Wafer clamping device for arm of semiconductor wet process groove type equipment

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to an arm wafer clamping device of semiconductor wet-process groove type equipment, which comprises a hanging bracket, two fixing clamps are movably mounted at the bottom end of the hanging bracket, and clamping mechanisms are arranged between the fixing clamps and the hanging bracket; and movable clamps are movably mounted on the outer sides of the two fixed clamps. According to the utility model, the fixed clamps, the movable clamps and the connecting pieces are matched for use, when a wafer is clamped, the motor is started, the motor drives the bidirectional screw rod to rotate, the bidirectional screw rod drives the two movable pieces to move in the same direction when rotating, and when the two movable pieces move in the same direction, the two fixed clamps below are controlled to clamp and fix the wafer from the two sides of the wafer; and the fixed clamp and the movable clamp are movably connected, so that when the fixed clamp moves, the connecting rod at the top end of the movable clamp overturns and controls the movable clamp to extend out along the outer part of the fixed clamp, and when the fixed clamp clamps the wafer, the lower end of the movable clamp extends out and then a wrap angle is added, thereby improving the clamping stability.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor wet process tank type equipment arm wafer clamping device. Background Art

[0002] A wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. After the wafer is formed, in order to adapt to semiconductor processing, the wafer surface needs to be cleaned, coated, and other processes. Therefore, the wafer needs to be clamped and shipped.

[0003] For example, a wafer clamping device disclosed in the authorization announcement number CN211670187U includes a support frame with a carrier platform, two left and right slide grooves provided on the support frame, a clamping member mounting plate with both ends respectively inserted into the slide grooves and slidably connected to the slide grooves, an adjustable clamping member provided on the clamping member mounting plate, and a clamping member adjustment device. After adopting the above technical solution, the beneficial effects of the utility model are: it can conveniently and quickly realize the clamping and transfer of wafers, and can quickly realize the processing of both sides of the wafer through the flipping mechanism. Therefore, it is suitable for popularization and application.

[0004] Although the above patent can be used to clamp wafers, as the diameter of the wafer to be clamped increases, the angle between the clamping half ring and the wafer will gradually decrease. Since the smaller the contact area, the worse the clamping stability, the above device has limitations when used. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor wet process tank equipment arm wafer clamping device to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A semiconductor wet process tank type equipment arm clamping wafer device, comprising

[0008] A hanger, wherein two fixing clamps are movably mounted on the bottom end of the hanger, and a clamping mechanism is provided between the fixing clamps and the hanger;

[0009] Movable clamps are movably installed on the outer sides of the two fixed clamps, a bracket is provided on the front side of the middle part of the hanger, and an adjustment mechanism is provided between the bracket and the movable clamp.

[0010] Preferably, the clamping mechanism includes a motor, the motor is fixedly mounted on the outside of one side of the hanger, the output shaft of the motor is located inside the hanger, and a bidirectional screw is provided at one end, both ends of the bidirectional screw are threadedly connected to a movable part, and the bottom end of the movable part is fixedly connected to the top end of the fixed clamp;

[0011] Preferably, a guide groove is provided in the middle of the bottom end of the hanger, and the movable member is slidably connected to the guide groove;

[0012] Preferably, the adjustment mechanism includes a spring, which is movably mounted on the inner middle portion of the bracket, a pressure plate is provided at the top end of the spring, and a cylinder is provided at the top end of the bracket;

[0013] Preferably, the adjustment mechanism further comprises a connecting piece, the connecting piece is provided at the top end of the movable clamp, and the connecting piece is movably connected to the pressure plate via a connecting rod;

[0014] Preferably, arc-shaped grooves are provided on both sides of the outer wall of the fixed clamp, and guide rods slidably connected to the arc-shaped grooves are provided on both sides of the upper end of the movable clamp.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. A semiconductor wet process trough equipment arm wafer clamping device is used in conjunction with a fixed clamp, a movable clamp and a connecting part. When clamping the wafer, the motor is started, and the motor drives the bidirectional lead screw to rotate. When the bidirectional lead screw rotates, it drives the two movable parts to move in the same direction. When the two movable parts move in the same direction, the two fixed clamps below are controlled to clamp and fix the wafer from both sides. Moreover, since the fixed clamp and the movable clamp are movably connected, when the fixed clamp moves, the connecting rod at the top of the movable clamp flips accordingly and controls the movable clamp to extend along the outside of the fixed clamp. When the fixed clamp clamps the wafer, the lower end of the movable clamp extends to increase the wrap angle, thereby improving the clamping stability.

[0017] 2. This is a semiconductor wet process trough equipment arm wafer clamping device, which is used in conjunction with a bracket, a cylinder, a pressure plate, a spring and a connecting rod. When the wafer is clamped by the fixed clamp, if the increased wrap angle after the movable clamp is extended is not enough to cover the wafer, the cylinder on the top of the bracket is started. After the cylinder is started, its output shaft presses down the pressure plate. When the pressure plate is pressed down, the spring is compressed synchronously, and the connecting rod is controlled to be stretched outward. When the connecting rod moves, it continues to press down the connecting piece, and the connecting piece controls the movable clamp to slide down along the outer arc of the fixed clamp until the lower end of the two movable clamps abuts against each other, so that the lower end of the wafer can be covered, thereby achieving the purpose of easy adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall main structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 3 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 4 It is a schematic diagram of the overall structure of the utility model.

[0022] In the figure: 1. Hanger; 2. Fixed clamp; 3. Movable clamp; 4. Bracket; 5. Motor; 6. Bidirectional screw; 7. Movable part; 8. Guide groove; 9. Spring; 10. Pressure plate; 11. Cylinder; 12. Connecting part; 13. Connecting rod; 14. Arc groove; 15. Guide rod. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] like Figure 1-4 As shown, the utility model provides a technical solution:

[0025] A semiconductor wet process tank-type equipment arm-gripping wafer device includes a hanger 1, two fixed clamps 2 are movably mounted on the bottom end of the hanger 1, a clamping mechanism is provided between the fixed clamps 2 and the hanger 1, and the clamping mechanism includes a motor 5, which is fixedly mounted on one side of the hanger 1. The output shaft of the motor 5 is located inside the hanger 1, and a bidirectional screw rod 6 is provided at one end. Both ends of the bidirectional screw rod 6 are threadedly connected to a movable part 7, and the bottom end of the movable part 7 is fixedly connected to the top end of the fixed clamp 2. A guide groove 8 is provided in the middle of the bottom end of the hanger 1, and the movable part 7 is slidably connected to the guide groove 8;

[0026] In this embodiment, when clamping the wafer, the motor 5 is started, and the motor 5 drives the bidirectional screw 6 to rotate. When the bidirectional screw 6 rotates, it drives the two movable parts 7 to move in the same direction. When the two movable parts 7 move in the same direction, they control the two fixed clamps 2 below to clamp and fix the wafer from both sides. And because the fixed clamp 2 and the movable clamp 3 are movably connected, when the fixed clamp 2 moves, the connecting rod 13 at the top of the movable clamp 3 flips along with it, and controls the movable clamp 3 to extend along the outside of the fixed clamp 2. When the fixed clamp 2 clamps the wafer, the lower end of the movable clamp 3 increases the wrap angle after extending, thereby improving the clamping stability.

[0027] like Figure 3As shown, movable clamps 3 are movably installed on the outside of the two fixed clamps 2, a bracket 4 is provided on the front of the middle part of the hanger 1, and an adjustment mechanism is provided between the bracket 4 and the movable clamp 3. The adjustment mechanism includes a spring 9, which is movably installed in the middle part of the inner side of the bracket 4. A pressure plate 10 is provided at the top of the spring 9, and a cylinder 11 is provided at the top of the bracket 4. The adjustment mechanism also includes a connecting member 12, which is provided at the top of the movable clamp 3. The connecting member 12 and the pressure plate 10 are movably connected by a connecting rod 13. Arc grooves 14 are provided on both sides of the outer wall of the fixed clamp 2, and guide rods 15 slidably connected to the arc grooves 14 are provided on both sides of the upper end of the movable clamp 3.

[0028] In this embodiment, after the wafer is clamped by the fixed clamp 2, if the increased wrap angle after the movable clamp 3 is extended is not enough to cover the wafer, the cylinder 11 at the top of the bracket 4 is started. After the cylinder 11 is started, its output shaft presses down the pressure plate 10. When the pressure plate 10 is pressed down, the spring 9 is compressed synchronously, and the connecting rod 13 is controlled to be stretched outward. When the connecting rod 13 moves, it continues to press down the connecting piece 12, and the connecting piece 12 controls the movable clamp 3 to slide down along the outer arc of the fixed clamp 2 until the lower end of the two movable clamps 3 abuts against each other, so that the lower end of the wafer can be covered, thereby achieving the purpose of easy adjustment.

[0029] Working principle: When clamping the wafer, start the motor 5, which drives the bidirectional screw 6 to rotate. When the bidirectional screw 6 rotates, it drives the two movable parts 7 to move in the same direction. When the two movable parts 7 move in the same direction, they control the two fixed clamps 2 below to clamp and fix the wafer from both sides. And because the fixed clamp 2 and the movable clamp 3 are movably connected, when the fixed clamp 2 moves, the connecting rod 13 at the top of the movable clamp 3 flips along with the trend and controls the movable clamp 3 to extend along the outside of the fixed clamp 2. When the fixed clamp 2 clamps the wafer, the lower end of the movable clamp 3 extends and increases. Add a wrap angle. When the wafer is clamped by the fixed clamp 2, if the increased wrap angle after the movable clamp 3 is extended is not enough to cover the wafer, start the cylinder 11 at the top of the bracket 4. After the cylinder 11 is started, its output shaft presses down the pressure plate 10. When the pressure plate 10 is pressed down, the spring 9 is compressed synchronously, and the connecting rod 13 is controlled to be stretched outward. When the connecting rod 13 moves, it continues to press down the connecting piece 12, and the connecting piece 12 controls the movable clamp 3 to slide down along the outer arc of the fixed clamp 2 until the lower end of the two movable clamps 3 abuts against each other, so that the lower end of the wafer can be covered.

[0030] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wet process tank type equipment arm wafer clamping device, characterized by: include A hanger (1), wherein two fixing clamps (2) are movably mounted on the bottom end of the hanger (1), and a clamping mechanism is provided between the fixing clamps (2) and the hanger (1); A movable clamp (3) is movably mounted on the outer sides of the two fixed clamps (2); a bracket (4) is provided on the front side of the middle portion of the hanger (1); and an adjustment mechanism is provided between the bracket (4) and the movable clamp (3).

2. The semiconductor wet process tank type equipment arm wafer gripping device according to claim 1, characterized in that: The clamping mechanism includes a motor (5), the motor (5) is fixedly mounted on the outside of one side of the hanger (1), the output shaft of the motor (5) is located inside the hanger (1), and a bidirectional screw rod (6) is provided at one end thereof, both ends of the bidirectional screw rod (6) are threadedly connected to a movable part (7), and the bottom end of the movable part (7) is fixedly connected to the top end of the fixed clamp (2).

3. The semiconductor wet process tank type equipment arm wafer gripping device according to claim 2, characterized in that: A guide groove (8) is provided in the middle of the bottom end of the hanger (1), and the movable member (7) is slidably connected to the guide groove (8).

4. The semiconductor wet process tank type equipment arm wafer gripping device according to claim 1, characterized in that: The regulating mechanism comprises a spring (9), which is movably mounted on the inner middle portion of the bracket (4), a pressure plate (10) is provided at the top end of the spring (9), and a cylinder (11) is provided at the top end of the bracket (4).

5. The semiconductor wet process tank type equipment arm wafer gripping device according to claim 4, characterized in that: The adjustment mechanism further comprises a connecting member (12), wherein the connecting member (12) is arranged at the top end of the movable clamp (3), and the connecting member (12) is movably connected to the pressure plate (10) via a connecting rod (13).

6. The semiconductor wet process tank type equipment arm wafer gripping device according to claim 1, characterized in that: Both sides of the outer wall of the fixed clamp (2) are provided with arc grooves (14), and both sides of the upper end of the movable clamp (3) are provided with guide rods (15) slidably connected to the arc grooves (14).

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