Test platform

Abstract

The embodiment of the utility model provides a test platform. The testing platform comprises a heat preservation shell, a device testing clamp and a device fixing clamp. The heat preservation shell is provided with a containing cavity, the device testing clamp is used for installing an optical device, and the device testing clamp is arranged in the containing cavity. The heat preservation shell is provided with a connecting area, the connecting area is provided with a plurality of connecting positions, and the device fixing clamp is selectively connected with one of the connecting positions so as to fix the device testing clamp. The test platform is convenient to use.

Description

Technical Field

[0001] The present application relates to the technical field of optical device testing, and in particular to a testing platform. Background Art

[0002] During optical device testing, the optical device needs to be fixed with a fixture to stabilize the optical device structure, thereby achieving the purpose of test accuracy and stability.

[0003] In the related art, high and low temperature testing of optical devices requires testing multiple optical device products. However, due to the different structures of different optical devices, independent fixtures must be used to match each optical device. This means that multiple different fixtures must be matched to the optical devices, which is not compatible and has poor versatility, making the use of the related art test platform more complicated. Summary of the Invention

[0004] In view of this, the main purpose of the embodiments of the present application is to provide a testing platform that is easy to use.

[0005] To achieve the above objectives, the technical solution of the embodiment of the present application is implemented as follows:

[0006] The present invention provides a test platform, including:

[0007] A heat-insulating shell having a receiving cavity;

[0008] A device test fixture, the device test fixture is used to install an optical device, and the device test fixture is arranged in the accommodating cavity;

[0009] The device fixing fixture is provided with a heat-insulating shell having a connection area, the connection area having a plurality of connection positions, and the device fixing fixture can be selectively connected to one of the connection positions to fix the device test fixture.

[0010] In one embodiment, the connection position has a first fastening hole, and the device fixing fixture has a second fastening hole. The device fixing fixture can be selectively connected to one of the connection positions, and the second fastening hole is connected to the corresponding first fastening hole and is fastened by a fastener.

[0011] In one embodiment, at least one of the first fastening hole and the second fastening hole is a waist-shaped hole.

[0012] In one embodiment, the thermal insulation housing has two connection areas, the two connection areas are respectively located on opposite sides of the device test fixture along a first direction, and the connection positions of the connection areas are spaced apart along a second direction, and the first direction is perpendicular to the second direction;

[0013] The device fixing fixture extends along the first direction, and two opposite ends of the device fixing fixture along the first direction are respectively connected to the connection areas in a one-to-one correspondence.

[0014] In one embodiment, the device fixing fixture includes a fixing piece and a fixing portion located on the top side of the device test fixture, the fixing portion has a fixing hole, the fixing piece can be movably inserted into the fixing hole, and the fixing piece fixes the device test fixture by pressing against the top surface of the device test fixture.

[0015] In one embodiment, the test platform includes a refrigeration assembly, which includes a metal plate, a refrigerator and a water-cooled plate. The bottom of the accommodating cavity is open to form a bottom opening. The water-cooled plate is arranged at the bottom opening. The refrigerator is arranged on the water-cooled plate and is located at the bottom of the device test fixture. The metal plate is arranged between the device test fixture and the refrigerator.

[0016] In one embodiment, the test platform also includes a crimping fixture and a support frame, the support frame is used to install a circuit board, one end of the FPC of the optical device extends out of the accommodating cavity to fit with the circuit board, and the clamping fixture includes a crimping portion, which is pressed at the fitting point between the FPC and the circuit board.

[0017] In one embodiment, the crimping clamp includes a mounting plate and two connecting frames, the two connecting frames are spaced apart along a first direction, the thermal insulation shell is arranged at the interval between the two connecting frames, the mounting plate is respectively connected to the top ends of the two connecting frames, and the crimping part is arranged on the mounting plate.

[0018] In one embodiment, the crimping portion includes a crimping head and a connecting portion connected to the crimping head, the crimping head is pressed at the joint between the FPC and the circuit board, and the connecting portion is mounted on the mounting plate;

[0019] The crimping head can be movable relative to the connecting portion in a height direction to switch between a crimping state and a separation state; and / or,

[0020] One of the mounting plate and the connecting portion has a first sliding groove extending along the first direction, and a partial area of ​​the other one extends into the first sliding groove, so that the connecting portion can slide relative to the mounting plate along the first direction.

[0021] In one embodiment, the test platform further comprises a fixing plate, and the crimping fixture, the support frame and the heat-insulating shell are all arranged on the fixing plate;

[0022] One of the fixing plate and the connecting frame has a second sliding groove extending along a second direction, and a portion of the other one extends into the second sliding groove, so that the connecting frame can slide relative to the fixing plate along the second direction, and the second direction is perpendicular to the first direction; and / or,

[0023] One of the support frame and the fixing plate has a third sliding groove extending along the first direction, and a partial area of ​​the other one extends into the third sliding groove, so that the support frame can slide relative to the fixing plate along the first direction.

[0024] An embodiment of the present application provides a test platform, including a thermal insulation shell, a device test fixture and a device fixing fixture. The device test fixture is used to install optical devices, and the device test fixture is arranged in the accommodating cavity of the thermal insulation shell. The thermal insulation shell has a connection area, and the connection area has multiple connection positions. The device fixing fixture can be selectively connected to one of the connection positions to fix the device test fixture. On the one hand, when testing different optical devices, different optical devices can be installed in the device test fixture, and the device test fixture is placed in the accommodating cavity, so that the optical devices are installed in place, thereby making the test platform applicable to the measurement of various optical devices. On the other hand, the device fixing fixture is installed on the thermal insulation shell, and the device fixing fixture has multiple installation positions on the thermal insulation shell. For different optical devices, the sizes of each device test fixture may be different. Therefore, the device fixing fixture can be selectively installed at a connection position to better fix the device test fixture by changing the installation position of the device fixing fixture, thereby completing the matching of the device fixing fixture and the device test fixture, making the device fixing fixture more compatible and more versatile, thereby further improving the ease of use of the test platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a partial structural diagram of a test platform according to an embodiment of the present application;

[0026] Figure 2 for Figure 1 Schematic diagram of part of the structure;

[0027] Figure 3 for Figure 1 Cross-sectional view of the test platform.

[0028] Description of Reference Numerals

[0029] 10. Insulated shell; 10a. Accommodating cavity; 11. Connection area; 111. Connection position; 111a. First fastening hole; 20. Device test fixture; 30. Device fixing fixture; 30a. Second fastening hole; 30b. Fixing hole; 40. Refrigeration assembly; 41. Metal plate; 42. Refrigerator; 43. Water-cooled plate; 50. Crimping fixture; 51. Crimping part; 511. Crimping head; 512. Connection part; 52. Mounting plate; 52a. First slide groove; 53. Connecting frame; 60. Support frame; 70. Fixing plate; 70a. Second slide groove; 70b. Third slide groove; 80. Circuit board. DETAILED DESCRIPTION

[0030] In this application, the orientation or position relationship of "first direction", "second direction" and "height direction" is based on the attached Figure 1 It should be understood that these directional terms are only used to facilitate the description of this application and simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting this application.

[0031] An embodiment of the present application provides a test platform. Figures 1 to 3 The test platform includes a heat-insulating shell 10 , a device test fixture 20 and a device fixing fixture 30 .

[0032] The heat-insulating housing 10 has a receiving chamber 10 a.

[0033] The device test fixture 20 is used to install the optical device, and the device test fixture 20 is disposed in the receiving cavity 10 a.

[0034] The heat-insulating housing 10 has a connection area 11 , and the connection area 11 has a plurality of connection positions 111 . The device fixing fixture 30 can be selectively connected to one of the connection positions 111 to fix the device testing fixture 20 .

[0035] Specifically, the heat-insulating shell 10 is a shell structure with a heat-insulating effect.

[0036] In practice, during high and low temperature testing of optical devices, the test platform also includes a refrigeration assembly 40, which can heat or cool the device test fixture 20 located within the accommodating cavity 10a, thereby heating or cooling the optical device. During this process, the thermal insulation housing 10, due to its excellent thermal insulation performance, can greatly enhance the heating and cooling effects of the refrigeration assembly 40 on the optical device.

[0037] The device test fixture 20 is used to install optical devices. It should be noted that for different optical devices, the device test fixture 20 corresponding to the optical device can be the same or different, which needs to be determined according to the actual installation needs of the optical device. Of course, the receiving cavity 10a is capable of accommodating the device test fixture 20.

[0038] The device fixing fixture 30 is used to fix the device test fixture 20 , thereby fixing the optical device installed in the device test fixture 20 .

[0039] The device fixing fixture 30 is mounted on the thermal insulation housing 10, and its connection with the thermal insulation housing 10 is located at a connection position 111 within the connection area 11 of the thermal insulation housing 10. The connection area 11 of the thermal insulation housing 10 has multiple connection positions 111, and the device fixing fixture 30 can be selectively connected to one of the connection positions 111. This allows the device fixing fixture 30 to be well installed at different positions on the thermal insulation housing 10 to accommodate the purpose of securing the device test fixture 20 at different positions. Therefore, when targeting different device test fixtures 20, the device fixing fixture 30 can correspond to the device test fixture 20 and be adaptively installed at different connection positions 111 to better secure the device test fixture 20.

[0040] The connection area 11 of the heat-insulating housing 10 is an area for connecting the device fixing fixture 30 .

[0041] The connection position 111 of the connection area 11 refers to a position in the connection area 11 for the device fixing fixture 30 to connect. In fact, the connection area 11 has a plurality of positions in which the device fixing fixture 30 can connect.

[0042] It should be noted that the device fixing fixture 30 switches between being connected to each connection position 111 respectively, and the implementation method is not limited.

[0043] For example, the device fixing fixture 30 is detachably connected to the heat-insulating housing 10 , so that the device fixing fixture 30 can be removed from the heat-insulating housing 10 to be installed at a different connection position 111 of the device fixing fixture 30 .

[0044] It should be noted that the manner in which the device fixing fixture 30 and the heat-insulating housing 10 are detachably connected is not limited, for example, the device fixing fixture 30 and the heat-insulating housing 10 are tightly connected.

[0045] For another example, the device fixing fixture 30 is movably connected to the thermal insulation shell 10 , so that the relative position of the device fixing fixture 30 can be changed by driving the device fixing fixture 30 relative to the thermal insulation shell 10 , thereby switching between connections with different connection positions 111 .

[0046] It should be noted that the manner in which the device fixing fixture 30 and the heat-insulating housing 10 are movably connected is not limited, for example, the device fixing fixture 30 and the heat-insulating housing 10 are slidably connected.

[0047] The specific shape of the heat-insulating shell 10 is not limited.

[0048] Exemplarily, the thermal insulation shell 10 includes a thermal insulation base and a thermal insulation cover, and the accommodating cavity 10a includes a first sub-cavity and a second sub-cavity. The thermal insulation base includes side walls and a top wall, and the side walls and the top wall enclose a first sub-cavity, a partial area of ​​the top wall is open to form a connecting port, and another partial area of ​​the top wall has a connecting area 11. A partial area of ​​the device fixing fixture 30 is installed on the connecting position 111 of the connecting area 11 to connect with the thermal insulation base. The thermal insulation cover has a second sub-cavity, and the thermal insulation cover is provided on the top wall of the thermal insulation base, and the second sub-cavity and the first sub-cavity are connected through the connecting port.

[0049] The test platform of the embodiment of the present application includes a heat-insulating shell 10, a device test fixture 20 and a device fixing fixture 30. The device test fixture 20 is used to install optical devices, and the device test fixture 20 is arranged in the accommodating cavity 10a of the heat-insulating shell 10. The heat-insulating shell 10 has a connection area 11, and the connection area 11 has a plurality of connection positions 111. The device fixing fixture 30 can be selectively connected to one of the connection positions 111 to fix the device test fixture 20. On the one hand, when testing different optical devices, different optical devices can be installed in the device test fixture 20, and the device test fixture 20 is placed in the accommodating cavity 10a, so that the optical devices are installed in place, thereby making the test platform suitable for measuring a variety of optical devices. On the other hand, the device fixing fixture 30 is installed on the heat-insulating shell 10, and the device fixing fixture 30 has a plurality of installation positions on the heat-insulating shell 10. For different optical devices, the sizes of each device test fixture 20 may be different. Therefore, the device fixing fixture 30 can be selectively installed at a connection position 111 to better fix the device test fixture 20 by changing the installation position of the device fixing fixture 30, thereby completing the matching of the device fixing fixture 30 and the device test fixture 20, making the device fixing fixture 30 more compatible and more versatile, thereby further improving the ease of use of the test platform.

[0050] In one embodiment, please refer to Figure 2The connection position 111 has a first fastening hole 111a, and the device fixing fixture 30 has a second fastening hole 30a. The device fixing fixture 30 can be selectively connected to one of the connection positions 111. The second fastening hole 30a communicates with the corresponding first fastening hole 111a and is fastened together by a fastener. As a result, the device fixing fixture 30 can be removed from the thermal insulation housing 10 and adaptively fastened to a corresponding connection position 111 according to the size and actual situation of the device test fixture 20, thereby better securing the device test fixture 20.

[0051] Specifically, each connection position 111 has a first fastening hole 111a. When the device fixing fixture 30 is connected to one of the connection positions 111, the second fastening hole 30a on the device fixing fixture 30 communicates with the first fastening hole 111a on the corresponding connection position 111. Thus, a fastener can be passed through the first fastening hole 111a and the second fastening hole 30a, thereby achieving a fastened connection between the device fixing fixture 30 and the thermal insulation housing 10.

[0052] It should be noted that the sizes and shapes of the first fastening hole 111 a and the second fastening hole 30 a may be the same or different.

[0053] For example, see Figure 2 At least one of the first fastening hole 111a and the second fastening hole 30a is a waist-shaped hole. In other words, only the first fastening hole 111a can be a waist-shaped hole, or only the second fastening hole 30a can be a waist-shaped hole. Of course, both the first fastening hole 111a and the second fastening hole 30a can also be waist-shaped holes.

[0054] It should be noted that the waist-shaped hole is larger than the fastener. This waist-shaped hole design allows for fine-tuning of the installation position of the device fixing fixture 30. Thus, by installing the device fixing fixture 30 at different connection locations 111, coarse adjustment of the device fixing fixture 30 can be achieved. Furthermore, by adjusting the relative position of the waist-shaped hole and the fastener, fine adjustment of the device fixing fixture 30 can be achieved. This allows for more precise and adjustable positioning of the device fixing fixture 30.

[0055] In one embodiment, please refer to Figure 2 and Figure 3 The thermal insulation shell 10 has two connection areas 11, which are respectively located on opposite sides of the device test fixture 20 along the first direction. The connection positions 111 of the connection area 11 are spaced apart along the second direction, and the first direction is perpendicular to the second direction.

[0056] The device fixing fixture 30 extends along the first direction, and opposite ends of the device fixing fixture 30 along the first direction are connected to the connection areas 11 in a one-to-one correspondence. This greatly improves the connection stability between the device fixing fixture 30 and the thermal insulation housing 10, thereby improving the fixing effect of the device fixing fixture 30 on the device test fixture 20.

[0057] Specifically, another connection area 11 is provided on opposite sides of the device testing fixture 20 along the first direction, and each connection area 11 has a plurality of connection positions 111. The opposite ends of the device fixing fixture 30 along the first direction are connected to the connection positions 111 on the corresponding sides, thereby ensuring a more stable connection between the device fixing fixture 30 and the thermal insulation housing 10.

[0058] In one embodiment, the device fixing fixture 30 includes a fixing member and a fixing portion located on the top side of the device test fixture 20. The fixing portion has a fixing hole 30b. The fixing member is movably inserted into the fixing hole 30b. The fixing member abuts against the top surface of the device test fixture 20 to fix the device test fixture 20. As a result, the device fixing fixture 30 can better fix the device test fixture 20, thereby improving the stability of the device test fixture 20 during testing.

[0059] Specifically, the fixture can be switched between being pressed against the top surface of the device test fixture 20 and being separated from the top surface of the device test fixture 20 by being movable. Thus, the fixture can be switched between fixing the device test fixture 20 and releasing the device test fixture 20 .

[0060] The fixing hole 30b may be a fastening hole, and the fixing member may be fastened to the fastening hole.

[0061] In one embodiment, please refer to Figure 3 The test platform includes a refrigeration assembly 40, which includes a metal plate 41, a refrigerator 42, and a water-cooling plate 43. The bottom of the accommodating cavity 10a is open to form a bottom opening. The water-cooling plate 43 is disposed at the bottom opening. The refrigerator 42 is disposed on the water-cooling plate 43 and is located at the bottom of the device test fixture 20. The metal plate 41 is disposed between the device test fixture 20 and the refrigerator 42. In this way, the optical device in the device test fixture 20 can be heated or cooled effectively.

[0062] Specifically, the refrigerator 42 is used to heat or cool the device test fixture 20 .

[0063] The metal plate 41 has a good heat transfer effect, and its specific material is not limited. For example, the metal plate 41 is a copper plate.

[0064] The bottom of the accommodating cavity 10 a of the heat-insulating shell 10 is open, and the water-cooling plate 43 is arranged on the bottom side of the heat-insulating shell 10 , which can seal the bottom side of the accommodating cavity 10 a.

[0065] The metal plate 41 and the cooler 42 are both located in the accommodating cavity 10a and between the device test fixture 20 and the water cooling plate 43, so that the cooler 42 can heat or cool the device test fixture 20, thereby enabling high and low temperature testing to be performed better.

[0066] It should be noted that the specific type of the refrigerator 42 can be determined according to actual conditions.

[0067] In one embodiment, the cooler 42 is a TEC cooler 42 (semiconductor cooler).

[0068] In the related art, a high and low temperature airflow impactor is used to perform high and low temperature tests on optical devices. The high and low temperature airflow impactor is a device that simulates the thermal stress and thermal fatigue generated by a substance after being heated and cooled under extreme temperatures. Its working principle is to control the heating device and the cooling device so that the material under test is continuously heated and cooled in cycles under extreme temperature conditions, simulating its fatigue changes during long-term use, thereby testing the durability and reliability of the material. However, the high and low temperature hot and cold shock table used in the related art is very limited in terms of usage scenarios, and the usage conditions are relatively harsh. It cannot meet the requirements of testing in common environments, requires a large space, is not conducive to moving the position, and the high and low temperature shock table will generate impact force, which may bring some risks to products that require stability. Multi-channel testing is also impossible, and normal operation requires a large amount of electricity, gas, and energy consumption.

[0069] This embodiment utilizes a TEC cooler 42, which achieves both heating and cooling effects. By varying the TEC current, the test platform can be adjusted to different temperatures. High and low temperature testing can be performed when the desired test temperature is reached. This design offers a wide test temperature range, low cost, and minimal energy consumption. It can be easily installed within the housing cavity 10a, enabling the test platform to perform multi-channel testing and adapt to a wide variety of optical device products.

[0070] In some embodiments, the refrigeration assembly 40 further includes a temperature sensing position provided on the metal plate 41 , thereby facilitating more accurate monitoring of the temperature of the heat-insulating shell 10 .

[0071] In some embodiments, the cooling assembly 40 further includes a thermal pad disposed between the metal plate 41 and the refrigerator 42 , thereby further improving the heat transfer effect.

[0072] In one embodiment, please refer to Figure 1 and Figure 3The test platform also includes a crimping fixture 50 and a support frame 60. The support frame 60 is used to install the circuit board 80. One end of the FPC (flexible circuit board) of the optical device extends out of the accommodating cavity 10a to fit with the circuit board 80. The pressing fixture includes a crimping portion 51, which is pressed at the fitting point between the FPC and the circuit board 80.

[0073] That is, the circuit board 80 is placed on the support frame 60 outside the heat-insulating housing 10, and one end of the FPC of the optical device is pressed against the circuit board 80 by the crimping portion 51. This improves the connection stability between the circuit board 80 and the optical device, making it easier to perform high and low temperature tests on the optical device.

[0074] It should be noted that when high and low temperature tests are required for different optical devices, the optical device can be directly replaced, and the FPC and circuit board 80 of the replaced optical device can be pressed together through the crimping part 51, so that high and low temperature tests can continue to be performed on other optical devices.

[0075] In one embodiment, please refer to Figure 1 and Figure 3 The crimping fixture 50 includes a mounting plate 52 and two connecting frames 53. The two connecting frames 53 are spaced apart along the first direction. The heat-insulating shell 10 is arranged at the interval between the two connecting frames 53. The mounting plate 52 is respectively connected to the top ends of the two connecting frames 53. The crimping portion 51 is arranged on the mounting plate 52.

[0076] Specifically, a connecting frame 53 is provided on two opposite sides of the heat-insulating housing 10 along the first direction, and the tops of the two connecting frames 53 are connected and fixed via a mounting plate 52. Thus, the crimping portion 51 can be well mounted on the mounting plate 52, so that the crimping portion 51 can press the FPC and the circuit board 80 together.

[0077] In one embodiment, please refer to Figure 1 and Figure 3 The crimping portion 51 includes a crimping head 511 and a connecting portion 512 connected to the crimping head 511. The crimping head 511 is pressed against the joint between the FPC and the circuit board 80, and the connecting portion 512 is mounted on the mounting plate 52. The crimping head 511 is movable in the height direction relative to the connecting portion 512 to switch between a pressed state and a separated state. Thus, the crimping head 511 can be adjusted in height by moving to switch between the actual state.

[0078] Specifically, the pressing state refers to a state in which the pressing head 511 presses the FPC and the circuit board 80 together.

[0079] The separated state refers to a state in which the pressing joint is separated from the FPC and the circuit board 80 so that the FPC and the circuit board 80 can be separated.

[0080] The crimping head 511 can move relative to the connecting portion 512 in any manner, such as sliding.

[0081] In one embodiment, please refer to Figure 1 The crimping portion 51 includes a crimping head 511 and a connecting portion 512 connected to the crimping head 511. The crimping head 511 is pressed against the joint between the FPC and the circuit board 80, and the connecting portion 512 is mounted on the mounting plate 52. One of the mounting plate 52 and the connecting portion 512 has a first slide groove 52a extending in a first direction, and a portion of the other extends into the first slide groove 52a, allowing the connecting portion 512 to slide relative to the mounting plate 52 in the first direction. This allows the relative position of the crimping head 511 to be adjusted along the first direction, allowing the crimping head 511 to better press the FPC and circuit board 80 together.

[0082] Specifically, the crimping head 511 is mounted on the mounting plate 52 via the connecting portion 512. Since the connecting portion 512 and the mounting plate 52 are relatively slidable, the crimping head 511 can be driven to slide relative to the mounting plate 52 by moving the connecting portion 512.

[0083] According to actual conditions, the mounting plate 52 may have a first sliding groove 52 a , and a partial area of ​​the connecting portion 512 extends into the first sliding groove 52 a , thereby allowing the connecting portion 512 to slide along the first direction.

[0084] According to actual conditions, the connecting portion 512 may also have a first sliding groove 52a, and a partial area of ​​the mounting plate 52 extends into the first sliding groove 52a, thereby allowing the connecting portion 512 to slide along the first direction.

[0085] In one embodiment, please refer to Figure 1 The test platform further includes a fixing plate 70 , on which the crimping fixture 50 , the support frame 60 and the heat-insulating shell 10 are all arranged.

[0086] One of the fixed plate 70 and the connecting frame 53 has a second slide groove 70a extending along the second direction, and a partial area of ​​the other one extends into the second slide groove 70a, so that the connecting frame 53 can slide relative to the fixed plate 70 along the second direction, and the second direction is perpendicular to the first direction.

[0087] Specifically, the connecting frame 53 can slide relative to the fixing plate 70 along the second direction. Thus, by moving the connecting frame 53, the relative position of the crimping portion 51 along the second direction can be adjusted to better press the FPC and the circuit board 80 together.

[0088] It should be noted that the fixing plate 70 may have a second slot 70a, and a portion of the connecting frame 53 may extend into the second slot 70a. Alternatively, the connecting frame 53 may have a second slot 70a, and a portion of the fixing plate 70 may extend into the second slot 70a.

[0089] In one embodiment, please refer to Figure 1 The test platform further includes a fixing plate 70 , on which the crimping fixture 50 , the support frame 60 and the heat-insulating shell 10 are all arranged.

[0090] One of the support frame 60 and the fixing plate 70 has a third sliding groove 70b extending along the first direction, and a portion of the other extends into the third sliding groove 70b, so that the support frame 60 can slide relative to the fixing plate 70 along the first direction.

[0091] Specifically, the support frame 60 can also slide relative to the fixing plate 70 along the second direction. Thus, by moving the support frame 60, the relative position of the circuit board 80 along the second direction can be adjusted to better fit the FPC.

[0092] It should be noted that the fixing plate 70 may have a third slot 70b, and a portion of the support frame 60 may extend into the third slot 70b. Alternatively, the support frame 60 may have a third slot 70b, and a portion of the fixing plate 70 may extend into the third slot 70b.

[0093] In the description of this application, the descriptions with reference to the terms "in one embodiment", "in some embodiments", "in a specific embodiment", or "exemplary" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine different embodiments or examples described in this application and features of different embodiments or examples without contradiction.

[0094] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application are intended to be within the scope of protection of the present application.

Claims

1. A test platform, characterized in that: include: A heat-insulating shell having a receiving cavity; A device test fixture, the device test fixture is used to install the optical device, and the device test fixture is arranged in the accommodating cavity; The device fixing fixture is provided with a heat-insulating shell having a connection area, the connection area having a plurality of connection positions, and the device fixing fixture can be selectively connected to one of the connection positions to fix the device test fixture.

2. The test platform according to claim 1, characterized in that: The connection position has a first fastening hole, and the device fixing fixture has a second fastening hole. The device fixing fixture can be selectively connected to one of the connection positions. The second fastening hole is connected to the corresponding first fastening hole and is fastened by a fastener.

3. The test platform according to claim 2, characterized in that: At least one of the first fastening hole and the second fastening hole is a waist-shaped hole.

4. The test platform according to any one of claims 1 to 3, characterized in that: The heat-insulating housing has two connection areas, the two connection areas are respectively located on opposite sides of the device test fixture along the first direction, the connection positions of the connection areas are spaced apart along the second direction, and the first direction is perpendicular to the second direction; The device fixing fixture extends along the first direction, and two opposite ends of the device fixing fixture along the first direction are respectively connected to the connection areas in a one-to-one correspondence.

5. The test platform according to claim 4, characterized in that: The device fixing fixture includes a fixing piece and a fixing portion located on the top side of the device test fixture. The fixing portion has a fixing hole. The fixing piece can be movably inserted into the fixing hole. The fixing piece fixes the device test fixture by pressing against the top surface of the device test fixture.

6. The test platform according to any one of claims 1 to 3, characterized in that: The test platform includes a refrigeration assembly, which includes a metal plate, a refrigerator and a water-cooling plate. The bottom of the accommodating cavity is open to form a bottom opening. The water-cooling plate is arranged at the bottom opening. The refrigerator is arranged on the water-cooling plate and is located at the bottom of the device test fixture. The metal plate is arranged between the device test fixture and the refrigerator.

7. The test platform according to any one of claims 1 to 3, characterized in that: The test platform also includes a crimping fixture and a support frame, the support frame is used to install a circuit board, one end of the FPC of the optical device extends out of the accommodating cavity to fit with the circuit board, and the crimping fixture includes a crimping portion, which is pressed at the fitting point between the FPC and the circuit board.

8. The test platform according to claim 7, characterized in that: The crimping fixture includes a mounting plate and two connecting frames, the two connecting frames are spaced apart along a first direction, the heat-insulating shell is arranged at the interval between the two connecting frames, the mounting plates are respectively connected to the top ends of the two connecting frames, and the crimping portion is arranged on the mounting plate.

9. The test platform according to claim 8, characterized in that: The crimping portion includes a crimping head and a connecting portion connected to the crimping head, the crimping head is pressed at the joint between the FPC and the circuit board, and the connecting portion is mounted on the mounting plate; The crimping head can be movable relative to the connecting portion in a height direction to switch between a crimping state and a separation state; and / or, One of the mounting plate and the connecting portion has a first sliding groove extending along the first direction, and a partial area of ​​the other one extends into the first sliding groove, so that the connecting portion can slide relative to the mounting plate along the first direction.

10. The test platform according to claim 8, characterized in that: The test platform further comprises a fixing plate, on which the crimping fixture, the supporting frame and the heat-insulating shell are all arranged; One of the fixing plate and the connecting frame has a second sliding groove extending along a second direction, and a portion of the other one extends into the second sliding groove, so that the connecting frame can slide relative to the fixing plate along the second direction, and the second direction is perpendicular to the first direction; and / or, One of the support frame and the fixing plate has a third sliding groove extending along the first direction, and a partial area of ​​the other one extends into the third sliding groove, so that the support frame can slide relative to the fixing plate along the first direction.

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