80w vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system

Abstract

The 80w vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system comprises a charger main body, a semiconductor refrigeration module, a first thermistor installed on a PCBA board of the charger main body, a second thermistor installed on a coil of the charger main body, a first fan, an MCU control module, an AD acquisition module and a data storage module. Wherein the first thermistor and the second thermistor are electrically connected with the AD acquisition module; the AD acquisition module is used for preprocessing acquired data, converting an analog signal into a digital signal and sending the digital signal to the MCU control module; the MCU control module is electrically connected with the semiconductor refrigeration module and the first fan, the air speed of the first fan and the voltage of the semiconductor refrigeration module are intelligently controlled through the MCU control module, and generated cold air is blown into the charger body for rapid cooling; according to the system, cold air is blown to the charging equipment and the charger for cooling, so that the charging effect and the charging safety can be ensured, and the problem of high heat of a high-power (80w) charger is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle chargers, in particular to an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system. Background Art

[0002] Currently, more and more cars are being equipped with onboard wireless chargers for charging phones, tablets, and other devices. However, a serious problem with onboard wireless chargers is the significant heat generation during charging. Although mainstream products are designed to charge at up to 15W, this heats up the phone and charger during charging. This increased temperature causes a decrease in charging power, especially with high-power wireless chargers such as 50W and 80W. Because 80W wireless charging places even stricter demands on the internal heat dissipation of the charging module and the phone itself, a cooling and heat dissipation system for 80W in-car mobile phone wireless charging is essential. Summary of the Invention

[0003] In view of the above technical problems and defects, the purpose of the utility model is to provide an 80W vehicle-mounted mobile phone wireless charging cooling and heat dissipation system. The system adds a semiconductor refrigeration module to the wireless charger, and sets NTC thermistors on the coil and the mainboard. The MUC control module controls the operation of the semiconductor refrigeration module and the fan according to the collected data, thereby blowing cold air to the charging device and charger to cool them down, ensuring the charging effect and charging safety, and avoiding the high heat problem of high-power chargers.

[0004] In order to achieve the above purpose, the technical solution adopted by the present utility model is:

[0005] An 80W in-vehicle mobile phone wireless charging cooling and heat dissipation system includes a charger body, a semiconductor cooling module mounted on the charger body, a first thermistor mounted on the charger body PCBA board, a second thermistor mounted on the charger body coil, a first fan for blowing air into the charging device and the interior of the charger, an MCU control module, an AD acquisition module, and a data storage module;

[0006] Wherein, the first thermistor and the second thermistor are electrically connected to the AD acquisition module, and the monitored data are sent to the AD acquisition module in real time;

[0007] The AD acquisition module is used to pre-process the collected data, convert the analog signal into a digital signal and send it to the MCU control module;

[0008] The MCU control module is connected to the vehicle communication network through the CAN serial communication protocol to exchange data, periodically report system status information, and obtain vehicle information in real time; the MCU control module is electrically connected to the semiconductor refrigeration module and the first fan, and the MCU control module intelligently controls the wind speed of the first fan and the voltage of the semiconductor refrigeration module, blowing the generated cold air into the charger body for rapid cooling;

[0009] The data storage module is used to store data.

[0010] As a preferred embodiment of the present invention, the first thermistor and the second thermistor are both negative temperature coefficient thermistors; and the data storage module is a non-volatile memory.

[0011] As a preferred embodiment of the present invention, the shielding slat of the charger body is installed on the rear shell, and a first air outlet is provided on the shielding slat, through which air is blown directly to the charging device for cooling; a first fan is provided on the side of the rear shell away from the shielding slat, an inner heat sink is installed near the first fan air outlet, an inner air inlet is opened near the inner heat sink, and a second air outlet is provided at the end away from the inner air inlet, and the air entering the rear shell is discharged through the second air outlet; a fan housing is also installed on the rear shell, and the fan housing contains the first fan, the inner heat sink and the inner air inlet cover, and the wind The fan housing is provided with a fan air inlet notch at a position opposite to the first fan, and an avoidance notch at a position opposite to the inner heat sink; the top surface of the fan housing is provided with a heat insulation plate at a position opposite to the avoidance notch; the heat insulation plate is processed with a mounting groove, and a semiconductor refrigeration module is provided in the mounting groove; the cold surface of the semiconductor refrigeration module contacts the inner heat sink, and the hot surface of the semiconductor refrigeration module contacts the outer heat sink; the outer heat sink is fixed on the heat insulation plate and the fan housing, and a second fan is installed on one side of the outer heat sink; the second fan is used to blow air to the outer heat sink to cool the semiconductor refrigeration module.

[0012] As a preferred embodiment of the present invention, the charger body includes a shielding film, a coil, a coil bracket, a cooling plate, thermal conductive glue, a PCBA board, and a back shell; wherein, the coil is pasted on the coil bracket; the cooling plate is arranged between the coil bracket and the thermal conductive glue; the thermal conductive glue is arranged between the cooling plate and the PCBA board; the PCBA board is fixed on the back shell; the cooling plate is composed of a main board and a plurality of cooling fins arranged at intervals on the main board; the coil bracket is provided with an air outlet channel near the air inlet in the back shell, and the cold air entering the air inlet in the back shell is diverted into two cold air streams under the action of the cooling plate and the coil bracket, one of which passes through the channel between the cooling fins to cool the cooling plate and is discharged from the second air outlet, and the PCBA board and the coil are cooled through the cooling plate, and the other cold air passes through the air outlet channel of the coil bracket and is discharged from the first air outlet, which is used to cool the charging device.

[0013] As a preferred embodiment of the present invention, the charger body further includes an NFC antenna, and the NFC antenna is integrated on the shielding film.

[0014] As a preferred embodiment of the present invention, the shielding fan is fixed to the rear shell by screws; the first fan is fixed to the rear shell by screws; the inner heat sink, the heat insulation plate and the fan casing are connected and fixed by screws; the fan casing and the rear shell are fixed by screws; the outer heat sink is fixed to the fan casing by screws, and the second fan is fixed to the outer heat sink by screws.

[0015] As a preferred embodiment of the present invention, the first air outlet, the inner air inlet of the rear shell and the air outlet channel of the coil bracket are arranged on the same side and opposite to each other, and the width of the inner air inlet is greater than the width of the air outlet channel.

[0016] Compared with the prior art, the advantages and beneficial effects of the present invention are:

[0017] (1) The refrigeration module (semiconductor refrigeration module) in the refrigeration and heat dissipation system provided by the present invention is controlled by the main control MCU to enable the TED module to work for cooling, and then the cold air is blown into the heat dissipation structure through the fan. The cold air will be divided into two airflows. One stream of cold air is used to blow to the back of the mobile phone to dissipate heat for the mobile phone to achieve the best charging efficiency, and the other stream of cold air is blown into the inside of the wireless charger to quickly cool the coil and PCBA, which plays a good protective role.

[0018] (2) The refrigeration and heat dissipation system provided by the present invention adds a second fan on the rear shell, and uses the second fan to lower the semiconductor refrigeration module, thereby reducing the internal and external temperatures of the wireless charger, effectively improving the heating and heat dissipation problems of the charger, and increasing the charging power of the vehicle-mounted wireless charger, thereby avoiding the problem that the charging power of the vehicle-mounted wireless charger is too low in summer and is far from reaching the designed charging power.

[0019] (3) The charger provided by the present invention provides over-temperature protection by judging the temperature of the heating coil and PCBA when cooling the internal heat dissipation components and the charging device. The setting of the semiconductor refrigeration module can make the air blown out by the charger cold air. The cold air can quickly cool down the phone, allowing the phone to continue charging, ensuring charging efficiency and preventing damage to the phone, and completely solving the high heat problem existing in high-power (80W) chargers.

[0020] (4) The cooling plate inside the charger of the utility model is composed of a main board and a plurality of cooling fins arranged at intervals on the main board. The air coming in from the air inlet of the rear shell passes through the channel between the two cooling fins and is discharged from the second air outlet. The coil that generates heat during the operation of the charger is directly in contact with the cooling plate, and the PCBA board is in contact with the cooling plate through thermal conductive glue. This structural design can quickly cool down the internal components of the charger, and the cooling effect is significant.

[0021] (5) The charger provided by the present invention has a simple overall structure and a compact layout, which improves the performance of the wireless charger and is conducive to ensuring and extending the service life of the wireless charger. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more clear and easy to understand. In the accompanying drawings:

[0023] Figure 1 This is a structural diagram of the utility model's vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system;

[0024] Figure 2 This is a schematic diagram of the overall structure of the charger body of the utility model Figure 1 ;

[0025] Figure 3 This is a schematic diagram of the overall structure of the charger body of the utility model Figure 2 ;

[0026] Figure 4 This is a partial structural diagram of the charger body of this utility model. Figure 1 ;

[0027] Figure 5 This is a partial structural diagram of the charger body of this utility model. Figure 2 ;

[0028] Figure 6 This is an exploded schematic diagram of the charger body of the utility model;

[0029] Figure 7 It is the plane of the charger body of the utility model Figure 1 ;

[0030] Figure 8 It is the plane of the charger body of the utility model Figure 2 ;

[0031] Figure 9 yes Figure 7 Cross-section of the middle AA;

[0032] Figure 10 yes Figure 8 Cross-section of the middle BB;

[0033] Figure 11 yes Figure 8 Cross-section of the middle CC;

[0034] Figure 12 yes Figure 8 Cross-section of the middle DD;

[0035] Figure 13 yes Figure 6 Enlarged view of the cooling plate and coil support;

[0036] Figure 14 Figure 1 is a schematic diagram of an NFC antenna.

[0037] The figure marks include: charger body 1, NFC antenna 2, first fan 3, inner heat sink 4, fan housing 5, heat insulation board 6, semiconductor refrigeration module 7, outer heat sink 8, second fan 9, shielding slit 11, rear shell 12, coil 13, coil bracket 14, cooling plate 15, thermal conductive adhesive 16, PCBA board 17, first air outlet 111, inner air inlet 121, second air outlet 122, fan air inlet notch 501, mounting slot 601, air outlet channel 141, mainboard 151, cooling fin 152. DETAILED DESCRIPTION

[0038] The following will clearly and completely describe the technical solutions of various embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. It should be pointed out that all the drawings are exemplary representations. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The present invention is further described in detail below through specific implementation examples and in conjunction with the drawings.

[0041] like Figure 1 As shown, this embodiment provides an 80W in-vehicle mobile phone wireless charging cooling and heat dissipation system, including a charger body 1, a semiconductor cooling module (also called a TED module) installed on the charger body, a first thermistor installed on the charger body PCBA board, a second thermistor installed on the charger body coil, a first fan for blowing air to the charging device and charger, an MCU control module, an AD acquisition module, and a data storage module;

[0042] The first thermistor and the second thermistor are electrically connected to the AD acquisition module to send the monitored data to the AD acquisition module in real time; specifically, the first thermistor and the second thermistor are both negative temperature coefficient thermistors (NTC);

[0043] The AD acquisition module is used to pre-process the collected data (filtering and operational amplification, etc.), convert the analog signal into a digital signal and send it to the MCU control module;

[0044] The MCU control module is connected to the vehicle communication network through the CAN serial communication protocol for data exchange, periodically reporting system status information and obtaining vehicle information in real time. Specifically, the information can be transmitted to the instrument via the CAN line for real-time information viewing. The MCU control module adopts the Xinwang micro single-chip microcomputer. The MCU control module is electrically connected to the semiconductor refrigeration module and the first fan. The MCU control module intelligently controls the wind speed of the first fan and the voltage of the semiconductor refrigeration module, and blows the generated cold air into the charger body for rapid cooling.

[0045] The data storage module is used to store data, including key parameters such as vehicle configuration; specifically, the data storage module is a non-volatile memory (NVM), and the use of non-volatile memory can prevent the loss of information when the vehicle is powered off.

[0046] Further, if Figures 2 to 14As shown, in this embodiment, the shielding slit 11 of the charger body 1 is installed on the rear shell 12, and a first air outlet 111 is provided on the shielding slit 11, through which air is blown directly to the charging device for cooling; a first fan 3 is provided on the side of the rear shell 12 away from the shielding slit 11, an inner heat sink 4 is installed near the first fan air outlet, an inner air inlet 121 is opened near the inner heat sink 4, and a second air outlet 122 is provided at one end away from the inner air inlet 121, and the air entering the rear shell 12 is discharged through the second air outlet 122; a fan housing 5 is also installed on the rear shell 12, and the fan housing 5 covers the first fan 3, the inner heat sink 4 and the inner air inlet 121 Inside, the fan housing 5 is provided with a fan air inlet notch 501 at a position opposite to the first fan 3, and an avoidance notch (not shown) at a position opposite to the inner heat sink 4. The top surface of the fan housing 5 is provided with a heat insulation plate 6 at a position opposite to the avoidance notch. The heat insulation plate 6 is processed with a mounting groove 601, and a semiconductor refrigeration module 7 is provided in the mounting groove 601. The cold surface of the semiconductor refrigeration module 7 contacts the inner heat sink 4, and the hot surface of the semiconductor refrigeration module 7 contacts the outer heat sink 8. The outer heat sink 8 is fixed on the heat insulation plate 6 and the fan housing 5. A second fan 9 is installed on one side of the outer heat sink 8. The second fan 9 is used to blow air to the outer heat sink 8 to cool the semiconductor refrigeration module 7.

[0047] Further, continue as Figures 2 to 14 As shown, in this embodiment, the charger body includes a shield 11, a coil 13, a coil bracket 14, a cooling plate 15, a thermal adhesive 16, a PCBA board 17, and a rear shell 12; wherein, the coil 13 is attached to the coil bracket 14, and the coil 13 is used to charge the charging device, and the charging device includes a mobile phone and a tablet; the cooling plate 15 is arranged between the coil bracket 14 and the thermal adhesive 16; the thermal adhesive 16 is arranged between the cooling plate 15 and the PCBA board 17; the PCBA board 17 is fixed to the rear shell 12; the cooling plate 15 is composed of a main board 151 and a spacer arranged on the back shell 12; It is composed of multiple cooling fins 152 on the main board; the coil bracket 14 is provided with an air outlet channel 141 near the air inlet 121 in the rear shell; the cold air coming in from the air inlet 121 in the rear shell is diverted into two streams of cold air under the action of the cooling plate 15 and the coil bracket 14, one of which passes through the channel between the cooling fins 15 and the cooling fins 15 to cool the cooling plate and then is discharged from the second air outlet 122, and the PCBA board 17 and the coil 13 are cooled by the cooling plate 15, and the other cold air passes through the air outlet channel 141 of the coil bracket 14 and is discharged from the first air outlet 111 to cool the charging device.

[0048] Furthermore, in this embodiment, the charger body further includes an NFC antenna 2 , which is integrated on the shielding slit 11 . The function of the NFC antenna 2 is to control electromagnetic interference and communication transmission.

[0049] Further, if Figures 2 to 5 As shown, in this embodiment, the shielding slat 11 is fixed to the rear shell 12 by screws, and the NFC antenna 2, coil 13, coil bracket 14, cooling plate 15, thermal conductive glue 16, and PCBA board 17 are arranged between the shielding slat 11 and the rear shell 12; the first fan 3 is fixed to the rear shell 12 by screws; the inner heat sink 4, the heat insulation plate 6 and the fan housing 5 are connected and fixed by screws; the fan housing 5 is fixed to the rear shell 12 by screws; the outer heat sink 8 is fixed to the fan housing 5 by screws, and the second fan 9 is fixed to the outer heat sink 8 by screws.

[0050] Further, if Figures 9 to 12 As shown, in this embodiment, the first air outlet 111 , the inner air inlet 121 of the rear shell and the air outlet channel 141 of the coil bracket are arranged on the same side and opposite to each other, and the width of the inner air inlet 121 is greater than the width of the air outlet channel 141 .

[0051] Furthermore, in this embodiment, there are two semiconductor refrigeration modules, one is a left semiconductor refrigeration module, and the other is a right semiconductor refrigeration module.

[0052] In this embodiment, the cooling and heat dissipation system adopts a time-slice polling architecture, which rationally allocates tasks to various time-slice tasks based on the time characteristics of the functions. Specifically, the cooling and heat dissipation system is designed with time-slice tasks of 1ms, 5ms, 20ms, 100ms, and 500ms. After initialization, the above time-slice tasks are executed in a round-robin manner; the five time-slice variables are: Tick1ms, Tick5ms, Tick20ms, Tick100ms, and Tick500ms.

[0053] The 1ms time slice task is used to process received active cooling and heat dissipation commands, checking every 1ms to see if there are new active cooling and heat dissipation commands. Specifically, it first checks if Tick1ms == 1. If so, it sets Tick1ms == 0 and receives a new CAN message (Receive new can msg). If there is a new CAN message, it processes the received CAN message (Handlecanmsg). If there is no new CAN message, it continues to check if Tick1ms == 1 and repeats the process.

[0054] The 5ms time slice task is used for AD acquisition. When Tick5ms == 4, a conversion is started; when Tick5ms == 5, the AD result is read. This way, there is no waiting time for conversion. Specifically, first check if Tick5ms == 4? If so, start a conversion to convert the analog signal to a digital signal. If not, continue to check if Tick5ms == 5? If so, set Tick5ms == 0, get the AD value (Get AD value), and repeat the process.

[0055] The 20ms time slice task is used for fault diagnosis, and existing methods can be used or referred to to detect whether there is a fault in the system;

[0056] The 100ms time slice task is segmented, with different functions executed at ticks 100ms==97, 98, and 99, respectively. This is primarily due to the long execution time of the cooling and heat dissipation PID algorithm, which takes approximately 200 microseconds at a 32M clock. Specifically, the task first checks if tick 100ms==97. If so, the first fan is processed. The task then checks if tick 100ms==98. If so, the left semiconductor cooling module is processed. The task then checks if tick 100ms==99. If so, the right semiconductor cooling module is processed. The task then checks if tick 100ms==100. If so, a CAN message is sent.

[0057] The 500ms time slice task is used for longer time measurement, such as the duration of cooling and heat dissipation.

[0058] In this embodiment, the cooling and heat dissipation function adopts the PID algorithm commonly used in automatic control. Specifically, according to the actual situation, the current cooling and heat dissipation duty cycle is used as input, the NTC is used as output feedback, and the deviation between the NTC and the target temperature is calculated through PID calculation to calculate the subsequent cooling and heat dissipation duty cycle. By adjusting the PID parameters in this embodiment, the temperature control effect can basically make the NTC reach the target temperature within 2 oscillation cycles, the time is about 1 minute, and the overshoot is about 1°C.

[0059] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An 80W car-mounted mobile phone wireless charging refrigeration and heat dissipation system, characterized in that: It includes a charger body, a semiconductor refrigeration module installed on the charger body, a first thermistor installed on the charger body PCBA board, a second thermistor installed on the charger body coil, a first fan for blowing air to the charging device and the inside of the charger, an MCU control module, an AD acquisition module, and a data storage module; Wherein, the first thermistor and the second thermistor are electrically connected to the AD acquisition module, and the monitored data are sent to the AD acquisition module in real time; The AD acquisition module is used to pre-process the collected data, convert the analog signal into a digital signal and send it to the MCU control module; The MCU control module is connected to the vehicle communication network through the CAN serial communication protocol to exchange data, periodically report system status information, and obtain vehicle information in real time; the MCU control module is electrically connected to the semiconductor refrigeration module and the first fan, and the MCU control module intelligently controls the wind speed of the first fan and the voltage of the semiconductor refrigeration module, blowing the generated cold air into the charger body for rapid cooling; The data storage module is used to store data.

2. The 80W vehicle-mounted mobile phone wireless charging cooling and heat dissipation system according to claim 1 is characterized in that: The first thermistor and the second thermistor are both negative temperature coefficient thermistors; and the data storage module is a non-volatile memory.

3. The 80W vehicle-mounted mobile phone wireless charging cooling and heat dissipation system according to claim 1 is characterized in that: The shielding slat of the charger body is installed on the rear shell, and a first air outlet is provided on the shielding slat, through which air is blown directly to the charging device for cooling; a first fan is provided on the side of the rear shell away from the shielding slat, an inner heat sink is installed near the first fan air outlet, an inner air inlet is opened near the inner heat sink, and a second air outlet is provided at the end away from the inner air inlet, through which the air entering the rear shell is discharged; a fan housing is also installed on the rear shell, and the fan housing contains the first fan, the inner heat sink and the inner air inlet cover, and the fan housing is in contact with the A fan air inlet notch is provided at a position opposite to the first fan, an avoidance notch is provided at a position opposite to the inner heat sink, and a heat insulation plate is provided on the top surface of the fan housing at a position opposite to the avoidance notch; a mounting groove is processed on the heat insulation plate, and a semiconductor refrigeration module is provided in the mounting groove; the cold surface of the semiconductor refrigeration module contacts the inner heat sink, and the hot surface of the semiconductor refrigeration module contacts the outer heat sink; the outer heat sink is fixed on the heat insulation plate and the fan housing, and a second fan is installed on one side of the outer heat sink; the second fan is used to blow air to the outer heat sink to cool the semiconductor refrigeration module.

4. The 80W vehicle-mounted mobile phone wireless charging cooling and heat dissipation system according to claim 3 is characterized in that: The charger body includes a shielding layer, a coil, a coil bracket, a cooling plate, thermal conductive glue, a PCBA board, and a back shell; wherein, the coil is pasted on the coil bracket; the cooling plate is arranged between the coil bracket and the thermal conductive glue; the thermal conductive glue is arranged between the cooling plate and the PCBA board; the PCBA board is fixed on the back shell; the cooling plate is composed of a main board and a plurality of cooling fins arranged at intervals on the main board; the coil bracket is provided with an air outlet channel near the air inlet in the back shell, and the cold air entering the air inlet in the back shell is diverted into two cold air streams under the action of the cooling plate and the coil bracket, one of which passes through the channel between the cooling fins to cool the cooling plate and is discharged from the second air outlet, and the PCBA board and the coil are cooled through the cooling plate, and the other cold air passes through the air outlet channel of the coil bracket and is discharged from the first air outlet, which is used to cool the charging device.

5. The 80W vehicle-mounted mobile phone wireless charging cooling and heat dissipation system according to claim 3 is characterized in that: The charger body further includes an NFC antenna, which is integrated on the shielding layer.

6. The 80W vehicle-mounted mobile phone wireless charging cooling and heat dissipation system according to claim 3 is characterized in that: The shielding fan is fixed to the rear shell by screws; the first fan is fixed to the rear shell by screws; the inner heat sink, the heat insulation plate and the fan housing are connected and fixed by screws; the fan housing and the rear shell are fixed by screws; the outer heat sink is fixed to the fan housing by screws, and the second fan is fixed to the outer heat sink by screws.

7. The 80W vehicle-mounted mobile phone wireless charging cooling and heat dissipation system according to claim 3 is characterized in that: The first air outlet, the inner air inlet of the rear shell and the air outlet channel of the coil bracket are arranged on the same side and opposite to each other, and the width of the inner air inlet is greater than the width of the air outlet channel.

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