Multi-layer composite intelligent card

Abstract

The utility model discloses a multi-layer composite intelligent card, which comprises an INLAY layer, a card base upper layer and a card base lower layer, the card base upper layer and the card base lower layer are made of native wood chips, frame structures are arranged on the edges of the bottom surface of the card base upper layer and the top surface of the card base lower layer, slot positions used for installing the INLAY layer are formed in the frame structures, and the card base upper layer, the LNLAY layer and the lower side of the card base are bonded through glue in a press fit mode. The top surface of the card base upper layer and the bottom surface of the card base lower layer are respectively coated with a transparent film. Because the wood grains of the wood chips have natural uniqueness, the wood grains presented on the outer surfaces of the card base upper layer and the card base lower layer enable each intelligent card to have unique wood grain appearance. The outer surfaces of the card base upper layer and the card base lower layer are protected by pasting the transparent thin film, so that moisture prevention is facilitated, the card can meet the bending standard, and hot stamping and panchromatic laser can be performed on the surface of the transparent thin film. In addition, the card base of the scheme is made of the wood material, and the wood material is easy to degrade, so that the generation of plastic garbage of the intelligent card is reduced, and environmental protection is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of smart cards, in particular to a multi-layer composite smart card. Background Art

[0002] A smart card is a plastic card with a built-in microchip that can store and transmit data. It primarily falls into two categories: contact smart cards and contactless smart cards. Contact smart cards typically use IC card technology and require physical contact with a card reader to exchange data. Contactless smart cards, also known as touchless smart cards, allow data to be transmitted via radio waves, eliminating the need for physical contact with a card reader. As a secure pass in the digital age, smart cards play a vital role in information exchange and security. Smart cards are widely used worldwide in finance, transportation, access control, and identity authentication. Existing contact and contactless smart cards are typically manufactured from petrochemical-based materials such as PVC, PC, and PET. A film with a patterned design is often applied to the card body for decorative purposes. These plastic materials are not easily degradable, and the large number of smart cards in use worldwide can easily contribute to white pollution. Furthermore, existing smart cards emphasize rarity or uniqueness through circulation and surface decoration, rather than inherently unique designs. Therefore, the existing smart card design still needs to be further developed and designed to solve the above technical problems. Utility Model Content

[0003] This application proposal is intended to research and design ways to reduce the production of smart card plastics and to achieve the uniqueness of natural smart cards, thereby proposing this application proposal.

[0004] The technical solution disclosed in the present application is a multi-layer composite smart card, comprising an INLAY layer, an upper card base layer made of virgin wood chips, and a lower card base layer. The bottom surface of the upper card base layer and the top surface edge of the lower card base layer are provided with a frame structure, and a slot for installing the INLAY layer is formed in the frame structure. The upper card base layer, the LNLAY layer and the lower side of the card base are bonded by glue pressing, and the top surface of the upper card base layer and the bottom surface of the lower card base layer are respectively covered with a transparent film.

[0005] In a preferred embodiment, the frame structure is formed by stacking and bonding at least two wooden frames, the outer edges of the wooden frames are aligned with the edges of the upper and lower layers of the card base, and the upper and lower parts of the wooden frames are respectively bonded to the upper and lower layers of the card base by glue pressing.

[0006] In a preferred embodiment, the frame structure is a slot for mounting the INLAY layer that is milled out on the bottom surface of the upper layer of the card base or on the top surface of the lower layer of the card base by CNC.

[0007] In a preferred embodiment, the frame structure is a groove milled by CNC on the bottom surface of the upper layer of the card base and the top surface of the lower layer of the card base, and the grooves on the bottom surface of the upper layer of the card base and the top surface of the lower layer of the card base constitute the slot for installing the INLAY layer.

[0008] Furthermore, the INLAY layer includes a plastic sheet, a coil and a chip. The coil is wound and implanted into the plastic sheet through an ultrasonic embedding device. The chip is spot-welded to the coil. The plastic sheet is any one of PVC sheet, ABS sheet, PET sheet and PETG sheet.

[0009] In one solution, the coil and the chip are coupled using an inductive coil and an RFID chip, and the formed INLAY layer is a contactless radio frequency identification INLAY unit.

[0010] In one solution, the coil and the chip are coupled using an induction coil and a memory chip, and the formed INLAY layer is a contact reading INLAY unit.

[0011] In one solution, the coil and chip are coupled with a dual induction coil and a CPU chip, and the formed INLAY layer is a dual-interface smart card INLAY unit.

[0012] Furthermore, the upper layer of the chip is coupled with a contact point metal sheet, the upper layer of the card base is provided with a step hole, and the contact point metal sheet is embedded in the step hole.

[0013] Preferably, the transparent film is any one of PET transparent film, degradable PVC transparent film, OPP transparent film, BOPP transparent film, and PP transparent film.

[0014] The multi-layer composite smart card designed using this technical solution has the following beneficial effects: First, the card base designed in this solution uses an upper card base layer and a lower card base layer made of original wood chips, and a frame structure is set between the upper card base layer and the lower card base layer to form a slot for installing the INLAY layer. Because the wood grain of the wood chips has a natural uniqueness, the wood grain displayed on the outer surfaces of the upper card base layer and the lower card base layer gives each smart card a unique wood grain appearance. By applying a transparent film, the outer surfaces of the upper card base layer and the lower card base layer are protected, which is beneficial for moisture resistance and ensures that the card meets bending standards. At the same time, the surface of the transparent film can be hot stamped and full-color lasered. Then, because the card base of this solution uses wood materials, the wood materials are easily degraded, which helps reduce the generation of plastic waste from smart cards and is beneficial to environmental protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structural decomposition of an embodiment of the present invention.

[0016] Figure 2 This is a cross-sectional view of the structure of an embodiment of the present invention.

[0017] Figure 3 For the utility model Figure 2 Enlarged schematic diagram of point A in the middle.

[0018] Figure 4 This is a cross-sectional view of an embodiment of a card base upper bottom surface provided with a slot for installing the INLAY layer according to the present invention.

[0019] Figure 5 This is a cross-sectional view of an embodiment of a card base lower layer top surface provided with a slot for installing the INLAY layer according to the present invention.

[0020] Figure 6 This is a cross-sectional view of an embodiment of the present invention in which grooves are provided on both the bottom surface of the upper layer of the card base and the top surface of the lower layer of the card base.

[0021] Figure 7 This is a three-dimensional diagram of the overall structure of the dual-interface smart card disclosed in this utility model.

[0022] Figure numerals: 1, card base upper layer; 2, card base lower layer; 3, INLAY layer; 4, wooden frame layer; 5, transparent film; 6, contact point metal sheet. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts are also within the scope of protection of the present disclosure.

[0024] Please refer to Figures 1 to 6 , is an embodiment of a multi-layer composite smart card provided by the present technical solution, the multi-layer composite smart card comprising an INLAY layer 3, an upper card base layer 1 made of virgin wood chips, and a lower card base layer 2. The bottom surface of the upper card base layer 1 and the top edge of the lower card base layer 2 are provided with a frame structure, a slot for installing the INLAY layer 3 is formed in the frame structure, the upper card base layer 1, the LNLAY layer and the lower side of the card base are bonded by adhesive pressing, and the top surface of the upper card base layer 1 and the bottom surface of the lower card base layer 2 are respectively covered with a transparent film 5.

[0025] Please refer to Figures 1 to 3 In one embodiment, the frame structure is formed by stacking and bonding at least two wooden frame layers 4, the outer edge of the wooden frame is aligned with the edge of the card base upper layer 1 and the card base lower layer 2, and the upper and lower parts of the wooden frame are respectively bonded to the card base upper layer 1 and the card base lower layer 2 by glue pressing.

[0026] Please refer to Figure 4 In another embodiment, the frame structure is a slot for installing the INLAY layer 3 by CNC milling on the bottom surface of the card base upper layer 1.

[0027] Please refer to Figure 5 In another embodiment, the frame structure is a slot for installing the INLAY layer 3 by CNC milling on the top surface of the card base lower layer 2.

[0028] Please refer to Figure 6 In another embodiment, the frame structure is a groove position milled by CNC on the bottom surface of the card base upper layer 1 and the top surface of the card base lower layer 2, and the groove position on the bottom surface of the card base upper layer 1 and the top surface of the card base lower layer 2 constitute a slot for installing the INLAY layer 3.

[0029] Furthermore, the INLAY layer 3 includes a plastic sheet, a coil and a chip. The coil is wound and implanted into the plastic sheet through an ultrasonic embedding device. The chip is spot-welded to the coil. The plastic sheet is any one of degradable PVC sheet, ABS sheet, PET sheet and PETG sheet.

[0030] In one embodiment, the coil and the chip are coupled by an inductive coil and an RFID chip, and the formed INLAY layer 3 is a contactless radio frequency identification INLAY unit, thereby making a radio frequency contactless induction smart card.

[0031] In another embodiment, the coil and chip are coupled with an induction coil and a memory chip, and the formed INLAY layer 3 is a contact reading INLAY unit. A contact point metal sheet 6 is coupled to the memory chip, thereby making an IC smart card with physical contact.

[0032] In another embodiment, the coil and chip are coupled with a dual induction coil and a CPU chip, and the formed INLAY layer 3 is a dual-interface smart card INLAY unit, thereby making a contact and contactless dual-interface smart card, and the CPU chip is coupled with a contact point metal sheet 6.

[0033] Please refer to Figure 7 When the contact point metal sheet 6 is provided, a step hole is provided on the card base upper layer 1, and the contact point metal sheet 6 is embedded in the step hole.

[0034] Preferably, the transparent film 5 is any one of PET transparent film, PVC transparent film, OPP transparent film, BOPP transparent film, and PP transparent film.

[0035] The card base in the above embodiment utilizes an upper card base layer 1 and a lower card base layer 2 made of virgin wood chips. Due to the naturally unique wood grain of the wood chips, the wood grain displayed on the outer surfaces of the upper card base layer 1 and the lower card base layer 2 gives each smart card a unique wood grain appearance. A transparent film 5 is applied to protect the outer surfaces of the upper card base layer 1 and the lower card base layer 2, facilitating moisture resistance and ensuring that the card meets bending standards. Furthermore, the transparent film 5 allows for hot stamping and full-color laser printing. Furthermore, since the card base in this embodiment utilizes a readily degradable wood material, this reduces the generation of plastic waste associated with smart cards, contributing to environmental protection.

[0036] While various embodiments of the present disclosure have been described above, the above descriptions are illustrative, non-exhaustive, and not intended to be limiting of the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or improvements to existing technologies, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A multi-layer composite smart card, characterized in that: It includes an INLAY layer, an upper card base layer made of original wood chips, and a lower card base layer. The bottom surface of the upper card base layer and the top surface edge of the lower card base layer are provided with a frame structure. A slot for installing the INLAY layer is formed in the frame structure. The upper card base layer, the LNLAY layer and the lower side of the card base are bonded by glue pressing. The top surface of the upper card base layer and the bottom surface of the lower card base layer are respectively covered with a transparent film.

2. The multi-layer composite smart card according to claim 1, characterized in that: The frame structure is formed by stacking and bonding at least two wooden frames. The outer edges of the wooden frames are aligned with the edges of the upper and lower layers of the card base, and the upper and lower parts of the wooden frames are respectively bonded to the upper and lower layers of the card base by glue pressing.

3. The multi-layer composite smart card according to claim 1, characterized in that: The frame structure is a groove for installing the INLAY layer by CNC milling on the bottom surface of the upper layer of the card base or the top surface of the lower layer of the card base.

4. The multi-layer composite smart card according to claim 1, characterized in that: The frame structure is a groove position milled by CNC on the bottom surface of the upper layer of the card base and the top surface of the lower layer of the card base. The groove position on the bottom surface of the upper layer of the card base and the top surface of the lower layer of the card base constitute the slot for installing the INLAY layer.

5. The multi-layer composite smart card according to claim 1, characterized in that: The INLAY layer includes a plastic sheet, a coil and a chip. The coil is wound and implanted into the plastic sheet through an ultrasonic embedding device. The chip is spot-welded to the coil. The plastic sheet is any one of degradable PVC sheet, ABS sheet, PET sheet and PETG sheet.

6. The multi-layer composite smart card according to claim 5, characterized in that: The coil and the chip are coupled by an inductive coil and an RFID chip, and the formed INLAY layer is a contactless radio frequency identification INLAY unit.

7. The multi-layer composite smart card according to claim 5, characterized in that: The coil and the chip are coupled with an induction coil and a memory chip, and the formed INLAY layer is a contact-type reading INLAY unit.

8. The multi-layer composite smart card according to claim 5, characterized in that: The coil and the chip are coupled with a dual induction coil and a CPU chip, and the formed INLAY layer is an INLAY unit of a dual-interface smart card.

9. The multi-layer composite smart card according to any one of claims 7-8, characterized in that: The upper layer of the chip is coupled with a contact point metal sheet, the upper layer of the card base is provided with a step hole, and the contact point metal sheet is embedded in the step hole.

10. The multi-layer composite smart card according to claim 1, characterized in that: The transparent film is any one of PET transparent film, degradable PVC transparent film, OPP transparent film, BOPP transparent film and PP transparent film.

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