Semiconductor wafer dust remover
By designing a semiconductor wafer dust removal machine that combines a rotating storage plate and cleaning cotton wipes with a cylinder and an electric push rod, the problem that existing equipment cannot fully remove dust is solved, and all-round cleaning and efficient cleaning are achieved to ensure the cleanliness of the wafer surface.
Patent Information
- Application Number
- CN202421992286.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-08-16
AI Technical Summary
Existing semiconductor wafer dust removal equipment is unable to completely remove surface dust, affecting the performance and yield of semiconductor products.
A semiconductor wafer dust removal machine was designed, which uses a rotating placement plate and cleaning cotton wipes combined with a cylinder and an electric push rod to achieve all-round cleaning. It is also equipped with a water pump and a cleaning pipe to flush and wipe water stains, thereby improving dust removal efficiency.
It achieves all-round dust removal effect, has good sealing, reduces external interference, improves dust removal efficiency and cleaning effect, and ensures the cleanliness of the wafer surface.
Smart Images
Figure CN223352327U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor wafer dust removal machine. Background Art
[0002] Semiconductor wafers, also known as silicon wafers, are circular, thin slices made of high-purity single-crystal silicon. After undergoing special surface treatment, they can be used to manufacture various semiconductor devices. They are the fundamental material for manufacturing integrated circuits, microelectronics, and other semiconductor products, and their quality directly impacts the performance and reliability of these products. However, during production and processing, semiconductor wafers are susceptible to contaminants such as dust clinging to their surfaces, impacting chip yield and performance. Therefore, dust removal from the wafer surface is an essential step in the semiconductor manufacturing process.
[0003] Existing semiconductor wafers are usually dusted using cleaning equipment. Although this method can remove pollutants on the wafer surface to a certain extent, it still cannot completely remove the dust on the surface of the semiconductor wafer, resulting in poor dust removal effect on the semiconductor wafer, affecting subsequent use. Utility Model Content
[0004] The purpose of the utility model is to provide a semiconductor wafer dust removal machine to solve the technical problems raised in the background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a semiconductor wafer dust collector comprises a base, the top of the base is fixedly connected to a pillar, the top of the pillar is fixedly connected to a dust collection box, the dust collection box is provided with a movable slot, the inner wall of the dust collection box is slidably connected to a collecting bin, the top of the collecting bin is provided with a top opening, the inner side wall of the top opening is fixedly connected to a protective plate, the front end of the collecting bin is hingedly provided with a baffle, the outer wall of the collecting bin is fixedly connected to a handle, the bottom of the inner wall of the collecting bin is fixedly connected to a round table, the center position of the round table is provided with a round hole, the inner wall of the round hole is fixedly connected to a fixing frame, the inner wall of the fixing frame is fixedly connected to a motor, the output end of the motor is fixedly connected to a storage plate, the top of the storage plate is bonded with an anti-slip rubber pad, a box cover is provided on the dust collection box, and a dust collection mechanism is provided at the bottom of the box cover.
[0006] Preferably, the dust removal mechanism includes a cylinder fixedly connected to the bottom of the box cover, the output end of the cylinder is fixedly connected to an L-shaped connecting plate, the inner side wall of the L-shaped connecting plate is fixedly connected to an electric push rod, and the output end of the electric push rod is fixedly connected to a cleaning cotton wipe;
[0007] An observation window is provided on the box cover.
[0008] Preferably, a chute is provided at the bottom of the inner wall of the dust removal box, and a limiting groove is symmetrically provided at the bottom of the inner wall of the dust removal box, and discharge holes are provided on the inner walls of the chute and the limiting groove;
[0009] The inner wall of the slide groove is fixedly connected with a fixed block, and the fixed block is located at the rear side of the middle discharge hole. The bottom surface of the collecting drawer is fixedly connected with a sliding block, and the outer wall of the sliding block is fixedly connected with a spring. The end of the spring away from the sliding block is fixedly connected to the fixed block. The bottom surface of the collecting drawer is symmetrically connected with a limiting block, and the two limiting blocks are respectively located on the left and right sides of the sliding block. The outer wall of the limiting block is slidably connected to the inner wall of the limiting groove.
[0010] Preferably, an annular groove is provided on the top of the dust removal box, a receiving groove is provided on the inner wall of the dust removal box, the receiving groove is connected to the annular groove, and the receiving groove is located below the annular groove, and a notch is provided on the dust removal box, and the notch is connected to the annular groove.
[0011] Preferably, a snap ring is fixedly connected to the bottom of the box cover, and the outer wall of the snap ring is slidably connected to the inner wall of the ring groove.
[0012] Preferably, an annular tube is provided on the inner side of the annular groove, and a cleaning tube is symmetrically connected to the outer wall of the annular tube, and the cleaning tube is located on the inner side of the accommodating groove.
[0013] Preferably, a water pump is fixedly connected to the top of the base, a water pipe is fixedly connected to the output end of the water pump, and an end of the water pipe away from the water pump is connected to the ring pipe.
[0014] Compared with related technologies, the semiconductor wafer dust removal machine provided by the present invention has the following beneficial effects:
[0015] 1. The utility model provides a semiconductor wafer dust removal machine. When in use, pull the handle to open the collection drawer, then place the semiconductor wafer on the placement plate, and push the collection drawer back into the dust removal box. The external dust is isolated by the protective plate and the baffle, and then the motor is started to drive the placement plate to rotate. When the cylinder and the electric push rod are started synchronously, the cleaning cotton wipe can perform a full-scale back and forth cleaning of the semiconductor wafer. The dust removal mechanism of this device is installed in the dust removal box, with good sealing performance. The interference from the external environment can be fully reduced during dust removal, and the dust removal effect is good.
[0016] 2. The utility model provides a semiconductor wafer dust removal machine. After use, the collecting drawer is pulled open and the baffle is opened to remove the dust inside the collecting drawer. During dust removal, the water pump is started to pump water, and the water flows into the ring pipe along the water pipe. After briefly converging in the ring pipe, the water is sprayed out through the spray holes on the cleaning pipe to rinse the surface of the semiconductor wafer, thereby improving the efficiency of dust removal for the semiconductor wafer. After cleaning, the water stains on the surface of the semiconductor wafer can be wiped off with a cleaning cotton wipe, and the accumulated water in the collecting drawer can be discharged by opening the baffle. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 This is a structural diagram of the storage plate of the present utility model;
[0019] Figure 3 This is a structural diagram of the installation platform of the utility model;
[0020] Figure 4 This is a structural diagram of the collecting drawer of the present utility model;
[0021] Figure 5 This is a structural diagram of the chute of the present utility model;
[0022] Figure 6 This is a schematic diagram of the spring structure of the utility model;
[0023] Figure 7 This is a structural diagram of the box cover of the present invention.
[0024] In the figure: 1. Base; 2. Dust removal box; 3. Support; 4. Movable groove; 5. Collecting drawer; 6. Baffle; 7. Top opening; 8. Protective plate; 9. Round table; 10. Round hole; 11. Fixed frame; 12. Motor; 13. Storage board; 14. Anti-slip rubber pad; 15. Slide groove; 16. Handle; 17. Box cover; 18. Observation window; 19. Cylinder; 20. L-shaped connecting plate; 21. Electric push rod; 22. Cleaning cotton wipe; 23. Snap ring; 24. Ring pipe; 25. Water pump; 26. Water pipe; 27. Sliding block; 28. Fixed block; 29. Spring; 30. Limit block; 31. Cleaning pipe; 32. Discharge hole; 33. Receiving groove; 34. Ring groove; 35. Notch; 36. Limit groove. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0026] Example 1:
[0027] See also Figure 1-Figure 7 The utility model provides a technical solution: a semiconductor wafer dust removal machine, including a base 1, a support 3 is fixedly connected to the top of the base 1, a dust box 2 is fixedly connected to the top of the support 3, a movable groove 4 is provided on the dust box 2, a collecting drawer 5 is slidably connected to the inner wall of the dust box 2, a top opening 7 is provided on the top of the collecting drawer 5, a protective plate 8 is fixedly connected to the inner side wall of the top opening 7, a baffle 6 is hingedly connected to the front end of the collecting drawer 5, a handle 16 is fixedly connected to the outer wall of the collecting drawer 5, and a round bottom is fixedly connected to the inner wall of the collecting drawer 5. The platform 9 has a circular hole 10 at its center. The inner wall of the circular hole 10 is fixedly connected to a fixing frame 11. The inner wall of the fixing frame 11 is fixedly connected to a motor 12. The output end of the motor 12 is fixedly connected to a storage plate 13. The top of the storage plate 13 is bonded with an anti-slip rubber pad 14. The top of the storage plate 13 is bonded with an anti-slip rubber pad 14. A box cover 17 is provided on the dust removal box 2. The bottom of the box cover 17 is fixedly connected to a snap ring 23. The outer wall of the snap ring 23 is slidably connected to the inner wall of the annular groove 34. A dust removal mechanism is provided at the bottom of the box cover 17.
[0028] The dust removal mechanism includes a cylinder 19 fixedly connected to the bottom of the box cover 17, the output end of the cylinder 19 is fixedly connected to an L-shaped connecting plate 20, the inner side wall of the L-shaped connecting plate 20 is fixedly connected to an electric push rod 21, and the output end of the electric push rod 21 is fixedly connected to a cleaning cotton wipe 22. An observation window 18 is provided on the box cover 17;
[0029] When in use, the collecting drawer 5 is opened by pulling the handle 16, and then the semiconductor wafer is placed on the placement plate 13. The anti-slip rubber pad 14 plays an anti-slip role, which is conducive to the placement of the semiconductor wafer more stably. Then the collecting drawer 5 is pushed back into the dust removal box 2, and the external dust is isolated by the protective plate 8 and the baffle 6. Then, the motor 12 is started to drive the placement plate 13 to rotate, and under the condition that the placement plate 13 rotates, the cylinder 19 and the electric push rod 21 are synchronously started to make the cleaning cotton wipe 22 sweep back and forth on the surface of the semiconductor wafer to achieve dust removal. The working status of the dust removal mechanism can be observed in real time through the observation window 18. After the dust removal is completed, the collecting drawer 5 is opened to take out the semiconductor wafer. The device has good sealing performance and effectively reduces the adverse effects of poor sealing on the dust removal work of the semiconductor wafer. After use, the collecting drawer 5 is pulled open and the baffle 6 is opened to remove the dust inside the collecting drawer 5.
[0030] In this embodiment, a chute 15 is provided at the bottom of the inner wall of the dust removal box 2, and a limiting groove 36 is symmetrically provided at the bottom of the inner wall of the dust removal box 2. The inner walls of the chute 15 and the limiting groove 36 are both provided with a discharge hole 32. The dust in the chute 15 can be discharged through the discharge hole 32 to prevent the dust from accumulating in the chute 15 and adversely affecting the sliding of the collection drawer 5.
[0031] The inner wall of the slide 15 is fixedly connected with a fixed block 28, and the fixed block 28 is located at the rear side of the middle discharge hole 32, and the bottom surface of the collection drawer 5 is fixedly connected with a sliding block 27. The outer wall of the sliding block 27 is fixedly connected with a spring 29. The end of the spring 29 away from the sliding block 27 is fixedly connected to the fixed block 28. The bottom surface of the collection drawer 5 is symmetrically connected with the limit block 30. The two limit blocks 30 are respectively located on the left and right sides of the sliding block 27. The outer wall of the limit block 30 is slidably connected to the inner wall of the limit groove 36. The collection drawer 5 is limited by the sliding block 27 and the limit block 30. When the spring 29 provides the elasticity, the collection drawer 5 can be automatically driven to close when the external force disappears, preventing dust from entering the collection drawer 5. During the closing process of the collection drawer 5, the sliding block 27 and the limit block 30 gradually slide into the inner side of the slide 15 and the limit groove 36 respectively, and at the same time, the dust in the slide 15 and the limit groove 36 can be cleared from the discharge hole 32.
[0032] Example 2:
[0033] See also Figure 1-Figure 7As shown, on the basis of Example 1, the utility model provides a technical solution: an annular groove 34 is provided on the top of the dust removal box 2, and a receiving groove 33 is provided on the inner wall of the dust removal box 2, which is connected with the annular groove 34, and the receiving groove 33 is located below the annular groove 34, and a notch 35 is provided on the dust removal box 2, which is connected with the annular groove 34, and an annular tube 24 is provided on the inner side of the annular groove 34, and a cleaning pipe 31 is symmetrically connected to the outer wall of the annular tube 24, and the cleaning pipe 31 is located on the inner side of the receiving groove 33, and a water pump 25 is fixedly connected to the top of the base 1, and a water pipe 26 is fixedly connected to the output end of the water pump 25, and the end of the water pipe 26 away from the water pump 25 is connected to the annular tube 24.
[0034] In this embodiment, when removing dust, the water pump 25 is started to pump water, and the water flows along the water pipe 26 into the ring pipe 24. After briefly converging in the ring pipe 24, it is sprayed out through the nozzle on the cleaning pipe 31 to rinse the surface of the semiconductor wafer, thereby improving the efficiency of dust removal on the semiconductor wafer. After cleaning is completed, the water stains on the surface of the semiconductor wafer can be wiped off by the cleaning cotton wipe 22, and the accumulated water in the collecting drawer 5 can be discharged by opening the baffle 6.
[0035] Working principle: Pull the handle 16 to open the collection drawer 5, and then place the semiconductor wafer on the placement plate 13. The anti-slip rubber pad 14 plays an anti-slip role, which is conducive to the more stable placement of the semiconductor wafer. Then push the collection drawer 5 back into the dust removal box 2, and isolate it from external dust by the protective plate 8 and the baffle 6. Then start the motor 12 to drive the placement plate 13 to rotate, and under the condition that the placement plate 13 rotates, synchronously start the cylinder 19 and the electric push rod 21, so that the cleaning cotton wipe 22 cleans the surface of the semiconductor wafer back and forth to achieve dust removal. The working status of the dust removal mechanism can be observed in real time through the observation window 18. During dust removal, start the water pump 25 to pump water, and the water flows into the annular pipe 24 along the water pipe 26. After a short period of convergence in the annular pipe 24, it is sprayed out through the nozzle on the cleaning pipe 31 to rinse the surface of the semiconductor wafer, thereby improving the efficiency of semiconductor wafer dust removal. After cleaning is completed, the water stains on the surface of the semiconductor wafer can be wiped off by the cleaning cotton wipe 22.
[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor wafer dust removal machine, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a support (3), the top of the support (3) is fixedly connected to a dust removal box (2), a movable groove (4) is provided on the dust removal box (2), the inner wall of the dust removal box (2) is slidably connected to a collecting drawer (5), the top of the collecting drawer (5) is provided with a top opening (7), the inner side wall of the top opening (7) is fixedly connected to a protective plate (8), the front end of the collecting drawer (5) is hinged with a baffle (6), the outer wall of the collecting drawer (5) is fixedly connected to a handle (16), the collecting drawer (5) is provided with a handle (16), and the collecting drawer (5) is provided with a handle (16). A round platform (9) is fixedly connected to the bottom of the inner wall of the collection drawer (5), a round hole (10) is opened at the center of the round platform (9), a fixing frame (11) is fixedly connected to the inner wall of the round hole (10), a motor (12) is fixedly connected to the inner wall of the fixing frame (11), an output end of the motor (12) is fixedly connected to a storage plate (13), a non-slip rubber pad (14) is bonded to the top of the storage plate (13), a box cover (17) is provided on the dust removal box (2), and a dust removal mechanism is provided at the bottom of the box cover (17).
2. A semiconductor wafer dust removal machine according to claim 1, characterized in that: The dust removal mechanism comprises a cylinder (19) fixedly connected to the bottom of the box cover (17), an output end of the cylinder (19) is fixedly connected to an L-shaped connecting plate (20), an inner side wall of the L-shaped connecting plate (20) is fixedly connected to an electric push rod (21), and an output end of the electric push rod (21) is fixedly connected to a cleaning cotton wipe (22); An observation window (18) is provided on the box cover (17).
3. The semiconductor wafer dust removal machine according to claim 1, characterized in that: A chute (15) is provided at the bottom of the inner wall of the dust removal box (2), and a limiting groove (36) is symmetrically provided at the bottom of the inner wall of the dust removal box (2), and a discharge hole (32) is provided on the inner walls of the chute (15) and the limiting groove (36); The inner wall of the slide groove (15) is fixedly connected with a fixed block (28), and the fixed block (28) is located at the rear side of the middle discharge hole (32). The bottom surface of the collecting drawer (5) is fixedly connected with a sliding block (27), and the outer wall of the sliding block (27) is fixedly connected with a spring (29), and the end of the spring (29) away from the sliding block (27) is fixedly connected to the fixed block (28). The bottom surface of the collecting drawer (5) is symmetrically connected with a limiting block (30), and the two limiting blocks (30) are respectively located on the left and right sides of the sliding block (27). The outer wall of the limiting block (30) is slidably connected to the inner wall of the limiting groove (36).
4. The semiconductor wafer dust removal machine according to claim 1, characterized in that: The top of the dust removal box (2) is provided with an annular groove (34), the inner wall of the dust removal box (2) is provided with a receiving groove (33), the receiving groove (33) is connected to the annular groove (34), and the receiving groove (33) is located below the annular groove (34), and the dust removal box (2) is provided with a notch (35), the notch (35) is connected to the annular groove (34).
5. The semiconductor wafer dust removal machine according to claim 2, characterized in that: A snap ring (23) is fixedly connected to the bottom of the box cover (17), and the outer wall of the snap ring (23) is slidably connected to the inner wall of the ring groove (34).
6. The semiconductor wafer dust removal machine according to claim 4, characterized in that: An annular tube (24) is provided inside the annular groove (34), and a cleaning tube (31) is symmetrically connected to the outer wall of the annular tube (24). The cleaning tube (31) is located inside the accommodating groove (33).
7. The semiconductor wafer dust removal machine according to claim 6, characterized in that: A water pump (25) is fixedly connected to the top of the base (1), a water pipe (26) is fixedly connected to the output end of the water pump (25), and an end of the water pipe (26) away from the water pump (25) is connected to the ring pipe (24).