Wafer cleaning medium circulating device and wafer packaging equipment

Abstract

The utility model discloses a wafer cleaning medium circulating device and wafer packaging equipment. A first pipeline is connected with a water receiving opening and a pump inlet of a pump body and is provided with a first control valve; the second pipeline is connected with the first outlet of the temperature controller and the water supply port, and is provided with a flow controller and a second control valve; the third pipeline is connected with the first outlet and the pump inlet of the temperature controller and is provided with a third control valve; the fourth pipeline is connected with the pump outlet and the first inlet; the first control valve, the second control valve and the third control valve are opened, the cleaning medium is conveyed circularly, the flow controller controls the second pipeline to convey a first flow of cleaning medium to the water supply port, the third pipeline conveys a second flow of cleaning medium back to the pump body, and the second flow is far greater than the first flow. According to the technical scheme, when the wafer is subjected to ultrasonic cleaning, the overflowing cleaning liquid can be effectively utilized, and the cleaning liquid can be slowly conveyed to the cleaning tank on the premise that ultrasonic cleaning is not affected, so that the cleaning effect of the cleaning tank on the wafer is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer equipment, in particular to a wafer cleaning medium circulation device and wafer packaging equipment. Background Art

[0002] A wafer is the substrate used to manufacture semiconductor transistors or integrated circuits. It is a crystalline material, round in shape, hence the name. The wafer storage basket used in automated wafer processing equipment in the semiconductor industry is a multi-layered, slotted structure.

[0003] Wafer cleaning is a critical step in the wafer packaging process. Conventional technology uses ultrasonic waves to clean wafers. During cleaning, the vibrations of the ultrasonic waves can cause the cleaning liquid to overflow from the cleaning tank, causing the liquid level in the tank to drop. This drop in level can affect the wafer cleaning effect, but the amount of overflowing cleaning liquid is limited. Therefore, how to utilize the overflowing cleaning liquid while ensuring that the liquid level in the tank remains stable and does not affect the wafer cleaning effect is an urgent problem to be solved in the wafer cleaning process. Utility Model Content

[0004] One of the purposes of the present invention is to overcome the deficiencies in the prior art. In order to address the problem in the prior art that ultrasonic vibrations may cause cleaning liquid to overflow from the cleaning tank, thereby affecting the cleaning effect of the wafer, a wafer cleaning medium circulation device and a wafer packaging device are provided.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] In a first aspect, the present invention provides a wafer cleaning medium circulation device, comprising a pump body, a water inlet, a water delivery port, a temperature controller, a flow controller, a first control valve, a second control valve, and a third control valve;

[0007] The pump body has a pump inlet and a pump outlet, and the temperature controller has a first inlet and a first outlet; the water inlet and the pump inlet are connected via a first pipeline, and the first control valve is provided in the first pipeline;

[0008] The first outlet is connected to the water delivery port via a second pipeline, the flow controller and the second control valve are provided in the second pipeline, and the flow controller is used to control the flow of the cleaning medium delivered to the water delivery port via the second pipeline;

[0009] The first outlet and the pump inlet are connected via a third pipeline, one end of the third pipeline is connected between the first control valve of the first pipeline and the pump inlet, and the other end of the third pipeline is connected between the first outlet of the second pipeline and the second control valve and the flow controller, and the third control valve is provided in the third pipeline;

[0010] The pump outlet and the first inlet are connected via a fourth pipeline;

[0011] The first control valve, the second control valve, and the third control valve are opened, and the cleaning medium is circulated between the pump body and the temperature controller. The flow controller controls the second pipeline to deliver a first flow of cleaning medium to the water delivery port, and the third pipeline returns the remaining second flow of cleaning medium to the pump body. The second flow rate is much greater than the first flow rate.

[0012] In a preferred embodiment of the present application, when the second control valve is closed, the temperature of the cleaning medium drawn by the pump body from the water inlet is adjusted by the temperature controller.

[0013] In a preferred embodiment of the present application, when the third control valve is closed, the flow controller increases the flow rate to replenish the cleaning medium to the water supply port.

[0014] In a preferred embodiment of the present application, a filter and a fourth control valve are further included. The filter and the fourth control valve are arranged in the fourth pipeline. The fourth control valve is located between the pump outlet and the filter. The filter is used to filter impurities in the cleaning medium. When the fourth control valve is opened, the cleaning medium enters the filter for filtration.

[0015] In a preferred embodiment of the present application, the filter and the pump inlet are further connected via a fifth pipeline, one end of the fifth pipeline is connected between the filter and the inlet of the fourth pipeline, and the other end of the fifth pipeline is connected between the pump inlet of the first pipeline and the first control valve. A fifth control valve is provided on the fifth pipeline. When the fifth control valve is opened, the cleaning medium is filtered through the filter, and part of the cleaning medium is transported back to the pump body through the fifth pipeline.

[0016] In a preferred embodiment of the present application, the first pipeline and the fourth pipeline are connected via a sixth pipeline, one end of the sixth pipeline is connected between the fourth control valve of the fourth pipeline and the pump outlet, and the other end of the sixth pipeline is connected in parallel with the third pipeline between the first control valve of the first pipeline and the pump inlet. A sixth control valve is provided on the sixth pipeline. When the sixth control valve is opened, part of the cleaning medium is transported back to the pump body through the sixth pipeline.

[0017] In a preferred embodiment of the present application, it further includes a discharge and replenishment port and a seventh control valve, the discharge and replenishment port is connected to the first pipeline through a seventh pipeline, the seventh pipeline is connected in parallel with the third pipeline between the first control valve and the pump inlet, and the seventh control valve is arranged in the seventh pipeline. When the seventh control valve is opened, the cleaning medium is replenished to the pump body or discharged through the discharge and replenishment port.

[0018] In a preferred embodiment of the present application, the system further includes a filter and a fourth control valve, wherein the filter and the fourth control valve are disposed in the fourth pipeline, the fourth control valve being located between the pump outlet and the filter, the filter being configured to filter impurities in the cleaning medium, and when the fourth control valve is opened, the cleaning medium enters the filter for filtration;

[0019] The filter and the pump inlet are further connected via a fifth pipeline. One end of the fifth pipeline is connected between the filter and the inlet of the fourth pipeline, and the other end of the fifth pipeline is connected between the pump inlet of the first pipeline and the first control valve. A fifth control valve is provided on the fifth pipeline. When the fifth control valve is opened, the cleaning medium is filtered by the filter, and part of the cleaning medium is transported back to the pump body through the fifth pipeline.

[0020] The first pipeline and the fourth pipeline are connected via a sixth pipeline, one end of the sixth pipeline is connected between the fourth control valve of the fourth pipeline and the pump outlet, and the other end of the sixth pipeline is connected in parallel with the third pipeline between the first control valve of the first pipeline and the pump inlet. A sixth control valve is provided on the sixth pipeline. When the sixth control valve is opened, part of the cleaning medium is transported back to the pump body through the sixth pipeline;

[0021] One or more of the third control valve, the fourth control valve, the fifth control valve, the sixth control valve and the seventh control valve are opened or closed according to the flow rate of the flow controller.

[0022] In a preferred embodiment of the present application, the first control valve, the second control valve, the third control valve, the fourth control valve, the fifth control valve, the sixth control valve and the seventh control valve are all one-way valves.

[0023] In a second aspect, the present invention provides a method for circulating a cleaning medium, including the circulation device described in the first aspect, wherein the circulation method comprises:

[0024] Upon receiving a cleaning instruction, the pump body, the filter, the temperature controller, and the flow controller are opened, the first control valve, the second control valve, the fourth control valve, and the seventh control valve are opened, and the cleaning medium is pumped from the pump body to the water supply port through the discharge and replenishment ports;

[0025] The seventh control valve is closed and the third control valve is opened, and the flow controller sets the flow of the second pipeline to a first flow, which is much smaller than the second flow in the third pipeline;

[0026] According to the first flow rate set by the flow controller, one or more of the third control valve, the fourth control valve, the fifth control valve, the sixth control valve and the seventh control valve are selected to be opened or closed.

[0027] In the third aspect, the utility model provides a wafer packaging device, comprising a wafer cleaning device and a circulation device as described in the first aspect, wherein the water supply port of the circulation device is connected to the water inlet of the wafer cleaning device, and the cleaning medium is replenished into the wafer cleaning device through the water inlet, and the water inlet of the circulation device is connected to the water outlet of the wafer cleaning device, and the cleaning medium overflowing from the wafer cleaning device is discharged through the water outlet.

[0028] The wafer cleaning medium circulation device, circulation method and wafer packaging equipment disclosed in the utility model can effectively utilize overflowed cleaning liquid when ultrasonic cleaning is performed on wafers, and can slowly transport the cleaning liquid to the cleaning tank without affecting the ultrasonic cleaning, so as to ensure the cleaning effect of the cleaning tank on the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention is described with the help of the following drawings:

[0030] Figure 1 It is a structural schematic diagram of a wafer packaging device in an embodiment of the present utility model;

[0031] Figure 2 It is a structural diagram of a circulation device in an embodiment of the present utility model.

[0032] Reference numerals:

[0033] 1-Wafer cleaning device; 2-Circulation device;

[0034] 10-pump body; 11-pump inlet; 12-pump outlet; 20-water inlet; 30-water supply port; 40-temperature controller; 41-first inlet; 42-first outlet; 50-flow controller; 60-filter; 70-discharge and replenishment port; 81-first control valve; 82-second control valve; 83-third control valve; 84-fourth control valve; 85-fifth control valve; 86-sixth control valve; 87-seventh control valve; 91-first pipeline; 92-second pipeline; 93-third pipeline; 94-fourth pipeline; 95-fifth pipeline; 96-sixth pipeline; 97-seventh pipeline. DETAILED DESCRIPTION

[0035] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0036] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0037] like Figure 1 As shown, an embodiment of the present invention provides a wafer packaging device, including a wafer cleaning device 1 and a circulation device 2. The water supply port 30 of the circulation device 2 is connected to the water inlet of the wafer cleaning device 1, and the cleaning medium is added to the wafer cleaning device 1 through the water inlet. The water receiving port 20 of the circulation device 2 is connected to the water outlet of the wafer cleaning device 1, and the cleaning medium overflowing from the wafer cleaning device 1 is discharged through the water outlet. When the wafer needs to be cleaned, the cleaning medium is filled into the wafer cleaning device 1 through the circulation device 2. When ultrasonic cleaning is used to clean the wafer, the cleaning medium overflowing from the wafer cleaning device 1 is collected through the circulation device 2, and most of the collected cleaning medium is circulated in the circulation device 2 to maintain its temperature and flow rate. A small part of the cleaning medium is slowly transported to the wafer cleaning device 1 through the water supply port 30, so that the cleaning effect of the wafer can be guaranteed.

[0038] like Figure 2 As shown, the wafer cleaning medium circulation device 2 of this embodiment includes a pump body 10, a water receiving port 20, a water supply port 30, a temperature controller 40, a flow controller 50, a filter 60, a discharge and replenishment port 70, a first control valve 81, a second control valve 82, a third control valve 83, a fourth control valve 84, a fifth control valve 85, a sixth control valve 86 and a seventh control valve 87.

[0039] The pump body 10 has a pump inlet 11 and a pump outlet 12, and the temperature controller 40 has a first inlet 41 and a first outlet 42. The water inlet 20 and the pump inlet 11 are connected via a first pipeline 91, with a first control valve 81 disposed in the first pipeline 91. The first outlet 42 and the water supply port 30 are connected via a second pipeline 92, with a flow controller 50 and a second control valve 82 disposed in the second pipeline 92. The flow controller 50 is used to control the flow of cleaning medium supplied from the second pipeline 92 to the water supply port 30. A third pipeline 93 connects the first outlet 42 and the pump inlet 11. One end of the third pipeline 93 is connected between the first control valve 81 of the first pipeline 91 and the pump inlet 11, and the other end of the third pipeline 93 is connected between the first outlet 42, the second control valve 82, and the flow controller 50 of the second pipeline 92. The third control valve 83 is disposed in the third pipeline 93. A fourth pipeline 94 connects the pump outlet 12 and the first inlet 41. The first, second, and third control valves 81, 82, and 83 are open, allowing the cleaning medium to circulate between the pump body 10 and the temperature controller 40. The flow controller 50 controls the second pipeline 92 to deliver a first flow rate of cleaning medium to the water inlet 30. The third pipeline 93 returns the remaining second flow rate of cleaning medium to the pump body 10. The second flow rate is significantly greater than the first flow rate. A filter 60 and a fourth control valve 84 are disposed in the fourth pipeline 94. The fourth control valve 84 is located between the pump outlet 12 and the filter 60. The filter 60 is used to filter impurities from the cleaning medium. A fifth pipeline 95 connects the filter 60 to the pump inlet 11. One end of the fifth pipeline 95 is connected between the filter 60 and the inlet of the fourth pipeline 94. The other end of the fifth pipeline 95 is connected between the pump inlet 11 of the first pipeline 91 and the first control valve 81. The fifth control valve 85 is disposed on the fifth pipeline 95. The first pipeline 91 and the fourth pipeline 94 are connected via a sixth pipeline 96. One end of the sixth pipeline 96 is connected between the fourth control valve 84 of the fourth pipeline 94 and the pump outlet 12. The other end of the sixth pipeline 96 is connected in parallel with the third pipeline 93 between the first control valve 81 of the first pipeline 91 and the pump inlet 11. The sixth control valve 86 is provided on the sixth pipeline 96. The discharge and replenishment port 70 is connected to the first pipeline 91 via a seventh pipeline 97. The seventh pipeline 97 is connected in parallel with the third pipeline 93 between the first control valve 81 and the pump inlet 11. The seventh control valve 87 is provided on the seventh pipeline 97.

[0040] In the circulation device 2 of this embodiment, when the second control valve 82 is closed, the temperature of the cleaning medium drawn from the water receiving port 20 by the pump body 10 is adjusted by the temperature controller 40 .

[0041] In the circulation device 2 of this embodiment, when the third control valve 83 is closed, the flow controller 50 increases the flow rate to replenish the cleaning medium to the water supply port 30 .

[0042] In the circulation device 2 of this embodiment, when the fourth control valve 84 is opened, the cleaning medium enters the filter 60 for filtration.

[0043] In the circulation device 2 of this embodiment, when the fifth control valve 85 is opened, the cleaning medium is filtered by the filter 60 , and part of the cleaning medium is transported back to the pump body 10 through the fifth pipeline 95 .

[0044] In the circulation device 2 of this embodiment, when the sixth control valve 86 is opened, part of the cleaning medium is transported back to the pump body 10 through the sixth pipeline 96 .

[0045] In the circulation device 2 of this embodiment, when the seventh control valve 87 is opened, the cleaning medium is replenished into the pump body 10 or discharged through the discharge and replenishment port 70 .

[0046] The flow rate of the cleaning medium delivered by the circulation device 2 of this embodiment to the water supply port 30 is set by the flow controller 50, and the size of the first flow rate in the second pipeline 92 is determined according to the degree of drop in the liquid level of the cleaning medium in the wafer cleaning device 1. The degree of drop in the liquid level can be the speed of the liquid level drop or the total amount of the liquid level drop. According to the flow rate of the flow controller 50, one or more of the third control valve 83, the fourth control valve 84, the fifth control valve 85, the sixth control valve 86 and the seventh control valve 87 are opened or closed.

[0047] In the circulation device 2 of this embodiment, the cleaning medium can be a cleaning liquid or a wet chemical. The filter 60 includes a filter element capable of filtering impurities. The temperature controller 40 has functions such as increasing and decreasing the temperature, and maintaining a constant temperature. The first flow rate set by the flow controller 50 is generally small, for example, when the cleaning medium is slowly replenished into the wafer cleaning equipment in the form of droplets through the water supply port 30. The first control valve 81, second control valve 82, third control valve 83, fourth control valve 84, fifth control valve 85, sixth control valve 86, and seventh control valve 87 are all one-way valves. The first control valve 81 only allows the cleaning medium to flow from the water inlet 20 to the pump inlet 11. The second control valve 82 only allows the cleaning medium to flow from the first outlet 42 to the water supply port 30. The third control valve 83 only allows the cleaning medium to flow from the third pipeline 93 and the first outlet 42 to the first pipeline 91 and the pump inlet 11. The fourth control valve 84 only allows the cleaning medium to flow from the pump outlet 12 to the filter 60. The fifth control valve 85 allows the cleaning medium to be supplied only from the filter 60 to the seventh line 97. The sixth control valve 86 allows the cleaning medium to be supplied only from the pump outlet 12 and the fourth line 94 to the seventh line 97. The seventh control valve 87 allows the cleaning medium to be supplied only from the fifth line 95, the sixth line 96, and the discharge and replenishment port 70 to the pump inlet 11.

[0048] The cleaning medium circulation device 2 of this embodiment ensures the cleaning effect of the wafer by executing a cleaning medium circulation method, and the circulation method includes:

[0049] When a cleaning instruction is received, the pump body 10, the filter 60, the temperature controller 40 and the flow controller 50 are opened, the first control valve 81, the second control valve 82, the fourth control valve 84 and the seventh control valve 87 are opened, and the cleaning medium is pumped from the pump body 10 to the water supply port 30 through the discharge and replenishment port 70;

[0050] The seventh control valve 87 is closed and the third control valve 83 is opened. The flow controller 50 sets the flow of the second pipeline 92 to the first flow, which is much smaller than the second flow in the third pipeline 93.

[0051] According to the first flow rate set by the flow controller 50 , one or more of the third control valve 83 , the fourth control valve 84 , the fifth control valve 85 , the sixth control valve 86 and the seventh control valve 87 are selectively opened or closed.

[0052] The wafer cleaning medium circulation device, circulation method and wafer packaging equipment disclosed in the present invention can effectively utilize overflowed cleaning liquid when ultrasonic cleaning is performed on wafers, and can slowly transport the cleaning liquid to the cleaning tank without affecting the ultrasonic cleaning, so as to ensure the cleaning effect of the cleaning tank on the wafers.

[0053] It should be understood that the above description of the specific embodiments of the present invention is merely for the purpose of illustrating the technical approach and features of the present invention. Its purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, the present invention is not limited to the above-described specific embodiments. Any changes or modifications made within the scope of the claims of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer cleaning medium circulation device, characterized in that: It includes a pump body, a water inlet, a water delivery port, a temperature controller, a flow controller, a first control valve, a second control valve and a third control valve; The pump body has a pump inlet and a pump outlet, and the temperature controller has a first inlet and a first outlet; the water inlet and the pump inlet are connected via a first pipeline, and the first control valve is provided in the first pipeline; The first outlet is connected to the water delivery port via a second pipeline, the flow controller and the second control valve are provided in the second pipeline, and the flow controller is used to control the flow of the cleaning medium delivered to the water delivery port via the second pipeline; The first outlet and the pump inlet are connected via a third pipeline, one end of the third pipeline is connected between the first control valve of the first pipeline and the pump inlet, and the other end of the third pipeline is connected between the first outlet of the second pipeline and the second control valve and the flow controller, and the third control valve is provided in the third pipeline; The pump outlet and the first inlet are connected via a fourth pipeline; The first control valve, the second control valve, and the third control valve are opened, and the cleaning medium is circulated between the pump body and the temperature controller. The flow controller controls the second pipeline to deliver a first flow of cleaning medium to the water delivery port, and the third pipeline returns the remaining second flow of cleaning medium to the pump body. The second flow rate is much greater than the first flow rate.

2. The circulation device according to claim 1, characterized in that When the second control valve is closed, the temperature of the cleaning medium drawn by the pump body from the water inlet is adjusted by the temperature controller.

3. The circulation device according to claim 1, characterized in that When the third control valve is closed, the flow controller increases the flow rate to replenish the cleaning medium to the water supply port.

4. The circulation device according to claim 1, characterized in that It also includes a filter and a fourth control valve, which are arranged in the fourth pipeline. The fourth control valve is located between the pump outlet and the filter. The filter is used to filter impurities in the cleaning medium. When the fourth control valve is opened, the cleaning medium enters the filter for filtration.

5. The circulation device according to claim 4, characterized in that The filter and the pump inlet are further connected via a fifth pipeline. One end of the fifth pipeline is connected between the filter and the inlet of the fourth pipeline, and the other end of the fifth pipeline is connected between the pump inlet of the first pipeline and the first control valve. A fifth control valve is provided on the fifth pipeline. When the fifth control valve is opened, the cleaning medium is filtered by the filter, and part of the cleaning medium is transported back to the pump body through the fifth pipeline.

6. The circulation device according to claim 4, characterized in that The first pipeline and the fourth pipeline are connected via a sixth pipeline. One end of the sixth pipeline is connected between the fourth control valve of the fourth pipeline and the pump outlet. The other end of the sixth pipeline is connected in parallel with the third pipeline between the first control valve of the first pipeline and the pump inlet. A sixth control valve is provided on the sixth pipeline. When the sixth control valve is opened, part of the cleaning medium is transported back to the pump body through the sixth pipeline.

7. The circulation device according to claim 1, characterized in that The system further includes a discharge and replenishment port and a seventh control valve. The discharge and replenishment port is connected to the first pipeline via a seventh pipeline. The seventh pipeline is connected in parallel with the third pipeline between the first control valve and the pump inlet. The seventh control valve is arranged in the seventh pipeline. When the seventh control valve is opened, the cleaning medium is replenished to the pump body or discharged through the discharge and replenishment port.

8. The circulation device according to claim 7, characterized in that The system further includes a filter and a fourth control valve, wherein the filter and the fourth control valve are disposed in the fourth pipeline, the fourth control valve being located between the pump outlet and the filter, the filter being used to filter impurities in the cleaning medium, and when the fourth control valve is opened, the cleaning medium enters the filter for filtration; The filter and the pump inlet are further connected via a fifth pipeline. One end of the fifth pipeline is connected between the filter and the inlet of the fourth pipeline, and the other end of the fifth pipeline is connected between the pump inlet of the first pipeline and the first control valve. A fifth control valve is provided on the fifth pipeline. When the fifth control valve is opened, the cleaning medium is filtered by the filter, and part of the cleaning medium is transported back to the pump body through the fifth pipeline. The first pipeline and the fourth pipeline are connected via a sixth pipeline, one end of the sixth pipeline is connected between the fourth control valve of the fourth pipeline and the pump outlet, and the other end of the sixth pipeline is connected in parallel with the third pipeline between the first control valve of the first pipeline and the pump inlet. A sixth control valve is provided on the sixth pipeline. When the sixth control valve is opened, part of the cleaning medium is transported back to the pump body through the sixth pipeline; One or more of the third control valve, the fourth control valve, the fifth control valve, the sixth control valve and the seventh control valve are opened or closed according to the flow rate of the flow controller.

9. The circulation device according to claim 8, characterized in that The first control valve, the second control valve, the third control valve, the fourth control valve, the fifth control valve, the sixth control valve, and the seventh control valve are all one-way valves.

10. A wafer packaging device, characterized in that: It comprises a wafer cleaning device and a circulation device as described in any one of claims 1 to 7, wherein the water supply port of the circulation device is connected to the water inlet of the wafer cleaning device, and the cleaning medium is replenished into the wafer cleaning device through the water inlet, and the water inlet of the circulation device is connected to the water outlet of the wafer cleaning device, and the cleaning medium overflowing from the wafer cleaning device is discharged through the water outlet.

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