Wafer centering device of rapid annealing furnace

Abstract

The utility model discloses a wafer centering device for a rapid annealing furnace, which belongs to the technical field of wafer processing and comprises a mounting bottom plate, a wafer body is arranged above the mounting bottom plate, and propelling cylinders are fixedly mounted on two sides of the top of the mounting bottom plate; according to the utility model, through the arrangement of the limiting grooves, when a wafer body is centered, the wafer body is firstly placed in the inner cavities of the limiting grooves, then a user can drive the two groups of limiting plates to move inwards through the propelling cylinders, and then the two sides of the wafer body are clamped and fixed through the arc-shaped parts of the inner cavities of the limiting grooves; through the arrangement of the wafer centering device, the wafer centering device has the advantages that a simple and convenient centering device is formed by the propelling air cylinder, matched hardware, the inductor and the like, the use cost of the wafer centering device is remarkably reduced, the wafer centering device can be flexibly matched with an actual equipment structure to design an installation position, and the internal use space of the equipment can be saved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer centering device for a rapid annealing furnace. Background Art

[0002] A wafer rapid annealing furnace is a key piece of equipment used in semiconductor manufacturing and materials research. It processes materials through rapid heating and cooling to alter their properties or structure. Typically utilizing halogen infrared lamps as a heat source, these furnaces heat wafers or materials to temperatures between 300°C and 1200°C in a very short time via an extremely rapid heating rate. This rapid heating process helps eliminate defects within the wafer or material, improving product performance. After reaching the preset temperature, a brief hold period is typically followed by rapid cooling to complete the annealing process.

[0003] Traditionally, wafer centering devices have relied on standard wafer aligners. These devices utilize notches on the wafer to adjust the wafer to a preset position, ensuring proper placement and orientation for subsequent processing. This high cost makes them unsuitable for low- and mid-range processes, significantly increasing equipment costs and hindering cost control. Furthermore, standard aligners are large, require a high level of space, and lack flexibility. Therefore, a rapid annealing furnace wafer centering device was developed. Utility Model Content

[0004] The purpose of the present utility model is to provide a wafer centering device for a rapid annealing furnace, which has a simple centering device composed of a cylinder, supporting hardware, and sensors, significantly reducing the use cost of the wafer centering device, and can be flexibly designed and installed in accordance with the actual equipment structure, thereby saving the internal space of the equipment, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides a wafer centering device for a rapid annealing furnace, comprising a mounting base plate, a wafer body is arranged above the mounting base plate, propulsion cylinders are fixedly installed on both sides of the top of the mounting base plate, the telescopic end of the propulsion cylinder is fixedly installed with a movable plate through a connecting assembly, a limiting plate is fixedly installed on the top of the movable plate, the wafer body is fixed to the top of the mounting base plate by two groups of the limiting plates, a mounting groove is opened at the top of the mounting base plate and directly below the wafer body, and a sensor is fixedly connected to the bottom of the inner cavity of the mounting groove.

[0006] Preferably, the connecting assembly includes a connecting screw connected to the telescopic end of the propulsion cylinder, one end of the connecting screw passes through the movable plate and extends to the external thread of the movable plate and is connected to a locking nut, and one side of the locking nut is in contact with the surface of the movable plate.

[0007] Preferably, a limiting groove adapted to the wafer body is provided on the surface of the limiting plate, and the surface of the wafer body is in contact with the inner wall of the limiting groove.

[0008] Preferably, the inner cavity of the limiting groove is provided with an arc-shaped portion adapted to the wafer body, and the edge of the wafer body is in contact with the surface of the arc-shaped portion.

[0009] Preferably, a mounting seat is fixedly installed on the top of the mounting base plate and at a corresponding position of the propulsion cylinder. The propulsion cylinder is fixed to the top of the mounting base plate through the mounting seat. A guide component for improving the movement stability of the movable plate is provided on one side of the mounting seat.

[0010] Preferably, the guide assembly includes a guide seat installed on one side of the mounting seat, the inner cavity of the guide seat is provided with a guide hole, the inner cavity of the guide hole is slidably connected to a guide rod, one end of the guide rod passes through the guide hole and extends to the outside of the guide hole and is fixedly connected to one side of the movable plate, and a positioning assembly for fixing the guide seat is also provided on one side of the mounting seat.

[0011] Preferably, the positioning assembly includes a positioning groove opened on one side of the mounting seat, the surface of the guide seat is slidably inserted into the inner cavity of the positioning groove, the surface of the guide seat is threadedly connected to a positioning rod, one end of the positioning rod passes through the guide seat and extends to the inner cavity of the positioning groove and fits into the inner wall of the positioning groove.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] The utility model provides a limit groove. When the wafer body is centered, the wafer body will first be placed in the inner cavity of the limit groove. Then the user can drive the two sets of limit plates to move inward through the propulsion cylinder, and then clamp and fix the two sides of the wafer body through the arc-shaped part of the inner cavity of the limit groove, thereby completing the centering operation of the wafer body. Through the setting of this device, a simple centering device composed of a propulsion cylinder, supporting hardware, and sensors is provided, which significantly reduces the use cost of the wafer centering device, and can flexibly cooperate with the actual equipment structure design and installation position, which can save the internal use space of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of the utility model;

[0015] Figure 2 For this utility model Figure 1 Enlarged view of point A in the middle;

[0016] Figure 3 This is a schematic structural diagram of the guide assembly of the utility model;

[0017] Figure 4This is a structural diagram of the connection component of the utility model.

[0018] In the figure: 1. Mounting base plate; 2. Wafer body; 3. Propulsion cylinder; 4. Moving plate; 5. Limiting plate; 6. Mounting slot; 7. Sensor; 8. Connecting screw; 9. Locking nut; 10. Limiting slot; 11. Arc-shaped portion; 12. Mounting seat; 13. Guide seat; 14. Guide hole; 15. Guide rod; 16. Positioning slot; 17. Positioning rod. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figure 1-Figure 4 The utility model provides a rapid annealing furnace wafer centering device, including a mounting base plate 1, a wafer body 2 is arranged above the mounting base plate 1, a mounting groove 6 is opened at the top of the mounting base plate 1 and directly below the wafer body 2, and an inductor 7 is fixedly connected to the bottom of the inner cavity of the mounting groove 6.

[0021] In this embodiment, a mounting groove 6 for mounting a sensor 7 is opened on the top of the mounting base plate 1. The sensor 7 is installed in the inner cavity of the mounting groove 6 to detect whether the wafer body 2 is located above the mounting base plate 1. In addition, the sensor 7 in this embodiment can be specifically set as a proximity sensor. The sensor 7 is located below the wafer body 2 and plays a role in detecting whether the wafer body 2 is present and in place.

[0022] Preferably, thrust cylinders 3 are fixedly installed on both sides of the top of the mounting base plate 1, and a movable plate 4 is fixed to the telescopic end of the thrust cylinder 3 through a connecting assembly. A limiting plate 5 is fixed on the top of the movable plate 4, and the wafer body 2 is fixed above the mounting base plate 1 by two groups of limiting plates 5. A limiting groove 10 is provided on the surface of the limiting plate 5, which is adapted to the wafer body 2. The surface of the wafer body 2 is fitted with the inner wall of the limiting groove 10, and the inner cavity of the limiting groove 10 is provided with an arc-shaped portion 11 which is adapted to the wafer body 2. The edge of the wafer body 2 is fitted with the surface of the arc-shaped portion 11.

[0023] Through the setting of the thrust cylinder 3, after the wafer body 2 is placed in the limiting groove 10 on the top of the limiting plate 5, the two groups of thrust cylinders 3 can drive the two groups of limiting plates 5 to move inward, and then the two sides of the wafer body 2 can be tightly fixed through the two groups of limiting grooves 10, thereby fixing the position of the wafer body 2.

[0024] Among them, the above-mentioned connecting component includes a connecting screw 8 connected to the telescopic end of the propulsion cylinder 3, one end of the connecting screw 8 passes through the movable plate 4 and extends to the external thread of the movable plate 4 and is connected with a locking nut 9, and one side of the locking nut 9 is in contact with the surface of the movable plate 4. Through the setting of the connecting component, the movable plate 4 and the telescopic end of the propulsion cylinder 3 can be installed and connected together. During installation, the user can insert one end of the connecting screw 8 through the movable plate 4 and tighten the locking nut 9 at one end of the connecting screw 8. The locking nut 9 is used in conjunction with the telescopic end of the propulsion cylinder 3 to tightly fix the connecting screw 8 and the movable plate 4 together. The telescopic end of the propulsion cylinder 3 can drive the movable plate 4 to slide on the top of the installation base plate 1.

[0025] It is worth noting that a mounting seat 12 is fixedly installed on the top of the mounting base plate 1 and at the corresponding position of the propulsion cylinder 3. The propulsion cylinder 3 is fixed to the top of the mounting base plate 1 through the mounting seat 12. A guide component for improving the movement stability of the movable plate 4 is provided on one side of the mounting seat 12. The guide component includes a guide seat 13 installed on one side of the mounting seat 12. The inner cavity of the guide seat 13 is provided with a guide hole 14. The inner cavity of the guide hole 14 is slidably connected with a guide rod 15. One end of the guide rod 15 passes through the guide hole 14 and extends to the outside of the guide hole 14 and is fixedly connected to one side of the movable plate 4.

[0026] By setting the mounting seat 12, the propulsion cylinder 3 can be installed and fixed on the top of the mounting base 1. In this embodiment, the stability of the movement of the movable plate 4 can be improved by setting the guide component. When the movable plate 4 moves, it will drive the guide rod 15 to slide in the inner cavity of the guide hole 14.

[0027] Furthermore, a positioning assembly for fixing the guide seat 13 is provided on one side of the mounting seat 12. The positioning assembly includes a positioning groove 16 provided on one side of the mounting seat 12. The surface of the guide seat 13 is slidably plugged into the inner cavity of the positioning groove 16. A positioning rod 17 is threadedly connected to the surface of the guide seat 13. One end of the positioning rod 17 passes through the guide seat 13 and extends to the inner cavity of the positioning groove 16 to fit the inner wall of the positioning groove 16. By providing the positioning assembly, the guide seat 13 can be fixedly installed in the inner cavity of the positioning groove 16. During installation, the user can insert the guide seat 13 into the inner cavity of the positioning groove 16 and then tighten the positioning rod 17 to fix the guide seat 13 in the inner cavity of the positioning groove 16.

[0028] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer centering device for a rapid annealing furnace, comprising a mounting base plate (1), characterized in that: A wafer body (2) is provided above the mounting base (1), and propulsion cylinders (3) are fixedly installed on both sides of the top of the mounting base (1). A movable plate (4) is fixedly installed on the telescopic end of the propulsion cylinder (3) through a connecting assembly, and a limiting plate (5) is fixedly installed on the top of the movable plate (4). The wafer body (2) is fixed above the mounting base (1) by two groups of the limiting plates (5). A mounting groove (6) is provided at the top of the mounting base (1) and directly below the wafer body (2), and a sensor (7) is fixedly connected to the bottom of the inner cavity of the mounting groove (6).

2. The wafer centering device for a rapid annealing furnace according to claim 1, characterized in that: The connecting assembly includes a connecting screw (8) connected to the telescopic end of the propulsion cylinder (3), one end of the connecting screw (8) passes through the movable plate (4) and extends to the external thread of the movable plate (4) to be connected with a locking nut (9), and one side of the locking nut (9) is in contact with the surface of the movable plate (4).

3. The wafer centering device for a rapid annealing furnace according to claim 1, characterized in that: The surface of the limiting plate (5) is provided with a limiting groove (10) adapted to the wafer body (2), and the surface of the wafer body (2) is in contact with the inner wall of the limiting groove (10).

4. The wafer centering device for a rapid annealing furnace according to claim 3, characterized in that: The inner cavity of the limiting groove (10) is provided with an arc-shaped portion (11) adapted to the wafer body (2), and the edge of the wafer body (2) is in contact with the surface of the arc-shaped portion (11).

5. The wafer centering device for a rapid annealing furnace according to claim 1, characterized in that: A mounting seat (12) is fixedly mounted on the top of the mounting base plate (1) and at a position corresponding to the propulsion cylinder (3). The propulsion cylinder (3) is fixed to the top of the mounting base plate (1) via the mounting seat (12). A guide component for improving the movement stability of the movable plate (4) is provided on one side of the mounting seat (12).

6. The wafer centering device for a rapid annealing furnace according to claim 5, characterized in that: The guide assembly includes a guide seat (13) mounted on one side of the mounting seat (12), an inner cavity of the guide seat (13) is provided with a guide hole (14), the inner cavity of the guide hole (14) is slidably connected to a guide rod (15), one end of the guide rod (15) passes through the guide hole (14) and extends to the outside of the guide hole (14) and is fixedly connected to one side of the movable plate (4), and a positioning assembly for fixing the guide seat (13) is also provided on one side of the mounting seat (12).

7. The wafer centering device for a rapid annealing furnace according to claim 6, characterized in that: The positioning assembly includes a positioning groove (16) opened on one side of the mounting seat (12), the surface of the guide seat (13) is slidably plugged into the inner cavity of the positioning groove (16), and the surface of the guide seat (13) is threadedly connected to a positioning rod (17), one end of the positioning rod (17) passes through the guide seat (13) and extends to the inner cavity of the positioning groove (16) and fits with the inner wall of the positioning groove (16).

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