodiment, the first interface module 71 includes an HDMI interface 81, two DP ports 82, four serial ports 83, eight USB interfaces 84, two network interfaces 85 and two audio interfaces 86; the second interface module 72 includes two serial ports 83, four network interfaces 85 and one GPIO interface 87.

[0072] In addition, a fan port 88 and a power port 89 are fixedly mounted on the power board 552. Both the fan port 88 and the power port 89 are exposed on the right end of the physical interface panel 63. A power indicator light 91 and a hard disk indicator light 92 are also fixedly connected to the left end of the physical interface panel 63. By providing an expansion case 62, the physical interface panel 63 can be equipped with more physical ports, thereby providing the industrial computer with a rich set of external physical interfaces.

[0073] The industrial computer provided in this embodiment is a fanless industrial computer with a compact structure and high space utilization, which can ensure effective heat dissipation of internal functional components. The CPU and the first memory stick 531 are easy to disassemble and assemble, and convenient for maintenance; in addition, the first memory stick 531 and the second memory stick 551 are distributed on opposite sides of the motherboard 2, so that their respective heat dissipation is independent of each other and does not affect each other.

[0074] Throughout this specification, references to terms such as "some embodiments," "other embodiments," and "desired embodiments" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present application. The schematic descriptions of these terms throughout this specification do not necessarily refer to the same embodiment or example.

[0075] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An industrial computer, characterized in that: The industrial computer includes: a chassis, a mainboard and a radiator; The mainboard is located in the chassis, a main heat dissipation opening is defined on a mounting surface of the chassis, the radiator is disposed on the outside of the chassis and is detachably connected to the chassis, the radiator covers the main heat dissipation opening, a main power device is disposed on a side of the mainboard facing the main heat dissipation opening, and the main power device is detachably connected to the mainboard; With respect to the plane where the mainboard is located, the outline of the main power device is located inside the outline of the main heat dissipation opening; The industrial computer further includes: an adapter bracket; The adapter bracket is fixedly arranged on the side of the mainboard facing the main heat dissipation opening, and an elastic pressing piece is fixedly arranged on the surface of the adapter bracket facing away from the mainboard. The elastic pressing member contacts the heat sink and is used to apply a force to the heat sink in a direction away from the mainboard.

2. The industrial computer according to claim 1, characterized in that: The heat sink contacts the main power components on the main board through the main heat dissipation opening.

3. The industrial computer according to claim 2, characterized in that: The adapter bracket is located in the main heat dissipation opening and is adapted to the main heat dissipation opening; A communication opening is formed on the inner side of the adapter bracket, and the heat sink contacts the main power device through the communication opening; Relative to the plane where the main board is located, the outline of the main power component is located inside the outline of the communication opening.

4. The industrial computer according to claim 2, characterized in that: The industrial computer further comprises: a main heat block; The main heat conducting block is located on a side of the heat sink facing the main board, and the heat sink is in contact with the main power device through the main heat conducting block.

5. The industrial computer according to claim 2, characterized in that: The surface of the adapter bracket facing the radiator is flush with the mounting surface, and a storage groove is formed on the surface of the adapter bracket facing the radiator; The elastic pressing member is located in the storage groove, and the protrusion of the elastic pressing member extends out of the storage groove and contacts the radiator.

6. The industrial computer according to claim 5, characterized in that: The adapter bracket is further provided with an escape groove on the bottom surface of the storage groove, and the opening of the escape groove faces the protruding portion.

7. The industrial computer according to claim 1, characterized in that: The mounting surface is further provided with a secondary heat dissipation opening, a first secondary power device is further provided on a side of the mainboard facing the primary heat dissipation opening, and the radiator contacts the first secondary power device through the secondary heat dissipation opening.

8. The industrial computer according to claim 7, characterized in that: The industrial computer further comprises: a first secondary heat conducting block, through which the heat sink passes through the secondary heat dissipation opening and contacts the first secondary power device; The first secondary power device includes a first memory bar, which is parallel to the mainboard and detachably connected to the mainboard through a physical interface.

9. The industrial computer according to claim 1, characterized in that: The industrial computer further comprises: a reinforcement member, a second auxiliary power device and a second auxiliary heat conducting block; The reinforcement, the second secondary power device and the second secondary heat-conducting block are all located on the side of the mainboard away from the radiator. The second secondary power device is connected to the chassis through the second secondary heat-conducting block. The reinforcement is fixedly connected to the mainboard, and the reinforcement overlaps with the main power device in a direction perpendicular to the mainboard.

10. The industrial computer according to any one of claims 1 to 9, characterized in that: The industrial computer further comprises: an expansion housing, a first interface module, a second interface module and a physical interface panel; The expansion housing and the first interface module are both located on a side of the mainboard facing the radiator, the second interface module is located on a side of the mainboard facing away from the radiator, and the first interface module is located in an expansion space provided by the expansion housing, which is in communication with the internal space of the chassis; The physical interface panel is used to close the opening at one end of the expansion housing and the opening at one end of the chassis, and the physical interface on the first interface module and the physical interface on the second interface module are both exposed through the opening on the physical interface panel.

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