Conveying device for wafer scrubbing

Abstract

The utility model discloses a conveying device for wafer scrubbing, and relates to the technical field of wafer scrubbing, the conveying device for wafer scrubbing comprises a material receiving box, a conveying assembly is arranged at the upper end of the material receiving box, a scrubbing assembly is arranged at the upper end of the conveying assembly, a variable frequency motor is arranged in the center of the interior of the material receiving box, and the variable frequency motor is connected with the conveying assembly. The output end of the variable frequency motor drives the conveying assembly to rotate, a second protective sleeve is arranged outside the variable frequency motor, a first protective sleeve is arranged outside the second protective sleeve, the conveying assembly comprises a center base, a plurality of connecting arms are arranged on the outer wall of the center base in a hot melting mode, and the conveying assembly further comprises a conveying disc; according to the scheme, the problems that according to existing wafer scrubbing and conveying, conveying is carried out one by one, scrubbing and conveying are carried out in sequence, the scrubbing efficiency is low, and water resources are seriously wasted are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer scrubbing, in particular to a conveying device for wafer scrubbing. Background Art

[0002] ‌The wafer is a thin sheet made of semiconductor material and is an important component of electronic devices. During production, the surface needs to be scrubbed to keep it clean.

[0003] For example, the Chinese patent with announcement number CN212652269U (a surface cleaning device for quartz wafers): comprises an outer shell and a wafer body, four bottom columns are fixedly mounted on the bottom of the outer shell, a pressurized water pump is fixedly mounted on one side of the outer shell, one end of the pressurized water pump extends into the interior of the water tank, the surface cleaning device for quartz wafers, by setting a nozzle and a cleaning tank, the pressurized water pump draws water in the water tank into the nozzle through the water inlet pipe, the water sprayed from the nozzle is scattered, completing a single cleaning of the surface of the wafer body, and can remove floating stains on the surface of the wafer body, a motor is provided in the cleaning box, driven by the structure in the cleaning box, and the connecting rod drives the cleaning cotton to wipe back and forth on the surface of the wafer body, completing a double cleaning of the surface of the wafer body, the traditional cleaning device can generally only perform one cleaning process, and the present device ensures the cleanliness of the wafer body surface to a certain extent.

[0004] However, the existing wafer brushing and conveying is carried out one by one and brushed in sequence, which has low conveying and brushing efficiency and serious waste of water resources; therefore, it does not meet the existing needs. We have proposed a conveying device for wafer brushing. Utility Model Content

[0005] The purpose of the present invention is to provide a conveying device for wafer scrubbing, so as to solve the problems in the above background technology that the existing wafer scrubbing conveying is one by one and scrubbing is performed in sequence, the conveying and scrubbing efficiency is low, and water resources are seriously wasted.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a conveying device for wafer scrubbing, comprising: a material receiving box, a conveying assembly is provided at the upper end of the material receiving box, a scrubbing assembly is provided at the upper end of the conveying assembly, a variable frequency motor is provided at the inner center of the material receiving box, and the output end of the variable frequency motor drives the conveying assembly to rotate, a second sheath is provided on the outside of the variable frequency motor, and a first sheath is provided on the outside of the second sheath.

[0007] Preferably, the conveying assembly includes a center seat, and a connecting arm is hot-melted on the outer wall of the center seat, and a plurality of connecting arms are provided. The conveying assembly also includes a conveying tray, and the conveying tray is located at one end of the connecting arm.

[0008] Preferably, the upper surface of the conveying tray is provided with a conveying trough, and the lower surface of the conveying trough is provided with a drainage hole penetrating from top to bottom.

[0009] Preferably, a mounting seat is provided on one side surface of the material receiving box, and a servo motor is installed inside the mounting seat.

[0010] Preferably, the brushing assembly includes a brushing plate, a water receiving seat is provided on the upper surface of the brushing plate, the brushing assembly also includes a connecting seat, and the connecting seat is located on one side surface of the brushing plate, the upper end of the connecting seat is provided with a fixing bolt, and the connecting seat is threadedly connected to the output end of the servo motor through the fixing bolt.

[0011] Preferably, the lower surface of the scrubbing plate is provided with an inner mounting groove, and the number and position of the inner mounting groove correspond to the conveying plate, a brush plate is provided inside the inner mounting groove, a water outlet is provided on the surface of the brush plate, and the water outlet is communicated with the water receiving seat.

[0012] Preferably, a second water receiving cavity is formed between the first sheath and the second sheath, and a first water receiving cavity is formed between the first sheath and the inner wall of the material receiving box, and a water permeable hole is provided on the lower surface of the second water receiving cavity.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] (1) The utility model sets a conveying component at the upper end of the receiving box, sets a brushing component at the upper end of the conveying component, places the wafers inside the conveying groove of the conveying disc, and multiple conveying discs can hold multiple wafers. The water is discharged through the outlet hole and falls on the upper end of the wafer, which has a pre-cleaning effect on the wafer. The output end of the frequency conversion motor drives the center seat to rotate, thereby realizing the rotation of multiple conveying discs and performing position adjustment. When rotating, the wafers contact the brush plate and have a brushing effect. The base of the receiving box is equipped with a linear slide rail for moving the receiving box back and forth, achieving a pre-brushing effect during the conveying process, and multiple wafers are operated at the same time. When brushing is carried out formally in the later stage, the brushing time and water consumption are reduced, the brushing efficiency is improved, and the problem that the existing wafer brushing and conveying is one by one and brushing is carried out in sequence, the conveying and brushing efficiency is low, and the water resource is seriously wasted is solved.

[0015] (2) By setting a servo motor inside the mounting base, the output end of the servo motor drives the brush plate to rotate, rotate to the upper end of the receiving box, and perform brushing. When it rotates to one side of the receiving box, the brush plate will also brush the chip to improve the cleaning degree. After the brush plate rotates to one side, it is convenient to perform chip loading and unloading operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a structural diagram of the material receiving box of the present utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the material receiving box of the present utility model when viewed from above;

[0019] Figure 4 This is a bottom view of the structure of the brushing assembly of the present invention;

[0020] In the figure: 1. Material receiving box; 2. Brushing assembly; 3. Brushing plate; 4. Water receiving seat; 5. Connecting seat; 6. Fixing bolt; 7. Conveying assembly; 8. Center seat; 9. Connecting arm; 10. Conveying plate; 11. Conveying trough; 12. Drain hole; 13. Frequency conversion motor; 14. First sheath; 15. First water receiving chamber; 16. Second sheath; 17. Second water receiving chamber; 18. Mounting seat; 19. Servo motor; 20. Water permeable hole; 21. Mounting inner groove; 22. Brush plate; 23. Water outlet. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] See also Figure 1-4The utility model provides an embodiment: a wafer scrubbing conveying device, comprising: a receiving box 1, a conveying assembly 7 is provided at the upper end of the receiving box 1, a scrubbing assembly 2 is provided at the upper end of the conveying assembly 7, a frequency conversion motor 13 is provided at the inner center of the receiving box 1, and the output end of the frequency conversion motor 13 drives the conveying assembly 7 to rotate, a second sheath 16 is provided on the outside of the frequency conversion motor 13, a first sheath 14 is provided on the outside of the second sheath 16, the conveying assembly 7 includes a center seat 8, and the outer wall of the center seat 8 is hot-melted with a connecting arm 9, and the connecting arm 9 is provided with multiple, the conveying assembly 7 also includes a conveying disc 10, and the conveying disc 10 is located at one end of the connecting arm 9, the upper surface of the conveying disc 10 is provided with a conveying trough 11, and the lower surface of the conveying trough 11 is provided with a water hole 12 running through the upper and lower parts, the brushing assembly 2 includes a brushing plate 3, the upper surface of the brushing plate 3 is provided with a water receiving seat 4, the brushing assembly 2 also includes a connecting seat 5, and the connecting seat 5 is located on one side surface of the brushing plate 3, the upper end of the connecting seat 5 is provided with a fixing bolt 6, and the connecting seat 5 is connected to the servo by the fixing bolt 6. The output end of the service motor 19 is threadedly connected, and the lower surface of the scrubbing plate 3 is provided with an installation inner groove 21, and the number and position of the installation inner groove 21 correspond to the conveying disc 10, and the interior of the installation inner groove 21 is provided with a brush plate 22, and the surface of the brush plate 22 is provided with a water outlet 23, and the water outlet 23 is interconnected with the water receiving seat 4. The wafer is placed inside the conveying groove 11 of the conveying disc 10. Multiple conveying discs 10 can place multiple wafers. After placement, the water supply device is connected to the water receiving seat 4. This is the existing water supply technology. Through the water outlet 23 The wafers are discharged and fall onto the upper end of the wafer, which has a pre-cleaning effect on the wafer. The output end of the frequency conversion motor 13 drives the center seat 8 to rotate, thereby realizing the rotation of multiple conveyor discs 10 and performing position adjustment. When rotating, the wafer contacts the brush plate 22, which has a scrubbing effect. The base of the receiving box 1 is equipped with a linear slide rail for moving the receiving box 1 back and forth, which realizes the pre-scrubbing effect in the process of conveying, and multiple wafers are operated at the same time. When scrubbing is carried out formally in the later stage, the scrubbing time and water consumption are reduced, thereby improving the scrubbing efficiency.

[0023] See also Figure 1 、 2 A mounting seat 18 is provided on one side surface of the receiving box 1, and a servo motor 19 is installed inside the mounting seat 18. The output end of the servo motor 19 drives the scrubbing plate 3 to rotate and rotate to the upper end of the receiving box 1, so that the scrubbing plate 3 can be rotated and opened, thereby performing the loading and unloading operations of the wafers.

[0024] See also Figure 2 、 3A second water receiving chamber 17 is formed between the first sheath 14 and the second sheath 16, and a first water receiving chamber 15 is formed between the first sheath 14 and the inner wall of the material receiving box 1. A water permeable hole 20 is provided on the lower surface of the second water receiving chamber 17, and water falls into the first water receiving chamber 15 and the second water receiving chamber 17. The rear surface of the first water receiving chamber 15 has a drain port, and drainage is performed through the drain port and the water permeable hole 20 to avoid water accumulation.

[0025] The washing machine 10 is a kind of washing machine 10 that is used for washing, and the washing machine 10 is a kind of washing machine 10 that is used for washing.

[0026] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A wafer cleaning conveying device, comprising a receiving box (1), characterized in that: A conveying assembly (7) is provided at the upper end of the material receiving box (1), a brushing assembly (2) is provided at the upper end of the conveying assembly (7), a variable frequency motor (13) is provided at the inner center of the material receiving box (1), and the output end of the variable frequency motor (13) drives the conveying assembly (7) to rotate, a second sheath (16) is provided on the outside of the variable frequency motor (13), and a first sheath (14) is provided on the outside of the second sheath (16).

2. The wafer scrubbing conveying device according to claim 1, wherein: The conveying assembly (7) includes a center seat (8), and a connecting arm (9) is hot-melted on the outer wall of the center seat (8), and a plurality of connecting arms (9) are provided. The conveying assembly (7) also includes a conveying tray (10), and the conveying tray (10) is located at one end of the connecting arm (9).

3. The wafer scrubbing conveying device according to claim 2, characterized in that: The upper surface of the conveying tray (10) is provided with a conveying trough (11), and the lower surface of the conveying trough (11) is provided with a water discharge hole (12) penetrating from top to bottom.

4. The wafer scrubbing conveying device according to claim 3, wherein: A mounting seat (18) is provided on one side surface of the material receiving box (1), and a servo motor (19) is installed inside the mounting seat (18).

5. The wafer scrubbing conveying device according to claim 4, characterized in that: The scrubbing assembly (2) includes a scrubbing plate (3), the upper surface of which is provided with a water receiving seat (4), and the scrubbing assembly (2) also includes a connecting seat (5), and the connecting seat (5) is located on a side surface of the scrubbing plate (3), and the upper end of the connecting seat (5) is provided with a fixing bolt (6), and the connecting seat (5) is threadedly connected to the output end of the servo motor (19) through the fixing bolt (6).

6. The wafer scrubbing conveying device according to claim 5, characterized in that: The lower surface of the scrubbing plate (3) is provided with mounting inner grooves (21), and the number and position of the mounting inner grooves (21) correspond to the conveying plate (10). A brush plate (22) is provided inside the mounting inner grooves (21), and a water outlet hole (23) is provided on the surface of the brush plate (22), and the water outlet hole (23) is communicated with the water receiving seat (4).

7. The wafer scrubbing conveying device according to claim 1, wherein: A second water receiving chamber (17) is formed between the first sheath (14) and the second sheath (16), a first water receiving chamber (15) is formed between the first sheath (14) and the inner wall of the material receiving box (1), and a water permeable hole (20) is provided on the lower surface of the second water receiving chamber (17).

Images