Semiconductor production system
By installing monitoring modules and bypass branches in the semiconductor production system, the problem of pipeline blockage caused by flammable, explosive and toxic gases is solved, achieving the effect of reducing maintenance costs and improving safety.
Patent Information
- Application Number
- CN202422801307.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-11-15
AI Technical Summary
During the semiconductor manufacturing process, flammable, explosive, toxic and corrosive gases can cause pipeline blockage and corrosion, affecting production stability and increasing maintenance costs and safety risks.
A monitoring module and a bypass branch are set on the main line. The monitoring module detects the gas flowing into the process equipment. The bypass branch directly introduces the gas into the exhaust gas treatment device when there is no gas flowing in, avoiding the gas from entering the process equipment and reducing the risk of blockage.
It reduces the blockage of main lines and process equipment, reduces maintenance costs and risks, and improves the flexibility and safety of semiconductor production systems.
Smart Images
Figure CN223360440U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of semiconductor manufacturing technology, and in particular relates to a semiconductor production system. Background Art
[0002] The semiconductor manufacturing process often utilizes and produces gases with flammable, explosive, toxic, and corrosive properties. Therefore, these gases are often treated by exhaust gas processors connected to industrial equipment to prevent them from being released directly into the atmosphere. However, when industrial equipment is idle, the characteristics of these gases often lead to pipe blockage or corrosion, resulting in gas leaks. This impacts the stability of the manufacturing process, increases maintenance costs, increases operational complexity, and reduces manufacturing safety. Utility Model Content
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor production system, which provides a bypass branch on the main line to detect whether gas is flowing into the process equipment in real time and optionally connect to the main line, so that when no gas is flowing into the process equipment, the gas flowing out of the gas supply device is directly flowed into the exhaust gas treatment device, which helps to reduce the possibility of blockage at the outlet of the main line and the gas supply device and the inlet of the process equipment, reduces maintenance costs and risks, and thus improves the flexibility and safety of the entire semiconductor production system.
[0004] In a first aspect, the present application provides a semiconductor production system, comprising:
[0005] A semiconductor production system, comprising:
[0006] A main pipeline, on which a gas supply device, process equipment and an exhaust gas treatment device are sequentially arranged;
[0007] a monitoring module, provided on the main pipe and located between the gas supply device and the process equipment, for detecting whether gas flows into the process equipment;
[0008] A bypass branch, one end of which is arranged between the outlet end of the air supply device and the inlet end of the process equipment, and the other end of which is connected to the inlet end of the exhaust gas treatment device. The bypass branch and the main line can be selectively connected.
[0009] According to the semiconductor production system of the present application, when the monitoring module detects that gas is flowing into the process equipment, the bypass branch and the main line are disconnected so that all the gas flowing out of the gas supply device enters the process equipment to ensure the normal operation of the process equipment; when the monitoring module detects that no gas is flowing into the process equipment, it means that the process equipment is in a state where gas is not needed or is under maintenance and failure, the bypass branch and the main line are connected so that the gas flowing out of the gas supply device can be directly guided to the exhaust gas treatment device without passing through the process equipment, which helps to reduce blockage of the main line and the outlet end of the gas supply device and the inlet end of the process equipment, reduce maintenance costs and maintenance risks, and thus improve the flexibility and safety of the entire semiconductor production system.
[0010] According to one embodiment of the present application, it further includes:
[0011] A first control valve is provided on the bypass branch and is communicatively connected to the monitoring module, and is used to connect or disconnect the bypass branch from the main line.
[0012] According to one embodiment of the present application, the first control valve is a pneumatic valve.
[0013] According to one embodiment of the present application, it further includes:
[0014] The first flow meter is arranged on the bypass branch. The first flow meter is arranged between the outlet end of the first control valve and the inlet end of the exhaust gas treatment device, and is used to adjust the flow rate of the gas flowing through the bypass branch.
[0015] According to one embodiment of the present application, the flow control range of the first flow meter is 0 to 500 sccm.
[0016] According to one embodiment of the present application, it further includes:
[0017] The second control valve is arranged on the bypass branch, and the second control valve is arranged between the outlet end of the first flow meter and the inlet end of the exhaust gas treatment device.
[0018] According to one embodiment of the present application, the second control valve is a pneumatic valve.
[0019] According to one embodiment of the present application, the monitoring module includes:
[0020] A flow sensor is provided between the connection point of the main line and the bypass branch and the inlet end of the process equipment.
[0021] According to one embodiment of the present application, the gas supply device includes:
[0022] Gas cylinders;
[0023] A pressure regulating valve, wherein the inlet end of the pressure regulating valve is connected to the outlet end of the gas cylinder, and the outlet end of the pressure regulating valve is connected to the inlet end of the process equipment.
[0024] According to one embodiment of the present application, the process equipment includes:
[0025] a process device, wherein the outlet end of the process device is connected to the inlet end of the exhaust gas treatment device;
[0026] A second flow meter, wherein the inlet end of the second flow meter is connected to the outlet end of the monitoring module, and the outlet end of the second flow meter is connected to the process device, and is used to adjust the flow rate of the gas flowing through the process device.
[0027] According to one embodiment of the present application, a plurality of the process equipment are provided, and the plurality of the process equipment are connected in parallel.
[0028] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0030] Figure 1 It is a structural schematic diagram of a semiconductor production system provided in an embodiment of the present application.
[0031] Reference numerals:
[0032] 100, main road;
[0033] 200, gas supply device; 210, gas cylinder; 220, pressure regulating valve;
[0034] 300, process equipment; 310, process device; 320, second flow meter;
[0035] 400. Waste gas treatment device;
[0036] 500, monitoring module;
[0037] 600, bypass branch;
[0038] 700, first control valve; 800, first flow meter; 900, second control valve. DETAILED DESCRIPTION
[0039] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.
[0040] Reference below Figure 1 The semiconductor production system provided by an embodiment of the present application is described. The semiconductor production system includes a main line 100 , a monitoring module 500 and a bypass branch line 600 .
[0041] The main pipeline 100 is sequentially provided with a gas supply device 200 , a process device 300 and an exhaust gas treatment device 400 .
[0042] It will be appreciated that the outlet of the gas supply device 200 is connected to the inlet of the process equipment 300, for supplying the required gas to the process equipment 300 so that the process equipment 300 can use the gas to produce the desired product. The outlet of the process equipment 300 is connected to the inlet of the exhaust gas treatment device 400, for producing the desired product based on the input gas and then outputting the resulting exhaust gas to the exhaust gas treatment device 400.
[0043] It should be noted that the gas includes, but is not limited to, diborane, which is commonly used in processes such as epitaxial growth, passivation, diffusion, and ion implantation of silicon and germanium. Process equipment 300 is used to perform specific processes in semiconductor manufacturing, such as CVDW (Chemical Vapor Deposition Tungsten) processes. Products include, but are not limited to, W thin film layers, that is, combining pyrolyzed diborane with WF6 (tungsten hexafluoride) to form a W thin film layer.
[0044] The monitoring module 500 is disposed on the main line 100 and located between the gas supply device 200 and the process equipment 300, and is used to detect whether gas flows into the process equipment 300. One end of the bypass branch 600 is disposed between the outlet of the gas supply device 200 and the inlet of the process equipment 300, and the other end of the bypass branch 600 is connected to the inlet of the exhaust gas treatment device 400. The bypass branch 600 and the main line 100 are selectively connected.
[0045] It should be noted that diborane naturally polymerizes from a gaseous state to a liquid higher-order borane at room temperature. If left in main conduit 100 for an extended period and unused, it transforms into a high-pressure, high-density gas that solidifies, accumulating in main conduit 100 and causing blockage. Furthermore, diborane's flammability, toxicity, and corrosive properties pose safety risks when replacing main conduit 100 and its components.
[0046] It can be understood that when the monitoring module 500 detects that gas is flowing into the process equipment 300, the bypass branch 600 and the main line 100 are disconnected so that all the gas flowing out of the gas supply device 200 enters the process equipment 300 to ensure the normal operation of the process equipment 300; when the monitoring module 500 detects that no gas is flowing into the process equipment 300, it means that the process equipment 300 is in a state where gas is not needed or is under maintenance and failure, the bypass branch 600 and the main line 100 are connected so that the gas flowing out of the gas supply device 200 can be directly guided to the exhaust gas treatment device 400 without passing through the process equipment 300, which helps to reduce blockage of the main line 100 and the outlet end of the gas supply device 200 and the inlet end of the process equipment 300, reduce maintenance costs and maintenance risks, and thus improve the flexibility and safety of the entire semiconductor production system.
[0047] According to the semiconductor production system provided in the embodiment of the present application, a real-time detection device for detecting whether gas flows into the process equipment 300 and a bypass branch 600 that can be optionally connected to the main line 100 are set on the main line 100, so that when no gas flows into the process equipment 300, the gas flowing out of the gas supply device 200 can flow directly into the exhaust gas treatment device 400, which helps to reduce blockage at the outlet end of the main line 100 and the gas supply device 200 and the inlet end of the process equipment 300, reduces maintenance costs and maintenance risks, and thus improves the flexibility and safety of the entire semiconductor production system.
[0048] In some embodiments, as Figure 1 As shown, the gas supply device 200 includes a gas cylinder 210 and a pressure regulating valve 220 , the inlet end of the pressure regulating valve 220 is connected to the outlet end of the gas cylinder 210 , and the outlet end of the pressure regulating valve 220 is connected to the inlet end of the process equipment 300 .
[0049] It should be noted that gas cylinder 210 is used to store supplied gas, ensuring safe storage of the gas under high pressure. Pressure regulating valve 220 is used to regulate the high-pressure gas in cylinder 210 to a low pressure suitable for use by process equipment 300, ensuring that the gas is supplied to process equipment 300 at a constant and appropriate pressure. Furthermore, pressure regulating valve 220 can also protect process equipment 300 from damage caused by excessive pressure. Specifically, if the pressure in the semiconductor production system exceeds a preset safety threshold, pressure regulating valve 220 can automatically reduce the gas flow rate or shut off the gas flow, thereby reducing the possibility of damage to process equipment 300 or safety accidents.
[0050] It can be understood that when the monitoring module 500 does not detect any gas flowing into the process equipment 300, the gas flowing out of the pressure regulating valve 220 can flow directly into the exhaust gas treatment device 400 through the bypass branch 600, thereby reducing the possibility of the pressure regulating valve 220 being blocked and out of control due to crystallization caused by the gas staying at the pressure regulating valve 220.
[0051] In some embodiments, as Figure 1 As shown, the process equipment 300 includes a process device 310 and a second flow meter 320, the outlet end of the process device 310 is connected to the inlet end of the exhaust gas treatment device 400; the inlet end of the second flow meter 320 is connected to the outlet end of the monitoring module 500, and the outlet end of the second flow meter 320 is connected to the process device 310, for adjusting the flow rate of the gas flowing through the process device 310.
[0052] It can be understood that the gas cylinder 210, the pressure regulating valve 220, the monitoring module 500, the second flow meter 320, the process device 310 and the exhaust gas treatment device 400 are arranged in sequence on the main line 100, so that the second flow meter 320 can be used to adjust the flow rate flowing into the process device 310 and the opening or closing of the gas according to production requirements and the real-time detection of the monitoring module 500, so as to ensure that the process device 310 has appropriate gas supply when it is in working state, and reduce the gas staying in the main line 100 between the second flow meter 320 and the process device 310 in the idle state, thereby improving the reliability of the use of the process equipment 300 and the safety of the entire semiconductor production system.
[0053] In some embodiments, multiple process equipment 300 are provided, and the multiple process equipment 300 are connected in parallel. That is, each process device 310 can independently receive gas flowing from the pressure regulating valve 220 and is connected to the same exhaust gas treatment device 400, thereby improving production flexibility and scalability. It should be noted that the number of industrial equipment 300 and the actual process steps implemented can be designed according to actual needs and are not specifically limited in this embodiment.
[0054] In some embodiments, as Figure 1 As shown, the semiconductor production system further includes a first control valve 700 , which is disposed on the bypass branch 600 and is in communication with the monitoring module 500 , for connecting or disconnecting the bypass branch 600 from the main line 100 .
[0055] It can be understood that the first control valve 700 is arranged on the bypass branch 600 and is located between the outlet end of the pressure regulating valve 220 and the inlet end of the exhaust gas treatment device 400, that is, the first control valve 700 receives the detection signal from the monitoring module 500 (gas flows into the process equipment 300 or no gas flows into the process equipment 300) to open or close according to the actual situation of the gas flow, thereby realizing the connection or cutoff of the bypass branch 600 and the main line 100.
[0056] In some embodiments, as Figure 1 As shown, the first control valve 700 is a pneumatic valve.
[0057] It is understandable that, considering the flammable, toxic and corrosive properties of gas, the first control valve 700 can be remotely controlled by a pneumatic actuator, thereby eliminating the need for direct contact with harmful gases, improving operational safety, and being suitable for working in harsh environments. It also has a relatively simple structure, strong adaptability and low maintenance costs.
[0058] In some embodiments, as Figure 1 As shown, the semiconductor production system also includes a first flow meter 800, which is arranged on the bypass branch 600. The first flow meter 800 is arranged between the outlet end of the first control valve 700 and the inlet end of the exhaust gas treatment device 400, and is used to adjust the flow rate of the gas flowing through the bypass branch 600.
[0059] It can be understood that the first flow meter 800 is installed on the bypass branch 600, located between the outlet end of the first control valve 700 and the inlet end of the exhaust gas treatment device 400, and is used to adjust and measure the gas flow flowing through the bypass branch 600, which helps to balance the flow between the main gas path and the bypass path, ensure that the gas can be properly diverted and adjusted when it does not need to enter the process equipment 300, and optimize the efficiency of the entire system.
[0060] In some embodiments, as Figure 1 As shown, the flow control range of the first flowmeter 800 is 0 to 500 sccm, so that the first flowmeter 800 can accurately control the gas flow flowing through the bypass branch 600, so as to achieve gas flow adjustment from complete closure (0 sccm) to maximum flow (500 sccm), thereby improving the accuracy and reliability of the gas flow control of the entire bypass branch 600.
[0061] In some embodiments, as Figure 1 As shown, the semiconductor production system further includes a second control valve 900 , which is disposed on the bypass branch 600 . The second control valve 900 is disposed between the outlet of the first flowmeter 800 and the inlet of the exhaust gas treatment device 400 .
[0062] It is understandable that, considering that when the first control valve 700 is closed, there is gas remaining in the bypass branch 600 between the first control valve 700 and the first flowmeter 800 and in the first flowmeter 800, in order to ensure that the first flowmeter 800 and the second control valve 900 are closed after all the gas flows into the exhaust gas treatment device 400, the possibility of blockage and loss of control of the bypass branch 600 and the first flowmeter 800 is reduced.
[0063] In some embodiments, as Figure 1 As shown, the second control valve 900 is a pneumatic valve.
[0064] It is understandable that, considering the flammable, toxic and corrosive properties of gas, the second control valve 900 can be remotely controlled by a pneumatic actuator, thereby eliminating the need for direct contact with harmful gases, improving operational safety, and being suitable for working in harsh environments. It has a relatively simple structure, strong adaptability and low maintenance costs.
[0065] In some embodiments, as Figure 1 As shown, the monitoring module 500 includes a flow sensor, which is disposed between the connection point of the main line 100 and the bypass branch 600 and the inlet end of the process equipment 300. The flow sensor includes, but is not limited to, a mechanical flow switch, an ultrasonic flow switch, an electromagnetic flow switch, a turbine flow switch, a photoelectric flow switch, a capacitive flow switch, a differential pressure flow switch, or a fluid dynamic pressure flow switch.
[0066] It can be understood that by setting the flow sensor at the connection between the main line 100 and the bypass branch 600 and the second flow meter 320, it is possible to accurately determine whether gas flows into the second flow meter 320, thereby achieving accurate real-time detection of the main line 100 and ensuring the safety and reliability of the entire semiconductor production system.
[0067] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.
[0068] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0069] In the description of this application, "first feature" and "second feature" may include one or more of the features.
[0070] In the description of this application, “plurality” means two or more.
[0071] In the description of the present application, a first feature being “on” or “under” a second feature may include the first and second features being in direct contact with each other, or the first and second features being in contact with each other not directly but via another feature therebetween.
[0072] In the description of this application, a first feature “on”, “above” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
[0073] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
[0074] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.
Claims
1. A semiconductor production system, characterized in that: include: A main pipeline, on which a gas supply device, process equipment and an exhaust gas treatment device are sequentially arranged; a monitoring module, provided on the main pipe and located between the gas supply device and the process equipment, for detecting whether gas flows into the process equipment; A bypass branch, one end of which is arranged between the outlet end of the air supply device and the inlet end of the process equipment, and the other end of which is connected to the inlet end of the exhaust gas treatment device. The bypass branch and the main line can be selectively connected.
2. The semiconductor production system according to claim 1, wherein Also includes: A first control valve is provided on the bypass branch and is communicatively connected to the monitoring module, and is used to connect or disconnect the bypass branch from the main line.
3. The semiconductor production system according to claim 2, wherein: The first control valve is a pneumatic valve.
4. The semiconductor production system according to claim 2, wherein: Also includes: The first flow meter is arranged on the bypass branch. The first flow meter is arranged between the outlet end of the first control valve and the inlet end of the exhaust gas treatment device, and is used to adjust the flow rate of the gas flowing through the bypass branch.
5. The semiconductor production system according to claim 4, wherein: The flow rate control range of the first flow meter is 0 to 500 sccm.
6. The semiconductor production system according to claim 4, wherein: Also includes: The second control valve is arranged on the bypass branch, and the second control valve is arranged between the outlet end of the first flow meter and the inlet end of the exhaust gas treatment device.
7. The semiconductor production system according to claim 6, wherein: The second control valve is a pneumatic valve.
8. The semiconductor production system according to any one of claims 1 to 7, characterized in that: The monitoring module includes: A flow sensor is provided between the connection point of the main line and the bypass branch and the inlet end of the process equipment.
9. The semiconductor production system according to any one of claims 1 to 7, characterized in that: The air supply device comprises: Gas cylinders; A pressure regulating valve, wherein the inlet end of the pressure regulating valve is connected to the outlet end of the gas cylinder, and the outlet end of the pressure regulating valve is connected to the inlet end of the process equipment.
10. The semiconductor production system according to any one of claims 1 to 7, characterized in that: The process equipment includes: a process device, wherein the outlet end of the process device is connected to the inlet end of the exhaust gas treatment device; A second flow meter, wherein the inlet end of the second flow meter is connected to the outlet end of the monitoring module, and the outlet end of the second flow meter is connected to the process device, and is used to adjust the flow rate of the gas flowing through the process device.
11. The semiconductor production system according to any one of claims 1 to 7, characterized in that: There are multiple process equipments, and the multiple process equipments are connected in parallel.