Aging test device and system for power amplifier module

Abstract

The utility model relates to the technical field of wireless communication equipment testing, and discloses a power amplifier module aging test device and system, and the device comprises a switching power supply module, a multipath voltage reduction module, and a switching control module. The switching power supply module is used for outputting a first voltage to the multi-path voltage reduction module and the switching control module; the switching power supply module is configured to output the first voltage to the power amplifier module; the multi-path voltage reduction module is used for outputting a second voltage and a third voltage, and the multi-path voltage reduction module is configured to output the second voltage to the power amplifier module; level input pins of the switch control module are used for receiving a third voltage, and level output pins are configured to be connected with a plurality of enabling pins of the power amplifier module in a one-to-one correspondence manner; and the switch control module is used for inputting the third voltage to the corresponding enabling pin, so that a circuit of a radio frequency channel corresponding to the enabling pin receiving the third voltage in the power amplifier module works. Through the mode, the structure can be simplified, and the test cost can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of wireless communication equipment testing, and in particular to a power amplifier module aging testing device and system. Background Art

[0002] In the field of radio frequency communications, power amplifier modules amplify radio frequency signals to enhance transmitted signal strength. A power amplifier module typically has multiple radio frequency channels in different frequency bands. Before being assembled into a complete device, each channel undergoes a power-on burn-in test to detect substandard products, such as defective products with damaged circuits and products at risk of component damage from long-term continuous operation.

[0003] The existing technology implements aging testing of power amplifier modules through a detection system that integrates a large number of electronic components such as a controller, voltage transformer, current transformer, etc. Such a system has problems such as complex structure and high testing cost. Utility Model Content

[0004] In view of the above problems, an embodiment of the present application provides an aging test device for a power amplifier module, which can simplify the structure and reduce the testing cost.

[0005] According to one aspect of an embodiment of the present application, a power amplifier module aging test device is provided, comprising: a switching power supply module, a multi-channel buck module and a switch control module electrically connected to each other; the switching power supply module is used to output a first voltage to the multi-channel buck module and the switch control module respectively, so as to supply power to the switch control module; the switching power supply module is configured to be electrically connected to the power amplifier module to be aging tested, so as to output the first voltage to the power amplifier module; the multi-channel buck module is used to output a second voltage and a third voltage with different voltage values ​​after stepping down the input first voltage, and the multi-channel buck module is configured to be electrically connected to the power amplifier module, so as to output the second voltage to the power amplifier module. Module; the switch control module has multiple groups of one-to-one corresponding level input pins and level output pins, the level input pins in each group are used to receive the third voltage, and the level output pins in the multiple groups are configured to be connected one-to-one with multiple enable pins of the power amplifier module; the switch control module is used to control the level input pins and the level output pins in each group to be turned on, so that the third voltage is input to the corresponding enable pin, the enable pin receiving the third voltage in the power amplifier module is at a high level, and then the circuit of the RF channel corresponding to the enable pin receiving the third voltage in the power amplifier module is operated, and the power amplifier module outputs the RF signal of the corresponding frequency band for aging testing.

[0006] In an optional embodiment, the power amplifier module aging test device also includes multiple attenuators, which are configured to be connected one-to-one to ports of multiple different frequency bands on the power amplifier module through RF lines, and the attenuators are used to attenuate the RF signals output by the corresponding ports.

[0007] In an optional manner, the power amplifier module aging test device also includes a heat dissipation module, which is electrically connected to the multi-channel step-down module; the multi-channel step-down module is also used to output a fourth voltage to the heat dissipation module to power the heat dissipation module, and the heat dissipation module is used to dissipate heat for the attenuator and / or power amplifier module.

[0008] In an optional manner, the switch control module is a switch card having a data transmission pin for connecting to a host computer. The switch card is used to control the conduction of the level input pin and the level output pin in each group respectively under the triggering of the host computer.

[0009] In an optional manner, the switch card is an ART switch card, and a data transmission pin of the ART switch card is connected to a host computer via a USB to RS485 data cable.

[0010] In an optional manner, the switching power supply module is used to output a first voltage after receiving the mains power and reducing the voltage.

[0011] In an optional manner, the switch control module is used to cyclically control the level input pin and the level output pin in each group to be turned on for a preset number of times, and each time the conduction lasts for a preset time.

[0012] In an optional embodiment, the power amplifier module aging test device also includes a base, the base has a accommodating cavity, the switching power supply module, the multi-channel step-down module and the switch control module are all arranged in the accommodating cavity, and an installation position is provided on the base, which is used to install the power amplifier module to be aged tested.

[0013] In an optional manner, the power amplifier module aging test device also includes multiple attenuators, which are configured to be connected one-to-one with multiple ports of different frequency bands on the power amplifier module through radio frequency lines, and the attenuators are used to attenuate the radio frequency signals output by the corresponding ports; the power amplifier module aging test device also includes a heat dissipation module, which is electrically connected to the multi-channel step-down module; the multi-channel step-down module is also used to output a fourth voltage to the heat dissipation module, whose voltage value is different from the second voltage and the third voltage, to power the heat dissipation module; the attenuator is arranged on the base, and the heat dissipation module is a fan arranged on at least one side of the attenuator, and the fan is used to drive gas to flow through the attenuator to dissipate heat from the attenuator.

[0014] According to another aspect of an embodiment of the present application, a power amplifier module aging test system is provided, comprising a host computer, a signal generator, and the power amplifier module aging test device described in any of the above items. The host computer is signal-connected to a switch control module to trigger the switch control module to respectively control the conduction of the level input pin and the level output pin in each group. The signal generator is configured to be connected to the power amplifier module to be aged to provide an initial RF signal to the power amplifier module.

[0015] In the power amplifier module aging test device provided in the embodiment of the present application, the power amplifier module is subjected to aging test by adopting a switching power supply module, a multi-channel step-down module and a switch control module as the main test devices, so as to achieve the purpose of simplifying the structure and reducing costs. Specifically, by conducting corresponding research and design on the form of electrical connection between the switching power supply module, the multi-channel step-down module and the switch control module, as well as the form of electrical connection between them and the power amplifier module, it is possible to provide the required operating voltage for all components on the basis of simplifying the structure and reducing costs, and then control the circuit of each RF channel in the power amplifier module to operate through the switch control module, thereby realizing aging test of each RF channel in the power amplifier module.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0018] Figure 1 A schematic diagram of the modular circuit structure of the power amplifier module aging test device provided by an embodiment of the present utility model;

[0019] Figure 2 A schematic diagram of the circuit structure of a power amplifier module aging test device provided by an embodiment of the present utility model;

[0020] Figure 3 A schematic structural diagram of a power amplifier module aging test device from one perspective provided by an embodiment of the present utility model;

[0021] Figure 4 This is a structural schematic diagram of the power amplifier module aging test device provided by an embodiment of the present utility model from another perspective.

[0022] The accompanying drawings in the specific implementation manner are as follows:

[0023] 100. Power amplifier module aging test device; 110. Switching power supply module; 120. Multi-channel step-down module; 130. Switch control module; 140. USB to RS485 data cable; 150. Attenuator; 160. Heat dissipation module; 161. Fan; 170. Base; 171. Accommodation cavity; 172. Mounting position;

[0024] 200, power amplifier module; 300, signal generator; 400, host computer;

[0025] 500. Power amplifier module aging test system. DETAILED DESCRIPTION

[0026] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0028] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0029] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0031] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0032] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0033] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0034] In response to the problems of complex structure and high cost of current power amplifier module testing devices, this application designs a power amplifier module aging testing device and system based on the research and analysis of the power amplifier module aging test principles. While meeting the basic requirements of power amplifier module aging testing, it has the characteristics of simple structure and low cost.

[0035] According to one aspect of the embodiment of the present application, a power amplifier module aging test device is provided. Figure 1 The figure shows the circuit structure of a power amplifier module aging test device. As shown in the figure, the power amplifier module aging test device 100 includes a switching power supply module 110, a multi-channel buck module 120, and a switch control module 130, which are electrically connected to each other. The switching power supply module 110 is configured to output a first voltage V1 to the multi-channel buck module 120 and the switch control module 130, respectively, to supply power to the switch control module 130. The switching power supply module 110 is configured to be electrically connected to the power amplifier module 200 to be tested for aging, and output the first voltage V1 to the power amplifier module 200. The multi-channel buck module 120 is configured to step down the input first voltage V1 and output a second voltage V2 and a third voltage V3 of different voltage values. The multi-channel buck module 120 is configured to be connected to the power amplifier module 200 to output the second voltage V2 to the power amplifier module 200. The first voltage V1 and the second voltage V2 provided by the switching power supply module 110 and the multi-channel buck module 120 to the power amplifier module 200 are respectively used to provide corresponding operating voltages to the circuit parts corresponding to the RF channels of different frequency bands in the power amplifier module 200.

[0036] The switch control module 130 has multiple sets of corresponding level input pins and level output pins. The figure uses three sets as an example: I1-O1, I2-O2, and I3-O3. The level input pins I1-I3 in each set are each configured to receive a third voltage V3, and the level output pins O1-O3 in the multiple sets are configured to correspond one-to-one with the multiple enable pins SW_1-SW_3 of the power amplifier module 200. The switch control module 130 is configured to control the level input pins and level output pins in each set to conduct, allowing the third voltage V3 to be input to the corresponding enable pin. The enable pin of the power amplifier module 200 that receives the third voltage is at a high level, thereby activating the circuit of the RF channel in the power amplifier module 200 corresponding to the enable pin receiving the third voltage. The power amplifier module 200 outputs an RF signal in the corresponding frequency band for burn-in testing.

[0037] It is understandable that if Figure 1 As shown in , when the power amplifier module 200 outputs the RF signal of the corresponding frequency band for aging test, an external signal generator 300 is required to provide the initial RF signal to the power amplifier module 200. When the power amplifier module 200 is working, the power of the initial RF signal is amplified and then output.

[0038] In order to ensure the effectiveness of the aging test, the switch control module 130 can be used to cyclically control the level input pin and the level output pin in each group to be turned on for a preset number of times, and each time the conduction lasts for a preset time. Taking the example of cyclically controlling the level input pin and the level output pin in each group to be turned on 20 times, each time for 3 minutes, the specific test process is as follows: the switch control module 130 first controls the level input pin I1 and the level output pin O1 to be turned on, and the third voltage V3 is input to the enable pin SW_1 via the level input pin I1 and the level output pin O1. The enable pin SW_1 is at a high level. At this time, the power amplifier module 200 works and outputs the radio frequency signal RF_1 of the first frequency band. After this process lasts for 3 minutes, the switch control module 130 controls the level input pin I1 and the level output pin O1 to be turned off, and controls the level input pin I2 and the level output pin O2 to be turned on. The third voltage V3 is input to the enable pin SW_2 via the level input pin I2 and the level output pin O2. Enable pin SW_2 is at a high level, causing the power amplifier module 200 to operate and output the RF signal RF_2 in the second frequency band. This process also continues for 3 minutes. The switch control module 130 then controls the level input pin I2 and the level output pin O2 to be turned off, and controls the level input pin I3 and the level output pin O3 to be turned on. The third voltage V3 is input to the enable pin SW_3 via the level input pin I3 and the level output pin O3. Enable pin SW_3 is at a high level, causing the power amplifier module 200 to operate and output the RF signal RF_3 in the third frequency band. The above steps are then repeated 20 times to complete the burn-in test of the power amplifier module 200. After the test is completed, if the power amplifier module 200 no longer operates normally, it indicates that its internal components are damaged. Practical research has shown that this testing method can effectively detect faulty and risky products in the power amplifier module 200.

[0039] It should be noted that the test process provided above is only an implementation method provided in this application, and it does not constitute a limitation on the specific test scheme. For example, it can also be cycled 5 times, 10 times or more, each time lasting 1 minute, 2 minutes, 5 minutes, etc.

[0040] In summary, in the power amplifier module aging test device 100 provided in the embodiment of the present application, the power amplifier module 200 is subjected to aging test by adopting the switching power supply module 110, the multi-channel buck module 120 and the switch control module 130 as the main test devices, so as to achieve the purpose of simplifying the structure and reducing costs. Specifically, by conducting corresponding research and design on the form of electrical connection between the switching power supply module 110, the multi-channel buck module 120 and the switch control module 130 and the form of electrical connection between them and the power amplifier module 200, it is possible to provide the required operating voltage for all components on the basis of simplifying the structure and reducing costs, and then control the circuit of each RF channel in the power amplifier module 200 to operate through the switch control module 130, thereby realizing aging test of each RF channel in the power amplifier module 200.

[0041] Specifically, the switching power supply module 110 may include a battery, so that the switching power supply module 110 itself can directly provide the first voltage V1 to the multi-channel buck module 120, the switch control module 130, and the power amplifier module 200. Of course, the switching power supply module 110 can also use an external power supply to provide the first voltage V1 to the multi-channel buck module 120, the switch control module 130, and the power amplifier module 200. For example, the switching power supply module 110 can be used to connect to the mains power and step down the voltage, and then output the first voltage V1 to the multi-channel buck module 120, the switch control module 130, and the power amplifier module 200.

[0042] The switch control module 130 can employ a simple switch control circuit or a switch card integrated with electronic components such as multiplexers and relays. It should be noted that in the embodiments of the present application, the switch control module 130 controls the conduction between the level input pins and the level output pins, and does not involve improvements to the computer program. Regarding the solution using a switch card, the present application proposes an implementation method. Specifically, the switch card has data transmission pins for connecting to a host computer (e.g., a terminal device such as a mobile phone, tablet computer, computer, or server). The switch card is used to control the conduction between the level input pins and the level output pins in each group when triggered by the host computer.

[0043] See also Figure 2The figure shows the circuit structure of a power amplifier module aging test device provided by another embodiment of the present application. In this embodiment, the switching power supply module 110 adopts a 220V to 32V switching power supply, and the switch control module 130 adopts an ART switch card. The switching power supply module 110 is used to connect to the 220V mains (L, N, ground) through the switch Switch-1, and after stepping down the 220V voltage, output two 32V first voltages. One of the first voltages is connected to the VIN pin of the multi-channel step-down module 120 through the switch Switch-2. It is also used to connect to the power amplifier module 200 to be aged through the switch Switch-2 to provide a 32V operating voltage to the power amplifier module 200. The other first voltage is connected to the +Vs pin of the switch control module 130 to supply power to the switch control module 130.

[0044] The multi-channel step-down module 120 outputs a 28V second voltage to the power amplifier module 200, providing a 28V operating voltage for the module. The multi-channel step-down module 120 also outputs a 3.3V third voltage to the multiple level input pins RL1COM, RL2COM, and RL3COM of the switch control module 130. The multiple level output pins RL1NO, RL2NO, and RL3NO of the switch control module 130 are connected to the three enable pins SW_SUBS, SW_C, and SW_S of the power amplifier module 200. SW_SUBS corresponds to the 0.4-2GHz RF channel, SW_C corresponds to the 4-6GHz RF channel, and SW_S corresponds to the 2-4GHz RF channel. A signal generator 300 is also connected to the power amplifier module 200.

[0045] The data transmission pins DATA+ and DATA- of the switch control module 130 (i.e., the ART switch card) are connected to the host computer 400 through the USB to RS485 data line 140. Specifically, the data transmission pin DATA+ of the switch control module 130 is connected to the T / R+ of the USB to RS485 data line 140, and the data transmission pin DATA- of the switch control module 130 is connected to the T / R- of the USB to RS485 data line 140. The USB to RS485 data line 140 is connected to the host computer 400 through the USB interface.

[0046] like Figure 2 As shown in , considering that during the aging test, the RF signal strength output by the power amplifier module 200 is relatively high and easily affects the test environment, based on this, in this embodiment, the power amplifier module aging test device 100 may further include a plurality of attenuators 150, and the plurality of attenuators 150 are configured to be connected one-to-one with ports of multiple different frequency bands on the power amplifier module 200 through RF lines. The attenuators 150 are used to attenuate the RF signals output by the corresponding ports so as to reduce the strength of the final output RF signal to a safe range.

[0047] Furthermore, considering that the attenuator 150 generates a lot of heat during operation, in order to dissipate the heat of the attenuator 150 in a timely manner, as shown in FIG. Figure 2 As shown in , the power amplifier module aging test device 100 may further include a heat dissipation module 160 (e.g., a fan, a liquid cooling heat sink, etc.), which is connected to the multi-channel buck module 120. The multi-channel buck module 120 is also configured to output a fourth voltage of 12V to the heat dissipation module 160 to power the heat dissipation module 160, which is configured to dissipate heat from the attenuator 150. Of course, in other embodiments, the heat dissipation module 160 may also be configured to dissipate heat from the power amplifier module 200.

[0048] Figure 2 The steps of the aging test of the specific embodiment shown are as follows:

[0049] First, the switch Switch- 1 is closed, and then the switch Switch- 2 is closed. At this time, the switching power supply module 110 , the multi-channel buck module 120 , the switch control module 130 and the heat dissipation module 160 are all powered on and working.

[0050] Step 1: The host computer 400 sends a signal to the level input pin RL1COM, and the level input pin RL1COM and the level output pin RL1NO are connected. The third voltage of 3.3V is output to the enable pin SW_SUBS of the power amplifier module 200 through the switch control module 130. The enable pin SW_SUBS is at a high level, and the circuit of the 0.4-2G RF channel inside the power amplifier module 200 starts to work. The RF signal RF_1 of the corresponding frequency band is attenuated by the attenuator 150 and then output. This process lasts for 3 minutes.

[0051] Step 2: The host computer 400 sends a signal to the level input pin RL2COM. The level input pin RL2COM and the level output pin RL2NO are connected, and the enable pin SW_C is at a high level. The circuit of the 4-6G RF channel inside the power amplifier module 200 starts to work, and the RF signal RF_2 of the corresponding frequency band is attenuated by the attenuator 150 and then output. This process also lasts for 3 minutes.

[0052] Step 3: The host computer 400 sends a signal to the level input pin RL3COM, the level input pin RL3COM and the level output pin RL3NO are connected, the enable pin SW_S is at a high level, and the circuit of the 2-4G RF channel inside the power amplifier module 200 starts to work. The RF signal RF_3 of the corresponding frequency band is attenuated by the attenuator 150 and then output. This process also lasts for 3 minutes.

[0053] Steps 1 to 3 are repeated 20 times to complete the aging test of the power amplifier module 200 .

[0054] It should be noted that Figure 2 In the specific embodiment shown, the specific product model used by each module and the specific value of each voltage are only an example provided by this application, which does not constitute a limitation on the specific implementation method of the power amplifier module aging test device 100.

[0055] The above is a description of the relevant circuit structure of the power amplifier module aging test device 100 provided in the embodiment of the present application. Regarding the specific product structure of the power amplifier module aging test device 100, the present application also proposes an implementation method, please refer to Figure 3 The figure shows the three-dimensional structure of a power amplifier module aging test device 100. As shown in the figure, the power amplifier module aging test device 100 also includes a base 170. The base 170 has a receiving cavity 171. The switching power supply module 110, the multi-channel step-down module 120, and the switch control module 130 are all disposed within the receiving cavity 171. The base 170 protects the switching power supply module 110, the multi-channel step-down module 120, and the switch control module 130, ensuring a stable and reliable working environment. The base 170 is provided with a mounting position 172 for mounting the power amplifier module 200 to be tested for aging.

[0056] Furthermore, for the embodiment mentioned above in which the attenuator 150 and the heat dissipation module 160 are provided, Figure 4 As shown in another perspective, the attenuator 150 can be set on the base 170, and the heat dissipation module 160 is a fan 161 set on at least one side of the attenuator 150. The fan 161 is used to drive air flow through the attenuator 150 to dissipate heat for the attenuator 150.

[0057] Specifically, the fan 161 can be as follows Figure 4 The number of fans 161 shown in FIG is equal to the number of attenuators 150, and they are arranged one-to-one on one side of the attenuator 150. Of course, in other embodiments, a larger number of fans 161 can be used and respectively arranged on both sides of each attenuator 150, with one side for extracting air and the other side for exhausting air, so as to achieve more efficient heat dissipation of the attenuator 150.

[0058] According to another aspect of the embodiment of the present application, a power amplifier module aging test system is also provided. Figure 2 As shown in the figure, the power amplifier module aging test system 500 includes a host computer 400, a signal generator 300 and the power amplifier module aging test device 100 provided in any of the above embodiments. The host computer 400 is signal-connected to the switch control module 130 to trigger the switch control module 130 to control the level input pin and the level output pin in each group to be turned on. The signal generator 300 is configured to be connected to the power amplifier module 200 to be aged to provide an initial RF signal to the power amplifier module 200.

[0059] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they may modify the technical solutions described in the above embodiments or replace some or all of the technical features therein with equivalents. Such modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the technical solutions of the embodiments of this application. In particular, the various technical features described in the various embodiments may be combined in any manner, as long as there are no structural conflicts.

Claims

1. A power amplifier module aging test device, characterized in that: include: A switching power supply module, a multi-channel step-down module and a switch control module electrically connected to each other; The switching power supply module is used to output a first voltage to the multi-channel buck module and the switch control module respectively, so as to supply power to the switch control module; The switching power supply module is configured to be electrically connected to the power amplifier module to be subjected to the aging test, so as to output the first voltage to the power amplifier module; The multi-channel buck module is used to output a second voltage and a third voltage with different voltage values ​​after stepping down the input first voltage. The multi-channel buck module is configured to be electrically connected to the power amplifier module to output the second voltage to the power amplifier module; The switch control module has multiple groups of one-to-one corresponding level input pins and level output pins, the level input pins in each group are used to receive the third voltage, and the level output pins in the multiple groups are configured to be connected to the multiple enable pins of the power amplifier module in a one-to-one correspondence; The switch control module is used to control the level input pin and the level output pin in each group to be turned on, so that the third voltage is input to the corresponding enable pin, and the enable pin in the power amplifier module that receives the third voltage is at a high level, thereby enabling the circuit of the RF channel in the power amplifier module corresponding to the enable pin that receives the third voltage to operate, and the power amplifier module outputs the RF signal of the corresponding frequency band for aging testing.

2. The power amplifier module aging test device according to claim 1, characterized in that: The power amplifier module aging test device also includes multiple attenuators, which are configured to be connected one-to-one with multiple ports of different frequency bands on the power amplifier module through radio frequency lines. The attenuators are used to attenuate the radio frequency signals output by the corresponding ports.

3. The power amplifier module aging test device according to claim 2, characterized in that: The power amplifier module aging test device further includes a heat dissipation module, which is electrically connected to the multi-channel step-down module; The multi-channel buck module is further configured to output a fourth voltage to the heat dissipation module to supply power to the heat dissipation module, and the heat dissipation module is configured to dissipate heat from the attenuator and / or the power amplifier module.

4. The power amplifier module aging test device according to claim 1, characterized in that: The switch control module is a switch card having a data transmission pin for connecting to a host computer. The switch card is used to control the level input pin and the level output pin in each group to be turned on respectively under the triggering of the host computer.

5. The power amplifier module aging test device according to claim 4, characterized in that: The switch card is an ART switch card, and a data transmission pin of the ART switch card is connected to the host computer via a USB to RS485 data cable.

6. The power amplifier module aging test device according to claim 1, characterized in that: The switching power supply module is used to output the first voltage after receiving the mains power and reducing the voltage.

7. The power amplifier module aging test device according to claim 1, characterized in that: The switch control module is used to cyclically control the level input pins and the level output pins in each group to be turned on for a preset number of times, and each time the conduction lasts for a preset time.

8. The power amplifier module aging test device according to any one of claims 1 to 7, characterized in that: The power amplifier module aging test device also includes a base, which has a accommodating cavity. The switching power supply module, the multi-channel step-down module and the switch control module are all arranged in the accommodating cavity. The base is provided with an installation position, which is used to install the power amplifier module to be aging tested.

9. The power amplifier module aging test device according to claim 8, characterized in that: The power amplifier module aging test device further includes a plurality of attenuators, which are configured to be connected to a plurality of ports of different frequency bands on the power amplifier module via radio frequency lines in a one-to-one correspondence, and the attenuators are used to attenuate the radio frequency signals output by the corresponding ports; the power amplifier module aging test device further includes a heat dissipation module, which is electrically connected to the multi-channel buck module; the multi-channel buck module is further used to output a fourth voltage to the heat dissipation module, the voltage value of which is different from the second voltage and the third voltage, to power the heat dissipation module; The attenuator is arranged on the base, and the heat dissipation module is a fan arranged on at least one side of the attenuator. The fan is used to drive air to flow through the attenuator to dissipate heat from the attenuator.

10. A power amplifier module aging test system, characterized in that: The device comprises a host computer, a signal generator, and a power amplifier module aging test device according to any one of claims 1 to 9, wherein the host computer is connected to the switch control module signal to trigger the switch control module to respectively control the level input pin and the level output pin in each group to be turned on, and the signal generator is configured to be connected to the power amplifier module to be aged to provide an initial RF signal to the power amplifier module.

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